ES2103341T3 - Resistor de tipo pelicula. - Google Patents

Resistor de tipo pelicula.

Info

Publication number
ES2103341T3
ES2103341T3 ES92302249T ES92302249T ES2103341T3 ES 2103341 T3 ES2103341 T3 ES 2103341T3 ES 92302249 T ES92302249 T ES 92302249T ES 92302249 T ES92302249 T ES 92302249T ES 2103341 T3 ES2103341 T3 ES 2103341T3
Authority
ES
Spain
Prior art keywords
type resistor
film
heatsink
resistor
film type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92302249T
Other languages
English (en)
Inventor
Milton J Streif
David L Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Caddock Electronics Inc
Original Assignee
Caddock Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Caddock Electronics Inc filed Critical Caddock Electronics Inc
Application granted granted Critical
Publication of ES2103341T3 publication Critical patent/ES2103341T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Laminated Bodies (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Thermistors And Varistors (AREA)
  • Surface Heating Bodies (AREA)

Abstract

DISPOSICION PARA RESISTOR DE TIPO PELICULA. UN RESISTOR DE TIPO PELICULA TIENE UNA ALTA CAPACIDAD DE DISIPACION Y UN COSTE DE MANUFACTURACION RELATIVAMENTE BAJO. LA FUERZA ESTRUCTURAL DEL RESISTOR SE DERIVA PRIMARIAMENTE DE UN CUERPO MOLDEADO (17) QUE CUBRE TANTO UN SUBSTRATO RECUBIERTO POR LA PELICULA (10) COMO UN DISIPADOR DE CALOR (11). EL DISIPADOR DE CALOR (11), AL CUAL ESTA UNIDO EL SUBSTRATO (17) EN UNA ALTA RELACION DE CONDUCTIVIDAD TERMICA, TIENE UNA SUPERFICIE INFERIOR PLANA DE UN AREA RELATIVAMENTE GRANDE PARA PONERSE EN CONTACTO CON UN CHASIS O UN DISIPADOR DE CALOR EXTERNO.
ES92302249T 1991-04-10 1992-03-16 Resistor de tipo pelicula. Expired - Lifetime ES2103341T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68330291A 1991-04-10 1991-04-10

Publications (1)

Publication Number Publication Date
ES2103341T3 true ES2103341T3 (es) 1997-09-16

Family

ID=24743439

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92302249T Expired - Lifetime ES2103341T3 (es) 1991-04-10 1992-03-16 Resistor de tipo pelicula.

Country Status (7)

Country Link
US (1) US5291178A (es)
EP (1) EP0508615B1 (es)
JP (1) JPH0760761B2 (es)
AT (1) ATE154990T1 (es)
DE (1) DE69220601T2 (es)
DK (1) DK0508615T3 (es)
ES (1) ES2103341T3 (es)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1252575B (it) * 1991-12-20 1995-06-19 Sgs Thomson Microelectronics Stampo e procedimento per la fabbricazione di dispositivi a semiconduttore in plastica, con dissipatore metallico visibile per il controllo della saldatura
US5521357A (en) * 1992-11-17 1996-05-28 Heaters Engineering, Inc. Heating device for a volatile material with resistive film formed on a substrate and overmolded body
US5397746A (en) * 1993-11-03 1995-03-14 Intel Corporation Quad flat package heat slug composition
US5481241A (en) * 1993-11-12 1996-01-02 Caddock Electronics, Inc. Film-type heat sink-mounted power resistor combination having only a thin encapsulant, and having an enlarged internal heat sink
DE9319473U1 (de) * 1993-12-17 1994-06-23 Siemens Ag Hybridschaltungsanordnung
US5481242A (en) * 1994-05-10 1996-01-02 Caddock Electronics, Inc. Debris-reducing telephone resistor combination and method
US5594407A (en) * 1994-07-12 1997-01-14 Caddock Electronics, Inc. Debris-reducing film-type resistor and method
US5914648A (en) 1995-03-07 1999-06-22 Caddock Electronics, Inc. Fault current fusing resistor and method
US5621378A (en) * 1995-04-20 1997-04-15 Caddock Electronics, Inc. Heatsink-mountable power resistor having improved heat-transfer interface with the heatsink
US5841340A (en) * 1996-05-07 1998-11-24 Rf Power Components, Inc. Solderless RF power film resistors and terminations
JP3027954B2 (ja) * 1997-04-17 2000-04-04 日本電気株式会社 集積回路装置、その製造方法
US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
KR20010088984A (ko) * 2001-08-30 2001-09-29 - 차량공조기의 팬 구동모우터 회전속도 조절용 저항기
US20040113240A1 (en) 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
US20070146114A1 (en) * 2005-12-28 2007-06-28 Nelson Charles S Trim resistor assembly and method for making the same
JP5665542B2 (ja) * 2007-09-27 2015-02-04 ヴィシェイ デール エレクトロニクス インコーポレイテッド 電力抵抗器とその製造方法
US7843309B2 (en) * 2007-09-27 2010-11-30 Vishay Dale Electronics, Inc. Power resistor
US10825748B2 (en) * 2015-12-15 2020-11-03 Semiconductor Components Industries, Llc Semiconductor package system and related methods
US11342237B2 (en) 2015-12-15 2022-05-24 Semiconductor Components Industries, Llc Semiconductor package system and related methods
JP6810526B2 (ja) * 2016-03-08 2021-01-06 Koa株式会社 抵抗器
DE102018101419A1 (de) * 2018-01-23 2019-07-25 Biotronik Se & Co. Kg Elektrischer Widerstand, insbesondere für medizinische Implantate
EP3544394A1 (en) 2018-03-24 2019-09-25 Melexis Technologies SA Integrated circuit lead frame design and method
US11543466B2 (en) 2018-03-24 2023-01-03 Melexis Technologies Sa Magnetic sensor component and assembly
CN114252820A (zh) * 2020-09-24 2022-03-29 迈来芯电子科技有限公司 磁传感器部件和组件

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649944A (en) * 1970-05-25 1972-03-14 Richard E Caddock Film-type power resistor
US3722085A (en) * 1970-05-25 1973-03-27 R Caddock Method of making film-type power resistors
JPS50433U (es) * 1973-04-16 1975-01-07
US4064477A (en) * 1975-08-25 1977-12-20 American Components Inc. Metal foil resistor
US4339768A (en) * 1980-01-18 1982-07-13 Amp Incorporated Transistors and manufacture thereof
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
WO1982003727A1 (en) * 1981-04-21 1982-10-28 Seiichiro Aigoo Method of making a semiconductor device having a projecting,plated electrode
JPS6041004U (ja) * 1983-08-29 1985-03-23 株式会社村田製作所 電圧非直線性抵抗素子
JPS61150354A (ja) * 1984-12-25 1986-07-09 Toshiba Corp 樹脂封止型半導体装置
US4868637A (en) * 1985-11-26 1989-09-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same
US4719443A (en) * 1986-04-03 1988-01-12 General Electric Company Low capacitance power resistor using beryllia dielectric heat sink layer and low toxicity method for its manufacture
JPS63205935A (ja) * 1987-02-23 1988-08-25 Toshiba Corp 放熱板付樹脂封止型半導体装置
JPH0750753B2 (ja) * 1987-08-21 1995-05-31 株式会社東芝 トランジスタ装置
JPS6452201U (es) * 1987-09-29 1989-03-31
US4866411A (en) * 1988-03-25 1989-09-12 Caddock Richard E Film-type cylindrical resistor, and method of making it
JPH0724112B2 (ja) * 1988-12-19 1995-03-15 ローム株式会社 レーザダイオードユニットの取り付け方法
JPH03108744A (ja) * 1989-09-22 1991-05-08 Toshiba Corp 樹脂封止型半導体装置
JPH03141607A (ja) * 1989-10-27 1991-06-17 Nitsukoomu Kk 電力用抵抗器の製造方法

Also Published As

Publication number Publication date
DE69220601T2 (de) 1997-10-23
US5291178A (en) 1994-03-01
JPH0760761B2 (ja) 1995-06-28
DE69220601D1 (de) 1997-08-07
DK0508615T3 (da) 1998-02-02
ATE154990T1 (de) 1997-07-15
JPH05101902A (ja) 1993-04-23
EP0508615A1 (en) 1992-10-14
EP0508615B1 (en) 1997-07-02

Similar Documents

Publication Publication Date Title
ES2103341T3 (es) Resistor de tipo pelicula.
AU675176B2 (en) Arrangement for the conduction away of heat and a process for the production thereof
DE3471205D1 (en) Semiconductor power module
ATE21755T1 (de) Kochplatte.
DE3781917D1 (de) Gekuehlte baugruppe.
EP0777275A3 (en) Semiconductor module with heat sink
DE69416107D1 (de) Integrierte Schaltungsgehäuse mit flach abgeschlossenem Kühlkörper
ES2112887T3 (es) Resistencia de potencia tipo pelicular.
DE69209799D1 (de) Thermische Farbstoffübertragungsdruckschicht
ATA428579A (de) Kuehlelement mit zwangsumlaufkuehlung fuer halbleiterbauelemente der leistungselektronik
MY110314A (en) Positive characteristic thermistor device
DK24486A (da) Montering af halvlederchips
JPS57185170A (en) Heat dissipating base plate
DE3473972D1 (en) Semiconductor device comprising a substrate
DE3176475D1 (en) Cooling means for integrated circuit chip device
JPS58175641U (ja) 半導体部品の取付装置
JPS57182461A (en) Heat dissipating substrate
IT1213140B (it) Componente elettronico integrato per assemblaggio di superficie.
ATE191581T1 (de) Hybridschaltungsanordnung
EP0174020A3 (en) Integrated circuit package with integral heat dissipating means
ES2093300T3 (es) Transformador de poca potencia aislado contra contacto accidental.
ATE94718T1 (de) Vorrichtung mit eine kuehlanordnung enthaltenden, oberflaechenmontierten, elektronischen bauelementen.
GB2022317A (en) Method of forming a plastic cavity package for integrated circuit devices
KR930005011A (ko) 감열 기록 소자
JPS5688383A (en) Optical coupling element

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 508615

Country of ref document: ES