ES255953U - Un conjunto de montaje de una pastilla de circuito integrado - Google Patents

Un conjunto de montaje de una pastilla de circuito integrado

Info

Publication number
ES255953U
ES255953U ES1981255953U ES255953U ES255953U ES 255953 U ES255953 U ES 255953U ES 1981255953 U ES1981255953 U ES 1981255953U ES 255953 U ES255953 U ES 255953U ES 255953 U ES255953 U ES 255953U
Authority
ES
Spain
Prior art keywords
assembly
chip
chip mounting
wall
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES1981255953U
Other languages
English (en)
Other versions
ES255953Y (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of ES255953U publication Critical patent/ES255953U/es
Application granted granted Critical
Publication of ES255953Y publication Critical patent/ES255953Y/es
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Un conjunto de montaje de una pastilla de circuito integrado que comprende un bastidor de conductores que proporciona un disipador de calor al que ha de unirse la pastilla por medio de material de soldadura, y una pluralidad de conductores para conexión a puntos de contacto alrededor de partes del disipador de calor y de los puntos de contacto y que proporciona una cavidad en la que ha de ser recibida la pastilla con una pieza elemental de material de soldadura debajo de ella para la unión subsiguiente de la pieza elemental de material de soldadura con el fin de unir la pastilla al disipador de calor, caracterizado porque el alojamiento tiene una pared inferior formada en el dispositivo de calor, teniendo la pared inferior una abertura a través de la cual el disipador de calor queda expuesto a la cavidad, estando configurada la abertura para recibir la pastilla con la pie a elemental de material de soldadura, debajo de ella para posicionar la pastilla en el disipador de calor, habiendo unapluralidad de hoyos para material de soldadura posicionados en torno a la abertura y en comunicación con ella.
ES1981255953U 1980-01-18 1981-02-04 Un conjunto de montaje de una pastilla de circuito integrado Expired ES255953Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/113,159 US4339768A (en) 1980-01-18 1980-01-18 Transistors and manufacture thereof

Publications (2)

Publication Number Publication Date
ES255953U true ES255953U (es) 1981-06-01
ES255953Y ES255953Y (es) 1981-12-01

Family

ID=22347887

Family Applications (2)

Application Number Title Priority Date Filing Date
ES498581A Granted ES498581A0 (es) 1980-01-18 1981-01-16 Un metodo de fabricar un conjunto de montaje de una pastilla de circuito integrado
ES1981255953U Expired ES255953Y (es) 1980-01-18 1981-02-04 Un conjunto de montaje de una pastilla de circuito integrado

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES498581A Granted ES498581A0 (es) 1980-01-18 1981-01-16 Un metodo de fabricar un conjunto de montaje de una pastilla de circuito integrado

Country Status (12)

Country Link
US (1) US4339768A (es)
EP (1) EP0034001B1 (es)
JP (1) JPS56108254A (es)
AR (1) AR222930A1 (es)
AT (1) ATE4757T1 (es)
AU (1) AU541489B2 (es)
BR (1) BR8100197A (es)
CA (1) CA1162392A (es)
DE (1) DE3160887D1 (es)
ES (2) ES498581A0 (es)
HK (1) HK81986A (es)
MX (1) MX149018A (es)

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JPH08139113A (ja) * 1994-11-09 1996-05-31 Mitsubishi Electric Corp 樹脂封止型半導体装置
JP3353526B2 (ja) * 1995-03-23 2002-12-03 株式会社デンソー 半導体パッケージ及びその製造方法
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DE19621000C2 (de) 1996-05-24 1999-01-28 Heraeus Sensor Nite Gmbh Temperatur-Sensor mit einem Meßwiderstand
DE10221857A1 (de) * 2002-05-16 2003-11-27 Osram Opto Semiconductors Gmbh Verfahren zum Befestigen eines Halbleiterchips in einem Kunststoffgehäusekörper, optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung
FR2902277B1 (fr) * 2006-06-13 2008-09-05 Valeo Electronique Sys Liaison Support pour composant electrique et dispositif electrique comprenant le support et le composant
WO2024132153A1 (en) * 2022-12-22 2024-06-27 Dynex Semiconductor Limited Power semiconductor module

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DE2608250C3 (de) * 1976-02-28 1985-06-05 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens
IN148328B (es) * 1977-04-18 1981-01-17 Rca Corp
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
US4158745A (en) * 1977-10-27 1979-06-19 Amp Incorporated Lead frame having integral terminal tabs

Also Published As

Publication number Publication date
BR8100197A (pt) 1981-08-04
ES255953Y (es) 1981-12-01
HK81986A (en) 1986-11-07
CA1162392A (en) 1984-02-21
AU6599481A (en) 1981-07-23
AR222930A1 (es) 1981-06-30
ES8204224A1 (es) 1982-04-01
EP0034001B1 (en) 1983-09-21
EP0034001A3 (en) 1981-08-26
ATE4757T1 (de) 1983-10-15
DE3160887D1 (en) 1983-10-27
MX149018A (es) 1983-08-08
ES498581A0 (es) 1982-04-01
AU541489B2 (en) 1985-01-10
EP0034001A2 (en) 1981-08-19
US4339768A (en) 1982-07-13
JPS56108254A (en) 1981-08-27

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