DE69220601T2 - Schichtwiderstand - Google Patents

Schichtwiderstand

Info

Publication number
DE69220601T2
DE69220601T2 DE69220601T DE69220601T DE69220601T2 DE 69220601 T2 DE69220601 T2 DE 69220601T2 DE 69220601 T DE69220601 T DE 69220601T DE 69220601 T DE69220601 T DE 69220601T DE 69220601 T2 DE69220601 T2 DE 69220601T2
Authority
DE
Germany
Prior art keywords
heatsink
film
resistor
sheet resistance
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69220601T
Other languages
English (en)
Other versions
DE69220601D1 (de
Inventor
Milton J Streif
David L Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Caddock Electronics Inc
Original Assignee
Caddock Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Caddock Electronics Inc filed Critical Caddock Electronics Inc
Publication of DE69220601D1 publication Critical patent/DE69220601D1/de
Application granted granted Critical
Publication of DE69220601T2 publication Critical patent/DE69220601T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Laminated Bodies (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Thermistors And Varistors (AREA)
  • Surface Heating Bodies (AREA)
DE69220601T 1991-04-10 1992-03-16 Schichtwiderstand Expired - Lifetime DE69220601T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68330291A 1991-04-10 1991-04-10

Publications (2)

Publication Number Publication Date
DE69220601D1 DE69220601D1 (de) 1997-08-07
DE69220601T2 true DE69220601T2 (de) 1997-10-23

Family

ID=24743439

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69220601T Expired - Lifetime DE69220601T2 (de) 1991-04-10 1992-03-16 Schichtwiderstand

Country Status (7)

Country Link
US (1) US5291178A (de)
EP (1) EP0508615B1 (de)
JP (1) JPH0760761B2 (de)
AT (1) ATE154990T1 (de)
DE (1) DE69220601T2 (de)
DK (1) DK0508615T3 (de)
ES (1) ES2103341T3 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1252575B (it) * 1991-12-20 1995-06-19 Sgs Thomson Microelectronics Stampo e procedimento per la fabbricazione di dispositivi a semiconduttore in plastica, con dissipatore metallico visibile per il controllo della saldatura
US5521357A (en) * 1992-11-17 1996-05-28 Heaters Engineering, Inc. Heating device for a volatile material with resistive film formed on a substrate and overmolded body
US5397746A (en) * 1993-11-03 1995-03-14 Intel Corporation Quad flat package heat slug composition
US5481241A (en) * 1993-11-12 1996-01-02 Caddock Electronics, Inc. Film-type heat sink-mounted power resistor combination having only a thin encapsulant, and having an enlarged internal heat sink
DE9319473U1 (de) * 1993-12-17 1994-06-23 Siemens Ag Hybridschaltungsanordnung
US5481242A (en) * 1994-05-10 1996-01-02 Caddock Electronics, Inc. Debris-reducing telephone resistor combination and method
US5594407A (en) * 1994-07-12 1997-01-14 Caddock Electronics, Inc. Debris-reducing film-type resistor and method
US5914648A (en) * 1995-03-07 1999-06-22 Caddock Electronics, Inc. Fault current fusing resistor and method
US5621378A (en) * 1995-04-20 1997-04-15 Caddock Electronics, Inc. Heatsink-mountable power resistor having improved heat-transfer interface with the heatsink
US5841340A (en) * 1996-05-07 1998-11-24 Rf Power Components, Inc. Solderless RF power film resistors and terminations
JP3027954B2 (ja) * 1997-04-17 2000-04-04 日本電気株式会社 集積回路装置、その製造方法
US6476481B2 (en) * 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
KR20010088984A (ko) * 2001-08-30 2001-09-29 - 차량공조기의 팬 구동모우터 회전속도 조절용 저항기
US20040113240A1 (en) 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
US20070146114A1 (en) * 2005-12-28 2007-06-28 Nelson Charles S Trim resistor assembly and method for making the same
US7843309B2 (en) * 2007-09-27 2010-11-30 Vishay Dale Electronics, Inc. Power resistor
EP2215639A1 (de) * 2007-09-27 2010-08-11 Vishay Dale Electronics, Inc. Leistungswiderstand
US11342237B2 (en) 2015-12-15 2022-05-24 Semiconductor Components Industries, Llc Semiconductor package system and related methods
US10825748B2 (en) * 2015-12-15 2020-11-03 Semiconductor Components Industries, Llc Semiconductor package system and related methods
JP6810526B2 (ja) * 2016-03-08 2021-01-06 Koa株式会社 抵抗器
DE102018101419A1 (de) * 2018-01-23 2019-07-25 Biotronik Se & Co. Kg Elektrischer Widerstand, insbesondere für medizinische Implantate
US11543466B2 (en) 2018-03-24 2023-01-03 Melexis Technologies Sa Magnetic sensor component and assembly
EP3544394A1 (de) * 2018-03-24 2019-09-25 Melexis Technologies SA Leiterrahmen für integrierte schaltung und verfahren
CN114252820A (zh) * 2020-09-24 2022-03-29 迈来芯电子科技有限公司 磁传感器部件和组件

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649944A (en) * 1970-05-25 1972-03-14 Richard E Caddock Film-type power resistor
US3722085A (en) * 1970-05-25 1973-03-27 R Caddock Method of making film-type power resistors
JPS50433U (de) * 1973-04-16 1975-01-07
US4064477A (en) * 1975-08-25 1977-12-20 American Components Inc. Metal foil resistor
US4339768A (en) * 1980-01-18 1982-07-13 Amp Incorporated Transistors and manufacture thereof
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
WO1982003727A1 (en) * 1981-04-21 1982-10-28 Seiichiro Aigoo Method of making a semiconductor device having a projecting,plated electrode
JPS6041004U (ja) * 1983-08-29 1985-03-23 株式会社村田製作所 電圧非直線性抵抗素子
JPS61150354A (ja) * 1984-12-25 1986-07-09 Toshiba Corp 樹脂封止型半導体装置
US4868637A (en) * 1985-11-26 1989-09-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same
US4719443A (en) * 1986-04-03 1988-01-12 General Electric Company Low capacitance power resistor using beryllia dielectric heat sink layer and low toxicity method for its manufacture
JPS63205935A (ja) * 1987-02-23 1988-08-25 Toshiba Corp 放熱板付樹脂封止型半導体装置
JPH0750753B2 (ja) * 1987-08-21 1995-05-31 株式会社東芝 トランジスタ装置
JPS6452201U (de) * 1987-09-29 1989-03-31
US4866411A (en) * 1988-03-25 1989-09-12 Caddock Richard E Film-type cylindrical resistor, and method of making it
JPH0724112B2 (ja) * 1988-12-19 1995-03-15 ローム株式会社 レーザダイオードユニットの取り付け方法
JPH03108744A (ja) * 1989-09-22 1991-05-08 Toshiba Corp 樹脂封止型半導体装置
JPH03141607A (ja) * 1989-10-27 1991-06-17 Nitsukoomu Kk 電力用抵抗器の製造方法

Also Published As

Publication number Publication date
DE69220601D1 (de) 1997-08-07
ES2103341T3 (es) 1997-09-16
JPH0760761B2 (ja) 1995-06-28
US5291178A (en) 1994-03-01
JPH05101902A (ja) 1993-04-23
EP0508615B1 (de) 1997-07-02
ATE154990T1 (de) 1997-07-15
EP0508615A1 (de) 1992-10-14
DK0508615T3 (da) 1998-02-02

Similar Documents

Publication Publication Date Title
DE69220601T2 (de) Schichtwiderstand
AU675176B2 (en) Arrangement for the conduction away of heat and a process for the production thereof
AU644654B2 (en) Domestic cooking apparatus
ATE21755T1 (de) Kochplatte.
DE69416107D1 (de) Integrierte Schaltungsgehäuse mit flach abgeschlossenem Kühlkörper
DK0532224T3 (da) Effektmodstand af film-typen
EP0392109A3 (de) Wärmeleitendes zusammengesetztes Material
MY110314A (en) Positive characteristic thermistor device
JPS57185170A (en) Heat dissipating base plate
DE3473972D1 (en) Semiconductor device comprising a substrate
JPS58175641U (ja) 半導体部品の取付装置
JPS57182461A (en) Heat dissipating substrate
ATE495655T1 (de) Elektronische vorrichtung
DE59409274D1 (de) Hybridschaltungsanordnung
JPH0440589U (de)
JPS6449247A (en) Semiconductor light emitting device
EP0174020A3 (de) Packung für integrierte Schaltung mit integraler Wärmeableitung
KR930005011A (ko) 감열 기록 소자
JPH029445U (de)
JPS60125144U (ja) サ−マルヘツド
JPS61240601A (ja) 放熱板付き抵抗器
WILSON et al. Heat sinking for printed circuitry[Patent Application]
JPS5891135U (ja) 表面温度センサ
JPS62166641U (de)
CA2431536A1 (en) Thermal printhead and protective cover used for the same

Legal Events

Date Code Title Description
8364 No opposition during term of opposition