ES462931A1 - Procedimiento para formar una capa epitaxial de un material sobre una superficie de un substrato. - Google Patents
Procedimiento para formar una capa epitaxial de un material sobre una superficie de un substrato.Info
- Publication number
- ES462931A1 ES462931A1 ES462931A ES462931A ES462931A1 ES 462931 A1 ES462931 A1 ES 462931A1 ES 462931 A ES462931 A ES 462931A ES 462931 A ES462931 A ES 462931A ES 462931 A1 ES462931 A1 ES 462931A1
- Authority
- ES
- Spain
- Prior art keywords
- substrate
- formation
- heat radiation
- epitaxial layers
- uniform heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 title abstract 7
- 230000005855 radiation Effects 0.000 title abstract 2
- 230000015572 biosynthetic process Effects 0.000 title 1
- 238000010438 heat treatment Methods 0.000 title 1
- 235000012431 wafers Nutrition 0.000 title 1
- 238000000151 deposition Methods 0.000 abstract 3
- 230000008021 deposition Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 238000009825 accumulation Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/04—Pattern deposit, e.g. by using masks
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Abstract
Procedimiento para formar una capa epitaxial de un material sobre una superficie de un substrato, que comprende montar el substrato en un reactor de deposición epitaxial y depositar una capa de material sobre el substrato, caracterizado porque durante la deposición; las partes periféricas del substrato se dejan comprendidas al menos parcialmente dentro de un elemento de enmascaramiento para inhibir la acumulación de la capa sobre las partes periféricas del substrato y para reducir la radiación térmica desde dichas partes e igualar la temperatura de un lado al otro del substrato con el fin de reducir la generación de dislocaciones de deslizamiento en el mismo.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72968276A | 1976-10-05 | 1976-10-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES462931A1 true ES462931A1 (es) | 1978-06-01 |
Family
ID=24932135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES462931A Expired ES462931A1 (es) | 1976-10-05 | 1977-10-05 | Procedimiento para formar una capa epitaxial de un material sobre una superficie de un substrato. |
Country Status (9)
Country | Link |
---|---|
US (1) | US4113547A (es) |
JP (1) | JPS5346274A (es) |
BE (1) | BE859262A (es) |
DE (1) | DE2744601A1 (es) |
ES (1) | ES462931A1 (es) |
FR (1) | FR2366871A1 (es) |
IT (1) | IT1091351B (es) |
NL (1) | NL7710659A (es) |
SE (1) | SE7710800L (es) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE7707767U1 (de) * | 1977-03-14 | 1977-09-08 | Balzers Hochvakuum Gmbh, 6200 Wiesbaden | Halterung fuer substratplaettchen |
US4386255A (en) * | 1979-12-17 | 1983-05-31 | Rca Corporation | Susceptor for rotary disc reactor |
US4469529A (en) * | 1981-12-04 | 1984-09-04 | Ushio Denki Kabushiki Kaisha | Method for heating semiconductor wafer by means of application of radiated light with supplemental circumferential heating |
US4468259A (en) * | 1981-12-04 | 1984-08-28 | Ushio Denki Kabushiki Kaisha | Uniform wafer heating by controlling light source and circumferential heating of wafer |
JPS58223320A (ja) * | 1982-06-22 | 1983-12-24 | Ushio Inc | 不純物拡散方法 |
US4535228A (en) * | 1982-12-28 | 1985-08-13 | Ushio Denki Kabushiki Kaisha | Heater assembly and a heat-treatment method of semiconductor wafer using the same |
US4504730A (en) * | 1983-10-04 | 1985-03-12 | Ushio Denki Kabushiki Kaisha | Method for heating semiconductor wafer by means of application of radiated light |
US4535227A (en) * | 1983-10-04 | 1985-08-13 | Ushio Denki Kabushiki Kaisha | Method for heating semiconductor wafer by means of application of radiated light |
US4560420A (en) * | 1984-06-13 | 1985-12-24 | At&T Technologies, Inc. | Method for reducing temperature variations across a semiconductor wafer during heating |
US5308594A (en) * | 1985-12-04 | 1994-05-03 | Massachusetts Institute Of Technology | Edge-heat-sink technique for zone melting recrystallization of semiconductor-on-insulator films |
US5296089A (en) * | 1985-12-04 | 1994-03-22 | Massachusetts Institute Of Technology | Enhanced radiative zone-melting recrystallization method and apparatus |
US4780174A (en) * | 1986-12-05 | 1988-10-25 | Lan Shan Ming | Dislocation-free epitaxial growth in radio-frequency heating reactor |
US5198034A (en) * | 1987-03-31 | 1993-03-30 | Epsilon Technology, Inc. | Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment |
US4981815A (en) * | 1988-05-09 | 1991-01-01 | Siemens Aktiengesellschaft | Method for rapidly thermally processing a semiconductor wafer by irradiation using semicircular or parabolic reflectors |
US5169453A (en) * | 1989-03-20 | 1992-12-08 | Toyoko Kagaku Co., Ltd. | Wafer supporting jig and a decompressed gas phase growth method using such a jig |
US4932358A (en) * | 1989-05-18 | 1990-06-12 | Genus, Inc. | Perimeter wafer seal |
US5094885A (en) * | 1990-10-12 | 1992-03-10 | Genus, Inc. | Differential pressure cvd chuck |
US5149675A (en) * | 1990-12-31 | 1992-09-22 | Texas Instruments Incorporated | Ring crystallization of wafers to prevent thermal shock |
US5820686A (en) * | 1993-01-21 | 1998-10-13 | Moore Epitaxial, Inc. | Multi-layer susceptor for rapid thermal process reactors |
US5444217A (en) * | 1993-01-21 | 1995-08-22 | Moore Epitaxial Inc. | Rapid thermal processing apparatus for processing semiconductor wafers |
US5580388A (en) * | 1993-01-21 | 1996-12-03 | Moore Epitaxial, Inc. | Multi-layer susceptor for rapid thermal process reactors |
JP3184000B2 (ja) * | 1993-05-10 | 2001-07-09 | 株式会社東芝 | 薄膜の形成方法およびその装置 |
US5590239A (en) * | 1994-06-06 | 1996-12-31 | Motorola | Planar uniform heating surface with additional circumscribing ring |
US6279506B1 (en) | 1995-06-26 | 2001-08-28 | Aixtron Ag | Reactor for coating plane substrates and method for producing said substrates |
WO1996000314A2 (de) * | 1994-06-24 | 1996-01-04 | Aixtron Gmbh | Reaktor und verfahren zum beschichten von flächigen substraten |
JP2701767B2 (ja) * | 1995-01-27 | 1998-01-21 | 日本電気株式会社 | 気相成長装置 |
US6176667B1 (en) | 1996-04-30 | 2001-01-23 | Applied Materials, Inc. | Multideck wafer processing system |
US5748434A (en) * | 1996-06-14 | 1998-05-05 | Applied Materials, Inc. | Shield for an electrostatic chuck |
JP3596710B2 (ja) * | 1996-09-10 | 2004-12-02 | 信越半導体株式会社 | 気相成長装置用サセプタ |
US6132517A (en) * | 1997-02-21 | 2000-10-17 | Applied Materials, Inc. | Multiple substrate processing apparatus for enhanced throughput |
US6222990B1 (en) * | 1997-12-03 | 2001-04-24 | Steag Rtp Systems | Heating element for heating the edges of wafers in thermal processing chambers |
KR100436657B1 (ko) * | 2001-12-17 | 2004-06-22 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 소자 가열 및 냉각장치 |
US6818533B2 (en) * | 2002-05-09 | 2004-11-16 | Taiwan Semiconductor Manufacturing Co., Ltd | Epitaxial plasma enhanced chemical vapor deposition (PECVD) method providing epitaxial layer with attenuated defects |
US20060194059A1 (en) * | 2005-02-25 | 2006-08-31 | Honeywell International Inc. | Annular furnace spacers and method of using same |
CN101600819B (zh) * | 2006-12-08 | 2012-08-15 | 卢米洛格股份有限公司 | 通过在防止基材边缘的生长的基材上的外延生长制造氮化物单晶的方法 |
TW200952115A (en) * | 2008-06-13 | 2009-12-16 | Huga Optotech Inc | Wafer carrier and epitaxy machine using the same |
KR101137545B1 (ko) * | 2009-12-30 | 2012-04-20 | 주식회사 탑 엔지니어링 | 일체형 웨이퍼 트레이 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1297085B (de) * | 1964-01-10 | 1969-06-12 | Siemens Ag | Verfahren zum Abscheiden einer einkristallinen Halbleiterschicht |
DE1289832B (de) * | 1964-08-21 | 1969-02-27 | Siemens Ag | Vorrichtung zur Herstellung planer Oberflaechen von aus der Gasphase abgeschiedenen Halbleiterkristallschichten |
DE1544264C3 (de) * | 1965-07-01 | 1974-10-24 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Herstellen von Halbleiterschichten durch Abscheiden aus der Gasphase |
US3436255A (en) * | 1965-07-06 | 1969-04-01 | Monsanto Co | Electric resistance heaters |
US3539759A (en) * | 1968-11-08 | 1970-11-10 | Ibm | Susceptor structure in silicon epitaxy |
NL7209297A (es) * | 1972-07-01 | 1974-01-03 | ||
US3845738A (en) * | 1973-09-12 | 1974-11-05 | Rca Corp | Vapor deposition apparatus with pyrolytic graphite heat shield |
-
1977
- 1977-09-27 SE SE7710800A patent/SE7710800L/xx unknown
- 1977-09-29 NL NL7710659A patent/NL7710659A/xx not_active Application Discontinuation
- 1977-09-30 BE BE181360A patent/BE859262A/xx unknown
- 1977-10-04 FR FR7729814A patent/FR2366871A1/fr not_active Withdrawn
- 1977-10-04 DE DE19772744601 patent/DE2744601A1/de active Pending
- 1977-10-04 IT IT69207/77A patent/IT1091351B/it active
- 1977-10-04 JP JP11868777A patent/JPS5346274A/ja active Pending
- 1977-10-05 ES ES462931A patent/ES462931A1/es not_active Expired
- 1977-11-21 US US05/853,126 patent/US4113547A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS5346274A (en) | 1978-04-25 |
FR2366871A1 (fr) | 1978-05-05 |
BE859262A (fr) | 1978-01-16 |
IT1091351B (it) | 1985-07-06 |
SE7710800L (sv) | 1978-04-06 |
DE2744601A1 (de) | 1978-04-06 |
NL7710659A (nl) | 1978-04-07 |
US4113547A (en) | 1978-09-12 |
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