ATE112923T1 - Anordnung und verfahren zur anordnung für den einbau von elektronischen bauelementen auf flexiblen gedruckten schaltungen. - Google Patents

Anordnung und verfahren zur anordnung für den einbau von elektronischen bauelementen auf flexiblen gedruckten schaltungen.

Info

Publication number
ATE112923T1
ATE112923T1 AT91830293T AT91830293T ATE112923T1 AT E112923 T1 ATE112923 T1 AT E112923T1 AT 91830293 T AT91830293 T AT 91830293T AT 91830293 T AT91830293 T AT 91830293T AT E112923 T1 ATE112923 T1 AT E112923T1
Authority
AT
Austria
Prior art keywords
arrangement
electronic components
flexible printed
printed circuits
installation
Prior art date
Application number
AT91830293T
Other languages
English (en)
Inventor
Maurizio Saraceni
Original Assignee
Rico Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rico Srl filed Critical Rico Srl
Application granted granted Critical
Publication of ATE112923T1 publication Critical patent/ATE112923T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT91830293T 1990-09-03 1991-07-02 Anordnung und verfahren zur anordnung für den einbau von elektronischen bauelementen auf flexiblen gedruckten schaltungen. ATE112923T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT630A IT1242420B (it) 1990-09-03 1990-09-03 Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili.

Publications (1)

Publication Number Publication Date
ATE112923T1 true ATE112923T1 (de) 1994-10-15

Family

ID=11099951

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91830293T ATE112923T1 (de) 1990-09-03 1991-07-02 Anordnung und verfahren zur anordnung für den einbau von elektronischen bauelementen auf flexiblen gedruckten schaltungen.

Country Status (5)

Country Link
US (1) US5153985A (de)
EP (1) EP0474605B1 (de)
AT (1) ATE112923T1 (de)
DE (1) DE69104580T2 (de)
IT (1) IT1242420B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5670009A (en) * 1995-02-28 1997-09-23 Eastman Kodak Company Assembly technique for an image sensor array
DE19739591A1 (de) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclingfähige Leiterplatte, bestehend aus einem Folien- und Trägersystem
SE517944C2 (sv) * 2000-04-06 2002-08-06 Ericsson Telefon Ab L M Förfarande och styrelement för fastsättning av ett mönsterkort på ett element
SE518778C2 (sv) * 2000-04-19 2002-11-19 Ericsson Telefon Ab L M Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort
US6884313B2 (en) * 2001-01-08 2005-04-26 Fujitsu Limited Method and system for joining and an ultra-high density interconnect
US20080241991A1 (en) * 2007-03-26 2008-10-02 National Semiconductor Corporation Gang flipping for flip-chip packaging

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US3887996A (en) * 1974-05-01 1975-06-10 Gen Motors Corp iconductor loading apparatus for bonding
DE2713280C3 (de) * 1977-03-25 1986-10-23 Esser Sicherheitstechnik GmbH & Co KG, 4040 Neuss Funktionsüberprüfbare Feuermelderanlage
JPS53149763A (en) * 1977-06-01 1978-12-27 Citizen Watch Co Ltd Mounting method of semiconductor integrate circuit
FR2541828B1 (fr) * 1983-02-28 1985-09-13 Inf Milit Spatiale Aeronaut Dispositif de connexion electrique entre deux cartes de circuits imprimes et procede de connexion de deux cartes de circuits imprimes a l'aide d'un tel dispositif
DE3336606A1 (de) * 1983-10-07 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur mikropackherstellung
DE3414552A1 (de) * 1984-04-17 1985-10-17 geb. Baur Christine 8042 Oberschleißheim Irnstetter Verfahren und vorrichtung zur montage anschlussleiterloser elektrischer bauelemente
JPH0793517B2 (ja) * 1986-11-20 1995-10-09 松下電器産業株式会社 電子部品の装着方法
US4916807A (en) * 1989-01-05 1990-04-17 Wiese Paul H Method and apparatus for assembling circuits having surface mounted components
US5054193A (en) * 1989-08-28 1991-10-08 Hewlett-Packard Company Printed circuit board fixture and a method of assembling a printed circuit board
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly

Also Published As

Publication number Publication date
IT9000630A1 (it) 1992-03-04
IT1242420B (it) 1994-03-04
IT9000630A0 (it) 1990-09-03
DE69104580D1 (de) 1994-11-17
DE69104580T2 (de) 1995-05-18
EP0474605A2 (de) 1992-03-11
EP0474605B1 (de) 1994-10-12
US5153985A (en) 1992-10-13
EP0474605A3 (en) 1993-01-13

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties