FI106894B - Resonaattorirakenteita - Google Patents
Resonaattorirakenteita Download PDFInfo
- Publication number
- FI106894B FI106894B FI981245A FI981245A FI106894B FI 106894 B FI106894 B FI 106894B FI 981245 A FI981245 A FI 981245A FI 981245 A FI981245 A FI 981245A FI 106894 B FI106894 B FI 106894B
- Authority
- FI
- Finland
- Prior art keywords
- resonator
- substrate
- acoustic
- structures
- switch
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 61
- 238000010295 mobile communication Methods 0.000 claims description 11
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 7
- 238000000059 patterning Methods 0.000 claims description 2
- 239000008187 granular material Substances 0.000 claims 11
- 239000010410 layer Substances 0.000 description 48
- 239000000463 material Substances 0.000 description 23
- 238000010897 surface acoustic wave method Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- 239000010409 thin film Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- CFAKWWQIUFSQFU-UHFFFAOYSA-N 2-hydroxy-3-methylcyclopent-2-en-1-one Chemical compound CC1=C(O)C(=O)CC1 CFAKWWQIUFSQFU-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000001837 2-hydroxy-3-methylcyclopent-2-en-1-one Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910003781 PbTiO3 Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000013047 polymeric layer Substances 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000013641 positive control Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/582—Multiple crystal filters implemented with thin-film techniques
- H03H9/583—Multiple crystal filters implemented with thin-film techniques comprising a plurality of piezoelectric layers acoustically coupled
- H03H9/585—Stacked Crystal Filters [SCF]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/10—Auxiliary devices for switching or interrupting
- H01P1/12—Auxiliary devices for switching or interrupting by mechanical chopper
- H01P1/127—Strip line switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/175—Acoustic mirrors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/545—Filters comprising resonators of piezoelectric or electrostrictive material including active elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/582—Multiple crystal filters implemented with thin-film techniques
- H03H9/586—Means for mounting to a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/587—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/60—Electric coupling means therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
- H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
- H01H1/20—Bridging contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0052—Special contact materials used for MEMS
- H01H2001/0057—Special contact materials used for MEMS the contact materials containing refractory materials, e.g. tungsten
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Micromachines (AREA)
- Waveguide Switches, Polarizers, And Phase Shifters (AREA)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI981245A FI106894B (fi) | 1998-06-02 | 1998-06-02 | Resonaattorirakenteita |
FI981415A FI108583B (fi) | 1998-06-02 | 1998-06-18 | Resonaattorirakenteita |
US09/321,058 US6204737B1 (en) | 1998-06-02 | 1999-05-27 | Piezoelectric resonator structures with a bending element performing a voltage controlled switching function |
US09/321,339 US6242843B1 (en) | 1998-06-02 | 1999-05-27 | Resonator structures |
CN99106965A CN1130790C (zh) | 1998-06-02 | 1999-06-02 | 谐振器结构 |
JP11154477A JP2000030594A (ja) | 1998-06-02 | 1999-06-02 | 共振器の構造 |
EP99304281A EP0963000B1 (fr) | 1998-06-02 | 1999-06-02 | Structures de résonateurs |
CN99106966A CN1127168C (zh) | 1998-06-02 | 1999-06-02 | 谐振器单元 |
EP08004288A EP1936733B1 (fr) | 1998-06-02 | 1999-06-02 | Structures de résonateur |
EP99304277A EP0962999A3 (fr) | 1998-06-02 | 1999-06-02 | Structures de résonateurs |
JP11154478A JP2000030595A (ja) | 1998-06-02 | 1999-06-02 | 共振器の構造 |
DE69927551T DE69927551T2 (de) | 1998-06-02 | 1999-06-02 | Resonatorstrukturen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI981245A FI106894B (fi) | 1998-06-02 | 1998-06-02 | Resonaattorirakenteita |
FI981245 | 1998-06-02 |
Publications (3)
Publication Number | Publication Date |
---|---|
FI981245A0 FI981245A0 (fi) | 1998-06-02 |
FI981245A FI981245A (fi) | 1999-12-03 |
FI106894B true FI106894B (fi) | 2001-04-30 |
Family
ID=8551881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI981245A FI106894B (fi) | 1998-06-02 | 1998-06-02 | Resonaattorirakenteita |
Country Status (5)
Country | Link |
---|---|
US (1) | US6242843B1 (fr) |
EP (2) | EP0962999A3 (fr) |
JP (1) | JP2000030594A (fr) |
CN (1) | CN1130790C (fr) |
FI (1) | FI106894B (fr) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI108583B (fi) * | 1998-06-02 | 2002-02-15 | Nokia Corp | Resonaattorirakenteita |
JP2000209063A (ja) * | 1998-11-12 | 2000-07-28 | Mitsubishi Electric Corp | 薄膜圧電素子 |
US6566786B2 (en) | 1999-01-14 | 2003-05-20 | The Regents Of The University Of Michigan | Method and apparatus for selecting at least one desired channel utilizing a bank of vibrating micromechanical apparatus |
US6593831B2 (en) | 1999-01-14 | 2003-07-15 | The Regents Of The University Of Michigan | Method and apparatus for filtering signals in a subsystem including a power amplifier utilizing a bank of vibrating micromechanical apparatus |
US6600252B2 (en) | 1999-01-14 | 2003-07-29 | The Regents Of The University Of Michigan | Method and subsystem for processing signals utilizing a plurality of vibrating micromechanical devices |
US6577040B2 (en) * | 1999-01-14 | 2003-06-10 | The Regents Of The University Of Michigan | Method and apparatus for generating a signal having at least one desired output frequency utilizing a bank of vibrating micromechanical devices |
FI107660B (fi) | 1999-07-19 | 2001-09-14 | Nokia Mobile Phones Ltd | Resonaattorirakenne |
JP2003516629A (ja) * | 1999-12-10 | 2003-05-13 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | マイクロメカニカルスイッチを含む電子デバイス |
DE10003704A1 (de) * | 2000-01-28 | 2001-08-09 | Infineon Technologies Ag | Schaltungsanordnung mit Bandpaßfiltern |
DE10007577C1 (de) | 2000-02-18 | 2001-09-13 | Infineon Technologies Ag | Piezoresonator |
CN1383610B (zh) * | 2000-04-06 | 2010-05-26 | Nxp股份有限公司 | 包括谐振器的可调谐滤波器装置 |
EP1285491A2 (fr) * | 2000-04-20 | 2003-02-26 | The Regents Of The University Of Michigan | Procede et appareil employes pour generer un signal ayant au moins une frequence de sortie desiree au moyen d'un groupe de dispositifs micromecaniques vibrants |
US6384697B1 (en) * | 2000-05-08 | 2002-05-07 | Agilent Technologies, Inc. | Cavity spanning bottom electrode of a substrate-mounted bulk wave acoustic resonator |
GB0014630D0 (en) * | 2000-06-16 | 2000-08-09 | Koninkl Philips Electronics Nv | Bulk accoustic wave filter |
SE0101184D0 (sv) * | 2001-04-02 | 2001-04-02 | Ericsson Telefon Ab L M | Micro electromechanical switches |
US7746292B2 (en) * | 2001-04-11 | 2010-06-29 | Kyocera Wireless Corp. | Reconfigurable radiation desensitivity bracket systems and methods |
US6690251B2 (en) * | 2001-04-11 | 2004-02-10 | Kyocera Wireless Corporation | Tunable ferro-electric filter |
US7174147B2 (en) * | 2001-04-11 | 2007-02-06 | Kyocera Wireless Corp. | Bandpass filter with tunable resonator |
US7221243B2 (en) * | 2001-04-11 | 2007-05-22 | Kyocera Wireless Corp. | Apparatus and method for combining electrical signals |
US7394430B2 (en) * | 2001-04-11 | 2008-07-01 | Kyocera Wireless Corp. | Wireless device reconfigurable radiation desensitivity bracket systems and methods |
US7154440B2 (en) * | 2001-04-11 | 2006-12-26 | Kyocera Wireless Corp. | Phase array antenna using a constant-gain phase shifter |
DE60225795T2 (de) | 2001-04-25 | 2009-04-16 | Philips Intellectual Property & Standards Gmbh | Anordnung mit zwei piezoelektrischen schichten und verfahren zum betreiben einer filtereinrichtung |
US6621368B2 (en) | 2001-06-06 | 2003-09-16 | Remec Oy | Dynamic range extension for an electronic circuit |
FI118400B (fi) * | 2001-08-21 | 2007-10-31 | Nokia Corp | Pietsosähköisiä resonaattoreita käsittävä suodinrakenne |
US7180467B2 (en) * | 2002-02-12 | 2007-02-20 | Kyocera Wireless Corp. | System and method for dual-band antenna matching |
US7176845B2 (en) * | 2002-02-12 | 2007-02-13 | Kyocera Wireless Corp. | System and method for impedance matching an antenna to sub-bands in a communication band |
US7184727B2 (en) * | 2002-02-12 | 2007-02-27 | Kyocera Wireless Corp. | Full-duplex antenna system and method |
KR100499126B1 (ko) * | 2002-06-20 | 2005-07-04 | 삼성전자주식회사 | 유기막 멤브레인을 이용한 액츄에이터 |
JP4075503B2 (ja) * | 2002-07-30 | 2008-04-16 | ソニー株式会社 | マイクロマシンおよびその製造方法 |
US6944432B2 (en) * | 2002-11-12 | 2005-09-13 | Nokia Corporation | Crystal-less oscillator transceiver |
WO2004047290A1 (fr) | 2002-11-19 | 2004-06-03 | Koninklijke Philips Electronics N.V. | Duplexeur et procede d'isolement d'une bande rx et d'une bande tx |
FR2852165A1 (fr) * | 2003-03-06 | 2004-09-10 | St Microelectronics Sa | Procede de realisation d'un microresonateur piezolectrique accordable |
JP2004281742A (ja) * | 2003-03-17 | 2004-10-07 | Japan Science & Technology Agency | 半導体素子、半導体センサーおよび半導体記憶素子 |
KR100599083B1 (ko) * | 2003-04-22 | 2006-07-12 | 삼성전자주식회사 | 캔틸레버 형태의 압전 박막 공진 소자 및 그 제조방법 |
US6927651B2 (en) * | 2003-05-12 | 2005-08-09 | Agilent Technologies, Inc. | Acoustic resonator devices having multiple resonant frequencies and methods of making the same |
US20040227578A1 (en) * | 2003-05-14 | 2004-11-18 | Miikka Hamalainen | Acoustic resonance-based frequency synthesizer using at least one bulk acoustic wave (BAW) or thin film bulk acoustic wave (FBAR) device |
US7720443B2 (en) | 2003-06-02 | 2010-05-18 | Kyocera Wireless Corp. | System and method for filtering time division multiple access telephone communications |
US6862441B2 (en) * | 2003-06-09 | 2005-03-01 | Nokia Corporation | Transmitter filter arrangement for multiband mobile phone |
US7196591B2 (en) * | 2003-08-06 | 2007-03-27 | Synergy Microwave Corporation | Tunable frequency, low phase noise and low thermal drift oscillator |
JP2005136588A (ja) * | 2003-10-29 | 2005-05-26 | Sharp Corp | 圧電薄膜共振器、フィルタ、フィルタバンク、フィルタバンク一体型電力増幅器および高周波通信装置 |
DE10352642B4 (de) * | 2003-11-11 | 2018-11-29 | Snaptrack, Inc. | Schaltung mit verringerter Einfügedämpfung und Bauelement mit der Schaltung |
US20050148065A1 (en) * | 2003-12-30 | 2005-07-07 | Intel Corporation | Biosensor utilizing a resonator having a functionalized surface |
FI20040162A0 (fi) | 2004-02-03 | 2004-02-03 | Nokia Oyj | Viitevärähtelijän taajuuden vakauttaminen |
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-
1998
- 1998-06-02 FI FI981245A patent/FI106894B/fi not_active IP Right Cessation
-
1999
- 1999-05-27 US US09/321,339 patent/US6242843B1/en not_active Expired - Lifetime
- 1999-06-02 JP JP11154477A patent/JP2000030594A/ja active Pending
- 1999-06-02 EP EP99304277A patent/EP0962999A3/fr not_active Ceased
- 1999-06-02 CN CN99106965A patent/CN1130790C/zh not_active Expired - Fee Related
- 1999-06-02 EP EP08004288A patent/EP1936733B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0962999A3 (fr) | 2001-05-16 |
EP1936733B1 (fr) | 2011-09-21 |
CN1130790C (zh) | 2003-12-10 |
EP0962999A2 (fr) | 1999-12-08 |
EP1936733A1 (fr) | 2008-06-25 |
FI981245A (fi) | 1999-12-03 |
FI981245A0 (fi) | 1998-06-02 |
JP2000030594A (ja) | 2000-01-28 |
CN1237827A (zh) | 1999-12-08 |
US6242843B1 (en) | 2001-06-05 |
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