JP2003037241A - Electrical circuit board package item and manufacturing method for the electric circuit board package item - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the electric circuit board package item of a resin sealing type, indicating sufficient durability with high flexibility of heat radiation design and high operation reliability, moreover without generating faults at a resin- sealing part, even in use under severe heat conditions. SOLUTION: At least two sets or more of boards 20 and 30, on which electronic components are mounted are respectively and non-continuously sealed with a resin and the boards, are connected to each other by leads 43 inserted to sealing resins 60 and 61.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric circuit board packaged product and a method for manufacturing the electric circuit board packaged product, and in particular, it is used under severe heat conditions such as an on-vehicle electric circuit board packaged product. The present invention relates to a resin-sealed type electric circuit board package product and a method for manufacturing the same.

[0002]

2. Description of the Related Art An electronic control unit for an automobile engine or an automatic transmission (hereinafter referred to as a control unit) has been installed in a passenger compartment, but is installed outside the passenger compartment as the number of control units in the passenger compartment increases. Are becoming required.

Further, when the control unit and the controlled object are separated from each other, the wiring of the wiring between the control unit and the controlled object becomes complicated, and the wiring laying cost becomes high. There is an increasing demand for integration with a control target, so-called modularization.

That is, the electronic control unit for the engine (engine control unit) is installed in the engine room, preferably in the engine itself, and the control unit for the automatic transmission (transmission control unit) is directly attached to the automatic transmission or automatically. In order to meet the needs of installing the transmission inside the transmission, there is a need for technology to achieve this.

However, their installation places are in a very severe temperature environment (-40 to 130 ° C.) and may be exposed to water, engine oil, and AT oil. Therefore, the control unit used under such harsh conditions is required to have electronic components mounted on a heat-resistant substrate such as ceramic and be housed in a completely airtight case. However, it is difficult to adopt a hermetic seal as a completely airtight case in terms of cost.

Therefore, as an inexpensive and highly reliable structure, electronic components are mounted on a ceramic substrate, the substrate and the leads of the lead frame are wire-bonded, and the entire substrate is collectively molded by transfer molding. An electric circuit board package product having a structure of encapsulation can be considered. Incidentally, as a conventional technique, although not a substrate, a technique relating to resin sealing of a semiconductor element for high-density mounting is disclosed in JP-A-7-50388 and JP-A-8-2506.
56 and Japanese Patent Laid-Open No. 9-74167.

[0007]

Epoxy resin is generally used as a resin suitable for transfer mold encapsulation (resin encapsulation). The linear expansion coefficient of epoxy resin is about 10 to 20 ppm / ° C. Yes, the linear expansion coefficient of a ceramic substrate suitable for heat-resistant and high-density mounting is 5-7 ppm /
Since the difference in linear expansion coefficient between the two is large, there is a concern that thermal stress generated by repeated temperature changes may lead to deterioration of adhesiveness of the sealed portion and eventually to interface peeling and resin cracks.

The electric circuit board packaged product for the control unit has a very large package size as compared with an ordinary semiconductor packaged product, and therefore,
Even if the linear expansion coefficients of the two are made close to each other by changing the materials of the two, there is a problem that excessive thermal stress is eventually generated at the end of the package. Further, a plurality of heat-generating components may be arranged in the same package, and in this case, there is a problem that proper heat radiation arrangement cannot be performed due to mutual interference of heat.

The present invention has been made in view of the above problems, and an object of the present invention is to sufficiently prevent the resin sealing portion from being damaged even when used under severe heat conditions. Provided are a resin-sealed type electric circuit board package product that exhibits excellent durability, and has high flexibility in heat radiation design (optimal placement of heat-generating components) and high operation reliability, and a manufacturing method thereof. It is in.

[0010]

In order to achieve the above object, in an electric circuit board packaged product according to the present invention, at least two or more sets of boards on which electronic parts are mounted are individually and non-continuously resin-sealed. The substrates are connected to each other by leads and tabs inserted in the sealing resin.

The substrate is electrically connected to the leads of the lead frame, the leads and tabs are obtained from the same lead frame, and the substrate is one electric circuit divided according to use and function. A board handled as a board package product is divided into a plurality of pieces. Due to the individual resin sealing for each divided board, the resin sealing size for each board is smaller than when one board is configured,
The thermal stress generated due to the difference in linear expansion coefficient between the substrate and the sealing resin is reduced, and it becomes possible to separate the package of high heat-generating components.

In the electric circuit board package product according to the present invention, when it is necessary to electrically connect the divided boards to each other, the boards are electrically connected to each other by the leads for interconnection. be able to. In addition, when it is not necessary to electrically connect the divided substrates to each other, the substrates may be connected in a non-conducting state by a tab.

In order to achieve the above-mentioned object, in the electric circuit board package product according to the present invention, at least one substrate on which electronic parts are mounted and at least one IC chip are individually and non-continuously resin-sealed. Then, the substrate and the IC chip are connected to each other in an electrically connected manner by the interconnecting leads inserted in the sealing resin.

The substrate and the IC chip are electrically connected to leads of a lead frame, the leads are obtained from the same lead frame, and the IC chip mounted on the substrate is separated from the substrate. It is made to exist (separate arrangement). By separating the IC chip from the substrate, the individual resin sealing size becomes smaller than that when the IC chip is mounted on the substrate.
The thermal stress generated due to the difference in the linear expansion coefficient between the chip and the sealing resin is reduced, and the packages with high heat-generating components can be separated.

In order to achieve the above-mentioned object, in the method of manufacturing an electric circuit board packaged product according to the present invention, at least two or more sets of boards on which electronic parts are mounted are set on the same lead frame, and the boards and A mode in which the leads of the lead frame are electrically connected, and the substrates are individually and non-continuously sealed with resin, and the substrates are connected to each other by the leads and tabs of the lead frame inserted in the sealing resin. Frame cutting, or at least one substrate on which electronic components are mounted and at least one IC chip are set in the same lead frame, and the substrate and the IC chip and the leads of the lead frame are electrically connected. Then, the substrate and the IC chip are individually and non-continuously resin-sealed, and the substrate and the IC chip are sealed with resin. Is intended to perform a frame-cut in a manner to be connected in an electrically connected manner to each other by a lead of the lead frame insert, a plurality of the sealing resin can be carried out simultaneously.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows the configuration of a control system including an electronic control unit for an automatic transmission for an automobile according to an embodiment to which an electric circuit board package product according to the present invention is applied. The automatic transmission control system 1 has an automatic transmission electronic control unit (transmission control unit) 2, and the electronic control unit 2 includes sensors and switches 12 to 1
4 and solenoid valves 15 to 18 are connected to the input / output section. The transmission control unit 2 is externally connected to a CAN communication bus 11 and a power supply line 10 of a battery power supply linked to an IGN key not shown.

The electronic control unit 2 is configured as one electric circuit board package product, and includes a CPU 3 and
A constant voltage power supply circuit 4 connected to a battery power supply line 10 to supply a constant voltage to the CPU 3, an input stage circuit 5, an output stage circuit 6, a clock generation circuit 7, and a CAN communication drive circuit 9
And executes control according to a program stored in the CPU 3.

The constant voltage power supply circuit 4 also has a function of monitoring the legitimacy of the program execution of the CPU 3, a so-called watchdog function. When the CPU 3 detects an abnormal program execution while monitoring the state of the CPU 3, Performs processing such as outputting a reset signal.

The CPU 3 takes in the signals of the rotation speed sensor 12, the range select switch 13, and the oil temperature sensor 14 composed of a thermistor from the input stage circuit 5, and after the arithmetic processing, outputs the output signal via the output stage circuit 6. The automatic transmission is maintained in an optimum state by outputting it to the shift solenoids 15, 16 of the automatic transmission hydraulic system, the line pressure solenoid 17, and the lockup solenoid 18 to control them. The CAN communication drive circuit 9 uses the CAN communication bus 11 to output the engine rotation signal and throttle opening signal required for transmission control.
It is imported from outside via.

(Embodiment 1) Next, a specific mounting layout of the electronic control unit 2 will be described with reference to FIGS.
Will be explained. The electronic control unit 2 is configured as one electric circuit board package product, and is mounted on a ceramic substrate divided into two, in other words, two sets of ceramic substrates 20 and 30. In order to divide the circuit according to the substrate division, the constant voltage power supply circuit 4 and the output stage circuit 6 are first separated into separate ceramic substrates 20 in consideration of the dispersion of heat generated by the elements.
The distribution was divided into 30, and then the arrangement was selected so that the signal flow could be smoothly connected.

More specifically, one ceramic substrate 20 has a power I which is a main element of the constant voltage power supply circuit 4.
The C chip 21 is mounted on a bare chip and is electrically connected to a circuit-structured conduction terminal portion (not shown) formed on the ceramic substrate 20 by wire bonding. Further, on the ceramic substrate 20, the CPU 3, the oscillator 22 for clock generation, and the component 2 for configuring the CAN communication drive circuit.
3. The input stage circuit configuration chip 24 and the like are mounted.
Among these, the IC group is conductively connected to the circuit-configuring conductive terminal portion (not shown) by wire bonding of the bare chip, and the other electronic components are conductively connected to the circuit-configurable conductive terminal portion (not shown) by solder reflow. .

On the other ceramic substrate 30, power IC chips 31, 32, which are the main elements of the output stage circuit 6,
33 and 34 are mounted in a bare chip state, and are electrically connected to a circuit-structured conduction terminal portion (not shown) formed on the ceramic substrate 30 by wire bonding.
It should be noted that the other mounted components are conductively connected to the circuit configuration conductive terminal portion (not shown) by solder reflow.

On the ceramic substrates 20 and 30, a plurality of conductive terminal portions 25 and 35 for external connection are formed in line along one side of the substrates 20 and 30, and a plurality of interconnection terminals are connected. Conduction terminal portions 26, 36 are formed in alignment along the other side of the substrates 20, 30. The IC chip mounting method may be flip-chip mounting, package mounting, or the like, and a material such as a conductive adhesive may be used instead of the solder reflow.

FIG. 3 shows a lead frame 40 on which the ceramic substrates 20 and 30 are collectively mounted. Generally, the material of the lead frame 40 is, from the viewpoint of electrical resistance and thermal resistance,
Copper alloys are preferred. If it is desired to keep the linear expansion coefficient low, a 42 alloy type is also selected.

The lead frame 40 includes a plurality of leads (external connection terminals) 41, 42 arranged in an array for external connection.
It has a plurality of leads 43 arranged in an array for mutual connection (for relay connection) and inner tabs 44, 45 for aiding in fixing the board and radiating heat, and these are integrally connected by a frame 46. The leads 41 and 42 are connection terminals for connecting the inside and outside of the transfer mold, and are Ni-plated as necessary to improve the wire bonding property. Similarly, lead 4
3 is also subjected to Ni plating treatment if necessary.

As shown in FIG. 4, the lead frame 40 has a ceramic substrate 2 on which electronic components are mounted.
0 and 30 are set. The ceramic substrate 20 is on the inner tab 44, and the ceramic substrate 30 is on the inner tab 4.
5 are positioned and placed on each of the substrates 20 and 30.
Is attached to the inner tabs 44, 45 with an adhesive having good heat conduction and a strong adhesive force.

The conductive terminals 25 and 35 for external connection of the ceramic substrates 20 and 30 and the leads 41 and 42 for external connection of the lead frame 40 are aluminum wires 50 and 51, respectively.
Are electrically connected by wire bonding. In addition, the conductive terminal portions 26 and 36 for interconnection of the ceramic substrates 20 and 30 and the lead 43 for interconnection (for relay connection) of the lead frame 40 are each made of aluminum wire 5.
Conductive connection is made by wire bonding with 2, 53. More specifically, one end of the lead 43 and the conductive terminal portion 26 of the ceramic substrate 20 are conductively connected by the aluminum wire 52, and the other end of the lead 43 and the ceramic substrate 3 are connected.
The 0 conductive terminal portion 36 is conductively connected by the aluminum wire 53. The use of the aluminum wires 50 to 53 is selected based on the relationship between the current capacity and the wire length, and the wire bonding is not limited to the aluminum wire.

When the above wire bonding is completed,
As shown in FIG. 5, the ceramic substrates 20, 30
Each of them is individually and non-continuously sealed with resin. One ceramic substrate 20 divided into two is hermetically sealed by a transfer mold resin (sealing resin) 60, and the other ceramic substrate 30 is separated from the transfer mold resin 60 by a transfer mold resin (sealing resin). )
It is hermetically sealed by 61.

The individual resin encapsulation for each substrate is performed so as to completely cover the wire bonding portion formed by the aluminum wires 50 to 53, and the leads 41, 42 and 43 are partially encapsulated with the encapsulating resins 60 and 61, respectively. The inner tabs 44 and 45 are entirely inserted into the sealing resins 60 and 61 together with the substrates 20 and 30, and have a full mold structure for ensuring airtightness. Especially the leads 41, 4
Since the interfaces of Nos. 2 and 43 are related to the airtightness, it is necessary to secure a sufficient creepage distance.

The resin molding for each substrate by the transfer mold resins 60 and 61 is performed simultaneously in one step by dividing the cavity of the mold for transfer molding into two in accordance with the resin sealing shape of each substrate. It can be carried out. After the resin sealing is completed, as shown in FIGS. 6 and 7, post-treatment of a transfer mold molded product is performed to obtain a product shape as an electric circuit board package product.

Generally, as post-processing, tie bar cutting (frame cutting), which is a step of cutting unnecessary portions of the lead frame 40, and deburring, which is a step of removing resin burrs during molding, are performed. Also, the leads 41, 4
From the viewpoint of preventing corrosion, the externally exposed portions 2 and 43 may be appropriately plated.

In FIGS. 6 and 7, reference numerals 46 and 47 denote tie bar cut surfaces of the inner tabs 45 and 46. If the heat dissipation performance is not satisfactory depending on the application, it is possible to improve the heat dissipation performance by extending the tie bar cut surface 45, 21 of the inner tabs 45, 46 and connecting the extension to one with a large heat capacity. Is.

The electric circuit board packaged product (electronic control unit 2) manufactured by the above steps has the electronic parts mounted thereon.
A set of ceramic substrates 20 and 30 are individually and non-continuously resin-sealed by transfer mold resins 60 and 61, and both ends of the substrates 20 and 30 are inserted into the transfer mold resins 60 and 61, and leads 4 for interconnection are formed.
3 are connected to each other (mechanical connection). At the same time, the two sets of ceramic substrates 20 and 30 are connected to the lead 4
It is also electrically connected by 3.

As can be seen from the above description, the ceramic substrates 20 and 30 are the leads 41 to 4 of the lead frame 40.
3 are electrically connected to the leads 41 to 43,
The inner tabs 45 and 46 are the same lead frame 40.
You get more. Further, the ceramic boards 20 and 30 are a plurality of boards (two boards, which are handled as one electric circuit board package product divided in terms of use and function, like the electronic control unit 2 for an automatic transmission for automobiles. ) Is divided into.

The individual resin sealing for each of the divided ceramic substrates 20 and 30 reduces the resin sealing size for each of the substrates 20 and 30 as compared with the case where one substrate is formed, and the sealing to the substrates 20 and 30 is performed. The thermal stress generated due to the difference in linear expansion coefficient from the resin 60, 61 is reduced, and even when used under severe thermal conditions, deterioration of adhesion of the sealing part, interface peeling, resin cracks, etc. are less likely to occur. As a result, sufficient durability can be obtained.

Further, in consideration of dispersion of heat generation, the power IC chip 21 for the constant voltage power supply circuit and the power IC chips 31 to 34 for the output stage circuit are separate ceramic substrates 20,
Since the components are distributed and mounted on 30, the heat generating components can be optimally mounted for mounting, and the operation reliability is high.

(Second Embodiment) FIG. 8 shows another embodiment of the electric circuit board package product according to the present invention.
In addition, in FIG. 8, portions corresponding to those in FIGS. 4 and 5 are denoted by the same reference numerals as those in FIGS. 4 and 5, and description thereof will be omitted.

In this embodiment, the heat generation amount of the power IC chips 31 to 34 for the output stage circuit is large, and the target heat radiation performance cannot be satisfied by the heat radiation by the inner tab 45 via the ceramic substrate 30 in the above-described embodiment. It is an example of implementation in the case. Generally, a ceramic substrate has good thermal conductivity, but the thermal conductivity is about 2 to 20 W / mK, which is more than 10 times worse than the thermal conductivity of metal, and high heat-generating components should be mounted on the ceramic substrate. Is not a good idea.

Therefore, in this embodiment, by placing only the power IC chips 31 to 34 for the output stage circuit, which are high heat generating components, directly on the inner tab 45 of the lead frame 40, the high thermal conductivity of the metal can be obtained. Effectively use, for example,
A copper-based lead frame generally has a thermal conductivity of about 300 W / mK and can improve heat dissipation, and the adhesive between the power IC chips 31 to 34 and the inner tab 45 also heats. It is possible to reduce the thermal resistance on the way by thinning the material with high conductivity.

In this case, the sealing resin 60 seals the ceramic substrate 20 and the sealing resin 61 collectively seals the power IC chips 31 to 34, as in the above-described embodiment. Also in this case, the size of each resin is reduced, and the substrate 2
0, power IC chips 31 to 34 and sealing resin 60, 61
The thermal stress generated due to the difference in the coefficient of linear expansion between the and is reduced, and even when used under harsh thermal conditions, deterioration of adhesion at the sealing part, interface peeling, resin cracks, etc. are less likely to occur, and sufficient durability is achieved. You can get sex.

Naturally, the relay connection with the ceramic substrate 20 and the electrical connection with the outside are performed by the power I of bare chip mounting.
It is made by wire bonding from the C chips 31 to 34. That is, the leads 42 and 43 are connected to the aluminum wire 5
By wire bonding with 1, 53, the power IC chips 31 to 34 are directly conductively connected. In this case, as shown in the figure, it is necessary to select the optimum shape of the leads 42 and 43 of the lead frame 40, which is optimum for wire bonding with the bare chip.

(Embodiment 3) FIGS. 9 to 11 show another embodiment of an electric circuit board package product according to the present invention. 9 to 11, parts corresponding to those in FIGS. 4, 5, and 7 are denoted by the same reference numerals as those in FIGS. 4, 5, and 7, and description thereof is omitted.

This embodiment is an example in which the rotation sensor 12 is also sealed in the transfer molding process at the same time. The rotation sensor 12 is a sensor that uses a Hall element, is a kind of electronic circuit including a waveform shaping unit, is configured by the Hall element IC chip 27, and has a sealing structure equivalent to or higher than that of the electronic control device 2. Is required. Therefore, the lead frame 70 in which the shape of the lead frame 40 is partially changed is used, and the size of the ceramic substrate 20 is reduced as shown in the figure to secure the area A in which the rotation sensor 12 is mounted. There is.

The Hall element IC chip 27 is placed on the inner tab 71 formed on the lead frame 70,
It is adhered to the inner tab 71 with a suitable adhesive.
In addition, a plurality of leads 72 for interconnection are formed in line on the lead frame 70, and one end of the lead 72 and the conductive terminal portion 28 of the ceramic substrate 20 are conductively connected by wire bonding with an aluminum wire 54, and the lead 7 is formed.
The other end of 2 and the Hall element IC chip 27 are electrically connected by wire bonding with an aluminum wire 53.

In this embodiment, the ceramic substrate 2
The 0, 30 and Hall element IC chips 27 can simultaneously form the individual transfer mold sealing parts (sealing resins) 60, 61, 62 corresponding thereto. Also in this embodiment, the cavity of the mold for transfer molding is divided into three parts according to the respective sealing shapes of the transfer mold sealing parts 60, 61 and 62, so that the steps can be performed simultaneously in one step. .

In any of the above-described embodiments, since the electrical connection between the transfer mold sealing parts is completed, it is possible to minimize the electrical connection work of the external connection terminals after transfer molding. become. Further, the insulation of the external connection terminal can be easily realized by an insulation coating treatment or by using an appropriate member.

(Embodiment 4) FIGS. 12 to 15 show another embodiment of an electric circuit board package product according to the present invention. In this embodiment, the divided substrate 8
The case where 0 and 90 need not be electrically connected to each other is shown, and the substrates 80 and 90 are mechanically connected in an electrically non-conductive state by an inner tab 105 provided from the lead frame 100.

Various electronic components 81 such as an IC chip are mounted on the substrate 80, and various electronic components 91 such as a CPU and an IC chip are mounted on the substrate 90. Substrates 80, 90
As shown in FIG. 12, the lead frame 100 on which the plurality of leads 10 are collectively mounted is provided with a plurality of leads 10 for external connection.
1, 102, 103, 104, and an inner tab 105 for assisting substrate fixing and heat dissipation.
The frames 106 are integrally connected.

As shown in FIG. 13, the substrate 80,
90 is positioned and placed on the inner tab 105 so as to be separated from each other, and these substrates 80 and 90 are attached to the inner tab 105 with an adhesive having good thermal conductivity and a strong adhesive force. Conductive terminal portion 8 for external connection of the substrate 80
2, 83 and the leads 101, 102 for external connection of the lead frame 100 are conductively connected by wire bonding with aluminum wires 110, 111, respectively.
Conductive terminal portions 92 and 93 for external connection of 0 and leads 103 and 104 for external connection of the lead frame 100 are conductively connected by wire bonding with aluminum wires 112 and 113, respectively.

When the above wire bonding is completed,
As shown in FIG. 14, the substrates 81 and 90 are individually and non-continuously resin-sealed. The one substrate 20 divided into two is a transfer mold resin (sealing resin) 120.
Is hermetically sealed by the other ceramic substrate 9
0 is hermetically sealed by a transfer mold resin (sealing resin) 121 separated from the transfer mold resin 120.

The individual resin encapsulation for each substrate is performed so as to completely cover the wire bonding portion of the aluminum wires 100 to 113, and the leads 101 to 104 are partially inserted in the encapsulating resins 120 and 121, respectively. The inner tab 105 is inserted into the sealing resins 120 and 121 at the portions corresponding to the substrates 80 and 90, respectively. After the resin sealing is completed, post-processing such as tie bar cutting (frame cutting) of the transfer molded product and resin deburring at the time of molding is performed to obtain a product shape as an electric circuit board package product (see FIG. 15).

The electric circuit board packaged product manufactured by the above process has two sets of boards 80 and 90 on which electronic parts are mounted.
Are individually and non-continuously resin-sealed by transfer mold resins 120 and 121, and the substrates 80 and 90 are connected (mechanically connected) to each other by an inner tab 105.

As can be seen from the above description, the substrate 80,
Reference numeral 90 denotes one electrically connected to the leads 101 to 104 of the lead frame 100.
Are obtained from the same lead frame 100. Also,
The ceramic substrates 80 and 90 are obtained by dividing a plurality of (two) substrates that are handled as one electric circuit board package product that is divided in terms of use and function.

Compared to the case where a single substrate is formed by sealing the individual resin for each of the divided substrates 80 and 90, the substrate 80,
The resin sealing size for each 90 becomes smaller, and the substrates 80, 90
The thermal stress generated due to the difference in linear expansion coefficient between the resin and the sealing resin 120, 121 is reduced, and even when used under severe thermal conditions, there are problems such as deterioration in adhesion of the sealing portion, interface peeling and resin cracks. It is less likely to occur and sufficient durability can be obtained.
Also in this embodiment, in consideration of the dispersion of heat generation, electronic components can be distributed and mounted on different ceramic substrates 80 and 90, and the operation reliability is increased by optimal mounting arrangement of the heat generation components. .

(Embodiment 5) FIGS. 16 to 19 show another embodiment of the electric circuit board package product according to the present invention. 16 to 19, parts corresponding to those in FIGS. 12 to 15 are denoted by the same reference numerals as those in FIGS. 12 to 15, and description thereof will be omitted.

This embodiment is a modification of the embodiment shown in FIGS. 12 to 15, and the external connection of the substrates 80 and 90 is changed from the double-sided type to the single-sided type, and the lead frame is accordingly changed. The lead arrangement of 100 has been changed. Further, there are two inner tabs 105 on the upper and lower sides, and the arrangement of the substrates 80, 90 with respect to the lead frame 100 is changed to the left-right spacing rather than the vertical spacing.

Also in this embodiment, the divided substrate 80 is used.
And 90 are connected (mechanically connected) to each other by the inner tab 105, and the individual resin encapsulation for each of the substrates 80 and 90 makes the resin encapsulation for each of the substrates 80 and 90 as compared with the case where one substrate is formed. The size is reduced, the thermal stress generated due to the difference in linear expansion coefficient between the substrates 80 and 90 and the sealing resins 120 and 121 is reduced, and the adhesiveness of the sealing portion deteriorates even when used under severe thermal conditions. Problems such as interfacial peeling and resin cracks are less likely to occur, and sufficient durability can be obtained.

In the above embodiments, a plurality of molds are sealed in the same process. However, when it is appropriate to perform transfer mold sealing independently of simultaneous sealing due to the assembly process, etc. , Transfer mold type 2
It can be easily implemented by preparing more than the mold.

[0060]

According to the present invention, it is possible to prevent the generation of excessive thermal stress due to the miniaturization of the transfer mold size due to the circuit division, and to optimize the heat radiation design by dividing the high heat generating parts into the circuit division. You can Further, by performing the simultaneous transfer mold sealing, it is possible to prevent an increase in the number of steps.

[Brief description of drawings]

FIG. 1 is a block diagram showing a system configuration including an electronic control device for an automatic transmission for an automobile to which an electric circuit board packaged product according to the present invention is applied.

2A and 2B are electronic circuit mounting layout diagrams showing an example of board division in an electric circuit board package product (Embodiment 1) according to the present invention.

FIG. 3 is a structural diagram of a lead frame in an electric circuit board packaged product (first embodiment) according to the present invention.

FIG. 4 is a diagram showing an example of mounting a board on a lead frame in an electric circuit board packaged product (first embodiment) according to the present invention.

FIG. 5 is a perspective view showing a state after transfer mold sealing in the electric circuit board package product (first embodiment) according to the present invention.

FIG. 6 is a product external view (plan view) of an electric circuit board package product (Embodiment 1) according to the present invention.

FIG. 7 is a product external view (side view) of an electric circuit board package product (Embodiment 1) according to the present invention.

FIG. 8 is a diagram showing an example of mounting a board on a lead frame in an electric circuit board packaged product (embodiment 2) according to the present invention.

FIG. 9 is a diagram showing an example of mounting a board on a lead frame in an electric circuit board packaged product (embodiment 3) according to the present invention.

FIG. 10 is a perspective view showing a state after transfer mold sealing in an electric circuit board package product (Embodiment 3) according to the present invention.

FIG. 11 is a product external view (side view) of an electric circuit board package product (Embodiment 3) according to the present invention.

FIG. 12 is a structural diagram of a lead frame in an electric circuit board package product (fourth embodiment) according to the present invention.

FIG. 13 is a diagram showing an example of mounting a board on a lead frame in an electric circuit board packaged product (embodiment 4) according to the present invention.

FIG. 14 is a perspective view showing a state after transfer mold sealing in an electric circuit board package product (embodiment 4) according to the present invention.

FIG. 15 is a product external view (side view) of an electric circuit board packaged product (fourth embodiment) according to the present invention.

FIG. 16 is a structural diagram of a lead frame in an electric circuit board package product (embodiment 5) according to the present invention.

FIG. 17 is a diagram showing an example of mounting a board on a lead frame in an electric circuit board packaged product (embodiment 5) according to the present invention.

FIG. 18 is a perspective view showing a state after transfer mold sealing in an electric circuit board packaged product (embodiment 5) according to the present invention.

FIG. 19 is a product external view (side view) of an electric circuit board package product (embodiment 5) according to the present invention.

[Explanation of symbols]

1 Automatic Transmission Control System 2 Electronic Control Device for Automatic Transmission 3 CPU 4 Constant Voltage Power Supply Circuit 5 Input Stage Circuit 6 Output Stage Circuit 7 Clock Generation Circuit 9 CAN Communication Drive Circuit 10 Battery Power Supply Line 11 CAN Communication Bus 12-14 Sensor -Switches 15-18 Solenoid valves 20, 30 Ceramic substrate 40 Lead frame 41-43 Lead 45 Inner tabs 50-53 Aluminum wires 60, 61, 62 Transfer mold resin (sealing resin) 70 Lead frame 80, 90 Substrate 100 Lead frames 101 to 104 Leads 105 Inner tabs 110 to 113 Aluminum wires 120, 121 Transfer mold resin (sealing resin)

Claims (10)

[Claims] 1. At least two sets of boards on which electronic components are mounted are individually and non-continuously resin-sealed, and the boards are connected to each other by leads and tabs inserted in a sealing resin. Electrical circuit board packaged product. 2. The electric circuit according to claim 1, wherein the substrate is electrically connected to the leads of the lead frame, and the leads and the tabs are obtained from the same lead frame. Circuit board package products. 3. The electric circuit board packaged product according to claim 1, wherein the substrates are electrically connected by leads for interconnection. 4. The board according to claim 1, wherein the board is divided into a plurality of boards which are handled as one electric circuit board package product which is divided in terms of use and function. The electric circuit board packaged product according to one item. 5. At least one substrate on which an electronic component is mounted and at least one IC chip are individually and non-continuously resin-sealed, and the substrate and the IC chip are inserted into a sealing resin for interconnection. An electrical circuit board packaged product, wherein the electrical circuit board packaged product is connected in a manner in which the leads are electrically connected. 6. The substrate according to claim 5, wherein the substrate and the IC chip are electrically connected to leads of a lead frame, and the leads are obtained from the same lead frame. Electric circuit board package products. 7. The electric circuit board packaged product according to claim 5, wherein the IC chip is one mounted on a substrate and separated from the substrate. 8. At least two sets of substrates on which electronic components are mounted are set on the same lead frame, the substrates and the leads of the lead frame are electrically connected, and each substrate is individually and non-continuously resin-bonded. A method for manufacturing an electric circuit board packaged product, which comprises performing sealing and performing frame cutting in such a manner that the substrates are connected to each other by leads and tabs of the lead frame inserted in a sealing resin. 9. At least one substrate on which an electronic component is mounted and at least one IC chip are set in the same lead frame, and the substrate and the IC chip are electrically connected to the leads of the lead frame, The substrate and the IC chip are individually and non-continuously resin-sealed, and the substrate and the IC chip are connected to each other by the leads of the lead frame inserted in the sealing resin and electrically connected to each other. A method of manufacturing an electric circuit board package product, which comprises performing frame cutting in a mode. 10. The method for manufacturing an electric circuit board packaged article according to claim 8, wherein a plurality of the resin encapsulations are performed at the same time.