FI105314B - Skärm för radiofrekvenskrets - Google Patents
Skärm för radiofrekvenskrets Download PDFInfo
- Publication number
- FI105314B FI105314B FI905710A FI905710A FI105314B FI 105314 B FI105314 B FI 105314B FI 905710 A FI905710 A FI 905710A FI 905710 A FI905710 A FI 905710A FI 105314 B FI105314 B FI 105314B
- Authority
- FI
- Finland
- Prior art keywords
- support
- substrate
- radio frequency
- power module
- jolloin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/1616—Cavity shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/166—Material
- H01L2924/167—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
- Noise Elimination (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Burglar Alarm Systems (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Electrotherapy Devices (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Electronic Switches (AREA)
- Networks Using Active Elements (AREA)
- Transmitters (AREA)
Claims (2)
1. Skärm för radiofrekvenskrets, varvid denna skärm inne-fattar ett underlag (1) som har en aktiv sida och en bak- 5 sida, varvid underlaget omfattar & ena sidan ett jordplan (8) beläget p4 dess baksida eller pä ett inre skikt av underlaget och ä andra sidan en cell hos kretsen anordnad p& den aktiva sidan av underlaget och täckt av en metall-käpa (15), varvid underlaget pä sin aktiva sida dessutom 10 innefattar ett monster (7) pä vilket nämnda käpa anbrin- gas och en ring av häl (10) beklädda med ett elektriskt ledande material som förbinder nämnda monster (7) med nämnda jordplan (8), kännetecknad av att underlaget pä sin aktiva sida innefattar en värmeutväxlingsyta (17) pä 15 vilken är fäst en kraftmodul (16), varvid denna värmeutväxlingsyta är täckt av ett material som har en god värmeledningsförmäga och sträcker sig & ena sidan under cellens kraftmodul (16) och ä andra sidan under en eller fler av käpans väggar (18) belägna i den omedelbara när-20 heten av kraftmodulen.
1. Radiotaajuuspiirin suojus, jolloin tämä suojus muodostuu alustasta (1), jolla on aktiivipinta ja takapinta, jolloin alustaan kuuluu toisaalta maattopinta (8), joka 15 on sen takapinnalla tai alustan yhdessä välikerroksessa ja toisaalta alustan aktiivipinnalle sovitettu piirijär-jestely ja joka on peitetty metallikotelolla (15), jolloin alustalla on aktiivipinnallaan lisäksi pintakuvio (7), jonka päälle kotelo sijoitetaan ja sähköä johtavalla 20 materiaalilla vuoratuista rei'ista (10) muodostuva kehys, joka yhdistää pintakuvion (7) maattopintaan (8), tunnettu siitä, että alustan aktiivipinnalla on lämmönvaihtopinta (17), jolle tehomoduuli (16) on kiinnitetty, jolloin tämä lämmönvaihtopinta on päällystetty materiaalilla, jolla on 25 hyvä lämmönjohtavuus ja joka ulottuu toisaalta piirijär- * jestelyyn kuuluvan tehomoduulin (16) alle ja toisaalta • · tehomoduulin välittömässä läheisyydessä sijaitsevan kote- • · · V · lon yhden tai useamman seinämän (18) alle. :***: 30 2. Patenttivaatimuksen 1 mukainen suojus, tunnettu siitä, • · · "**: että se välimatka, joka erottaa alustassa (1) olevat kak- • · # *. si peräkkäistä reikää (10) toisistaan, on pienempi kuin • M kolmasosa radiotaajuuspiirin käsittelemien signaalien aallonpituudesta. % « « e f e c i i i « t «Il « «i « i 6 105314
2. Avskärmning enligt krav l kännetecknad av att avstän-det som ätskiljer tvä efter varandra följande häl (10) i nämnda underlag (1) är mindre än en tredjedel av vägläng- ' 25 den av signalerna bearbetade av radiofrekvenskretsen. « I C f It· · • · · • · • · • ·· ··· • » · • · e « · • » • · · ·»· • · ·· · * M· • IM ' IM * « • « » • lii • · f • · • * · · * «
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8915188 | 1989-11-20 | ||
FR8915188A FR2654891A1 (fr) | 1989-11-20 | 1989-11-20 | Blindage pour circuit radiofrequence. |
Publications (3)
Publication Number | Publication Date |
---|---|
FI905710A0 FI905710A0 (fi) | 1990-11-19 |
FI905710A FI905710A (fi) | 1991-05-21 |
FI105314B true FI105314B (sv) | 2000-07-14 |
Family
ID=9387550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI905710A FI105314B (sv) | 1989-11-20 | 1990-11-19 | Skärm för radiofrekvenskrets |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0429037B1 (sv) |
AT (1) | ATE103462T1 (sv) |
AU (1) | AU639501B2 (sv) |
DE (1) | DE69007589T2 (sv) |
DK (1) | DK0429037T3 (sv) |
ES (1) | ES2050913T3 (sv) |
FI (1) | FI105314B (sv) |
FR (1) | FR2654891A1 (sv) |
NO (1) | NO176420C (sv) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5053924A (en) * | 1990-03-30 | 1991-10-01 | Motorola, Inc. | Electromagnetic shield for electrical circuit |
FR2687270A1 (fr) * | 1992-02-11 | 1993-08-13 | Platon Jean Pierre | Dispositif d'emission de puissance miniaturise. |
AU662950B2 (en) * | 1992-02-12 | 1995-09-21 | Alcatel N.V. | An electromagnetic interference shield arrangement |
DE9208148U1 (de) * | 1992-06-17 | 1993-10-21 | Siemens AG, 80333 München | Videorecorder |
FR2701603B1 (fr) * | 1993-02-16 | 1995-04-14 | Alcatel Telspace | Système de connexion électrique de masse entre une embase coaxiale et une semelle d'un circuit hyperfréquence et dispositif de liaison électrique utilisé dans un tel système. |
DE4327766C2 (de) * | 1993-08-18 | 1997-04-24 | Hella Kg Hueck & Co | Schaltungsanordnung für Kraftfahrzeuge |
DE9313327U1 (de) * | 1993-09-04 | 1993-11-18 | Telenorma Gmbh, 60327 Frankfurt | Gehäuseanordnung für eine Telekommunikations-Vermittlungsanlage |
US5621363A (en) * | 1994-10-03 | 1997-04-15 | Motorola, Inc. | Modem having an electromagnetic shield for a controller |
DE19522455A1 (de) * | 1995-06-21 | 1997-01-02 | Telefunken Microelectron | EMV-Abschirmung bei elektronischen Bauelementen |
JP2004158605A (ja) | 2002-11-06 | 2004-06-03 | Konica Minolta Holdings Inc | プリント配線基板、及びプリント配線基板の導電性筐体への取付方法 |
US7359693B2 (en) | 2003-05-23 | 2008-04-15 | Rfstream Corporation | Enclosure and substrate structure for a tuner module |
DE10333806A1 (de) * | 2003-07-24 | 2005-02-17 | Siemens Ag | Leiterplatte und Verfahren zur Herstellung einer Leiterplatte |
DE102006024551A1 (de) | 2006-05-23 | 2007-11-29 | Siemens Ag | Elektrische Einrichtung mit Abschirmung |
DE102007032593B3 (de) * | 2007-07-12 | 2008-11-13 | Continental Automotive Gmbh | Steuervorrichtung |
DE102007048159B4 (de) * | 2007-10-08 | 2009-07-23 | Eubus Gmbh | Gehäuse zur Aufnahme elektrischer oder elektronischer Bauteile und/oder Komponenten, inbesondere Hochfrequenzkomponenten |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1243175A (en) * | 1967-09-01 | 1971-08-18 | Lucas Industries Ltd | Electrical component assemblies |
DE2656489C3 (de) * | 1976-12-14 | 1984-09-20 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Leiterplatte für eine Hochfrequenz- Schaltungsanordnung |
DE3520531A1 (de) * | 1985-06-07 | 1986-12-11 | Hagenuk GmbH, 2300 Kiel | Elektromagnetische abschirmung fuer leiterplatten |
JPH0627995Y2 (ja) * | 1986-03-20 | 1994-07-27 | 株式会社東芝 | シ−ルド構造 |
JPH0669120B2 (ja) * | 1986-06-20 | 1994-08-31 | 松下電器産業株式会社 | シ−ルド装置 |
DE3811313A1 (de) * | 1988-04-02 | 1989-10-19 | Messerschmitt Boelkow Blohm | Gehaeuse fuer hybrid-schaltungen |
-
1989
- 1989-11-20 FR FR8915188A patent/FR2654891A1/fr active Pending
-
1990
- 1990-11-08 AU AU65918/90A patent/AU639501B2/en not_active Ceased
- 1990-11-15 NO NO904965A patent/NO176420C/no not_active IP Right Cessation
- 1990-11-19 DE DE69007589T patent/DE69007589T2/de not_active Expired - Lifetime
- 1990-11-19 ES ES90122070T patent/ES2050913T3/es not_active Expired - Lifetime
- 1990-11-19 DK DK90122070.7T patent/DK0429037T3/da active
- 1990-11-19 AT AT90122070T patent/ATE103462T1/de not_active IP Right Cessation
- 1990-11-19 EP EP90122070A patent/EP0429037B1/fr not_active Expired - Lifetime
- 1990-11-19 FI FI905710A patent/FI105314B/sv not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU639501B2 (en) | 1993-07-29 |
NO904965D0 (no) | 1990-11-15 |
AU6591890A (en) | 1991-05-23 |
FI905710A (fi) | 1991-05-21 |
NO176420C (no) | 1995-03-29 |
DK0429037T3 (da) | 1994-06-20 |
FI905710A0 (fi) | 1990-11-19 |
NO176420B (no) | 1994-12-19 |
FR2654891A1 (fr) | 1991-05-24 |
ES2050913T3 (es) | 1994-06-01 |
EP0429037B1 (fr) | 1994-03-23 |
DE69007589T2 (de) | 1994-06-30 |
NO904965L (no) | 1991-05-21 |
EP0429037A1 (fr) | 1991-05-29 |
ATE103462T1 (de) | 1994-04-15 |
DE69007589D1 (de) | 1994-04-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM | Patent lapsed |
Owner name: ALCATEL RADIOTELEPHONE |