ES401743A1 - Procedimiento para formar un condensador monolitico. - Google Patents
Procedimiento para formar un condensador monolitico.Info
- Publication number
- ES401743A1 ES401743A1 ES401743A ES401743A ES401743A1 ES 401743 A1 ES401743 A1 ES 401743A1 ES 401743 A ES401743 A ES 401743A ES 401743 A ES401743 A ES 401743A ES 401743 A1 ES401743 A1 ES 401743A1
- Authority
- ES
- Spain
- Prior art keywords
- areas
- ceramic
- conductive material
- porous
- sheets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13468971A | 1971-04-16 | 1971-04-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES401743A1 true ES401743A1 (es) | 1975-11-01 |
Family
ID=22464508
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES401743A Expired ES401743A1 (es) | 1971-04-16 | 1972-04-14 | Procedimiento para formar un condensador monolitico. |
ES1974205338U Expired ES205338Y (es) | 1971-04-16 | 1974-08-16 | Un condensador monolitico. |
ES429324A Expired ES429324A1 (es) | 1971-04-16 | 1974-08-16 | Procedimiento para fabricar cuerpos ceramicos sinterizados. |
ES1974205337U Expired ES205337Y (es) | 1971-04-16 | 1974-08-16 | Un cuerpo ceramico unitario, sinterizado. |
ES0205339U Expired ES205339Y (es) | 1971-04-16 | 1974-08-16 | Estructura de circuito en multicapas. |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES1974205338U Expired ES205338Y (es) | 1971-04-16 | 1974-08-16 | Un condensador monolitico. |
ES429324A Expired ES429324A1 (es) | 1971-04-16 | 1974-08-16 | Procedimiento para fabricar cuerpos ceramicos sinterizados. |
ES1974205337U Expired ES205337Y (es) | 1971-04-16 | 1974-08-16 | Un cuerpo ceramico unitario, sinterizado. |
ES0205339U Expired ES205339Y (es) | 1971-04-16 | 1974-08-16 | Estructura de circuito en multicapas. |
Country Status (18)
Country | Link |
---|---|
US (1) | US3679950A (es) |
JP (1) | JPS5335085B1 (es) |
AR (1) | AR202778A1 (es) |
AU (1) | AU473476B2 (es) |
BE (1) | BE782146A (es) |
BR (1) | BR7202200D0 (es) |
CH (1) | CH593875A5 (es) |
DE (1) | DE2264943C3 (es) |
ES (5) | ES401743A1 (es) |
FR (1) | FR2139827B1 (es) |
GB (1) | GB1373575A (es) |
IE (1) | IE36276B1 (es) |
IL (1) | IL38721A (es) |
IT (1) | IT951296B (es) |
NL (1) | NL162505C (es) |
NO (1) | NO133819C (es) |
SE (1) | SE7708721L (es) |
ZA (1) | ZA722439B (es) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4030004A (en) * | 1971-04-16 | 1977-06-14 | Nl Industries, Inc. | Dielectric ceramic matrices with end barriers |
US3882059A (en) * | 1973-05-11 | 1975-05-06 | Technical Ceramics Inc | Method of making ceramic capacitor |
US4189760A (en) * | 1973-05-13 | 1980-02-19 | Erie Technological Products, Inc. | Monolithic capacitor with non-noble metal electrodes and method of making the same |
US3879645A (en) * | 1973-09-24 | 1975-04-22 | Nl Industries Inc | Ceramic capacitors |
US4353957A (en) * | 1973-09-24 | 1982-10-12 | Tam Ceramics Inc. | Ceramic matrices for electronic devices and process for forming same |
US4071880A (en) * | 1974-06-10 | 1978-01-31 | N L Industries, Inc. | Ceramic bodies with end termination electrodes |
ATE1897T1 (de) * | 1980-03-25 | 1982-12-15 | Rosenthal Technik Ag | Verfahren zur herstellung von keramischen mehrschichtgehaeusen. |
GB2103422B (en) * | 1981-07-30 | 1985-02-27 | Standard Telephones Cables Ltd | Ceramic capacitors |
GB2118366B (en) * | 1982-03-30 | 1985-09-18 | Standard Telephones Cables Ltd | Terminals for multilayer ceramic dielectric capacitors |
US4458294A (en) * | 1982-07-28 | 1984-07-03 | Corning Glass Works | Compliant termination for ceramic chip capacitors |
US4430690A (en) | 1982-10-07 | 1984-02-07 | International Business Machines Corporation | Low inductance MLC capacitor with metal impregnation and solder bar contact |
US4574329A (en) * | 1983-10-07 | 1986-03-04 | U.S. Philips Corporation | Multilayer ceramic capacitor |
DE3407443A1 (de) * | 1984-02-29 | 1985-08-29 | Buchtal Gmbh Keramische Betriebe, 8472 Schwarzenfeld | Plattenfoermiges verbundelement |
DE3509746A1 (de) * | 1985-03-18 | 1986-09-18 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum verfuellen von evakuierten hohlraeumen in material bzw. in koerpern |
US4687044A (en) * | 1985-05-03 | 1987-08-18 | Tam Ceramics, Inc. | Injection method and apparatus |
DE3771973D1 (de) * | 1986-08-18 | 1991-09-12 | Siemens Ag | Verfahren zur herstellung von fuellschichtbauteilen. |
ES2035837T3 (es) * | 1986-08-18 | 1993-05-01 | Siemens Aktiengesellschaft | Componente de capa de relleno. |
DE3873206D1 (de) * | 1987-07-31 | 1992-09-03 | Siemens Ag | Fuellschichtbauteil mit einem gesinterten, monolithischen keramikkoerper und verfahren zu dessen herstellung. |
DE3725454A1 (de) * | 1987-07-31 | 1989-02-09 | Siemens Ag | Elektrisches vielschichtbauelement mit einem gesinterten, monolithischen keramikkoerper und verfahren zur herstellung des elektrischen vielschichtbauelementes |
DE3725455A1 (de) * | 1987-07-31 | 1989-02-09 | Siemens Ag | Elektrisches vielschichtbauelement mit einem gesinterten, monolithischen keramikkoerper und verfahren zur herstellung des elektrischen vielschichtbauelementes |
US5234641A (en) * | 1988-05-06 | 1993-08-10 | Avx Corporation | Method of making varistor or capacitor |
US4881308A (en) * | 1988-07-01 | 1989-11-21 | Avx Corporation | Method of terminating lead filled capacitor |
US4903166A (en) * | 1989-06-09 | 1990-02-20 | Avx Corporation | Electrostrictive actuators |
JP3041952B2 (ja) † | 1990-02-23 | 2000-05-15 | セイコーエプソン株式会社 | インクジェット式記録ヘッド、圧電振動体、及びこれらの製造方法 |
US5121288A (en) * | 1990-10-12 | 1992-06-09 | Motorola, Inc. | Capacitive power supply |
JP3121119B2 (ja) * | 1992-06-16 | 2000-12-25 | ローム株式会社 | 積層セラミックコンデンサの外部電極の形成方法 |
US5216573A (en) * | 1992-08-21 | 1993-06-01 | Avx Corporation | Lead filled ceramic capacitor and method of making same |
DE4331381C1 (de) * | 1993-09-15 | 1995-02-09 | Siemens Matsushita Components | Verfahren zur Herstellung von elektrischen Vielschichtwiderstandselementen |
US5601673A (en) * | 1995-01-03 | 1997-02-11 | Ferro Corporation | Method of making ceramic article with cavity using LTCC tape |
DE19509668C1 (de) * | 1995-03-17 | 1996-05-23 | Karlsruhe Forschzent | Verfahren zur Herstellung eines keramischen Sinterkörpers |
US5661882A (en) * | 1995-06-30 | 1997-09-02 | Ferro Corporation | Method of integrating electronic components into electronic circuit structures made using LTCC tape |
DE19529304C2 (de) * | 1995-08-09 | 1998-09-03 | Siemens Matsushita Components | Verfahren zur Herstellung von elektrischen Vielschichtwiderstandselementen |
JP3077056B2 (ja) * | 1996-09-12 | 2000-08-14 | 株式会社村田製作所 | 積層型電子部品 |
DE10018377C1 (de) * | 2000-04-13 | 2001-12-06 | Epcos Ag | Keramisches Vielschichtbauelement und Verfahren zur Herstellung |
GB0109782D0 (en) * | 2001-04-20 | 2001-06-13 | Btg Int Ltd | Nanoelectronic devices and circuits |
CN1319086C (zh) * | 2001-05-08 | 2007-05-30 | 埃普科斯股份有限公司 | 陶瓷质多层元件及其制造方法 |
US20030020377A1 (en) * | 2001-07-30 | 2003-01-30 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive element and piezoelectric/electrostrictive device and production method thereof |
US7152291B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
JP3870936B2 (ja) * | 2003-07-14 | 2007-01-24 | 株式会社村田製作所 | 積層セラミック電子部品 |
US6798640B1 (en) * | 2003-09-03 | 2004-09-28 | Sun Microsystems, Inc. | Capacitor having plates with a pattern void of conductive material and method of making therfor |
US7279724B2 (en) * | 2004-02-25 | 2007-10-09 | Philips Lumileds Lighting Company, Llc | Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection |
JP2006295077A (ja) * | 2005-04-14 | 2006-10-26 | Rohm Co Ltd | セラミック製チップ型電子部品とその製造方法 |
CN100521000C (zh) * | 2005-09-21 | 2009-07-29 | 佳荣科技股份有限公司 | 固态电容及其制作方法 |
DE602005021892D1 (de) * | 2005-11-17 | 2010-07-29 | Ctech Corp | Festkondensator und dessen Herstellungsverfahren |
JP2007234800A (ja) * | 2006-02-28 | 2007-09-13 | Tdk Corp | 電子部品及びその製造方法 |
DE102006022600B4 (de) * | 2006-05-15 | 2008-02-14 | Siemens Ag | Herstellungsverfahren eines Piezoaktors |
US20090064476A1 (en) * | 2007-07-27 | 2009-03-12 | The Penn State Research Foundation | Piezoelectric materials based on flexoelectric charge separation and their fabrication |
DE102007043098A1 (de) * | 2007-09-10 | 2009-03-12 | Epcos Ag | Verfahren zur Herstellung eines Vielschichtbauelements |
CN109320260B (zh) * | 2018-08-30 | 2021-06-04 | 四川众磊陶瓷科技有限公司 | 一种馈电/绝缘异质复合陶瓷材料一体化制备方法 |
KR102416778B1 (ko) * | 2020-11-23 | 2022-07-06 | 한국생산기술연구원 | 유전체와 전극의 어셈블리 및 그 제조 방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2421652A (en) * | 1943-08-02 | 1947-06-03 | Sprague Electric Co | Electrical conductor |
US2939059A (en) * | 1955-03-21 | 1960-05-31 | Clevite Corp | Capacitor of high permittivity ceramic |
US3223905A (en) * | 1964-10-14 | 1965-12-14 | Sprague Electric Co | Mixed metal-ceramic capacitor |
-
1971
- 1971-04-16 US US134689A patent/US3679950A/en not_active Expired - Lifetime
-
1972
- 1972-02-08 IL IL38721A patent/IL38721A/xx unknown
- 1972-03-08 CH CH340772A patent/CH593875A5/xx not_active IP Right Cessation
- 1972-04-10 IT IT22991/72A patent/IT951296B/it active
- 1972-04-11 IE IE470/72A patent/IE36276B1/xx unknown
- 1972-04-11 ZA ZA722439A patent/ZA722439B/xx unknown
- 1972-04-12 AU AU41067/72A patent/AU473476B2/en not_active Expired
- 1972-04-12 JP JP3682972A patent/JPS5335085B1/ja active Pending
- 1972-04-13 FR FR7212977A patent/FR2139827B1/fr not_active Expired
- 1972-04-13 NO NO1264/72A patent/NO133819C/no unknown
- 1972-04-14 ES ES401743A patent/ES401743A1/es not_active Expired
- 1972-04-14 BR BR2200/72A patent/BR7202200D0/pt unknown
- 1972-04-14 GB GB1746372A patent/GB1373575A/en not_active Expired
- 1972-04-14 DE DE2264943A patent/DE2264943C3/de not_active Expired
- 1972-04-14 AR AR241494A patent/AR202778A1/es active
- 1972-04-14 BE BE782146A patent/BE782146A/xx unknown
- 1972-04-14 NL NL7205042.A patent/NL162505C/xx not_active IP Right Cessation
-
1974
- 1974-08-16 ES ES1974205338U patent/ES205338Y/es not_active Expired
- 1974-08-16 ES ES429324A patent/ES429324A1/es not_active Expired
- 1974-08-16 ES ES1974205337U patent/ES205337Y/es not_active Expired
- 1974-08-16 ES ES0205339U patent/ES205339Y/es not_active Expired
-
1977
- 1977-07-29 SE SE7708721A patent/SE7708721L/ not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
CH593875A5 (es) | 1977-12-15 |
NL162505B (nl) | 1979-12-17 |
ES205337U (es) | 1976-02-01 |
BE782146A (fr) | 1972-07-31 |
ES205339Y (es) | 1976-06-01 |
DE2264943B2 (de) | 1979-03-01 |
NL162505C (nl) | 1980-05-16 |
FR2139827A1 (es) | 1973-01-12 |
AU473476B2 (en) | 1973-10-18 |
GB1373575A (en) | 1974-11-13 |
NO133819B (es) | 1976-03-22 |
ZA722439B (en) | 1973-01-31 |
DE2218170B2 (de) | 1976-03-04 |
DE2218170A1 (de) | 1972-11-30 |
IL38721A (en) | 1975-06-25 |
IE36276L (en) | 1972-10-16 |
US3679950A (en) | 1972-07-25 |
ES205339U (es) | 1976-02-01 |
AR202778A1 (es) | 1975-07-24 |
ES429324A1 (es) | 1976-08-16 |
IL38721A0 (en) | 1972-04-27 |
SE7708721L (sv) | 1977-07-29 |
AU4106772A (en) | 1973-10-18 |
NO133819C (es) | 1976-06-30 |
DE2264943A1 (de) | 1975-07-31 |
IE36276B1 (en) | 1976-09-29 |
ES205338U (es) | 1976-02-01 |
ES205337Y (es) | 1976-06-01 |
IT951296B (it) | 1973-06-30 |
NL7205042A (es) | 1972-10-18 |
FR2139827B1 (es) | 1976-10-29 |
BR7202200D0 (pt) | 1973-05-15 |
DE2264943C3 (de) | 1979-10-31 |
ES205338Y (es) | 1976-06-01 |
JPS5335085B1 (es) | 1978-09-25 |
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