IT1242420B - Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili. - Google Patents

Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili.

Info

Publication number
IT1242420B
IT1242420B IT630A IT63090A IT1242420B IT 1242420 B IT1242420 B IT 1242420B IT 630 A IT630 A IT 630A IT 63090 A IT63090 A IT 63090A IT 1242420 B IT1242420 B IT 1242420B
Authority
IT
Italy
Prior art keywords
electronic components
flexible printed
application
printed circuits
mounting method
Prior art date
Application number
IT630A
Other languages
English (en)
Other versions
IT9000630A0 (it
ITAN900630A1 (it
Inventor
Maurizio Saraceni
Original Assignee
Ri Co Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ri Co Srl filed Critical Ri Co Srl
Priority to IT630A priority Critical patent/IT1242420B/it
Publication of IT9000630A0 publication Critical patent/IT9000630A0/it
Priority to DE69104580T priority patent/DE69104580T2/de
Priority to AT91830293T priority patent/ATE112923T1/de
Priority to EP91830293A priority patent/EP0474605B1/en
Priority to US07/729,323 priority patent/US5153985A/en
Publication of ITAN900630A1 publication Critical patent/ITAN900630A1/it
Application granted granted Critical
Publication of IT1242420B publication Critical patent/IT1242420B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
IT630A 1990-09-03 1990-09-03 Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili. IT1242420B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT630A IT1242420B (it) 1990-09-03 1990-09-03 Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili.
DE69104580T DE69104580T2 (de) 1990-09-03 1991-07-02 Anordnung und Verfahren zur Anordnung für den Einbau von elektronischen Bauelementen auf flexiblen gedruckten Schaltungen.
AT91830293T ATE112923T1 (de) 1990-09-03 1991-07-02 Anordnung und verfahren zur anordnung für den einbau von elektronischen bauelementen auf flexiblen gedruckten schaltungen.
EP91830293A EP0474605B1 (en) 1990-09-03 1991-07-02 Assembly and method of assembly for the application of electronic components to flexible printed circuits
US07/729,323 US5153985A (en) 1990-09-03 1991-07-12 Method of assembly for the application of electronic components to flexible printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT630A IT1242420B (it) 1990-09-03 1990-09-03 Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili.

Publications (3)

Publication Number Publication Date
IT9000630A0 IT9000630A0 (it) 1990-09-03
ITAN900630A1 ITAN900630A1 (it) 1992-03-03
IT1242420B true IT1242420B (it) 1994-03-04

Family

ID=11099951

Family Applications (1)

Application Number Title Priority Date Filing Date
IT630A IT1242420B (it) 1990-09-03 1990-09-03 Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili.

Country Status (5)

Country Link
US (1) US5153985A (it)
EP (1) EP0474605B1 (it)
AT (1) ATE112923T1 (it)
DE (1) DE69104580T2 (it)
IT (1) IT1242420B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5670009A (en) * 1995-02-28 1997-09-23 Eastman Kodak Company Assembly technique for an image sensor array
DE19739591A1 (de) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclingfähige Leiterplatte, bestehend aus einem Folien- und Trägersystem
SE517944C2 (sv) * 2000-04-06 2002-08-06 Ericsson Telefon Ab L M Förfarande och styrelement för fastsättning av ett mönsterkort på ett element
SE518778C2 (sv) * 2000-04-19 2002-11-19 Ericsson Telefon Ab L M Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort
US6884313B2 (en) * 2001-01-08 2005-04-26 Fujitsu Limited Method and system for joining and an ultra-high density interconnect
US20080241991A1 (en) * 2007-03-26 2008-10-02 National Semiconductor Corporation Gang flipping for flip-chip packaging

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US3887996A (en) * 1974-05-01 1975-06-10 Gen Motors Corp iconductor loading apparatus for bonding
DE2713280C3 (de) * 1977-03-25 1986-10-23 Esser Sicherheitstechnik GmbH & Co KG, 4040 Neuss Funktionsüberprüfbare Feuermelderanlage
JPS53149763A (en) * 1977-06-01 1978-12-27 Citizen Watch Co Ltd Mounting method of semiconductor integrate circuit
FR2541828B1 (fr) * 1983-02-28 1985-09-13 Inf Milit Spatiale Aeronaut Dispositif de connexion electrique entre deux cartes de circuits imprimes et procede de connexion de deux cartes de circuits imprimes a l'aide d'un tel dispositif
DE3336606A1 (de) * 1983-10-07 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur mikropackherstellung
DE3414552A1 (de) * 1984-04-17 1985-10-17 geb. Baur Christine 8042 Oberschleißheim Irnstetter Verfahren und vorrichtung zur montage anschlussleiterloser elektrischer bauelemente
JPH0793517B2 (ja) * 1986-11-20 1995-10-09 松下電器産業株式会社 電子部品の装着方法
US4916807A (en) * 1989-01-05 1990-04-17 Wiese Paul H Method and apparatus for assembling circuits having surface mounted components
US5054193A (en) * 1989-08-28 1991-10-08 Hewlett-Packard Company Printed circuit board fixture and a method of assembling a printed circuit board
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly

Also Published As

Publication number Publication date
US5153985A (en) 1992-10-13
EP0474605B1 (en) 1994-10-12
EP0474605A3 (en) 1993-01-13
DE69104580T2 (de) 1995-05-18
ATE112923T1 (de) 1994-10-15
IT9000630A0 (it) 1990-09-03
DE69104580D1 (de) 1994-11-17
ITAN900630A1 (it) 1992-03-03
EP0474605A2 (en) 1992-03-11

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970929