FI105314B - Skärm för radiofrekvenskrets - Google Patents

Skärm för radiofrekvenskrets Download PDF

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Publication number
FI105314B
FI105314B FI905710A FI905710A FI105314B FI 105314 B FI105314 B FI 105314B FI 905710 A FI905710 A FI 905710A FI 905710 A FI905710 A FI 905710A FI 105314 B FI105314 B FI 105314B
Authority
FI
Finland
Prior art keywords
support
substrate
radio frequency
power module
jolloin
Prior art date
Application number
FI905710A
Other languages
English (en)
Finnish (fi)
Other versions
FI905710A0 (fi
FI905710A (fi
Inventor
Van Christian Trinh
Original Assignee
Alcatel Radiotelephone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Radiotelephone filed Critical Alcatel Radiotelephone
Publication of FI905710A0 publication Critical patent/FI905710A0/fi
Publication of FI905710A publication Critical patent/FI905710A/fi
Application granted granted Critical
Publication of FI105314B publication Critical patent/FI105314B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616—Cavity shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/166—Material
    • H01L2924/167—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Noise Elimination (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
  • Electrotherapy Devices (AREA)
  • Networks Using Active Elements (AREA)
  • Electronic Switches (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Burglar Alarm Systems (AREA)
  • Transmitters (AREA)

Claims (2)

1. Skärm för radiofrekvenskrets, varvid denna skärm inne-fattar ett underlag (1) som har en aktiv sida och en bak- 5 sida, varvid underlaget omfattar & ena sidan ett jordplan (8) beläget p4 dess baksida eller pä ett inre skikt av underlaget och ä andra sidan en cell hos kretsen anordnad p& den aktiva sidan av underlaget och täckt av en metall-käpa (15), varvid underlaget pä sin aktiva sida dessutom 10 innefattar ett monster (7) pä vilket nämnda käpa anbrin- gas och en ring av häl (10) beklädda med ett elektriskt ledande material som förbinder nämnda monster (7) med nämnda jordplan (8), kännetecknad av att underlaget pä sin aktiva sida innefattar en värmeutväxlingsyta (17) pä 15 vilken är fäst en kraftmodul (16), varvid denna värmeutväxlingsyta är täckt av ett material som har en god värmeledningsförmäga och sträcker sig & ena sidan under cellens kraftmodul (16) och ä andra sidan under en eller fler av käpans väggar (18) belägna i den omedelbara när-20 heten av kraftmodulen.
1. Radiotaajuuspiirin suojus, jolloin tämä suojus muodostuu alustasta (1), jolla on aktiivipinta ja takapinta, jolloin alustaan kuuluu toisaalta maattopinta (8), joka 15 on sen takapinnalla tai alustan yhdessä välikerroksessa ja toisaalta alustan aktiivipinnalle sovitettu piirijär-jestely ja joka on peitetty metallikotelolla (15), jolloin alustalla on aktiivipinnallaan lisäksi pintakuvio (7), jonka päälle kotelo sijoitetaan ja sähköä johtavalla 20 materiaalilla vuoratuista rei'ista (10) muodostuva kehys, joka yhdistää pintakuvion (7) maattopintaan (8), tunnettu siitä, että alustan aktiivipinnalla on lämmönvaihtopinta (17), jolle tehomoduuli (16) on kiinnitetty, jolloin tämä lämmönvaihtopinta on päällystetty materiaalilla, jolla on 25 hyvä lämmönjohtavuus ja joka ulottuu toisaalta piirijär- * jestelyyn kuuluvan tehomoduulin (16) alle ja toisaalta • · tehomoduulin välittömässä läheisyydessä sijaitsevan kote- • · · V · lon yhden tai useamman seinämän (18) alle. :***: 30 2. Patenttivaatimuksen 1 mukainen suojus, tunnettu siitä, • · · "**: että se välimatka, joka erottaa alustassa (1) olevat kak- • · # *. si peräkkäistä reikää (10) toisistaan, on pienempi kuin • M kolmasosa radiotaajuuspiirin käsittelemien signaalien aallonpituudesta. % « « e f e c i i i « t «Il « «i « i 6 105314
2. Avskärmning enligt krav l kännetecknad av att avstän-det som ätskiljer tvä efter varandra följande häl (10) i nämnda underlag (1) är mindre än en tredjedel av vägläng- ' 25 den av signalerna bearbetade av radiofrekvenskretsen. « I C f It· · • · · • · • · • ·· ··· • » · • · e « · • » • · · ·»· • · ·· · * M· • IM ' IM * « • « » • lii • · f • · • * · · * «
FI905710A 1989-11-20 1990-11-19 Skärm för radiofrekvenskrets FI105314B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8915188A FR2654891A1 (fr) 1989-11-20 1989-11-20 Blindage pour circuit radiofrequence.
FR8915188 1989-11-20

Publications (3)

Publication Number Publication Date
FI905710A0 FI905710A0 (fi) 1990-11-19
FI905710A FI905710A (fi) 1991-05-21
FI105314B true FI105314B (sv) 2000-07-14

Family

ID=9387550

Family Applications (1)

Application Number Title Priority Date Filing Date
FI905710A FI105314B (sv) 1989-11-20 1990-11-19 Skärm för radiofrekvenskrets

Country Status (9)

Country Link
EP (1) EP0429037B1 (sv)
AT (1) ATE103462T1 (sv)
AU (1) AU639501B2 (sv)
DE (1) DE69007589T2 (sv)
DK (1) DK0429037T3 (sv)
ES (1) ES2050913T3 (sv)
FI (1) FI105314B (sv)
FR (1) FR2654891A1 (sv)
NO (1) NO176420C (sv)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053924A (en) * 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
FR2687270A1 (fr) * 1992-02-11 1993-08-13 Platon Jean Pierre Dispositif d'emission de puissance miniaturise.
AU662950B2 (en) * 1992-02-12 1995-09-21 Alcatel N.V. An electromagnetic interference shield arrangement
DE9208148U1 (de) * 1992-06-17 1993-10-21 Siemens AG, 80333 München Videorecorder
FR2701603B1 (fr) * 1993-02-16 1995-04-14 Alcatel Telspace Système de connexion électrique de masse entre une embase coaxiale et une semelle d'un circuit hyperfréquence et dispositif de liaison électrique utilisé dans un tel système.
DE4327766C2 (de) * 1993-08-18 1997-04-24 Hella Kg Hueck & Co Schaltungsanordnung für Kraftfahrzeuge
DE9313327U1 (de) * 1993-09-04 1993-11-18 Telenorma Gmbh, 60327 Frankfurt Gehäuseanordnung für eine Telekommunikations-Vermittlungsanlage
US5621363A (en) * 1994-10-03 1997-04-15 Motorola, Inc. Modem having an electromagnetic shield for a controller
DE19522455A1 (de) * 1995-06-21 1997-01-02 Telefunken Microelectron EMV-Abschirmung bei elektronischen Bauelementen
JP2004158605A (ja) * 2002-11-06 2004-06-03 Konica Minolta Holdings Inc プリント配線基板、及びプリント配線基板の導電性筐体への取付方法
US7359693B2 (en) 2003-05-23 2008-04-15 Rfstream Corporation Enclosure and substrate structure for a tuner module
DE10333806A1 (de) * 2003-07-24 2005-02-17 Siemens Ag Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
DE102006024551A1 (de) 2006-05-23 2007-11-29 Siemens Ag Elektrische Einrichtung mit Abschirmung
DE102007032593B3 (de) * 2007-07-12 2008-11-13 Continental Automotive Gmbh Steuervorrichtung
DE102007048159B4 (de) * 2007-10-08 2009-07-23 Eubus Gmbh Gehäuse zur Aufnahme elektrischer oder elektronischer Bauteile und/oder Komponenten, inbesondere Hochfrequenzkomponenten
CN115250610A (zh) * 2022-06-13 2022-10-28 宁波宁捷电子有限公司 电视信号放大器结构及其制造工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1243175A (en) * 1967-09-01 1971-08-18 Lucas Industries Ltd Electrical component assemblies
DE2656489C3 (de) * 1976-12-14 1984-09-20 Standard Elektrik Lorenz Ag, 7000 Stuttgart Leiterplatte für eine Hochfrequenz- Schaltungsanordnung
DE3520531A1 (de) * 1985-06-07 1986-12-11 Hagenuk GmbH, 2300 Kiel Elektromagnetische abschirmung fuer leiterplatten
JPH0627995Y2 (ja) * 1986-03-20 1994-07-27 株式会社東芝 シ−ルド構造
JPH0669120B2 (ja) * 1986-06-20 1994-08-31 松下電器産業株式会社 シ−ルド装置
DE3811313A1 (de) * 1988-04-02 1989-10-19 Messerschmitt Boelkow Blohm Gehaeuse fuer hybrid-schaltungen

Also Published As

Publication number Publication date
ATE103462T1 (de) 1994-04-15
DE69007589D1 (de) 1994-04-28
NO176420C (no) 1995-03-29
AU639501B2 (en) 1993-07-29
NO904965D0 (no) 1990-11-15
ES2050913T3 (es) 1994-06-01
NO904965L (no) 1991-05-21
EP0429037B1 (fr) 1994-03-23
AU6591890A (en) 1991-05-23
EP0429037A1 (fr) 1991-05-29
DE69007589T2 (de) 1994-06-30
FI905710A0 (fi) 1990-11-19
FR2654891A1 (fr) 1991-05-24
DK0429037T3 (da) 1994-06-20
NO176420B (no) 1994-12-19
FI905710A (fi) 1991-05-21

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MM Patent lapsed

Owner name: ALCATEL RADIOTELEPHONE