JPS5429239B2 - - Google Patents

Info

Publication number
JPS5429239B2
JPS5429239B2 JP13838274A JP13838274A JPS5429239B2 JP S5429239 B2 JPS5429239 B2 JP S5429239B2 JP 13838274 A JP13838274 A JP 13838274A JP 13838274 A JP13838274 A JP 13838274A JP S5429239 B2 JPS5429239 B2 JP S5429239B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13838274A
Other languages
Japanese (ja)
Other versions
JPS5165589A (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13838274A priority Critical patent/JPS5429239B2/ja
Priority to US05/636,452 priority patent/US4074299A/en
Priority to DE2554398A priority patent/DE2554398C3/de
Priority to CA240,949A priority patent/CA1050647A/en
Publication of JPS5165589A publication Critical patent/JPS5165589A/ja
Publication of JPS5429239B2 publication Critical patent/JPS5429239B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/926—Elongated lead extending axially through another elongated lead

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP13838274A 1974-12-04 1974-12-04 Expired JPS5429239B2 (https=)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP13838274A JPS5429239B2 (https=) 1974-12-04 1974-12-04
US05/636,452 US4074299A (en) 1974-12-04 1975-12-01 Light-emitting diode element and device
DE2554398A DE2554398C3 (de) 1974-12-04 1975-12-03 Kontaktierung einer Lumineszenzdiode
CA240,949A CA1050647A (en) 1974-12-04 1975-12-03 Light-emitting diode element and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13838274A JPS5429239B2 (https=) 1974-12-04 1974-12-04

Publications (2)

Publication Number Publication Date
JPS5165589A JPS5165589A (https=) 1976-06-07
JPS5429239B2 true JPS5429239B2 (https=) 1979-09-21

Family

ID=15220621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13838274A Expired JPS5429239B2 (https=) 1974-12-04 1974-12-04

Country Status (4)

Country Link
US (1) US4074299A (https=)
JP (1) JPS5429239B2 (https=)
CA (1) CA1050647A (https=)
DE (1) DE2554398C3 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2156153B (en) * 1984-03-21 1988-02-24 Pitney Bowes Inc Alignment process for semiconductor chips
GB2249428A (en) * 1988-08-11 1992-05-06 Plessey Co Plc Connections for led arrays
KR910006706B1 (ko) * 1988-12-12 1991-08-31 삼성전자 주식회사 발광다이오드 어레이 헤드의 제조방법
EP0374121A3 (de) * 1988-12-16 1991-01-16 RSF-Elektronik Gesellschaft m.b.H. Leuchtdiode
JP2753153B2 (ja) * 1991-04-15 1998-05-18 キヤノン株式会社 発光素子
KR100594036B1 (ko) * 2003-12-30 2006-06-30 삼성전자주식회사 광신호 증폭장치, 이를 구비하는 광통신 모듈 및 그제조방법
DE102004047061B4 (de) 2004-09-28 2018-07-26 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
BRPI0519478A2 (pt) * 2004-12-27 2009-02-03 Quantum Paper Inc display emissivo endereÇÁvel e imprimÍvel
US7284896B2 (en) * 2005-04-15 2007-10-23 Jiahn-Chang Wu Light unit display
DE102007011123A1 (de) * 2007-03-07 2008-09-11 Osram Opto Semiconductors Gmbh Licht emittierendes Modul und Herstellungsverfahren für ein Licht emittierendes Modul
DE102007015893A1 (de) * 2007-04-02 2008-10-09 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung sowie Verfahren zum Betrieb und Verfahren zur Herstellung einer optoelektronischen Anordnung
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US8384630B2 (en) * 2007-05-31 2013-02-26 Nthdegree Technologies Worldwide Inc Light emitting, photovoltaic or other electronic apparatus and system
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8133768B2 (en) * 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8889216B2 (en) * 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
WO2020022808A1 (ko) * 2018-07-25 2020-01-30 주식회사 제이마이크로 투명 발광 디스플레이 필름, 이의 제조 방법, 및 이를 사용한 투명 발광 사이니지

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3054034A (en) * 1958-10-01 1962-09-11 Rca Corp Semiconductor devices and method of manufacture thereof
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
FR1518717A (fr) * 1966-12-21 1968-03-29 Radiotechnique Coprim Rtc Perfectionnements aux diodes électroluminescentes
US3520054A (en) * 1967-11-13 1970-07-14 Mitronics Inc Method of making multilevel metallized ceramic bodies for semiconductor packages
US3573568A (en) * 1969-06-18 1971-04-06 Gen Electric Light emitting semiconductor chips mounted in a slotted substrate forming a display apparatus
US3641401A (en) * 1971-03-10 1972-02-08 American Lava Corp Leadless ceramic package for integrated circuits
FR2160710B1 (https=) * 1971-11-22 1974-09-27 Radiotechnique Compelec
GB1416671A (en) * 1973-02-14 1975-12-03 Siemens Ag Layer circuits
US3964157A (en) * 1974-10-31 1976-06-22 Bell Telephone Laboratories, Incorporated Method of mounting semiconductor chips

Also Published As

Publication number Publication date
CA1050647A (en) 1979-03-13
DE2554398B2 (de) 1979-10-11
DE2554398A1 (de) 1976-06-10
DE2554398C3 (de) 1980-07-03
US4074299A (en) 1978-02-14
JPS5165589A (https=) 1976-06-07

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