ES2050913T3 - Blindaje para circuito radiofrecuencia. - Google Patents

Blindaje para circuito radiofrecuencia.

Info

Publication number
ES2050913T3
ES2050913T3 ES90122070T ES90122070T ES2050913T3 ES 2050913 T3 ES2050913 T3 ES 2050913T3 ES 90122070 T ES90122070 T ES 90122070T ES 90122070 T ES90122070 T ES 90122070T ES 2050913 T3 ES2050913 T3 ES 2050913T3
Authority
ES
Spain
Prior art keywords
support
pattern feature
shielding
radio frequency
frequency circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES90122070T
Other languages
English (en)
Inventor
Van Christian Trinh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel CIT SA
Original Assignee
Alcatel Radiotelephone SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Radiotelephone SA filed Critical Alcatel Radiotelephone SA
Application granted granted Critical
Publication of ES2050913T3 publication Critical patent/ES2050913T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616—Cavity shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/166—Material
    • H01L2924/167—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Noise Elimination (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
  • Electrotherapy Devices (AREA)
  • Networks Using Active Elements (AREA)
  • Electronic Switches (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Burglar Alarm Systems (AREA)
  • Transmitters (AREA)

Abstract

LA PRESENTE INVECION SE REFIERE A UN CIRCUITO ELECTRONICO BLINDADO PARA SEÑALES RADIOFRECUENCIA. EL CIRCUITO ELECTRONICO BLINDADO PARA SEÑALES RADIOFRECUENCIA COMPRENDE, SOBRE UN SOPORTE (1), UNA CELULA (5) DISPUESTA ENCIMA DE UN PLANO DE MASA (8) Y CUBIERTA CON UN CAPO METALICO (6). ADEMAS, EL SOPORTE COMPRENDE UN MOTIVO (7) SOBRE EL CUAL SE APLICA ESTE CAPO Y UN CINTURON CON AGUJEROS (10) REVESTIDOS CON UN MATERIAL ELECTRICAMENTE CONDUCTOR QUE UNE ESTE MOTIVO AL PLANO DE MASA. LA CELULA (5) COMPRENDE UN MODULO DE POTENCIA (16), EL SOPORTE (1) COMPRENDE UNA SUPERFICIE DE INTERCAMBIO (17) SOBRE LA CUAL ESTA FIJADO ESE MODULO DE POTENCIA, QUE SE EXTIENDE HASTA EL MOTIVO (7).
ES90122070T 1989-11-20 1990-11-19 Blindaje para circuito radiofrecuencia. Expired - Lifetime ES2050913T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8915188A FR2654891A1 (fr) 1989-11-20 1989-11-20 Blindage pour circuit radiofrequence.

Publications (1)

Publication Number Publication Date
ES2050913T3 true ES2050913T3 (es) 1994-06-01

Family

ID=9387550

Family Applications (1)

Application Number Title Priority Date Filing Date
ES90122070T Expired - Lifetime ES2050913T3 (es) 1989-11-20 1990-11-19 Blindaje para circuito radiofrecuencia.

Country Status (9)

Country Link
EP (1) EP0429037B1 (es)
AT (1) ATE103462T1 (es)
AU (1) AU639501B2 (es)
DE (1) DE69007589T2 (es)
DK (1) DK0429037T3 (es)
ES (1) ES2050913T3 (es)
FI (1) FI105314B (es)
FR (1) FR2654891A1 (es)
NO (1) NO176420C (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053924A (en) * 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
FR2687270A1 (fr) * 1992-02-11 1993-08-13 Platon Jean Pierre Dispositif d'emission de puissance miniaturise.
AU662950B2 (en) * 1992-02-12 1995-09-21 Alcatel N.V. An electromagnetic interference shield arrangement
DE9208148U1 (de) * 1992-06-17 1993-10-21 Siemens AG, 80333 München Videorecorder
FR2701603B1 (fr) * 1993-02-16 1995-04-14 Alcatel Telspace Système de connexion électrique de masse entre une embase coaxiale et une semelle d'un circuit hyperfréquence et dispositif de liaison électrique utilisé dans un tel système.
DE4327766C2 (de) * 1993-08-18 1997-04-24 Hella Kg Hueck & Co Schaltungsanordnung für Kraftfahrzeuge
DE9313327U1 (de) * 1993-09-04 1993-11-18 Telenorma Gmbh, 60327 Frankfurt Gehäuseanordnung für eine Telekommunikations-Vermittlungsanlage
US5621363A (en) * 1994-10-03 1997-04-15 Motorola, Inc. Modem having an electromagnetic shield for a controller
DE19522455A1 (de) * 1995-06-21 1997-01-02 Telefunken Microelectron EMV-Abschirmung bei elektronischen Bauelementen
JP2004158605A (ja) * 2002-11-06 2004-06-03 Konica Minolta Holdings Inc プリント配線基板、及びプリント配線基板の導電性筐体への取付方法
US7359693B2 (en) 2003-05-23 2008-04-15 Rfstream Corporation Enclosure and substrate structure for a tuner module
DE10333806A1 (de) * 2003-07-24 2005-02-17 Siemens Ag Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
DE102006024551A1 (de) * 2006-05-23 2007-11-29 Siemens Ag Elektrische Einrichtung mit Abschirmung
DE102007032593B3 (de) * 2007-07-12 2008-11-13 Continental Automotive Gmbh Steuervorrichtung
DE102007048159B4 (de) * 2007-10-08 2009-07-23 Eubus Gmbh Gehäuse zur Aufnahme elektrischer oder elektronischer Bauteile und/oder Komponenten, inbesondere Hochfrequenzkomponenten
CN115250610B (zh) * 2022-06-13 2024-09-27 宁波宁捷电子有限公司 电视信号放大器结构及其制造工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1243175A (en) * 1967-09-01 1971-08-18 Lucas Industries Ltd Electrical component assemblies
DE2656489C3 (de) * 1976-12-14 1984-09-20 Standard Elektrik Lorenz Ag, 7000 Stuttgart Leiterplatte für eine Hochfrequenz- Schaltungsanordnung
DE3520531A1 (de) * 1985-06-07 1986-12-11 Hagenuk GmbH, 2300 Kiel Elektromagnetische abschirmung fuer leiterplatten
JPH0627995Y2 (ja) * 1986-03-20 1994-07-27 株式会社東芝 シ−ルド構造
JPH0669120B2 (ja) * 1986-06-20 1994-08-31 松下電器産業株式会社 シ−ルド装置
DE3811313A1 (de) * 1988-04-02 1989-10-19 Messerschmitt Boelkow Blohm Gehaeuse fuer hybrid-schaltungen

Also Published As

Publication number Publication date
AU6591890A (en) 1991-05-23
AU639501B2 (en) 1993-07-29
NO904965L (no) 1991-05-21
FR2654891A1 (fr) 1991-05-24
FI105314B (fi) 2000-07-14
DE69007589D1 (de) 1994-04-28
NO176420B (no) 1994-12-19
FI905710A0 (fi) 1990-11-19
NO904965D0 (no) 1990-11-15
DE69007589T2 (de) 1994-06-30
EP0429037B1 (fr) 1994-03-23
EP0429037A1 (fr) 1991-05-29
NO176420C (no) 1995-03-29
FI905710A (fi) 1991-05-21
ATE103462T1 (de) 1994-04-15
DK0429037T3 (da) 1994-06-20

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