NO176420C - Avskjerming for en höyfrekvenskrets - Google Patents

Avskjerming for en höyfrekvenskrets

Info

Publication number
NO176420C
NO176420C NO904965A NO904965A NO176420C NO 176420 C NO176420 C NO 176420C NO 904965 A NO904965 A NO 904965A NO 904965 A NO904965 A NO 904965A NO 176420 C NO176420 C NO 176420C
Authority
NO
Norway
Prior art keywords
support
pattern feature
shielding
high frequency
frequency circuit
Prior art date
Application number
NO904965A
Other languages
English (en)
Other versions
NO176420B (no
NO904965L (no
NO904965D0 (no
Inventor
Christian Trinh Van
Original Assignee
Alcatel Radiotelephone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Radiotelephone filed Critical Alcatel Radiotelephone
Publication of NO904965D0 publication Critical patent/NO904965D0/no
Publication of NO904965L publication Critical patent/NO904965L/no
Publication of NO176420B publication Critical patent/NO176420B/no
Publication of NO176420C publication Critical patent/NO176420C/no

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0039Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616Cavity shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/166Material
    • H01L2924/167Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
NO904965A 1989-11-20 1990-11-15 Avskjerming for en höyfrekvenskrets NO176420C (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8915188A FR2654891A1 (fr) 1989-11-20 1989-11-20 Blindage pour circuit radiofrequence.

Publications (4)

Publication Number Publication Date
NO904965D0 NO904965D0 (no) 1990-11-15
NO904965L NO904965L (no) 1991-05-21
NO176420B NO176420B (no) 1994-12-19
NO176420C true NO176420C (no) 1995-03-29

Family

ID=9387550

Family Applications (1)

Application Number Title Priority Date Filing Date
NO904965A NO176420C (no) 1989-11-20 1990-11-15 Avskjerming for en höyfrekvenskrets

Country Status (9)

Country Link
EP (1) EP0429037B1 (no)
AT (1) ATE103462T1 (no)
AU (1) AU639501B2 (no)
DE (1) DE69007589T2 (no)
DK (1) DK0429037T3 (no)
ES (1) ES2050913T3 (no)
FI (1) FI105314B (no)
FR (1) FR2654891A1 (no)
NO (1) NO176420C (no)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053924A (en) * 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
FR2687270A1 (fr) * 1992-02-11 1993-08-13 Platon Jean Pierre Dispositif d'emission de puissance miniaturise.
AU662950B2 (en) * 1992-02-12 1995-09-21 Alcatel N.V. An electromagnetic interference shield arrangement
DE9208148U1 (de) * 1992-06-17 1993-10-21 Siemens Ag Videorecorder
FR2701603B1 (fr) * 1993-02-16 1995-04-14 Alcatel Telspace Système de connexion électrique de masse entre une embase coaxiale et une semelle d'un circuit hyperfréquence et dispositif de liaison électrique utilisé dans un tel système.
DE4327766C2 (de) * 1993-08-18 1997-04-24 Hella Kg Hueck & Co Schaltungsanordnung für Kraftfahrzeuge
DE9313327U1 (de) * 1993-09-04 1993-11-18 Telefonbau & Normalzeit Gmbh Gehäuseanordnung für eine Telekommunikations-Vermittlungsanlage
US5621363A (en) * 1994-10-03 1997-04-15 Motorola, Inc. Modem having an electromagnetic shield for a controller
DE19522455A1 (de) * 1995-06-21 1997-01-02 Telefunken Microelectron EMV-Abschirmung bei elektronischen Bauelementen
JP2004158605A (ja) * 2002-11-06 2004-06-03 Konica Minolta Holdings Inc プリント配線基板、及びプリント配線基板の導電性筐体への取付方法
US7359693B2 (en) 2003-05-23 2008-04-15 Rfstream Corporation Enclosure and substrate structure for a tuner module
DE10333806A1 (de) * 2003-07-24 2005-02-17 Siemens Ag Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
DE102006024551A1 (de) 2006-05-23 2007-11-29 Siemens Ag Elektrische Einrichtung mit Abschirmung
DE102007032593B3 (de) * 2007-07-12 2008-11-13 Continental Automotive Gmbh Steuervorrichtung
DE102007048159B4 (de) * 2007-10-08 2009-07-23 Eubus Gmbh Gehäuse zur Aufnahme elektrischer oder elektronischer Bauteile und/oder Komponenten, inbesondere Hochfrequenzkomponenten

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1243175A (en) * 1967-09-01 1971-08-18 Lucas Industries Ltd Electrical component assemblies
DE2656489C3 (de) * 1976-12-14 1984-09-20 Standard Elektrik Lorenz Ag, 7000 Stuttgart Leiterplatte für eine Hochfrequenz- Schaltungsanordnung
DE3520531A1 (de) * 1985-06-07 1986-12-11 Hagenuk GmbH, 2300 Kiel Elektromagnetische abschirmung fuer leiterplatten
JPH0627995Y2 (ja) * 1986-03-20 1994-07-27 株式会社東芝 シ−ルド構造
JPH0669120B2 (ja) * 1986-06-20 1994-08-31 松下電器産業株式会社 シ−ルド装置
DE3811313A1 (de) * 1988-04-02 1989-10-19 Messerschmitt Boelkow Blohm Gehaeuse fuer hybrid-schaltungen

Also Published As

Publication number Publication date
EP0429037B1 (fr) 1994-03-23
FI905710A (fi) 1991-05-21
NO176420B (no) 1994-12-19
DE69007589D1 (de) 1994-04-28
FR2654891A1 (fr) 1991-05-24
DE69007589T2 (de) 1994-06-30
AU6591890A (en) 1991-05-23
ES2050913T3 (es) 1994-06-01
FI105314B (fi) 2000-07-14
FI905710A0 (fi) 1990-11-19
ATE103462T1 (de) 1994-04-15
AU639501B2 (en) 1993-07-29
DK0429037T3 (da) 1994-06-20
NO904965L (no) 1991-05-21
EP0429037A1 (fr) 1991-05-29
NO904965D0 (no) 1990-11-15

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Legal Events

Date Code Title Description
MM1K Lapsed by not paying the annual fees

Free format text: LAPSED IN MAY 2001