AU604904B2

AU604904B2 - A resin sealed semiconductor device and a method for making the same

Info

Publication number: AU604904B2
Application number: AU16920/88A
Authority: AU
Inventors: Hidetoshi Kato; Fuyuki Maehara; Hiroshi Shibata; Akira Shintai
Original assignee: NipponDenso Co Ltd
Current assignee: Denso Corp
Priority date: 1987-06-05
Filing date: 1988-05-31
Publication date: 1991-01-03
Anticipated expiration: 2008-05-31
Also published as: AU1692088A

Description

COMMONWEALTH OF AUSTRALIA PATENTS ACT 1952 Form COMPLETE SPECIFICATION FOR OFFICE USE Short Title: Int. Cl: Application Number: Lodged: Complete Specification-Lodged: Accepted: ,Lapsed: Published: This cldoumnt contains the Priority: amendments made uic. i SSection 49 and is ccrrct fo, printing.

Related Art: TO BE COMPLETED BY APPLICANT Name of Applicant: NIPPONDENSO CO., LTD, Address of Applicant: 1-1, Showa-cho, Kariya-shi, Aichi, JAPAN Actual Inventor HIROSHI SHIBATA; FUYUKI MAEHARA; S" AAKIRA SHINTAI and HIDETOSHI KATO Address for Service: GRIFFITH HASSEL FRAZER 71 YORK STREET SYDNEY NSW 2000

AUSTRALIA

Complete Specification for the invention entitled: "A RESIN SEALED SEMICONDUCTOR DE'ICE AND A METHOD FOR MAKING THE SAME" The following statement is a full description of this invention, including the best method of performing it known to us:- 4515A/bm V S ,,ND-6708 1A- A RESIN :EALED SEMICONDUCTOR DEVICE AND A METHOD FOR MAKING THE SAME BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a resin sealed semiconductor device and a method for making the same and it is preferably applicable to an IC regulator (integrated semiconductor regulator) used as a voltage regulator,for example, as an A.C. generator acting an alternator, for vehicles.

2. Description of the Related Art Heretofore, an IC regulator, as described in 1 10 Japanese Utility Model Publicatiion 57-44717, is a a Shybrid IC comprising a substrate (for example, a ceramic substrate) on which ICs, transistors and chip condensers or the like are mounted, incorporated into a shield case having a connector thereon, and this case is mounted on an electrical load.

But such a hybrid increases the size of the revice, and the number of component.S used in this device is also increased, and therefore, many operational steps t are requied, which will reduce tie reliability of the device.

Recently, the requirements for a high integration nd a minimized size have increased and o'o consequently, for example a controlling circuit for an elect-ric load is integrally incorporated with a power device for energizing the the electric load and such a N device is reduced to a monolithic integrated circuit (IC).

There is a trend for such a monolithic IC to become more minimized, lighter and cheaper, for directly mounting the same on an electrical load.

When making such a resin sealed semiconductor devic, in which a monolithic IC mentioned above is c i i /4 ,ii L11 i r -2 incorporated, a lead frame in which each connecting terminal is connected to an outer frame thereof is used, to reduce the number of components used in the device and the number of operational steps. But, assuming that the electrical load is an A.C. generator or the like and it is necessary to control the operation 'hereof, the IC regulator must be in electrical contact with connecting terminals in the A.C. generator for transmitting signals back and forth and energizing current, and simultaneously, must maintain electrical contact with a portion other than the A.C. generator for '"ansmitting signals back and forth and energizing current. Namely, connecting terminal for connecting to an electrical load, and other connecting terminals for connecting to an external 15 device other than the load, a,:e generally required.

More specifically, such a device generally must have .rt connecting terminals for connecton to the A.C. generator and connecting terminals for connecton to a device other than the A.C. generator, and further, must ensure that the connecting terminal connected to the device other than the A.C. generator is not bent by mechanical impact.

V Also such a device must usually form a connector with resin by a molding method because, in general, each connecting terminal has a high input e, impedance, and therefore, a water-proof construction is 4 to required.

Accordingly, it is difficult to apply the current technology, in which a lead frame is used in the 30 resin seaiad semiconductor device, to this problem, and therefore, a resin sealed IC regulator using a lead frame is not currently available.

Therefore, solutions to these problems are required.

~~~lrn t ]l i^ Ui T ln r' SUMMARY OF THE INVENTION According to one aspect of the present invention there is provided a resin sealed semiconductor device, which comprises a first connecting terminal electrically connected to an electrical load, a second connecting terminal connected to a device other than said electrical load, a monolithic IC which controls an operation of said electrical load mounted on a conductive member and connected to both said first connecting terminal and said second connecting terminal and resin molded portion of an electric insulating said resin molded portion having a first molded port.-on molded with a first resin and sealing said monolithic IC and at least a portion of said first and second connecting terminals so that said first and second 15 connecting terminals are rigidly fixed thereby, and a second molded portion integrated with a connector housing portion integratedly molded with a second resin, said connector housing portion being molded in such a way that the second connecting terminal is disposed in a cavity at one end of 20 the connector housing portion and said second connecting ao** terminal is surrounded thereby.

0 According to another aspect of the present invention there is provided a resin sealed IC regulator, which Pik' comprises a first connecting terminal electrically connected to a generator, a second connecting terminal connected to a device other than said generator, a monolithic IC, which S controls an operation of said generator, mounted on a conductive member and connected to both said first connecting terminal and said second connecting terminal, a resin molded portion of an electric insulating resin, said resin molded portion having a first molded pcrtion molded with a first resin and sealing said momolithic 1C and at least a portion of said first and second connecting terminals so that said first and second connecting terminals are rigidly fixed thereby, and a second molded portion integrated with a connector housing portion Ijntegratedly molded with a second resin, said connector housing portion being molded in such a way that said second connecting terminal is surrounded thereby and a heat sink made of a Is/JM -3i ill~-L-I~BLC; ]1 high thermal conductivity material is fixed in a proximity of said monolithic IC by molding with said first resin.

According to another aspect of the present invention there is provided a resin sealed semiconductor device, which comprises a first connecting terminal electrically connected to an electrical load, a second connecting terminal electrically connected to a device other than said electrical load., a monolithic IC which controls and operation of said electrical load mounted on a conductive member and connected to both said first connecting terminal and said second connecting terminal and a resin molded portion of an electric insulating resin, said resin molded portion having a first molded portion molded with a first resin and sealing said monolithic IC and at least a protion of said first and said second connecting terminals so that said first and said second connecting terminals are rigidly e* fixed thereby, and a second molded portion integrated with a Sconnector housing portion integratedly molded with a second Sresin, said connector housing protion being molded in such a ,220 way that said second connecting terminal is surrounded S thereby.

According to another aspect of the present invention there is provided a resin sealed semiconductor device, which comprises a first connecting terminal electrically connected ,2 5 to an electrical load, a second connecting terminal connected to a device other than said electrical load, a a monolithic IC which controls an operation of said electrical S, load mounted on a conductive member and connected to both said first connecting terminal and said second connecting terminal and a resin molded portion of an electric insulating resin, said resin molded portion having a first S molded portion molded with a first resin and saaling said monolithic IC and at least a portion of said first and said second connecting terminals so that said first and said second connecting terminals directly extend from outside of said molded portion into a portion adjacent to said monolithic IC and are rigidly fixed as .one piece thereby, /as -3A- I and a second molded portion integrated with a connector housing portion integratedly molded with a second resin, said connector housing portion being molded in such a way that said second connecting terminals are surrounded thereby.

According to another aspect of the present invention there is provided a resin sealed semiconductor device which comprises a first connecting terminal electrically connected to an electrical load, a second connecting terminal electrically connected to a device other than said electrical load, a monolithic IC which controls and operation of said electrical load, mounted on a conductive member and electrically connected to both said first a corinecting terminal and said second connecting terminal, and a resin molded portion of an electric insulating resin 15 sealing said monolithic IC and at least a portion of said *first and said second connecting terminals so that said first and said second connecting terminals are rigidly fixed ot ~thereby, said resin molded portion having a connector housing portion integrally formed thereon by a molding resin in such a way that the second connecting terminal is disposed in a cavity at one end of the connector housing portion and said second connecting terminal is surrounded thereby.

According to another aspect of the present invention there is provided a method of producing a resin molded IC regulator comprising, forming a lead frame, in which at least a first connecting terminal to be electrically connected to an electrical load and a second connecting terminal to be electrically connected to a device other than said electrical load are connected to a frame portion thereof, out of a plate made of an electric conductive 4material, mounting a monolithic IC controlling an operation of said electrical load, on a conductive member and electrically connecting said monolithic IC to said lead frame, sealing overall said monolithic IC mounted on said conductive member completely and at least a portion of said first and second connecting terminals electrically connected to said monolithic IC partially, with a first resin having an electrical insulating characteristic to make a first molded portion, so that said first and said second JM -3B- 0~lr r ~ig:t i 4 4 4 44 I1 4,4 44444 Irr connecting terminals are rigidly fixed thereby, separating said frame portion from said lead frame and making a second molded portion by an externally covering molding operation to cover at least a portion of said first molded portion and surround said second connecting terminal in such a way that said second connecting terminal is disposed inside a cavity provided on said second molded portion, with a second resin having an electric insulating characteristic.

According to another aspect of the present invention there is provided a method of producing a resin molded IC regulator comprising, forming a lead frame, in which at least a first connecting terminal to be electrically connected at an electric load and a second connecting terminal to be electric load and a second connecting terminal to be electrically connected to a device other than said electric load are connected to a frame portion thereof, out of a plate made of electric conductive material, mounting a monolithic IC controlling a'a operation of said electric load on a conductive member and electrically ,20 connecting said monolithic IC to said lead frame, sealing overall said monolithic IC completely and at least a portion of said first and second connecting terminals partially, with an electric insulating resin, so that first and said second connecting terminals are rigidly fixed thereby, and 25 simultaneously, making a molded portion having a connector portion provided with a cavity portion with which said second connection terminal is surrounded and integrated with said sealing portion, and separating said frame portion from said lead frame.

30 Preferred embodiments of the present invention will now be described by way of example only with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Figures 1 to 3 show a front plane view, a back plane view, and a sectional view of a resin sealed semiconductor device made in Example i, respectively; Figure 4(a) shvws a front plane view of a lead frame used in Example 1; #444 4 4 4c 9 44 4 .4 4 4 44l 4'' *44 It' -3Cj i 1

:I

Figure 4(b) shows a back plane view of a lead frame on which a resin sealed monolithic IC portion is mounted; Figure 5 shows a plane view of a lead frame on which a resin sealed monolithic IC portion is molded in Example 1; Figures 6 and 7 are a plane view of a heat sink and a side view of a heat sink respectively; Figures 8 and 9 show a front plane view and a back S4 4 S344 -3D- «...,iiiii i|iniiiijiirii ^T tfufefe^^ -4plane view of a resin sealed monolithic IC portion after cutting off frame portions, respectively; Figures 10 and 11 are a plane view and a side view of a fabricated portion of an end tip portion of an external connecting terminal, respect,vely; Figure 12 shows a plane view of a lead frame on which a monolithic IC is mounted in Example 2; Figure 13 shows a plane view of a lead frame on which a resin sealed monolithic IC portion is molded in Example 2; Figure 14 and 15 are a back plane view and a side view of a lead frame on which a monolithic IC is mounted ;in Example 3, respectively; Figures 16 and 17 are a front and back plane view of a resin sealed semiconductor device in Example 4 ,o respectively; Figure 18 is a sectional view taken along the line o B-B in Figure 17; Figure 19 shows a back plane view of a lead frame on which a monolithic IC is mounted in Example 3; o Figure 20 shows a plane view of a lead frame on ooO° which a resin sealed monolithic IC portion is molded; Figures 21 and 22 are a front plane view and a back aplane view of a resin sealed monolithic IC portion separated from a frame portion of a lead frame, respectively; Figure 23 ad 24 are a plane view ar, a sectional <view of the resin sealed monolithic IC portion shown in Figure 21, in '.,hich external connecting terminals are beat, respactively; Figure 25 shows a plane view of a lead frame used in the Example Figure 26 shows a plane view of a lead frame used in the Example 5, on which a monolithic IC is mounted; Figure 27 shows a plane view of a lead frame shown in Figure 26, on which a resin sealed monolithic IC portion is molded; 5 Figure 28 shows a plane view of a heat sink; Figure 29 shows a back plane view of a resin sealed monolithic IC portion separated from a frame portion of a lead frame; Figure 30 is a perspective view of a resin sealed monolithic IC portion shown in Figure 29 in which external connecting terminals are bent; Figure 31 is a perspective view of an IC regulator made in Example 5 Figure 32 is a plane view showing a configuration in which the IC regulator is mounted on an alternator; Figure 33 shows an electric circuit related to the IC regulator and the alternator; Figure 34 shows a side view of the IC regulator oo 15 used in Example o Figure 35 shows a plane view of a resin sealed SO° semiconductor device made in Example 6; oo o Figures 35 and show a plane view and a side view of a heat sink used in Example 6, respectively; Figure 36 shows a plane view of a lead frame used in Example 6; Figure 37 shows a plane view of the resin sealed semiconductor device with a connector housing molded on the lead frame shown in Figure 36; Figure 38 shows a plane view of a resin sealed semiconductor device made in Example 7; o in Figure 39 shows a plane view of a lead frame used o in Example 7; Figure 40 shows a plane view of the resin sealed semiconductor device with a connector housing molded on the lead frame; and, Figure 41 shows an aperture portion provided on the resin sealed semiconductor device with sealing portion therein.

DESCRIPTION OF THE PREFERRED EMBODIMENT To attain the object of this invention, the resin sealed semiconductor device of this invention is characterized in that a resin sealed semiconductor A 1 1 6 device, which comprises a first connecting terminal electrically connected to an electric load, a second connecting terminal electrically connected to a device other than the electric load, a monolithic IC which controls an operation of the load mounted on a conductive member and electrically connected to both the first connecting terminal and the second connecting terminal, and a resin molded portion of an electric insulating resin sealing the monolithic IC and solidly fixing the monolithic IC and at least a portion of the first and second connecting terminals connected to the monolithic IC.

To attain the object of this invention, the resin sealed semiconductor device of this invention is further oo 15 characterized by comprising, a first connecting terminal ;o o electrically connected to an electric load, a second o" .connecting terminal electrically connected to a device other than the electric load, a monolithic IC which controls an operation of the electric load mounted on a c .am- and electrically connected to both the first connecting terminal and the second connectinj terminal, a first molded r rtion in which the monolithic IC and at least a portion of the first and second connecting terminals connected to the monolithic IC are sealed with a first resin, and a second molded portion formed by an externally covering mold ing method to cover at least a portion of the first molded portion externally rn *with a second resin in such a manner that at least a portion of the first molded portion is held by the second molded portion.

i The resin sealed semiconductor device of this invention is further specifically characterized by comprising a connector housing made by a conne:tor molding method carried 0 simultaneously with or following the externally covering molding method utiliz- S4 ing the second resin and the second connecting terminal is surrounded within a cavity provided in the connector 7 housing.

The first resin and the second resin may be the same kind of resin or may be different kinds of resins, for example, having different chemical components, viscosity, or strength, or the like.

In this invention, the resin used as a first resin may be a thermosetting resin and the second resin may be a thermoplastic resin.

The second resin may be molded in such a manner that at least a root portion of the second connecting terminal extending outwardly from the first molded portion molded with the first resin is covered with the second resin.

o Further, a contacting surface of each of the first o 15 and the second resins is roughened, and such a roughened to surface may be provided for example, with concave and Sa*, convexe portions or grooves or ribs.

In another embodiment of this invention, the resin sealed semiconductor device is characterized by comprising, a first connecting terminal electrically connected to an electric load, a second connecting terminal electrically connected to a device other than the electric load and bent at a predetermined angle, a monolithic 1C which controls an operation of the electric load mounted on a i ier and electrically connected to both the first and the second connecting terminal, a heat sink made of a high thermal conductive material, a sealed monolithic IC portion in which the heat sink is fixed in proximity to the monolithic C1 by molding with a first resin and the monolithic IC and at least a portion of the first and second connecting terminals connected to the monolithic IC are sealed together with a first resin, a molded portion formed by an externally covering molding method with a second resin (referred to as second molded portion) whereby at least a portion of the sealed portion described above T (referred to as first molded portion hereafter), is 8 covered with the second molded portion in such a manner that the first molded portic eld by the second molded portion to strengthar .ntacting force therebetween and a connector housing integrally molded with the second molded portion as described above made by a connector molding method for surrounding the second connecting terminal with a second resin, being bent together with the second connecting terminal.

To attain the other object of this invention, the method for making the resin sealed semiconductor device is characterized by comprising, forming a lead frame in which at least a first connecting terminal electrically connected to an electric load and a second connecting terminal connected to a device other than the electric load are connected to a frame portion thereof, made of a J plate of an electric conductive material, mounting a So monolithic i controlling an operation of the electrical ao load on ae ndt ve~1ember and electrically connecting the monolithic IC to the lead frame, sealing the monolithic IC mounted on the conductive member and at least a portion of the first and second connecting terminals electrically connected to the monolithic IC with a first resin having an electric insulation characteristic, separating the frame portion from the lead frame and making a molded portion by a moldinq method including an externally covering molding mt, hed, or if S desired, additionally by a connector molding method to Sprovide a connector housing surrounding the second connecting terminal with a second resin having an electric insulation characteristic.

U The most characteristic feature of this invention is the construction thereof comprising a plurality of first connecting terminals, at least one a second connecting terminal, a monolithic 1C which controls an operation of the electrical load mounted on asnductve imeber and connected to both the first connecting terminal and the second connecting terminal and a resin

I

B

4r 48 f 4~ 8 1, 1 4 4 44 I 4 9 molded portion of an electric insulating resib sealing the monolithic IC and at least a portion of the first and second connecting terminals connected to the monolithic IC, wherein each connecting terminal is directly extended from the out side of the molded portion into a portion adjacent to the monolithic IC in the molded portion in a form of single piece, and the extended portion of the connecting terminal is rigidly fixed within the resin and the molded portion further comprising a dnnector housing integrally mounted thereon, and surrounding the second connecting terminals.

In this invention, by adopting the construction described above, each connecting terminal can be given a 15 suitable thickness for end use and, therefore, the strength of each connecting terminal is increased wherein contact with an opposite connecting portion.

Alsoif desired, a means of fixing means for the connecting terminal to a fixing point of the another device can be provided on thb connecting terminal.

Especially, when using this device in an alternator, which is one object of this invention, this device can be fixed in contact with the connecting portion thereof, and vibration of the alternator when energized will not 25 affect same. l 'rther, in this construction, since one end of the connecting terminal is located adjacent to che monolithic Ic, therefore, a length of a wire for wire bonding can be considerably reduced, and thus the production efficiency is increased because the occurrence of defective products caused by a molding operation is greatly reduced.

In this invention, to improve a close adherence force between the first resin and second resin, an externally covering molding operation is adopted.

Note, "an externally covering molding method" referred to herein is a molding method in which at least a portion of the first molded portion is covered with wln.~.l* A^lff tXA fl-^ 1- 1* 10 I the second molded portion in such a manner that at least a portion of the first molded portion is held by the second molded portion and, if desired, the externally covering molding method can be carried out simultaneously with a connector molding method to make a connector housing surrounding the second connecting terminals, of the same resin used for the second molded portion.

Another specific characteristic feature of this invention is that the first connecting terminal can be directly connected to a portion on the electrical load and the second connecting terminal can be used as a connector.

Namely, in this invention, the semiconductor device o t has at least two different kind of groups of connecting 15 terminals, in that the first group is the first conc "I "a necting terminals that can output or input electric

S

0 information signal related to a control of an electrical load, and the second group is the second connecting terminal that can input an electric information signal related to a power source to a control circuit of a 0 monolithic TC and output an electric information signal a trelated to a control of the electrical load.

In making such a semiconductor device, many components were used in such a device and, therefore, a drawback aroses in that to integrally combine such components, an increment of the number of the components and the number of the process steps was required and o (further, another drawback occurred in that in such a device, many cut portions, produced by cutting a connecting portion between the terminal and the lead frame, appear on a surface of the regulator. However, these problems are also resolved in this invention.

EXAMPLE

Hereafter, this invention will be explained by way of examples with reference to with drawings.

EXAMPLE 1 Figure 1 and Figure 2A show a front plane view and a back plane view of a resin Pealed semiconductor device in the Example 1 of this invention, respectively and Figure 5 shows a cross sectional view taken along the line A-A of Figure 2.

This resin sealed semiconductor device 1 comprises a connector housing 14 including a second molded portion Y integrally rmoluad with the housing 14, a sealed monolithic IC portion 13, a first molded portion X which is partially covered by the second molded portion Y, integrated eith the connector housing 14 and a heat sink (heat radiating plate) 12.

The second molded portion Y is formed by an externally covering molding method to cover at least main surface of the sealed monolithic 1C portion 13, 0 0 15 the first molded portion X, in sluch a manner that the first molded portion is held by the second molded portion and the connector housing 14 is integrated with 4 the second molded portion Y, is formed by connecto4' 4 molding method carried out simultaneously with the externally covering molding method, and this connector housing surrounds a group of connecting terminals connected to the extc.rnal separate portion, an~i forms a cover.

*The sealed monoli't.hic IC portion, 13 is produced by a meth! in which the monolithic IC 16 is first mounted on a predetermined portion of a back side of the lead frame 11, as shown in Figure 4 r and the monolithic IC 1.6 and each of the connecting terminals are electrically conneoted by lead wires 1.7 to get a lead frame Ila as shown in Figure 4 and thereafter, the leae frame ILla is sealed with a resin 13a. 0 The lead frame 11 itt made from a plate bypunching method and consists~a frame portion, a group of connecting terminals, and a connector p,-rtion for the heat sinki the frame portion being separated 4rom the lead frame before the resit sealed semiconductor device is f ormed.

12 Both contacting surfaces of the resin 13a for sealing the monolithic IC and of the resin 14b for molding a connector housing, a contacting surface between the first molded portion X and the second molded portion Y, are provided with roughened surfaces: For example, a plurality of projected lines or ribs 131 are provided on the surface of the sealed monolithic IC portion 13 and cause a fixed adhesion thereof with the resin 14b.

A cavity 14a, which is defined by the connector housing and it has a construction such that it can be connected to a female adapter of a counterpart connector, is defined an atmospheric portion of the connecting terminal connected to the external separated portions.

15 The lead frame 11 shown in Fiure 4 is formed o from a plate made of copper alloy having an even thickness, by a mechanical process such as a punching method, and has two external frcme portions 111 extending vertically and two transverse frame portions 112 connected to the external frame portions 111.

Each inside portion enclosed by the two external frame portions 111 and two transverse frame portions 112 has three internal connecting terminals 113, 114 ind 115 connected to one of the external frame portions 111 through a later cut out connecting portion llla having a shorter length, and 4 external connecting terminals 116, 117, 118 and 119 connected to the other external frame portions 111 through a tie bar lllb and a heat sink connector 120 connected to the transverse frame portion 112 through a short connecting portion 112a.

These portions such as internal connecting terminals 113, 114, and 115, external connecting terminals 116, 117, 118, and 110, and heat sink connector 120 are separated from the external frame portions 111 and transverse frame portions 112 when the resin sealed monolithic IC portion 13 is formed by a resin whereby each is electrically separated from the other.

13 The opposite end of each terminal corresponds to each electrode of the monolithic IC 16, respectively, and are bonded thereto.

In this invention, internal connecting terminals 113, 114, and 115 are connecting terminals electrically connected to an electrical load, for example, an alternator or a generator, and correspond to the first connecting terminal, and the external connecting terminals 116, 117, 118, and 119 means are connecting terminals electrically connected to a device other than the electrical load, which device is locateds separately form and externally of the leid and oorrespond to the second connecting terminals.

Further, an electrically conductive material used io 0 ou S 15 in th.s invention is provided integrally with the O° 0internal connecting terminal 114.

S 0 ou The lead frame 11 of this invention may be treated a by a chemical treatment such as etching, or the surface Sthereof may be plated, taking the solderability and wire-bonding ability thereof into account.

C In this invention, a plate that has been already o .o plated also can be used as the lead frame.

S

a As shown in Figure 4 after the monolithic IC 16 is fixedly mounted on a predetermined portion of the lead frame 11 by for example, soldering, the opposite end of each connecting terminal and each electrode of Sthe monolithic 1C 16 is wire-bonded, respectively.

a Then a resin sealed monolithic IC portion 13 is S* formed by sealing the monolithic IC 16 and at least a 30 portion of the internal connecting terminals 113, 114 and 115 and the external connecting terminals 116, 117, 118, and 119, with the resin 13a.

Namely, first, a heat sink 12 made of a metal having a good heat conductivity such as aluminum or copper is fixed inside a first molding die, and then a lead frame lla having a monolithic IC 16 mounted thereon is fixed thereover and a clamping operation performed.

14 The heat sink 12 of this invention has a rectangular shape having projecting portions extended in a longitudinal direction of the shape provided with an aperture 121 for fixing a connecting terminal, and further, on one of the projecting portions, a step like portion 122 is provided as shown in Figures 6 and 7.

Since the heat sink 12 is fixed inside of the molding die in such a way that it is in contact with only the heat sink connector portion 120 of the lead frame 11, by utilizing the step like portion 122, the heat sink 12 is electrically separated from all of the connetting terminals except the heat sink connector port.jn 12C, after the molding operation with resin is carried out and predetermined parts cut off.

After the clamping operation, a certain resin 13a is injected into a cavity of the molding die and solidified, and therefore, a lead frame la having a resin sealed monolithic IC portion 13 can be obtained as shown in Figure 20 Next, the frame portion of this lead frame la is cut by using a die. Namely, a boundary portion between each of the internal connecting terminals 113, 114, and 115 and a connecting portion Illa and a boundary portion between the each external connecting terminals 116, 117,118 'T 25 and 119 and tie bar lllb, and further, a boundary portion between the heat sink connector portion 120 and the connecting portion 112a, are cut.

In, this example, each tip end portion l16a, 117a, 118a, and 119a of the external connecting terminals 116, 117, 118, and 119, respectively, may be pressed in a direction of a thickness of the terminal to make a tapered end portion, and both of the end corners located widthwise of the terminal may be chamfered as shown in Figures 10 and 11. The molded body thus obtained is referred to as a first molded body lb.

On the other hand, on a contacting surface between y/,0

R

a resin 13a of a resin sealed monolithic IC portion 13 i and a resin 14b for molding a connector, some projecting portions, for example, rib portions or projecting lines or the like, are provided to strengthen the contacting surface by increasing a mutual engaging ability therebetween, as shown in Figures 8 and 9.

Then, the first molded portion is fixedly mounted on a second molded die and clamped, and thereafter, a resin sealed monolithic IC is obtained by a molding method with a resin 14b, as shown in Figures 1, 2, and 3.

In this example, the resin sealed monolithic IC and external connecting terminals 116, 117, 118, and 119 are molded by an externally covering molding method with the resin 14 b, and at the same time as shown in Figures 1 4 15 and 3, the root portion of the external connecting *moo terminals are sealed with a resin, for improving the moisture proof characteristic.

In the Oecond molded portion Y, each tip end 0 portion 116a, 117a, 118a, and 119a of the external connecting terminals 116, 117, 118, and 119, respectively, are positioned inside a cavity (a concave portion) 14a of the connector made of the molded resin 14b.

The resin sealed semicond~uctor device of this .9:1 example of this invention can be obtained by using a lead frame as described above, and consequently, the steps for setting each connecting terminal and for covering a shield case required in a prcless for making a ordinary device having a hybrid construction are eliminated, and the number of components and the number of 30 steps can be reduced because of a plurali.1ty of these molded bodies can be obtainded simultaneously.

Further, a cutting operation of the lead frame can hie carried out easily and accurately by separately performing a molding process for the connector housing and a sealing process for the monolithic IC.

In, this invention, the cutting off operation for cutting the frame portion from the lead frame, and the 16 molding operation for forming the connector housing, are carried out after the operation for sealing the monolithic IC, and thus, an advantage can be obtained such that, since the root portions of the external connecting terminali 116, 117, 118 and 119 are sealed with a resin 14b, the deterioration due to moisture, which used to occurr when the lead frame was cut off, can be effectively avoided.

Furthermore, the resin 13a for sealing a monolithic IC and the resin 14b for molding a connector housing by an external covering molding method may be different each to other in this invention. For example, when a thermosetting epoxy resin having good moisture proof characteristic, stress proof characteristic, and molding 15 ability is used as the resin 13a, and a thermoplastic resin such as PBT (polybutylene telephthalate), PPS o o (polyphenylenesulfide), and 66-Nylon having a good 0 6 a mechanical strength and dimensional stability are used o" as the resin 14b, a Eemiconductor package having a good 20 moisture proof characteristic, stress proof characteristic and a good mechanical strength and dimensional stability, can be obtained.

Moreover, as described above, when both the thermosetting resin and thermoplastic resin are used simultaneously, there is less adhesive force between St* these resins and the moisture proof characteristic is usually reduced. Such a defect can be overcome by providing projecting portions 131 on the surface of the ,t resin sealed monolithic IC portion 13 and molding with 30 the resin 14b which increases the engagement force between the resins 13a and 14b.

In this invention, the resin used may preferably have, for example, Izod impact strength of more than 3 kg.f.cm/cm and a bending strength of more than 8 kg.f/mm 2 Accordingly, by obtaining a closer engagement between the resins 13a and 14b, the semiconductor Fix--r~n l i~ ru, i;li ;i 17 package thus obtained has a construction such that the intrusion of moisture at an interface between the resins can be avoided, and therefore, the moisture proof characteristic is improved.

On the other hand, instead of using the projecting portion 131, the surface may be provided with an uneven configuration for obtaining a close engagement between both resins and increase an interclinching force therebetween.

In this example, the external frame portions 111, transverse frame portions 112, connecting portion llla 112a, and tie bar Lllb are cut off after the resin sealed monolithic IC portion 13 is formed, but these cut off portions are disposed outside of the resin sealed eoo 15 monolithic IC portion 13, and consequently, when the cutting operation is carried out, the operation does not have an adverse affect on the wire-bonding already performed, because that the wire-bonded portions are "o completely sealed off by the resin.

20 Therefore, the resin sealed semiconductor device of this invention has superior moisture proof and mechanical strength characteristics.

:o On the other hand, as each tip end portion 116a, oo 117a, 118a, and 119a of the external connecting terminals i16, 117, 118, and 119, respectively, are positioned o o inside a cavity 14a of the connector housing made of the molded resin 14b, an unpreferable condition such that the tip end portion 116a, 117a, 118a, and 119a come into Scontact with another device Iefore coupling between such tip end portions and an opposite device of the connector is completed, or the tip end portions are reversely coupled with a female adapter of an opposite device of the connector, can be prevented.

EXAMPLE 2 The resin sealed semiconductor device produced in this example has the same construction as that of the device produced in Example 1, with the exception that 18 the leod frame/aes different structure from that of the semiconductor device produced in Example 1.

The lead frame used in this example is shown in Figure 12.

This lead frame 21 has external connecting terminals 216, 217, 218, and 219, which are not connected to the external frame portions 211, but two of the 4 external connecting terminals 216 and 219 existing outside are connected to a connecting portion 212b having a long length and extended from the transverse frame portions 212, and further, the external connecting terminals 217 and 218 are connected to an external connecting terminal adjacent thereto, respectively, through an intermediate connecting portion 25. The connecting portion 212b and the intermediate connecting portion 25 are positioned outside of a resin 23a after the resin sealed monolithic So IC portion 23 is formed but are covered by a second 9 resin when the connector housing is molded with that I° resin.

In this example, the lead frame is different from that of in Example 1 in that each tip end portion 216a, 217a, 218a, and 219a of external connecting terminals 216, 217, 218, and 219, respectively, are previously i fabricated, as shown in Figures 10 and 11.

As shown in Figure 12, after mounting the monolithic o IC 26 on the lead frame 21 and wire bonding between the monolithic IC 26 and the connecting terminals with wires 27 in the same way as in Example i, the monolithic IC is sealed with a resin 23a together with a heat sink 22.

30 The lead frame 2a having a resin sealed monolithic IC portion 23 thus obtained is shown in Figure 13.

Thereafter, by cutting off frame portions of the lead frame 2a and molding a resin connector housing by the externally covering molding method, the same resin sealed semiconductor device as that of Example 1 can be A obtained.

Z V Since each tip end portion 216a, 217a, 218a, and S 819 19 219a of the external connecting terminals 216, 217, 218, and 219 are previously fabricated in the configuration described in Example 1, the resin sealed semiconductor device of this Example can improve the product yield because it is not necessary to fabricate the tip end of each connecting terminal after the monolithic IC is sealed with resin.

Namely, the fabrication process applied to raw materials is superior to the fabrication process applied to partially fabricated goods form an economical point of view and of the occurrence of faulty products.

Further, since the connecting portion 212b having a longer length and extended from the external connecting terminals 216 and 219 to the transverse frame portions 15 212 and the intermediate connecting portion 25 connecting the external connecting terminals to each other including the terminal 217 and 218, which are to be cut off after the monolithic IC is sealed, are covered with s the resin by the second molding operation, no residual 20 portions exist on the terminals, a small pieces caused by the cutting,or a burs, over the connecting portion 212 and intermediate connecting portion Accordingly, a smoothly sliding coupling action between the terminals and an external connector (not shown) can be attained.

EXAMPLE 3 The resin sealed semiconductor device produced in this example has the same construction as that of the device produced in Example 3, with the exception that a lead frame 31 shown in Figures 14 and 15 is used.

This lead frame 31 is produced from a copper alloy plate having different thicknesses, a thick portion 31a and thin portion 31b, respectively, by a punching method, as shown in Figure As shown in Figure 14, in the lead frame 31, a left hand side of the external frame portions 311, a left hand side of the transverse frame portions 312, three 20 internal connecting terminals 313, 314, and 315, a heat sink connector 320, and respective portions of each of the four external connecting terminals 316, 317, 318 and 319 on which the wire bonding with a monolithic IC 36 utilizing a wire has been performed, are thick portions, and the remaining portions other portions of each of the four external connecting terminals 316, 317, 318, and 319, a right hand side of the external frame portions 311, and a right hand side of the transverse frame portions 312, are thin portions.

in the resin sealed viemiconductor device using the lead frame 31 produced ir, this Example, the internal connecting terminals 313, 314 and 315 receive stress caused by vibration generated by an electrical load including a resin sealed semiconductor device thereon, 4 or form, external vibration, but, these terminals are not a broken because the thick portions thereof allow a stress relaxation thereof.

Further in the device of this example, another advantage is gained in that a transient heat generated by a power device in a switching operation can be radiated Xf a plate made of copper alloy is selected by taking an antistress corrosion characteristic thereof into account, and if the thickness of the thick portion 31~a is more than, for example, I mm, a burring treatment In which at least three screw threads having pitches of M4 are reserved can be applied thereto, and further, the connection with the terminals oIf the opposite side is easily performed.

EXAMPLE 4 Figure 16 and Figure 17 show a front plane view and a back plane view of a resin sealed semiconductor device 4 of this Example, respectively, and Figure 1.8 shows a cross sectional view taken along a line B-fl Is of Fig. 1.7.

This resin sealed semiconductor device 4 is 21 characterized in that the external connecting terminals are bent at right angle and the connector housing has an opening in the saine direction as that of the internal conncoting terminals.

A lead frame used in this Example is shown in Figure 19.

A monolithic IC 46 is mounted on a predetermined portion of the lead frame 41 by, for example, soldering, and a resin sealed monolithic IC portion is formed by molding with a resin 43a together with a heat sink 42, after the wire bonding is performed with a wire 47 (Figure Then, a first molded body 4b is obtained by cutting off the external frame portion 411, transverse frame portion 412, and connecting p zrtion 412b from the lead fra ne, as shown in Figures 21 and 22! To make the external connecting terminals 416, 417, 418, and 419 to be at a right angle to the surface on Ott which a resin sealed semiconductor device 4 is mounted, the external connecting terminals are bent at the dotted line 46, and the first molded body 4b is joined with the second molded body 4c as shown in the front plane view and back plane view of Figures 23 and 24, respectively.

Finallyt the revin sealed semiconductor device 4 shown in Figure 16 can be obtained by carrying out an external covering molding method with a resin, to form the connector housing.

The lead frame 41 is made from a Copper alloy plate having an even thickness, by punchingt and as shown in Figure 19, comprises eXternal frame portions 411, transverse frame portions 412, three internal connecting terminals 413, 414, and 415, four external connecting terminals 416, 417, 418, and 419, and a hMat sink connector 420.

Each tip end portion 416a, 417a, 418a and 419a of the external connecting terminals 416, 417, 418, and 419 of the lead frame 41 are previously fabricated to a 22 configuration which is the sae as that of the lead frame 21 used in Example 1, as shown in Figures and 11, and further, the lead frAme 41 also has an intermediate connecting portion A5, and thus, since the external connecting terminsls 416, 417, 418, and 419 are bent at a right angle to the surface on which a resin sealed semiconductor devico 4 is a.tnted, the configuration around the external connecting terminals 416, 417, 418 and 419 is completely changed.

Also, tLe connecting position and connecting length of the connecting portions connecting the external connecting terminals, external frame portions, and transverse frame portions are changed, As shown in Figures 18 and 24, a tapered portion 15 432 provided on the monolithic IC 43 is tapered and is provided for making a t in off portion 442 for a second I, I molded body molded with resin 44b.

A414 In an external connector having a skirt, the run off portion 442 is provided to prevent interference between the skirt and the connector housing 44.

To prevent this interference, the connector housing 44 should be separate from the first molded body made of resin 43a, but in this method, only the lenqth of the device is extended, and therefore, this method is not preferable from viewpoint of reducing weight and of miniaturization.

Accordinqly, as shown in Example 4, the run off portion 442 can be created by providing a tapered portion on the device, In the resin setled semiconductor device of tlis example, as shown in Figures 16 and 17, two lightening holes 441 are provided, which are formed after all of the external connecting terminal 416, 417, 418, and 419 are bent at an angle of 90 6 in the same direction, and are apertures or penetrations appearing because patterns of the lead frame do not exAst on that portion. This allows a saving of materials, reduced costs and weight a t^ V 23reduction.

This device has another advantage in that a connector arrangement which is difficult, to realized by using the connector having a direction parallel to the connecting direction, as shown in Figures 1, 2 and 3, can be realized and the occupied area of the device is smaller than that of a device having all portions arranged on a plane.

Further, when the resin sealed semiconductor device is integrally mounted on an electric load, as described in this invention, prefetably the occvpied area is as small as possible when it is utilized for compact electrical load.

EXAMPLE 15 in this example, an IC regulator connected to an alternat(r as an electric load is explained in more detail.

A perspective view of the IC regulator 5 it shown Sain Figure 31.

The external connecting terminals of this IC regulator 5 are bent at an angle of 90°, as in Example 4, and the connector housing has an opening which is o' directed in a direction at a right angle to the internal connecting terminals, the external connecting terminals being bent in the sair e direction in which the heat 4 sink 52 is provided on the monolithic IC, which is opposite the direction in example 4.

Next, a method of producing this Example is explained with re.erence to Figures Z5 to 31.

j "30 First, a -ront plane view of the lead frame is 'shown in Figure In this lead frame 51, the internal connecting terminals 513, 514, 515, and 520, and the external connecting terminals 516, 517. 518, and 519 are connected to tha external frame portions 511 and the transverse frame portions 512, respectively, and further, island poti)ns 514a, 520a, and 519a on each of which the EXAMPLE 1 Figure 1 and Figure 2A show a front plane view and d- 24 44 1 Pa 4 4 41 @4 4 o I~ t~ monolithic IC's 56a, 56b, and 56c are mounted, respectively, the details of which will be explained later, are provided on each end of the internal connecting terminals 514, 520, and 519 respectively.

The island portion 520a is also connected to the internal connecting terminal 513, and therefore, the island portion 520a is supported at both ends by the terminals.

Lock holes 514b and 513b are provided on the internal connecting terminals 5141 and 513, respectively, to increase the adherence force between the resin 53a for a first molded portion and the resin 54b for connector housing, secor, molded portion, each of which will be explained lp'er, and other lock holes 516b, 517b, 518b, and 1J9b are provided on the external connecting terminals 516, 517, 518, and 519, respectively, to increase the adherence force with the resin 53a for the first molded portion, which will be explained later.

20 As shown in Figure 26, the monolithic IC's 56a, 56b, and 56c are fixed on the island portions 514a, 520a and 519a by, for example, soldering.

After the wire bonding operation with the wire 57 is completed, the molding operation is carried out over the lead frame 51 together with a heat sink 52 having a configuration as shown in Figure 28, to obtain a resin sealed monolithic IC portion Figure 27 shows the resin sealed monolithic 1C portion 5a in which the heat sink 52 is fixed to a back side of the lead frame 51 and that portion has ribs 531 provided on the resin 53a to increase the adherence force with the resin 54b, as explained later.

Nfet, the first Molded body 5b can be obtained by cuttitJ off the external frame portions 511 and the transverse frame portions 512, and other connecting portions from the lead frame 51, as shown in Figure 29, which shows the back side portion of the body.

c .r L I -DII~L--d 25 a 044 0 0 aa 00* 0 0 o i) 04 4 04 0 4r 0 401

I

0 .#4 Now, T;he connection portion 513c connecting between the island portion 520a and the internal connecting terminal 513 is also cut off simultaneously.

Furthermore, the external connecting terminals 516, 517, 518, and 519 are bent at a right angle to the surface on which the IC regulator 5 is mounted, a flat surface of the resin 53a, to obtain a second molded portion 5c as shown in the perspective view in Figure Finally, the IC regulator 5 as shown in the perspective view in Figure 31, can be obtained by carrying out the externally covering molding method over that portion with a resin, for example, PBT.

The IC regulator 5 thus obtained is incorporated in an alternator 6 through the internal connecting terminals 513, 514, 515, and 520 as shown in the plane view of Figure 32.

Figure 32 partially shows a rear side of an alternator 6 with the rear cover removed, in which a rectifier 61 having eight diodes 63 and a brush holder 20 62 are provided, and the IC regulator 5 is assembled to the alternator 6 by fixir.g with bolts, which establish an electrical contact between the IC regulator 5 and the alternator 6.

An equivalent electric circuit of the IC regulator 25 -nd alternator 6 is shown in Figure 33.

In Figure 33, the same components as those of previous figures are given the same numbers.

The alternator 6 comprises a brush holder 62, diodes 63, stator coil 64, and rotor coil 65, and a generated voltage is controlled to a predetermined value by controlling a 'urrent of the rotor coil by a control circuit 70 of the IC regulator 5 through a transistor 71 and an F torminal.

A charge lamp 81 is tir:ied OFF when the alternator is generating a current, a load 82, for example, an electrothermal choke, for increasing a fuel mix ratio in vehicles, for example, whi- is turned ON when the 1 1 26 alternator is generating a current. A battery 83 and a key switch 84 are also provided.

The IC regulator 5 controls the generation of the alternator 6 by controlling the transistor 71 to ON or OFF corresponding to signals of a generated voltage of the alternator 6 input to the control circuit 70 through the terminal B, and the voltage of the battery input to the control circuit 70 through the terminal S.

An output voltage VG of one phase of the alternator 6 is input to the IC regulator 5 through the terminal P, and when the voltage VG exceeds a predetermined voltage value VA a low level signal L is output o on the lines a and b, respectively.

Accordingly, the transistor 72 and 73 is turned ON 0 "a 15 and OFF, respectively, and therefore, the electric Scurrent from the battery 83 flows into the load 82 o' through the terminal IG, transistor 72, and the m«aa terminal L.

When the voltage VG is lower than the predetermined voltage value VA a high level signal H is output on the lines a and b respectively, and accordingly, the o transistor 72 and 73 is turned OFF and ON, respectively, and therefore, the electric current from the battery 83 a "o 6flows through the charge lamp 81, the terminal L, and transistor 73, causing the charge lamp 81 to turn ON.

Further, since the ON and OFF condition of the <,ioa transistor 71 is closely connected to the generating condition of the alternator 6, this signal, which is S* already transmitted to the terminal FR through the 30 control circuit 70, can be supplied to an Electronic Control Unit (ECU) for controlling vehicles, for example.

In this Figure, the terminals F, E, and P coris.spond to the internal connecting terminals 514, 515, 520, and 513, respectively, and the terminals S, IG, L, and FR correspond to the external connecting terminals 517, 518, 519, and 516, respectively.

"a I 27 s4 44 49a o B9 4 44 0Q9 The terminal E is grounded and the terminal B is used for supplying the voltage generated by the alternator 6 to the battery 83.

In this circuit construction, an input impedance of the terminals of the control circuit 70 is set at a high level, since a voltage signal is output at the terminals S and FR, and therefore, a connector housing covering the external connecting terminals is provided by externally covering molding operation to prevent a variation in voltage cause'd by a leak current, for example.

Further, a connector housing can not be formed on the side of the internal connecting terminals since it must be connected to the alternator 6 mechanically and 15 electrically, and therefore, the ends of the internal connecting terminals are fabricated into a configuration which enables them to be directly fixed to the load by, for example, thread tightening.

Consequently, at the terminal F or the like in which a leak current can be more or less ignored if it flows in the terminal, an offset operation is not required, but at a terminal in which a leak current flow can not be ignored, the offset for leak current is applied by setting the input impedance at a low level.

According to this example, the number of components and the number of production steps can be reduced, and an IC regulator having a more compact size can be provided, as in Example 4. Further, in this Example, as the extended external connecting terminals 516, 517, 518, and 519 are bent to the direction of the side where the heat sink 52 is located, the contacting area between the resin 53a and the resin 54b becomes large at the side opposite to the heat sink 52, as shown in Figure 34, without any deterioration of the heat radiation performance thereof.

When an opposite connector portion having a female adapter is inserted into the connector housing made of

B

I

E

28 the resin 54b, a pressing force occurs as shown by an arrow P in Figure 34, but this force produces another force PI, which presses the resin 54c arranged under the resin 53a onto the resin 53a through a fulcrum f, amd thus the resin 54b is bent, and accordingly, the reliability of the adhesion between the resin 53a and the resin 54b is enhanced.

In the example described above, embodiments of this invention are explained by a method in which a process of sealing the monolithic IC and a connector molding process are carried out in separate steps, and hereafter, other embodiments of this invention in which both processes can be carried out simultaneously in one step °will be explained.

o0 15 The lead frame used in this embodiment is different o ao from that used in previous Examples.

Q Namely, this lead frame is provided with a frame 0 portion such that first connecting terminals are 0 0connected to the frame portion through a cutting portior and second connecting terminals are connected to the frame portion through an intermediate connecting portion, and when molding occurs, parts of the intermediate connecting portions are not covered with resin, and the intermediate connecting portions are then cut off when a cutting operation is carried out, to be eliminated from the frame portion.

A plane view of a semiconductor device 600 made in this example is shown in Figure 35-A. This device is produced in such a way that, first a monolithic IC is wire bonded to the lead frame 61, a plane view of which is shown in Figure 36, and then the lead frame 61 is inserted into a molding die with a heat sink 620, and thereafter, a molding operation is carried out to make a molded body, t plane view of which is shown in Figure 37, and finally, the device is cut off the lead frame.

The lead frame 61 is made from a plate made of copper 29 alloy having an even thickness, by punching, and as shown in Figure 36, two external frame portions 611 extending vertically and a plurality of transverse frame portions 612 coupling with the external frame portions are provided.

In an inner portion enclosed by the two adjacent external frame portions 611 and two adjacent transversal frame portions 612, three internal connecting terminals 613, 614, and 615 connected to the external frame portions through a later cut short connecting portion 611a, four external connecting terminals 616, 617, 618, and 619 connected to the external frame portion 611 through a tie bar G61b and a heat sink connector 620 °oo connected to the transverse frame portion 612 through a 15 short connecting portion 612a, are provided.

0 00 The two outermost external connecting terminals 616 s o and 619 are also connected to a connecting 612b having a longer length and extended from each of the transverse frame portions 612.

Each connecting terminal of the lead frame and each electrode of the IC are wire bonded, respectively, and then a heat sink 620 made of a metal having a superior heat conductivity, such as aluminum or copper is first inserted into a molding die, and thereafter, the lead frame 61 having an IC mounted thereon is inserted and a clamping operation is carried out.

In this case, the heat sink 620 has a rectangular confirmation with two projecting portions each projected from a short side thereof, with an aperture 621 for fixing same to a load provided thereon, as shown in Figure 35-B, and has a step like portion 622 on one of the projecting portions as shown in Figure This step like portion has the same function as stated in previous examples. Thereafter, a molding operation for fabricating a molded portion over the IC with a connector housing (3Q is carried out by injecting a resin into a cavity of the molding die and then 30 solidifying the resin to make a molded body in which a connector housing 630 is integrated with the lead frame 611, as shown in Figure 37, is carried out.

Then, a semiconductor device is obtained by cutting the portions 611a connecting the external frame portion 611 of the lead frame and each internal connecting terminal 613 615, the portion 612a connecting a heat sink connector 640 and a transverse frame portion 612, a boundary portion between each external connecting terminal 616 619 and a tie bar 611b and a projecting portion of the connecting portion 612b projected from the connector housing 630, and the connecting portion 612b connecting each transverse frame portion 612 and an outer portion of the external connecting terminals 616 64 S 15 and 617, by a cutter.

0 ,A semiconductor device of this example is produced in one step of sealing the IC and molding a connector housing.

Therefore, the number of step in the process is reduced and the process per se is simplified. Further, this device has a water proof construction because the IC is integrally embedded inside the connector housing 630.

Moreover, since the external connecting terminals 616 619 are disposed inside a cavity 630a of the connector housing 630, and therefore, each tip portion Sthereof does not project from the connector housing 630, short circuits caused by the intrusion of a foreign tance into the connecting portion, are prevented.

T Dpen portion of the cavity 630a retaining the F external connecting terminals 616 619 therein is molded in such a way that the open area io gradually expanded in an outward direction, and thus an opposite connector (not shown) can be easily inserted therein.

In this example, instead of providing a step like portion on the heat sink 620, the same effect as above can be obtained by providing a step like portion on a rdi r i i "r:l ;i 31 0 04 0 01 4 001 lp 00044 41 4 heat sink connector on a lead frame 61.

Further, instead of providing a specific step like portion, a process of fixedly adhering a heat sink 62 having a insulating layer, such as a layer produced by an anodic oxidation method, with a lead frame by utilizing an adhesive having a good heat conductivity, or a process in which a heat sink 620 and a lead frame 61 are inserted into a molding die while interposing an insulating film having high heat conductivity therebetween, and thereafter, carrying out the molding, may be adopted to obtain the same effect.

Example 7 A plane view of a semiconductor device made in this Example 7 is shown in Figure 38. This device 700 is 15 produced in such a way that, first an IC (not shown) is wirebonded to a lead frame 721 as shown in Figure 39, and the lead frame 721 and a heat sink 722 are clamped in a molded die, and thereafter, molded to produce a molded body, a plane view of which is shown in Figure 40, and finally, is cutoff.

In this semiconductor device 700, a drawback in that it is relatively difficult to cut off the external connecting terminals 616 619 of the semiconductor 6 from a lead frame 61 shown in Figure 35 in Example 6, is eliminated.

The lead frame 721 is fabricated from a plate made of copper alloy having an even thickness, by punching, and has a configuration as shown in Figure 39, wherein an external frame portion 711, a transverse frame portion 712, three internal connecting terminals 713, 714, and 715, four external connecting terminals 716, 717, 718, and 719, and a heat sink connector 720, are provided.

This lead frame is generally the same as that in Example 6, but is different in that the external connecting terminals 716 719 are not connected to the external frame portion 721 and the tip portions thereof i

I

It 41

'A^

are previously fabricated, and further, two inside external connecting terminals 717 and 718 are connected to an inner connecting terminals 714 through an intermediate connecting portion 76 having a T shape and the two outside external connecting terminals 716 and 719 are connected to the connecting portion 722b connected to the transverse frame 712, respectively.

It is also different from the heat sink of Example 6 that a heat sink 722 of this Example has a concave portion 732 on one of the long sides thereof.

Further, a molding die used in this example, not shown, is also different from that used in Example 6, in the configuration of the cavity for molding the intermediate connecting portion 76 and a portion whereat the tip portions of the external connecting terminals are surrounded.

Each connecting terminal of this lead frame 721 is wirebonded with an electrode of the IC, and thereafter, the I lead frame with the IC and a heat sink 722 are inserted into a molding die in the same manner as in Example 6, and then a 0:.20 resin is injected into a cavity of the die and the resin is soldified to make a molded body with a connector housing 723.

Thus the molded body in which a lead frame 721 is intergrated with a connector housing 723 as shown in Figure can be obtained. An apertured portion 7a is provided on a center portion of the connector housing 723, and the intermediate connecting portion 76 appears in this aperture.

The external connecting terminals 716 719 are retained inside a cavity 73a of the connector housing 723, and thereafter, in the same manner as in Example 6, the frame portions 711, 712, 722b and the intermediate connecting portion 76 are cut off, and therefore, the semiconductor device 700 having a aperture 7a as shown in Figure 38 can be obtained. By cutting off the intermediate connecting portion 76, the internal connecting terminal 714 and the external connecting terminals 717, 718 are electrically separated and insulated.

-32- Further, preferably the ends of the external connecting terminals 717, and 718 caused by the cutting operation and appearing on the inner wall of the aperture 7a, and the ends of the portion connected to the external connecting terminals 716 and 719 caused by cutting operation and appet ring on the outer surface of the side wall of the mole id resin 723, are sealed by a sealing material such as a silicone resin or alkydresin, to make a sealed portion 77 and thus improve the water-proofing, This sealing operation may be applied on the after portion where the terminal portions unnecessarily appear on the surface of the connector housing, and is not restricted only to the intermediate connecting portion.

In the semiconductor device of %his example, a lead frame having the external connecting terminals 716 719 the tip ends of which are previously fabricated into a predetermined shape, is used, and therefore, the cutting .o*o operation for cutting the tip ends of the external connecting terminals is not required when the connector housing is cut off from the lead frame. Moreover, the

V

.oo cutting operation for cutting the intermediate connecting portion can be carried out simultaneously with cutting off Sof the lead frame. Accordingly the semiconductor device in this Example is more easily produced than that of Example 6.

In the above, the invention is explained by Examples 1 to 7, but this invention is not restricted to these *Examples, various variations as described hereunder can be considered, as long as they do not fall outside of the scope of this invention.

In an electric conductive material on which the monolithic IC is mounted, the external connecting terminals, 4i and the internal connecting terminals may be formed as a separate portions, not as an integrated body.

Where there is no need to control the charge lamp 81 and a load 82 through a plurality of external connecting terminals, as in Example 5, preferably at least one terminal (S terminal) for inputting the battery voltage, for example, is provided, and conversely, -a ^sQ3sj/as -33- A -34if an input and output of more signals to and from the external connecting terminals is required preferably a water proof connector having more than five terminals is provided.

When the resin sealed semiconductor device of this invention is used as an IC regulator as shown in Example 5, the electric load to be controlled may be a DC generator (dynamo) as well as the alternator 6.

As a method for producing the resin sealed semiconductor device, the sequential process thereof is not restricted only to that described in the Examples, Q forming a resin sealed monolithic IC portion, 4. cutting off frame portions from a lead frame, forming a connector housing, but another sequence such o° 15 as forming a connector housing, cutting off 1o frame portions from a lead frame, and forming a So' resin sealed monolithic IC portion, may be adopted, and o in such a case, when forming the connector housing, the electric conductive materials on which the monolithic IC is mounted, the external connecting terminals, and the oVo" internal connecting terminals are fixed after the oVo housing is formed.

As the resin for sealing the monolithic IC and "I for molding the connector housing a combination of resins such as a PPS resin including silica, for example, as a filler which is not an increase in the melting viscosity, and a PPS resin including a glass fiber, for S"o example, may be used as the thermosetting resin and the thermoplastic resin mentioned above.

Note, preferably the resin for sealing the monolithic IC is a resin having a low melting viscosity such that the resin does not produce extreme deformation of the wiring connected between the monolithic IC and the connecting terminals, and does not cut these wires when the molding operation is carried out.

The resin for molding the connector housing must have a certain mechanical strength after the 35 molding operation, to protect the connecting terminals.

This invention can be applied to an igniter or the like having a connector housing formed by the externally covering molding operation, in the same manner as in these Examples, other than the IC regulator used in these Examples.

EFFECTS OF THE INVENTION As described above, in accordance with this invention, since the molding of the monolithic IC and the connector housing are performed with the first resin and the second resin, respectively, it is not necessary for the second connecting terminals to have a special S* configuration to be cut off.

o Further, according to the construction of this 1"2 15 invention, a lead frame can be used, and consequently, S*it the number of components and the number of process steps can be reduced.

Moreover, the resin can be selected to correspond to a required function.

20 According to the invention, the molded product with the resin having the advantages of the respective resin used can be obtained.

Further, the moistureproof characteristic of the device can be improved.

25 Moreover, the adhesive force between the first Sresin and the second resin can be strengthened, and the reliability of the adhesion between the first resin and the second resin can be further improved.

According to this invention, as the resin sealed semiconductor device is formed by using a lead frame, I the number of components and the number of process steps can be reduced, and moreover, by separating the process of sealing the monolithic IC and the process of molding the device by an externally covering molding method, the cut off of the frame portions from the lead frame can be carried out very easily, and consequently, the fabricate flexibility of the lead frame is increased.

Claims

1. A resin sealed semiconductor device, which comprises a first connecting terminal electrically connected to an electrical load, a second connecting terminal connected to a device other than said electrical load, a monolithic IC which co.itrols an operation of said electrical load mounted on a conductive member and connected to both said first connecting terminal and said second connecting terminal and a resin molded portion of an electric insulating resin, said resin molded portion having first molded portion molded with a first resin and sealing said monolithic IC and at least a portion of said first and second connecting terminals so that said first and second connecting terminals t 15 are rigidly fixed thereby, and a second molded portion S integrated with a connector housing portion integratedly i molded with a second resin, said connector housing portion being molded in such a way that the second connecting terminal is diposed in a cavity at one end of the connector owe 20 housing portion and said second connecting terminal is 0 t surrounded thereby. S*

2. A resin sealed se iconductor device according to a claim 1, wherein the electrical load is a generator.

S3. A resin sealed semiconductor device according to claim 1, wherein said f'irst and second connecting terminals are directly extended from outside of said first Iolded portion into a portion adjacent to said monolithic IC. s

4. A resin sealed semiconductor device according to claim 1, wherein said first connecting terminal is directly connected to a portion on said electrical load and said second c;nnocting terminal forms a connector which can be i connected to a device other than said load.

A resin sealed semiconductor device according to claim 1 or 4, wherein said connector housing and said second connecting terminal are bent at a predetermined angle to a surface direction defined by said first molded portion, 233S/JM -'36-

6. A resin sealed semiconductor device according to claim 1, wherein said second molded portion molded with a second resin externally covers at least a portion of said first molded portion.

7. A resin sealed semiconductor device according to claim 1, wherein said first and said second connecting terminals and said conductive member are made of the same material.

8. A resin sealed semiconductor device according to claim 1, wherein a penetrating aperture is further provided tr st on saidiresin molded portion.

9. A resin sealed semiconductor device according to claim 1, wherein said second molded portion integrated with a conductor housing portion integratingly molded with a second resin, externally cover;s at least a portion of said t first molded portion.

A resin sealed semiconductor device according to claim 1, wherein said first connecting terminal, said second connecting terminal and said conductive member are formed by a punching method from a plate made of an electric conductive material. *4I ,t

11. A resin sealed semiconductor device according to i claim 1, wherein the first resin and the second resin are the same kind of resin.

12. A resin sealed semiconductor device according to claim 1, wherein the first resin and the second resin are I, different kinds of resin.

13. A resin sealed semiconductor device according to claim 12, wherein the first resin and the second resin have different mechanical strengths represunted by any one of the Izod impact strength and bending strength. S 023s/as -3"3 J

14. A resin sealed semiconductor device according to claim 13, wherein said strength of the second resin is higher than that of the first resin.

15. A resin sealed semiconductor device according to claim 12, wherein each of said first resin and said second resin has a characteristic such that, when molding, said first resin, has a lower viscosity than that of said second resin and after molding, said second resin has a higher mechanical strength represented by any one of the Izod impact strength and a bending strength than that of the first resin.

16. A resin sealed semiconductor device according to claim 12, wherein said first resin is made of a thermosetting resin and said second resin in made of a thermoplastic resin. a

17. A resin sealed semiconductor device according to a' :20 claim 1, wherein said second resin is molded in such a way that at least a root portion of said second connecting terminal extending from said first molded portion Is covered Sby said second resin.

18. A resin sealed semiconductor device according to claim 1, wherein said second molded portion is molded in t such a way that at least a portion of said first molded portion is held by said second resin and fixedly engaged therein.

19. A resin sealed semiconductor device according to *t claim 18, wherein at least one of the contacting surfaces of said first and sa.d second mould portions is formed as a S roughened surface.

A resin sealed semiconductor device according to claim 1, wherein said second connecting terminal is bent at Sa predetermined angle to a surface direction defined by said first molded portion molded with the f t resin. 3s/as -38- .L I

21. A resin sealed semiconductor device according to any one of claims 1 to 20, wherein said resin sealed semiconductor device includes a resin sealed IC regulator.

22. A resin sealed IC regulator, which comprises a first connecting terminal electrically connected to a generator, a second connecting terminal electrically connected to a device other than said generator, a monolithic IC which controls an operation of said generator, mounted on a conductive member and electrically connected to both said first connecting terminal and said second connecting terminal, and a resin molded portion of an electric insulating resin, said resin molded portion having a first molded portion molded with a first resin and sealing said monolithic IC and at least a portion of said first and second connecting terminals so that said first and second connecting terminals are rigidly fixed thereby, and a second molded portion integrated with a connector housing portion 4o",1 integratedly molded with a second resin, said connector 20 housing portion being molded in such a way that said second connecting terminal is surrounded thereby.

23. A resin sealed IC regulator according to claim 22, wherein said second molded portion is molded with a second resin and externally covers at least a portion of said first molded portion.

S24. A resin seale IC regulator according to claim 22, ,,wherein a tip end of said second connecting terminal is 30 disposed inside of a cavity provided in said connector housing portion surrounding said terminal. 44

25. A resin sealed IC regulator according to claim 22, wherein said first resin is made of a thermosetting resin and said second resin is made of a thermoplastic resin, 0233s/s -39- 0233s/as -39- i, 1 J lr;rc~c~-i;il-- i I J1~ I I ef4 t: i44 4444 4 44r c 44 a 44 44

26. A resin sealed IC regulator according to claim 22, wherein said second terminal is bent at a predetermined angle to a surface defined by a main portion of the molded portion and said heat sink is fixed over one surface of said molded portion facing the same direction as that in which said second connecting terminal is bent.

27. A resin sealed semiconductor device according to claim 22 or 24 wherein said connector housing is bent at a predetermined angle to a surface direction defined by said molded portion.

28. A resin sealed semiconductor device which comprises a first connecting terminal electrically connected to an elactrical load, a second connecting terminal electrically connected to a device other than said electrical load, a monolithic IC which controls an operation of said electrical load, mounted on a conductive member and electrically connected to bothh said first connecting terminal and said second connecting terminal, and a resin molded portion of an electric insulating resin sealing said monolithic IC and at least a portion of said first and said second connecting terminals so that said first and said second connecting terminals are rigidly fixed thereby, said resin molded portion having a connector housing portion integrally formed thereon by a molding resin in such a way that the second connecting terminal is disposed in a cavity at one end of the connector housing portion and said second connecting terminal is surrounded thereby4

29. A resin sealed semiconductor device according to claim 28, wherein said semiconductor device is an IC regulator.

A resin sealed semiconductor device according to claim 28, wherein said electrical load is a generator.

31. A resin sealed semiconductor device according to claim 28, wherein said first and second connecting terminals and said conductive member are made of the same material. 1 B' 0233s/JM

32. A resin sealed semiconductor device according to claim 28, wherein said first connecting terminal, said second connecting terminal and said conductive member are formed by a punching method from a plate made of an electric conductive material. 4 e 4 4II 44 1

33. A resin sealed semiconductor device according to claim 28, wherein a tip end of said second connecting terminal is disposed inside a cavity provided in said connector housing portion surrounding said terminal.

34. A resin sealed semiconductor device according to claim 28, wherein said second terminal is bent at a predetermined angle to a surface defined by a main portion of said molded portion and said connector housing portion.

A resin sealed semiconductor device according to 15 claim 34, wherein a heat sink is fixedly provided on one surface of said molded portion facing the same direction as that in which said connector housing portion is bent.

36. A resin sealed semiconductor device according to claim 28, wherein a plurality of said second connecting terminals are provided and at least a cut portion of a conductive material connected to at least one of said second connecting terminals surrounded by said connector housing is exposed on the side surface of said resin molded portion.

37. A resin sealed semiconductor device according to claim 28, wherein a penetrating aperature is provided on said resin molded portion.

38. A resin sealed semiconductor device according to claim 37, wherein a plurality of said second connecting terminals ar( provided and at least a cut portion of a conductive material connected to at least one of said first and said second connecting terminals is exposed on the inside surface of said penetrating aperature. d 4. 41 0 44 0233S/JM -41- i

39. A method of producing a resin molded IC regulator comprising, forming a lead frame, in which at least a first connecting terminal to be electrically connected to an electrical load and a second connecting terminal to be electrically connected to a device other that said electrical load are connected to a frame portion theieof, out of a plate made of an electric conductive material, mounting a monolithic IC controlling an operation of said electrical load, on a conductive member and electrically connecting said monolithic IC to said lead frame, sealing overall said monolithic IC mounted on said conductive member completely and at least a portion of said first and second connecting terminals electrically connected to said monolithic IC partially, with a first resin having an electrical insulating characteristic to make a first molded portion, so that said first and said second connecting terminals are rigidly fixed thereby, separating said frame portion from said lead frame and making a second molded portion by an externally covering molding operation to ft o* .,20 surround said second connecting terminal in such a way that .I said second connecting terminal is disposed inside a cavity fi 1*s provided on said second molded portion, with a second resin having an electric insulating characteristic.

40. A method of producing a resin molded IC regulator according to claim 39, wherein the step of sealing with said first resin is performed before the step of separating said ,t frame portion from said lead frame, and the step of making said second molded portion with said second resin to cover :30 at least a portion of said first molded portion is performed after the step of separating said frame portion from said lead frame. t

41. A method of producing a resin molded IC regulator according to claim 39, wherein the step of making said second molded portion with the second resin is a process for molding resin with a portion surrounding said second connecting terminal therewithin, performed before the step I*02'33s/as -42- of separating said frame portion from said lead frame, and the step of sealing said monolithic IC and at least a portion of said first connecting terminal and second connecting terminal with said first resin to make said first molded portion is performed after thestep of separating said frame portion from said lead frame.

42. A method of producing a resin molded IC regulator according to claim 40, wherein said first resin and said second resin are the same kind of resin.

43. A method of producing a resin molded IC regulator according to claim 40, wherein said first resin and said second resin have different mechanical stengths represented by any one of the Izod impact strength and a bending strength.

44. A method of producing a resin molded IC regulator according to claim 43, wherein said second resin has a higher mechanical strength than that of the first resin.

A method of producing a resin molded IC regulator according to claim 43, wherein said first resin is made of a thermosetting resin and said second resin in made of a thermoplastic resin.

46. A method of producing a resin molded IC reqgulator comprising, forming a lead frame, in which at least a first connecting terminal to be electrically connected to an f '30 electric load and a second connecting terminal to be electrically connected to a device other than said electric load are connected to a frame portion thereof, out of a plate made of electric conductive material, mounting a monolithic IC controlling an operation of said electric load on a conductive member and electrically connecting said monolithic IC to said lead frame, sealing overall said monolithic IC completely and at least a portion of said 2 -43- <1 im-. first and second connecting terminals partially, with an electric insulating resin to form a sealing portion, so that first and said second connecting terminals are rigidly fixed thereby, and simultaneously, making a molded portion with said electric insulating resin havinga connector portion provided with a cavity portion with which said second connecting terminal is surrounded and integrated with said sealing portion, and separating said frame portion from said lead frame.

47. A method of producing a resin molded IC regulator according to claim 46, wherein a tip end of said second connecting terminal is disposed inside of a cavity provided in said molded portion surrounding said terminal.

48. A method of producing a resin molded IC regulator according to claim 39 or 46, wherein said lead frame has a 'u configuration such that said second connecting terminal is connected to said lead frame through a connecting portion 20 connected between said frame and a portion of said second connecting terminal except a tip portion thereof and the tC sealing operation or the molding operation is carried out in lt such a way that said connecting portion remains outside of said sealed or molded portion, and the separating operation is carried out by separating said connecting portion.

49. A method of producing a resin molded IC regulator according to claim 39 or 46, wherein a plurality of said second connecting terminals are provided and said lead frame 4:"t30o has a configuration such that two outermost of said second connecting terminals are connected to said lead frame |1 through a connecting portion connected between said frame and a portion of the second connecting terminal except for a tip portion thereof, and other inner second connecting terminals are connected to one of the first connecting terminals through an intermediate connecting portion connected to a portion of said second connecting terminal except for a tip pprtion thereof, and the sealing operation t i/a -44- T-t i or the molding operation is carried out in such a way that said connecting portion remains outside said sealed or molded portion and the separating operation is carried out by separating said connecting portion and said intermediate connecting portion. A method of producing a resin molded IC regulator according to claim 49, wherein said sealing operation or molding operation is carried out in such a way that said connecting portion remains outside of said sealed or molded portion and said intermediate connecting portion is inside and aperture provided on said sealed or molded portion, and the separating operation is carried out by separating said connecting portion and said intermediate connecting portion inside said aperture. L*14 4 t It 4: S ai Sti 44'( DATED this 23rd day of January, 1990 NIPPONDENSO CO., LTD By their Patent Attorneys GRIFFITH HACK CO. .4i 4 t' t 41 4 s I I #4 "NT O 02335/au