WO2016199306A1 - Power module with terminal block and method for manufacturing power module with terminal block - Google Patents

Power module with terminal block and method for manufacturing power module with terminal block Download PDF

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Publication number
WO2016199306A1
WO2016199306A1 PCT/JP2015/067086 JP2015067086W WO2016199306A1 WO 2016199306 A1 WO2016199306 A1 WO 2016199306A1 JP 2015067086 W JP2015067086 W JP 2015067086W WO 2016199306 A1 WO2016199306 A1 WO 2016199306A1
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WO
WIPO (PCT)
Prior art keywords
terminal block
terminal
lead
power module
resin
Prior art date
Application number
PCT/JP2015/067086
Other languages
French (fr)
Japanese (ja)
Inventor
正喜 後藤
中島　泰
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2016526252A priority Critical patent/JPWO2016199306A1/en
Priority to PCT/JP2015/067086 priority patent/WO2016199306A1/en
Publication of WO2016199306A1 publication Critical patent/WO2016199306A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a power module with a terminal block and a method for manufacturing the power module with a terminal block, and more particularly to a mounting structure thereof.
  • Patent Document 1 discloses a fin base integrated power module in which a fin base such as a metal substrate in which fin mounting grooves are formed is embedded in a sealing resin together with a semiconductor chip. Patent Document 1 also discloses a structure in which a terminal block is sealed simultaneously with the sealing of a semiconductor chip and a fin base. The terminal block is a connection part for connection with another device or a power source.
  • the wiring length between the power semiconductor chip and the terminal block can be shortened by sealing the terminal block with the transfer mold at the same time as the power semiconductor chip.
  • a thermosetting resin is used in the transfer mold, there is a problem that the terminal block is easily cracked when the terminal block is screwed.
  • Patent Document 2 proposes a structure in which a power module is sealed inside a case and a terminal block and a wiring board are provided.
  • Patent Document 1 In the technique of Patent Document 1, the mounting of the heat radiating fins was ensured. However, when the terminal block has a collective sealing structure, there is a problem that cracking is likely to occur when the terminal block is screwed. In both configurations of Patent Documents 1 and 2, the wiring length for connecting the terminal block and the semiconductor chip is long, which causes a voltage drop.
  • Patent Document 2 it is necessary to form a package by filling the outer case with resin one by one, and there is a problem that sufficient productivity cannot be obtained because many pieces cannot be obtained. there were.
  • the present invention has been made in view of the above, and an object thereof is to obtain a highly reliable power module with a terminal block by shortening the wiring length for connecting the terminal block and the semiconductor chip.
  • the present invention includes a resin-sealed power element including a resin package and a lead terminal derived from the resin package, and a resin-sealed power element.
  • the lead terminal of the resin-encapsulated power element includes a first lead terminal directly connected to the terminal block and a second lead terminal connected to the wiring board.
  • the present invention it is possible to reduce the wiring length for connecting the terminal block and the semiconductor chip, and to obtain a highly reliable power module with a terminal block.
  • Sectional drawing of the power module with a terminal block concerning Embodiment 1 of this invention The top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 1 of this invention.
  • the top view which shows the state which removed the wiring board and the terminal block from the power module with a terminal block concerning Embodiment 1 of this invention.
  • the perspective view which shows the state which removed the wiring board and the terminal block from the power module with a terminal block concerning Embodiment 1 of this invention.
  • the perspective view which shows the terminal block of the power module with a terminal block concerning Embodiment 1 of this invention The figure which shows the inverter circuit using the power module with a terminal block concerning Embodiment 1 of this invention.
  • the flowchart which shows the manufacturing process of the power module with a terminal block concerning Embodiment 1 of this invention.
  • Sectional drawing of the power module with a terminal block concerning Embodiment 2 of this invention The top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 2 of this invention.
  • the top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 4 of this invention The top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 5 of this invention.
  • FIG. 1 is a cross-sectional view of a power module with a terminal block according to a first embodiment of the present invention.
  • FIG. 2 is a top view showing a state where the wiring board of the power module with a terminal block according to the first embodiment of the present invention is removed.
  • FIG. 1 is a view corresponding to the AA cross section of FIG.
  • FIG. 3 is a top view showing a state in which the wiring board and the terminal block are removed from the power module with a terminal block according to the first embodiment of the present invention.
  • FIG. 4 is a perspective view showing a state where the wiring board and the terminal block of the power module according to the first embodiment of the present invention are removed.
  • FIG. 5 is a perspective view showing a terminal block of the power module with a terminal block according to the first embodiment of the present invention.
  • FIG. 6 is a diagram illustrating an inverter circuit using the power module with a terminal block according to the first embodiment of the present invention.
  • the power module 1 with a terminal block includes a resin-encapsulated power element 100 including a resin package 101, a first lead terminal 110 derived from the resin package 101, and a second lead terminal 120.
  • a wiring board 200 on which the resin-encapsulated power element 100 is mounted and a terminal block 300 are provided.
  • the first lead terminal 110 is directly connected to the terminal block 300, and the second lead terminal 120 is connected to the wiring board 200.
  • the resin-encapsulated power element 100 may be referred to as a power module.
  • the power semiconductor chip 102 and the other semiconductor chip 103 are connected to the first lead terminal 110 or the second lead terminal 120 by bonding wires 104.
  • the power semiconductor chip 102 and other semiconductor chips 103 are fixed on the die pad 130 with a solder layer (not shown), and the back surface of the die pad 130 is fixed to the fin base 140 with a conductive adhesive 106.
  • the fin base 140 has a groove portion 141 for mounting the fin 142 on a stainless steel plate-like body, and the resin package 101 is formed in the resin package 101 when the resin package 101 is molded by resin sealing using a transfer mold. Embedded. Eighteen fins 142 are arranged in parallel in the grooves 141 formed in the fin base 140 by caulking.
  • the resin package 101 used here has an extremely large outer size of 120 m ⁇ 80 mm ⁇ 30 mm, and is configured to flow a large current.
  • the five first lead terminals 110 are led out from the resin package 101 at equal intervals, the lead-out position and the connection position with the terminal block 300 are on the same plane, and there is no bent portion.
  • the wiring board 200 is obtained by forming a wiring pattern (not shown) on a usual glass epoxy board. Although illustration is omitted, a functional element is mounted on the wiring pattern.
  • the terminal block 300 includes a terminal block main body 301, an L-shaped conductive plate 302 embedded in the terminal block main body 301, a terminal screw 303, and a washer.
  • 304 has a crimp terminal 305 connected to the conductive plate 302, and is connected to the power supply unit 2 such as a solar cell module, which is a secondary terminal part, via the crimp terminal 305.
  • the first lead terminal 110 and the second lead terminal 120 are mounted on the same side of the resin package 101. That is, on the lead-out side of the first lead terminal 110, not only the first lead terminal 110 for connection to the terminal block 300 but also the second lead for connection to the wiring board 200 or another device. A terminal 120 is also formed. In addition, by arranging a plurality of types of lead terminals on the same side, system design including other devices becomes easy.
  • the second lead terminal 120 is derived from two opposite sides of the resin package 101. That is, on one side, the first lead terminal 110 connected to the terminal block 300 and the second lead terminal 120 connected to the wiring board or other device are juxtaposed. Therefore, there is an advantage that the circuit design has a degree of freedom and can be miniaturized.
  • first lead terminal 110 on the terminal block 300 side.
  • a structure in which the first lead terminals 110 are arranged over the entire width of the terminal block 300 can be taken, and mounting becomes easy.
  • the first lead terminal 110 has a terminal block lead insertion hole 111 at the end.
  • a terminal block lead 307 provided at the tip of a conductive plate 302 having an L-shaped cross section of the terminal block 300 is inserted into the terminal block lead insertion hole 111 and fixed by solder 306 to be electrically connected and mechanically connected.
  • FIG. 7 is a flowchart showing a method for manufacturing the power module of the first embodiment.
  • 8 to 13 are diagrams showing manufacturing steps of the power module of the first embodiment.
  • a lead frame shown in FIG. 8 is prepared.
  • the lead frame used here includes a plurality of first lead terminals 110 directly connected to the terminal block 300, a plurality of second lead terminals 120 connected to the wiring substrate 200, and the power semiconductor chip 101.
  • a unit U including a die pad 130 on which another semiconductor chip 103 is mounted is connected by a side bar 131.
  • the die pad 130 is fixed to the side bar 131 by a support bar 132.
  • the lead frame is formed by stamping a metal strip made of nickel plated copper or copper alloy, and solder plating is applied to the connection regions at the tips of the first and second lead terminals 110 and 120. It is.
  • the intermediate portion of the first lead terminal 110 and the second lead terminal 120 is fixed by a tie bar 133, and the unit U is positioned by the feed holes 134 formed in the side bar 131 at regular intervals, and assembled. However, it is configured to be sequentially conveyed.
  • a frame structure such as the side bar 131, the support bar 132, and the tie bar 133 is used. However, the frame structure can be appropriately changed.
  • step S102 for mounting the power semiconductor chip 102 the power semiconductor chip 102 and another semiconductor chip 103 are mounted on the die pad 130 as shown in FIG. 9 to 12 are views corresponding to the BB cross section of FIG.
  • the power semiconductor chip 102 and the other semiconductor chips 103 and the inner ends of the first and second leads 110 and 120, that is, the inner leads are bonded by the bonding wires 104. Connect the corresponding position.
  • the fin base 140 and the die pad 130 are connected via the conductive adhesive 106 as shown in FIG.
  • step S105 the resin is sealed by transfer molding for each fin base using a mold.
  • a thermosetting resin such as an epoxy resin, a phenol resin, an unsaturated polyester resin, a urea resin, or a melamine resin is used for the transfer mold.
  • step S106 the fin 142 is caulked to the groove 141 formed in the fin base 140.
  • the first lead terminal 110 and the second lead terminal 120 are bent and connected to the terminal block 300 in step S107.
  • the terminal block 300 and the first lead terminal 110 are connected by inserting the terminal block lead 307 through the terminal block lead insertion hole 111 provided at the tip of the first lead terminal 110 and fixing with the solder 306. .
  • step S108 frame structures such as the side bar 131, the support bar 132, and the tie bar 133 are cut out and separated into pieces.
  • the terminal block 300 is formed by embedding a conductive plate 302 having an L-shaped cross section in a terminal block main body 301 formed of a thermoplastic resin, but the conductive plate 302 is composed of a terminal screw 303 and a washer 304. And is connected to the secondary terminal portion via the crimp terminal 305.
  • the conductive plate 302 is composed of a terminal screw 303 and a washer 304.
  • the crimp terminal 305 for example, in the case of the power module 1 with a terminal block that constitutes an inverter circuit connected between the power source 2 and the motor 3 as shown in FIG. 6, between the terminal block 300 and the resin-encapsulated power element 100.
  • the wiring length can be kept to a minimum, and connection with good electrical characteristics is possible.
  • thermoplastic resin vinyl polymers such as polyethylene resin, polypropylene resin, polystyrene resin, and polyvinyl chloride resin, polyester resin, polyamide resin, and the like are also applicable.
  • the power module 1 with a terminal block formed in this way is a power module with the terminal block 300 because the resin-encapsulated power element 100 and the terminal block 300 are directly connected without the wiring board 200 interposed therebetween.
  • the wiring length between the resin-encapsulated power element 100 can be shortened, and the effect of high reliability is achieved without cracking during screw tightening.
  • the power module 1 with a terminal block according to the first embodiment can be mounted using a lead frame, and after sealing a large number of units U, the side bars 131 and the like are cut out and separated into pieces. It is easy to produce in large numbers and is highly productive.
  • the resin package 101 is fixed by the side bar 131 or the like, so that deformation is prevented and mounting is easy.
  • the frame structure such as the side bar 131, the support bar 132, and the tie bar 133 is cut off after the connection with the terminal block 300, so that the connection of the terminal block 300 is easy. is there. Further, the frame structure such as the side bar 131 may be cut off before connection to the terminal block 300 or after connection to the wiring board 200.
  • FIG. 13 is a cross-sectional view of the power module with a terminal block according to the second embodiment.
  • FIG. 14 is a top view of the power module with a terminal block according to the second embodiment.
  • the power module 1S with a terminal block according to the second embodiment is different from the power module 1 with a terminal block according to the first embodiment in the terminal structure of the terminal block 300S and the tip shape of the first lead terminal 110S.
  • the terminal block lead 307S as a tip connection portion in which the conductive plate 302S of the terminal block 300S is further bent into an L shape at the tip of the conductive plate 302S having an L-shaped cross section is the first lead terminal 110S.
  • the tip of the first lead terminal 110 ⁇ / b> S and the terminal block lead 307 ⁇ / b> S of the terminal block 300 are fixed with solder 306.
  • the wiring board 200 has a configuration in which a notch 201 is formed in a region where the terminal block 300 is mounted so as not to interfere with the terminal block 300.
  • the wiring length for connecting the power module that is, the resin-encapsulated power element 100S and the terminal block 300S can be further shortened, and the terminal block of the first embodiment It is possible to further reduce the wiring resistance as compared with the attached power module 1.
  • the wiring board 200 has a configuration in which the notch 201 is formed in the region where the terminal block 300S is mounted so as not to interfere with the terminal block 300, the wiring length can be reduced to the maximum.
  • the present invention is not limited to two directions, and may be three directions and four directions. Absent.
  • the terminal block is not limited to only one direction, and two terminal blocks can be provided on opposite sides.
  • the connection portion can be downsized. It is also possible to arrange two or more terminal blocks on one side instead of two sides.
  • FIG. 16 is sectional drawing of the top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 3 of this invention.
  • the power module 1P with a terminal block according to the third embodiment is different from the power module 1 with a terminal block according to the first embodiment in that the terminal block 300 is mounted on two opposite sides of the resin package 101 of the power module. It is a point.
  • a first lead terminal 110 and a second lead terminal 120 are led out from two opposite sides, and a terminal block 300 is attached to each of the first lead terminals 110.
  • the connection between the first lead terminal 110 and the terminal block 300 may be the same as in the first or second embodiment, and the description thereof is omitted here.
  • the power module 1P with a terminal block formed as described above is connected to the load such as the power source 2 or the motor 3 via the terminal block 300, and the total wiring length in a portion where a large current flows is obtained. It has the feature that can be minimized. If connection to the wiring board 200 or another device is necessary, the second lead terminal 120 may be used for connection.
  • the power semiconductor chip layout in the power module is placed as close to the terminal block as possible, thereby minimizing the wiring length in areas where large current flows. Can be suppressed.
  • the wiring length in a portion where a large current flows can be shortened, and the terminal block and the load or the power source can be used. It is highly reliable because it does not break when tightened with screws when connecting to other circuit system elements.
  • FIG. 17 is sectional drawing of the top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 4 of this invention.
  • the power module 1Q with a terminal block according to the fourth embodiment is different from the power module 1P with a terminal block according to the third embodiment in that in addition to the two opposite long sides of the resin package 101 of the power module, the short side
  • the terminal block 300 is mounted on one side of the side, and the terminal block 300 is mounted on all sides except for one side.
  • a first lead terminal 110 is led out from two opposite sides and one side adjacent to the two sides, and a terminal block 300 is attached to each of the first lead terminals 110. Then, the second lead terminal 120 is led out from the remaining one side and connected to the wiring board or another device.
  • the connection between the first lead terminal 110 and the terminal block 300 may be the same as in the first or second embodiment, and the description thereof is omitted here.
  • the power module 1Q with a terminal block formed as described above is connected to a power source or a plurality of loads such as a motor through the terminal block 300, and wiring at a portion where a large current flows.
  • the feature is that the total length can be minimized. If connection to a wiring board or another device is necessary, the connection may be made using the second lead terminal.
  • the power semiconductor chip layout in the power module is arranged as close to the terminal block as possible, thereby minimizing the wiring length in the portion where a large current flows. Can be suppressed.
  • the wiring length in a portion where a large current flows can be shortened while allowing a degree of freedom in design,
  • the terminal block and a load or a circuit system element such as a power source are not cracked at the time of screw connection, and the effect of high reliability is achieved.
  • FIG. 18 is sectional drawing of the top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 5 of this invention.
  • the power module 1R with a terminal block according to the fifth embodiment is different from the power module 1Q with a terminal block according to the fourth embodiment in that in addition to the three sides of the resin package 101 of the power module, the terminal block 300 is also provided on the remaining one side. This is the point that is attached.
  • First lead terminals 110 are led out from all four sides, and terminal blocks 300 are attached to the first lead terminals 110, respectively.
  • the connection between the first lead terminal 110 and the terminal block 300 may be the same as in the first or second embodiment, and the description thereof is omitted here.
  • the power module 1R with a terminal block formed as described above is connected to a plurality of loads such as a power source or a motor via the terminal block 300, and wiring at a portion where a large current flows.
  • the feature is that the total length can be minimized.
  • connection may be made via a terminal block, or the second lead terminal 120 may be juxtaposed on a necessary side.
  • the power semiconductor chip layout in the power module is arranged as close to the terminal block as possible, thereby minimizing the wiring length in the portion where a large current flows. Can be suppressed.
  • the wiring length in a portion where a large current flows can be shortened while giving a degree of freedom in design,
  • the terminal block and a load or a circuit system element such as a power source are not cracked at the time of screw connection, and the effect of high reliability is achieved.
  • the wiring for connecting the terminal blocks 300 and 300S to the first lead terminal 110 is used.
  • the length can be minimized, but may be bent as required.
  • connection between the first lead terminal 110 and the terminal block 300 can be realized on the lead frame, there is an advantage that workability is good and misalignment hardly occurs.
  • the terminal block 300 is connected on a plurality of sides, it is difficult to support the terminal block 300, but it is easy to work on the lead frame.
  • connection between the terminal block tip lead and the first lead terminal 110 is not limited to the configuration of the first and second embodiments, and can be appropriately changed.
  • the power module of the inverter circuit has been described.
  • the present invention is not limited to the inverter circuit, and any system can be used as long as it is a circuit system using a power module having a power semiconductor chip used for a large current. It is also applicable to.
  • the example in which the lead frame on which a plurality of semiconductor chips are mounted is collectively sealed in the power module has been described.
  • one power semiconductor chip may be sealed.
  • the shape of the lead frame can be changed as appropriate.
  • a structure in which a tie bar is not provided on the lead terminal is also effective.
  • the die pad 130 has a divided structure of the power semiconductor chip mounting region as shown by a broken line in FIG. 8, but it is also effective in an example in which a plurality of semiconductor chips are mounted on one die pad 130.
  • a lead frame without a die pad may be used, and a semiconductor chip may be directly mounted on the fin base.
  • the mounting of the semiconductor chip on the die pad 130 is performed with the element mounting surface upward, that is, face-up.
  • flip chip connection in which the element mounting surface is connected downward, that is, face-down. Also good. In the case of flip chip connection, wire bonding is not necessary.
  • the semiconductor element mounted in the power module is not limited to the bare chip, but may be a packaged semiconductor element and can be changed as appropriate.
  • the material of the strip material for forming the lead frame copper or copper alloy plated with nickel is used, but another material may be used, and the first and second lead terminals may be used. Needless to say, a solder plating layer formed only at the tip can be appropriately modified.
  • the configuration in which the fin base having the fin mounting groove portion is resin-sealed integrally with the power semiconductor chip and the fin is mounted in the fin base groove portion is described.
  • the fins may be bonded to the fin base with a flat bottom surface sealed with resin with heat-dissipating grease.
  • the mounting of the radiation fins can be selected as appropriate, such as exposing the bottom surface of the power semiconductor chip and sealing with resin, and adhering the radiation fin so as to contact the bottom surface of the power semiconductor chip.
  • the lead frame pattern may be adjusted according to the circuit design, and a terminal block with terminal blocks on a plurality of sides can be easily attached.
  • a power module can be formed, and the size of a connection portion with another circuit device can be reduced.
  • connection between the inverter circuit, the solar cell module and the load can be reduced in size and the connection resistance can be reduced. Is realized.
  • the configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

Abstract

In order to reduce the length of wiring used in order to connect a terminal block and a semiconductor chip and obtain a highly reliable power module, this invention is provided with a resin-sealed power element 100 provided with a resin package 101 and a lead terminal led out from the resin package 101, a wiring board 200 on which the resin-sealed power element 100 is mounted, and a terminal block 300. The lead terminals of the resin-sealed power element 100 is provided with a first lead terminal 110 directly connected to the terminal block 300 and a second lead terminal 120 connected to the wiring board 200.

Description

端子台付きパワーモジュールおよび端子台付きパワーモジュールの製造方法Power module with terminal block and method for manufacturing power module with terminal block
　本発明は、端子台付きパワーモジュールおよび端子台付きパワーモジュールの製造方法に係り、特にその実装構造に関する。 The present invention relates to a power module with a terminal block and a method for manufacturing the power module with a terminal block, and more particularly to a mounting structure thereof.
　大電流を使用するパワー半導体チップを用いたトランスファーモールド型のパワーモジュールは、駆動時に半導体チップからの発熱を伴うため、この熱を放熱するために放熱フィンを装着する技術が広く用いられている。放熱フィンの装着方法としては種々の方法が提案されてきたが、そのひとつに、パワー半導体チップ搭載部あるいはパワー半導体チップ搭載部を有する回路基板の背面側に貼着したフィンベースに形成した溝に放熱フィンをかしめ込む構造がある。 Since a transfer mold type power module using a power semiconductor chip that uses a large current is accompanied by heat generation from the semiconductor chip during driving, a technique of mounting a radiation fin to dissipate this heat is widely used. Various methods have been proposed as a method of attaching the heat radiating fins. One of them is a groove formed in a fin base attached to the back side of a circuit board having a power semiconductor chip mounting portion or a power semiconductor chip mounting portion. There is a structure to squeeze the radiating fins.
　この構造では、かしめ工程においてフィンベースに応力がかかるため、この応力によって、端子の接合部のはんだにクラックが入り、接合部が剥離するなどの不都合が生じることがあった。 In this structure, since stress is applied to the fin base in the caulking process, the stress sometimes causes a problem such as cracks in the solder at the joint portion of the terminal and peeling of the joint portion.
　そこで、特許文献１では、フィン装着用の溝を形成した金属基板などのフィンベースを半導体チップとともに封止樹脂に埋め込んだ、フィンベース一体型のパワーモジュールが開示されている。また特許文献１では半導体チップおよびフィンベースの封止と同時に、端子台をも、封止した構造も開示されている。端子台は、他のデバイスあるいは電源との接続のための接続部である。 Therefore, Patent Document 1 discloses a fin base integrated power module in which a fin base such as a metal substrate in which fin mounting grooves are formed is embedded in a sealing resin together with a semiconductor chip. Patent Document 1 also discloses a structure in which a terminal block is sealed simultaneously with the sealing of a semiconductor chip and a fin base. The terminal block is a connection part for connection with another device or a power source.
　端子台をパワー半導体チップと同時にトランスファーモールドで封止することで、パワー半導体チップと端子台との配線長は短くすることができる。しかしながら、トランスファーモールドでは熱硬化性樹脂が用いられるため、端子台のネジ締め時に端子台にわれが生じ易いという問題がある。 The wiring length between the power semiconductor chip and the terminal block can be shortened by sealing the terminal block with the transfer mold at the same time as the power semiconductor chip. However, since a thermosetting resin is used in the transfer mold, there is a problem that the terminal block is easily cracked when the terminal block is screwed.
　また、このようなパワーモジュールにおいては、放熱性という問題に加え、他方では、配線抵抗の低減という課題がある。これは大電流が流れる構造であるため、配線抵抗が大きな電圧降下を伴うことになるためである。 Moreover, in such a power module, in addition to the problem of heat dissipation, on the other hand, there is a problem of reducing wiring resistance. This is because the wiring resistance is accompanied by a large voltage drop because of the structure in which a large current flows.
　そこで、パワーモジュールのリード端子を接続した配線基板に、端子台を接続する方法がとられることが多い。 Therefore, a method of connecting the terminal block to the wiring board to which the lead terminal of the power module is connected is often used.
　また特許文献２では、ケースの内部に、パワーモジュールを封じ込み、端子台および配線基板を備えた構造が提案されている。 Patent Document 2 proposes a structure in which a power module is sealed inside a case and a terminal block and a wiring board are provided.
特開２００９－３３０６５号公報JP 2009-33065 A 特開２００２－３５９３４８号公報JP 2002-359348 A
　特許文献１の技術では、放熱フィンの取り付けは確実となった。しかしながら、端子台を一括封止構造とすると、端子台のネジ締め時に割れが生じ易いという問題があった。また特許文献１，２のいずれの構成においても、端子台と半導体チップとの接続のための配線長が長く、これが、電圧降下の原因となっている。 In the technique of Patent Document 1, the mounting of the heat radiating fins was ensured. However, when the terminal block has a collective sealing structure, there is a problem that cracking is likely to occur when the terminal block is screwed. In both configurations of Patent Documents 1 and 2, the wiring length for connecting the terminal block and the semiconductor chip is long, which causes a voltage drop.
　また、特許文献２の構造においては、１個１個、外側ケースに樹脂を充填し、パッケージを形成する必要があり、多数個どりができないため、十分な生産性が得られない、という問題があった。 In addition, in the structure of Patent Document 2, it is necessary to form a package by filling the outer case with resin one by one, and there is a problem that sufficient productivity cannot be obtained because many pieces cannot be obtained. there were.
　本発明は、上記に鑑みてなされたものであって、端子台と半導体チップとの接続のための配線長を短縮し、信頼性の高い端子台付きパワーモジュールを得ることを目的とする。 The present invention has been made in view of the above, and an object thereof is to obtain a highly reliable power module with a terminal block by shortening the wiring length for connecting the terminal block and the semiconductor chip.
　上述した課題を解決し、目的を達成するために、本発明は、樹脂パッケージと樹脂パッケージから導出されたリード端子とを備えた樹脂封止型パワー素子と、樹脂封止型パワー素子が搭載される配線基板と、端子台とを備える。樹脂封止型パワー素子のリード端子が、端子台に直接接続される第１のリード端子と、配線基板に接続される第２のリード端子とを備える。 In order to solve the above-described problems and achieve the object, the present invention includes a resin-sealed power element including a resin package and a lead terminal derived from the resin package, and a resin-sealed power element. A wiring board and a terminal block. The lead terminal of the resin-encapsulated power element includes a first lead terminal directly connected to the terminal block and a second lead terminal connected to the wiring board.
　本発明によれば、端子台と半導体チップとの接続のための配線長を短縮し、信頼性の高い端子台付きパワーモジュールを得ることが可能となるという効果を奏する。 According to the present invention, it is possible to reduce the wiring length for connecting the terminal block and the semiconductor chip, and to obtain a highly reliable power module with a terminal block.
本発明の実施の形態１にかかる端子台付きパワーモジュールの断面図Sectional drawing of the power module with a terminal block concerning Embodiment 1 of this invention 本発明の実施の形態１にかかる端子台付きパワーモジュールから配線基板をはずした状態を示す上面図The top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 1 of this invention 本発明の実施の形態１にかかる端子台付きパワーモジュールから配線基板および端子台をはずした状態を示す上面図The top view which shows the state which removed the wiring board and the terminal block from the power module with a terminal block concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる端子台付きパワーモジュールから配線基板および端子台をはずした状態を示す斜視図The perspective view which shows the state which removed the wiring board and the terminal block from the power module with a terminal block concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる端子台付きパワーモジュールの端子台を示す斜視図The perspective view which shows the terminal block of the power module with a terminal block concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる端子台付きパワーモジュールを用いたインバータ回路を示す図The figure which shows the inverter circuit using the power module with a terminal block concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる端子台付きパワーモジュールの製造工程を示すフローチャートThe flowchart which shows the manufacturing process of the power module with a terminal block concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる端子台付きパワーモジュールの製造工程を示す図The figure which shows the manufacturing process of the power module with a terminal block concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる端子台付きパワーモジュールの製造工程を示す図The figure which shows the manufacturing process of the power module with a terminal block concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる端子台付きパワーモジュールの製造工程を示す図The figure which shows the manufacturing process of the power module with a terminal block concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる端子台付きパワーモジュールの製造工程を示す図The figure which shows the manufacturing process of the power module with a terminal block concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる端子台付きパワーモジュールの製造工程を示す図The figure which shows the manufacturing process of the power module with a terminal block concerning Embodiment 1 of this invention. 本発明の実施の形態２にかかる端子台付きパワーモジュールの断面図Sectional drawing of the power module with a terminal block concerning Embodiment 2 of this invention 本発明の実施の形態２にかかる端子台付きパワーモジュールから配線基板をはずした状態を示す上面図The top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 2 of this invention. 本発明の実施の形態２にかかる端子台付きパワーモジュールの配線基板を示す図The figure which shows the wiring board of the power module with a terminal block concerning Embodiment 2 of this invention. 本発明の実施の形態３にかかる端子台付きパワーモジュールから配線基板をはずした状態を示す上面図The top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 3 of this invention. 本発明の実施の形態４にかかる端子台付きパワーモジュールから配線基板をはずした状態を示す上面図The top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 4 of this invention 本発明の実施の形態５にかかる端子台付きパワーモジュールから配線基板をはずした状態を示す上面図The top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 5 of this invention.
　以下に、本発明の実施の形態にかかる端子台付きパワーモジュールおよび端子台付きパワーモジュールの製造方法を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。 Hereinafter, a power module with a terminal block and a method for manufacturing the power module with a terminal block according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.
実施の形態１．
　図１は、本発明の実施の形態１にかかる端子台付きパワーモジュールの断面図である。図２は、本発明の実施の形態１にかかる端子台付きパワーモジュールの配線基板をはずした状態を示す上面図である。図１は、図２のＡ－Ａ断面に相当する図である。図３は、本発明の実施の形態１にかかる端子台付きパワーモジュールから配線基板および端子台をはずした状態を示す上面図である。図４は、本発明の実施の形態１にかかるパワーモジュールの配線基板および端子台をはずした状態を示す斜視図である。図５は、本発明の実施の形態１にかかる端子台付きパワーモジュールの端子台を示す斜視図である。図６は、本発明の実施の形態１にかかる端子台付きパワーモジュールを用いたインバータ回路を示す図である。 Embodiment 1 FIG.
FIG. 1 is a cross-sectional view of a power module with a terminal block according to a first embodiment of the present invention. FIG. 2 is a top view showing a state where the wiring board of the power module with a terminal block according to the first embodiment of the present invention is removed. FIG. 1 is a view corresponding to the AA cross section of FIG. FIG. 3 is a top view showing a state in which the wiring board and the terminal block are removed from the power module with a terminal block according to the first embodiment of the present invention. FIG. 4 is a perspective view showing a state where the wiring board and the terminal block of the power module according to the first embodiment of the present invention are removed. FIG. 5 is a perspective view showing a terminal block of the power module with a terminal block according to the first embodiment of the present invention. FIG. 6 is a diagram illustrating an inverter circuit using the power module with a terminal block according to the first embodiment of the present invention.
　実施の形態１の端子台付きパワーモジュール１は、樹脂パッケージ１０１と樹脂パッケージ１０１から導出された第１のリード端子１１０と第２のリード端子１２０とを備えた樹脂封止型パワー素子１００と、樹脂封止型パワー素子１００が搭載される配線基板２００と、端子台３００とを備える。第１のリード端子１１０は、端子台３００に直接接続され第２のリード端子１２０は、配線基板２００に接続される。以下、樹脂封止型パワー素子１００をパワーモジュールということもある。 The power module 1 with a terminal block according to the first embodiment includes a resin-encapsulated power element 100 including a resin package 101, a first lead terminal 110 derived from the resin package 101, and a second lead terminal 120. A wiring board 200 on which the resin-encapsulated power element 100 is mounted and a terminal block 300 are provided. The first lead terminal 110 is directly connected to the terminal block 300, and the second lead terminal 120 is connected to the wiring board 200. Hereinafter, the resin-encapsulated power element 100 may be referred to as a power module.
　樹脂封止型パワー素子１００は、パワー半導体チップ１０２と、その他の半導体チップ１０３とが、ボンディングワイヤ１０４で第１のリード端子１１０あるいは第２のリード端子１２０に接続されている。またこれらパワー半導体チップ１０２およびその他の半導体チップ１０３は、図示しないはんだ層でダイパッド１３０上に固定されており、ダイパッド１３０の裏面は導電性接着剤１０６でフィンベース１４０に固定されている。 In the resin-encapsulated power element 100, the power semiconductor chip 102 and the other semiconductor chip 103 are connected to the first lead terminal 110 or the second lead terminal 120 by bonding wires 104. The power semiconductor chip 102 and other semiconductor chips 103 are fixed on the die pad 130 with a solder layer (not shown), and the back surface of the die pad 130 is fixed to the fin base 140 with a conductive adhesive 106.
　フィンベース１４０は、ステンレス製の板状体にフィン１４２を装着するための溝部１４１を有し、トランスファーモールドを用いた樹脂封止によって樹脂パッケージ１０１の成形がなされるときに、樹脂パッケージ１０１内に埋め込まれる。フィン１４２はフィンベース１４０に形成された溝部１４１にかしめによって平行に１８枚配列される。ここで用いられる樹脂パッケージ１０１は、１２０ｍ×８０ｍｍ×３０ｍｍという極めて外形サイズの大きいもので、大電流が流れる設定のものである。 The fin base 140 has a groove portion 141 for mounting the fin 142 on a stainless steel plate-like body, and the resin package 101 is formed in the resin package 101 when the resin package 101 is molded by resin sealing using a transfer mold. Embedded. Eighteen fins 142 are arranged in parallel in the grooves 141 formed in the fin base 140 by caulking. The resin package 101 used here has an extremely large outer size of 120 m × 80 mm × 30 mm, and is configured to flow a large current.
　第１のリード端子１１０は、５本が等間隔で樹脂パッケージ１０１から導出され、導出位置と、端子台３００との接続位置とが同一面上にあり、曲げ部を持たない。 The five first lead terminals 110 are led out from the resin package 101 at equal intervals, the lead-out position and the connection position with the terminal block 300 are on the same plane, and there is no bent portion.
　配線基板２００は、通例のガラエポ基板に図示しない配線パターンを形成したものである。図示は省略するが、配線パターン上に機能素子が搭載されている。 The wiring board 200 is obtained by forming a wiring pattern (not shown) on a usual glass epoxy board. Although illustration is omitted, a functional element is mounted on the wiring pattern.
　また端子台３００は、図１に断面図、図５に斜視図を示すように、端子台本体３０１と端子台本体３０１に埋め込まれる、断面Ｌ字状の導電板３０２、端子ネジ３０３と、ワッシャ３０４とによって、導電板３０２に接続される圧着端子３０５とを有し、圧着端子３０５を介して二次側端子部である、例えば太陽電池モジュールなどの電源部２と接続される。 Further, as shown in a sectional view in FIG. 1 and a perspective view in FIG. 5, the terminal block 300 includes a terminal block main body 301, an L-shaped conductive plate 302 embedded in the terminal block main body 301, a terminal screw 303, and a washer. 304 has a crimp terminal 305 connected to the conductive plate 302, and is connected to the power supply unit 2 such as a solar cell module, which is a secondary terminal part, via the crimp terminal 305.
　図２および図３からあきらかなように、第１のリード端子１１０および第２のリード端子１２０は樹脂パッケージ１０１の同一辺上に搭載される。つまり、第１のリード端子１１０の導出辺側には、端子台３００との接続用である第１のリード端子１１０だけでなく、配線板２００あるいは他の機器との接続用の第２のリード端子１２０も形成されている。なお、同一辺上に複数種のリード端子を配設することで、他のデバイスを含めたシステム設計が容易となる。 As apparent from FIGS. 2 and 3, the first lead terminal 110 and the second lead terminal 120 are mounted on the same side of the resin package 101. That is, on the lead-out side of the first lead terminal 110, not only the first lead terminal 110 for connection to the terminal block 300 but also the second lead for connection to the wiring board 200 or another device. A terminal 120 is also formed. In addition, by arranging a plurality of types of lead terminals on the same side, system design including other devices becomes easy.
　実施の形態１では、図２および図３からあきらかなように、第２のリード端子１２０は、樹脂パッケージ１０１の相対向する２辺から導出されていることになる。つまり一つの辺上では端子台３００に接続された第１のリード端子１１０と、配線基板あるいは他のデバイスに接続される第２のリード端子１２０とが並置されている。従って回路設計に自由度があり、小型化が可能となるという利点がある。 In the first embodiment, as clearly shown in FIGS. 2 and 3, the second lead terminal 120 is derived from two opposite sides of the resin package 101. That is, on one side, the first lead terminal 110 connected to the terminal block 300 and the second lead terminal 120 connected to the wiring board or other device are juxtaposed. Therefore, there is an advantage that the circuit design has a degree of freedom and can be miniaturized.
　また、端子台３００側には第１のリード端子１１０のみを形成することも可能である。端子台３００の幅全体に第１のリード端子１１０が配列された構造をとることができ、実装が容易となる。 Also, it is possible to form only the first lead terminal 110 on the terminal block 300 side. A structure in which the first lead terminals 110 are arranged over the entire width of the terminal block 300 can be taken, and mounting becomes easy.
　第１のリード端子１１０は、端部に端子台リード挿通孔１１１を有する。端子台リード挿通孔１１１に端子台３００の断面Ｌ字状の導電板３０２の先端に設けられた端子台リード３０７が挿通され、はんだ３０６で固定され電気的接続および機械的接続がなされる。 The first lead terminal 110 has a terminal block lead insertion hole 111 at the end. A terminal block lead 307 provided at the tip of a conductive plate 302 having an L-shaped cross section of the terminal block 300 is inserted into the terminal block lead insertion hole 111 and fixed by solder 306 to be electrically connected and mechanically connected.
　次に、実施の形態１のパワーモジュールの製造方法について説明する。図７は、実施の形態１のパワーモジュールの製造方法を示すフローチャートである。図８から図１３は、実施の形態１のパワーモジュールの製造工程を示す図である。 Next, a method for manufacturing the power module according to the first embodiment will be described. FIG. 7 is a flowchart showing a method for manufacturing the power module of the first embodiment. 8 to 13 are diagrams showing manufacturing steps of the power module of the first embodiment.
　まず、ステップＳ１０１で、図８に示すリードフレームを用意する。ここで用いられるリードフレームは、端子台３００に直接接続される複数本の第１のリード端子１１０と、配線基板２００に接続される、複数本の第２のリード端子１２０と、パワー半導体チップ１０１および他の半導体チップ１０３を搭載するダイパッド１３０とを備えたユニットＵが、サイドバー１３１で接続されている。ダイパッド１３０は、サポートバー１３２でサイドバー１３１に固定されている。リードフレームは銅もしくは銅合金にニッケルめっきがなされた金属条材を打ち抜き加工により成形したものであり、第１および第２のリード端子１１０，１２０先端の接続領域にはんだめっきを施されてなるものである。第１のリード端子１１０、および第２のリード端子１２０は、タイバー１３３で中間部を固定されており、ユニットＵはサイドバー１３１に一定の間隔で形成された送り穴１３４によって位置決めし、組み立てをしながら順次搬送されるように構成されている。上記例では、サイドバー１３１、サポートバー１３２、タイバー１３３などのフレーム構造体を用いているが、フレーム構造体については適宜変更可能である。 First, in step S101, a lead frame shown in FIG. 8 is prepared. The lead frame used here includes a plurality of first lead terminals 110 directly connected to the terminal block 300, a plurality of second lead terminals 120 connected to the wiring substrate 200, and the power semiconductor chip 101. A unit U including a die pad 130 on which another semiconductor chip 103 is mounted is connected by a side bar 131. The die pad 130 is fixed to the side bar 131 by a support bar 132. The lead frame is formed by stamping a metal strip made of nickel plated copper or copper alloy, and solder plating is applied to the connection regions at the tips of the first and second lead terminals 110 and 120. It is. The intermediate portion of the first lead terminal 110 and the second lead terminal 120 is fixed by a tie bar 133, and the unit U is positioned by the feed holes 134 formed in the side bar 131 at regular intervals, and assembled. However, it is configured to be sequentially conveyed. In the above example, a frame structure such as the side bar 131, the support bar 132, and the tie bar 133 is used. However, the frame structure can be appropriately changed.
　そしてパワー半導体チップ１０２の搭載ステップＳ１０２で、図９に示すように、ダイパッド１３０上にパワー半導体チップ１０２および他の半導体チップ１０３を搭載する。図９から図１２は図８のＢ－Ｂ断面に相当する図である。 Then, in step S102 for mounting the power semiconductor chip 102, the power semiconductor chip 102 and another semiconductor chip 103 are mounted on the die pad 130 as shown in FIG. 9 to 12 are views corresponding to the BB cross section of FIG.
　この後、ワイヤボンディングステップＳ１０３で、図１０に示すように、ボンディングワイヤ１０４でパワー半導体チップ１０２および他の半導体チップ１０３と、第１および第２のリード１１０，１２０の内方端つまりインナーリードに対応する位置とを接続する。 Thereafter, in the wire bonding step S103, as shown in FIG. 10, the power semiconductor chip 102 and the other semiconductor chips 103 and the inner ends of the first and second leads 110 and 120, that is, the inner leads are bonded by the bonding wires 104. Connect the corresponding position.
　そして、フィンベース固着ステップＳ１０４で、図１１に示すように、導電性接着剤１０６を介してフィンベース１４０とダイパッド１３０とを接続する。 Then, in the fin base fixing step S104, the fin base 140 and the die pad 130 are connected via the conductive adhesive 106 as shown in FIG.
　更にステップＳ１０５で、図１２に示すように、金型を用いてフィンベースごと、トランスファーモールドにより樹脂封止を行う。ここでトランスファーモールドには、エポキシ樹脂、フェノール樹脂、不飽和ポリエステル樹脂、ユリア樹脂、メラミン樹脂、などの熱硬化性樹脂が用いられる。 Further, in step S105, as shown in FIG. 12, the resin is sealed by transfer molding for each fin base using a mold. Here, a thermosetting resin such as an epoxy resin, a phenol resin, an unsaturated polyester resin, a urea resin, or a melamine resin is used for the transfer mold.
　そして、ステップＳ１０６でフィン１４２をフィンベース１４０に形成した溝部１４１にかしめる。 In step S106, the fin 142 is caulked to the groove 141 formed in the fin base 140.
　この後、第１のリード端子１１０および第２のリード端子１２０を曲げ、ステップＳ１０７で端子台３００に接続する。端子台３００と第１のリード端子１１０との接続は、端子台リード３０７を第１のリード端子１１０先端に設けられた端子台リード挿通孔１１１に挿通し、はんだ３０６で固着することによってなされる。 Thereafter, the first lead terminal 110 and the second lead terminal 120 are bent and connected to the terminal block 300 in step S107. The terminal block 300 and the first lead terminal 110 are connected by inserting the terminal block lead 307 through the terminal block lead insertion hole 111 provided at the tip of the first lead terminal 110 and fixing with the solder 306. .
　そして最後に、ステップＳ１０８でサイドバー１３１、サポートバー１３２、タイバー１３３などのフレーム構造体を切除して、個片化する。 Finally, in step S108, frame structures such as the side bar 131, the support bar 132, and the tie bar 133 are cut out and separated into pieces.
　なお、端子台３００は、熱可塑性樹脂で形成された端子台本体３０１に、断面Ｌ字状の導電板３０２が埋め込まれて形成されるが、端子ネジ３０３と、ワッシャ３０４とによって、導電板３０２に接続される圧着端子３０５とを有し、圧着端子３０５を介して二次側端子部と接続される。例えば図６に示すような、電源２とモータ３との間に接続されるインバータ回路を構成する、端子台付きパワーモジュール１の場合、端子台３００と、樹脂封止型パワー素子１００との間の配線長を最小限に維持することができ、電気的特性の良好な接続が可能となる。 The terminal block 300 is formed by embedding a conductive plate 302 having an L-shaped cross section in a terminal block main body 301 formed of a thermoplastic resin, but the conductive plate 302 is composed of a terminal screw 303 and a washer 304. And is connected to the secondary terminal portion via the crimp terminal 305. For example, in the case of the power module 1 with a terminal block that constitutes an inverter circuit connected between the power source 2 and the motor 3 as shown in FIG. 6, between the terminal block 300 and the resin-encapsulated power element 100. The wiring length can be kept to a minimum, and connection with good electrical characteristics is possible.
　また、熱可塑性樹脂としては、ポリエチレン樹脂、ポリプロピレン樹脂、ポリスチレン樹脂、ポリ塩化ビニル樹脂などのビニル系ポリマー、ポリエステル樹脂、ポリアミド樹脂なども適用可能である。 Further, as the thermoplastic resin, vinyl polymers such as polyethylene resin, polypropylene resin, polystyrene resin, and polyvinyl chloride resin, polyester resin, polyamide resin, and the like are also applicable.
　このようにして形成された端子台付きパワーモジュール１は、樹脂封止型パワー素子１００と端子台３００とが配線基板２００を介することなく直接接続されているため、端子台３００とパワーモジュールである樹脂封止型パワー素子１００との間の配線長を短くすることができ、かつネジ締め時に割れることもなく、信頼性が高いという効果を奏功する。 The power module 1 with a terminal block formed in this way is a power module with the terminal block 300 because the resin-encapsulated power element 100 and the terminal block 300 are directly connected without the wiring board 200 interposed therebetween. The wiring length between the resin-encapsulated power element 100 can be shortened, and the effect of high reliability is achieved without cracking during screw tightening.
　また、実施の形態１の端子台付きパワーモジュール１は、リードフレームを用いた実装が可能であり、多数個のユニットＵを封止した後、サイドバー１３１などを切除し、個片化することができ、多数個どりが容易で、生産性の高いものとなっている。 Moreover, the power module 1 with a terminal block according to the first embodiment can be mounted using a lead frame, and after sealing a large number of units U, the side bars 131 and the like are cut out and separated into pieces. It is easy to produce in large numbers and is highly productive.
　実装に際して、フィン１４２をフィンベース１４０に形成した溝部１４１にかしめる際、サイドバー１３１などによって樹脂パッケージ１０１ごと固定されているため、変形が防止され、実装が容易である。なおフィンベース１４０にフィン１４２をかしめた後で、端子台３００との接続後にサイドバー１３１、サポートバー１３２、タイバー１３３などのフレーム構造体を切除しているため、端子台３００の接続が容易である。また、サイドバー１３１などのフレーム構造体は、端子台３００との接続前あるいは配線基板２００への接続後に切除してもよい。 During mounting, when the fin 142 is caulked to the groove 141 formed in the fin base 140, the resin package 101 is fixed by the side bar 131 or the like, so that deformation is prevented and mounting is easy. After the fin 142 is crimped to the fin base 140, the frame structure such as the side bar 131, the support bar 132, and the tie bar 133 is cut off after the connection with the terminal block 300, so that the connection of the terminal block 300 is easy. is there. Further, the frame structure such as the side bar 131 may be cut off before connection to the terminal block 300 or after connection to the wiring board 200.
実施の形態２．
　次に、本発明の実施の形態２にかかる端子台付きパワーモジュールについて説明する。図１３は、実施の形態２にかかる端子台付きパワーモジュールの断面図である。図１４は、実施の形態２にかかる端子台付きパワーモジュールの上面図である。実施の形態２に係る端子台付きパワーモジュール１Ｓが、実施の形態１の端子台付きパワーモジュール１と異なる点は、端子台３００Ｓの端子構造と、第１のリード端子１１０Ｓの先端形状である。実施の形態２では、端子台３００Ｓの導電板３０２Ｓが、断面Ｌ字状の導電板３０２Ｓの先端にさらにＬ字状に曲げられた先端接続部としての端子台リード３０７Ｓが第１のリード端子１１０Ｓ上に、端子台本体３０１から導出されている。第１のリード端子１１０Ｓの先端と端子台３００の端子台リード３０７Ｓが、はんだ３０６で固着されている。 Embodiment 2. FIG.
Next, a power module with a terminal block according to Embodiment 2 of the present invention will be described. FIG. 13 is a cross-sectional view of the power module with a terminal block according to the second embodiment. FIG. 14 is a top view of the power module with a terminal block according to the second embodiment. The power module 1S with a terminal block according to the second embodiment is different from the power module 1 with a terminal block according to the first embodiment in the terminal structure of the terminal block 300S and the tip shape of the first lead terminal 110S. In the second embodiment, the terminal block lead 307S as a tip connection portion in which the conductive plate 302S of the terminal block 300S is further bent into an L shape at the tip of the conductive plate 302S having an L-shaped cross section is the first lead terminal 110S. Above, it is derived from the terminal block body 301. The tip of the first lead terminal 110 </ b> S and the terminal block lead 307 </ b> S of the terminal block 300 are fixed with solder 306.
　配線基板２００は、図１５に示すように、端子台３００と干渉しないように、端子台３００の装着される領域に切り欠き２０１を形成した構成とした。 As shown in FIG. 15, the wiring board 200 has a configuration in which a notch 201 is formed in a region where the terminal block 300 is mounted so as not to interfere with the terminal block 300.
　他の部分については図１に示した実施の形態１の端子台付きパワーモジュール１と同様であり、ここでは説明を省略する。なお同一部位には同一符号を付した。 Other parts are the same as those of the power module 1 with a terminal block of the first embodiment shown in FIG. 1, and the description is omitted here. In addition, the same code | symbol was attached | subjected to the same site | part.
　実施の形態２の端子台付きパワーモジュール１Ｓでは、パワーモジュールすなわち樹脂封止型パワー素子１００Ｓと端子台３００Ｓとの接続のための配線長をさらに短くすることができ、実施の形態１の端子台付きパワーモジュール１よりもさらに配線抵抗の低減を図ることが可能となる。 In the power module 1S with a terminal block of the second embodiment, the wiring length for connecting the power module, that is, the resin-encapsulated power element 100S and the terminal block 300S can be further shortened, and the terminal block of the first embodiment It is possible to further reduce the wiring resistance as compared with the attached power module 1.
　また、配線基板２００は、端子台３００と干渉しないように、端子台３００Ｓの装着される領域に切り欠き２０１を形成した構成をとるため、配線長を最大限に短縮することが可能となる。 Further, since the wiring board 200 has a configuration in which the notch 201 is formed in the region where the terminal block 300S is mounted so as not to interfere with the terminal block 300, the wiring length can be reduced to the maximum.
　なお、実施の形態１および２では、リード端子の導出方向が２方向である例について説明したが、２方向に限定されることなく、３方向、４方向であっても良いことはいうまでもない。また、端子台についても１方向のみに限定されることなく、相対向する側に２個設けることも可能である。例えば図６に示したシステムの場合、電源２側だけでなく、モータ３などの負荷側も端子台を用いた接続とすることができ、接続部の小型化が可能となる。また、２辺ではなく１辺に２個以上の端子台を配列することも可能である。 In the first and second embodiments, the example in which the lead terminal is led out in two directions has been described. However, the present invention is not limited to two directions, and may be three directions and four directions. Absent. Also, the terminal block is not limited to only one direction, and two terminal blocks can be provided on opposite sides. For example, in the case of the system shown in FIG. 6, not only the power supply 2 side but also the load side such as the motor 3 can be connected using a terminal block, and the connection portion can be downsized. It is also possible to arrange two or more terminal blocks on one side instead of two sides.
実施の形態３．
　次に、本発明の実施の形態３にかかる端子台付きパワーモジュールについて説明する。図１６は、本発明の実施の形態３にかかる端子台付きパワーモジュールから配線基板をはずした状態を示す上面図の断面図である。実施の形態３に係る端子台付きパワーモジュール１Ｐが、実施の形態１の端子台付きパワーモジュール１と異なる点は、パワーモジュールの樹脂パッケージ１０１の相対向する２辺に端子台３００が、装着されている点である。相対向する２辺から第１のリード端子１１０および第２のリード端子１２０が導出されており、第１のリード端子１１０にはそれぞれ端子台３００が装着されている。第１のリード端子１１０と端子台３００との接続は実施の形態１または２と同様にすればよく、ここでは説明を省略する。 Embodiment 3 FIG.
Next, a power module with a terminal block according to Embodiment 3 of the present invention will be described. FIG. 16: is sectional drawing of the top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 3 of this invention. The power module 1P with a terminal block according to the third embodiment is different from the power module 1 with a terminal block according to the first embodiment in that the terminal block 300 is mounted on two opposite sides of the resin package 101 of the power module. It is a point. A first lead terminal 110 and a second lead terminal 120 are led out from two opposite sides, and a terminal block 300 is attached to each of the first lead terminals 110. The connection between the first lead terminal 110 and the terminal block 300 may be the same as in the first or second embodiment, and the description thereof is omitted here.
　以上のようにして形成された端子台付きパワーモジュール１Ｐは、電源２あるいはモータ３等の負荷との間の接続が端子台３００を介して行われ、大電流が流れる部分での配線長の合計を最小限に抑えることができるという特徴を有する。また、配線基板２００あるいは他のデバイスとの接続が必要な場合は、第２のリード端子１２０を用いて接続すればよい。 The power module 1P with a terminal block formed as described above is connected to the load such as the power source 2 or the motor 3 via the terminal block 300, and the total wiring length in a portion where a large current flows is obtained. It has the feature that can be minimized. If connection to the wiring board 200 or another device is necessary, the second lead terminal 120 may be used for connection.
　さらにはパワー半導体チップが複数個用いられる場合にも、パワーモジュール内でのパワー半導体チップのレイアウトをできるだけ端子台に近い位置に配置することで、大電流が流れる部分での配線長を最小限に抑えることができる。 Furthermore, even when multiple power semiconductor chips are used, the power semiconductor chip layout in the power module is placed as close to the terminal block as possible, thereby minimizing the wiring length in areas where large current flows. Can be suppressed.
　実施の形態３の構成によれば、インバータ回路などのパワーモジュールを、回路システム内に接続する際、大電流が流れる部分での配線長を短くすることができ、かつ端子台と負荷あるいは電源などの回路システムの要素との接続時のネジ締め時に割れることもなく、信頼性が高いという効果を奏功する。 According to the configuration of the third embodiment, when a power module such as an inverter circuit is connected to the circuit system, the wiring length in a portion where a large current flows can be shortened, and the terminal block and the load or the power source can be used. It is highly reliable because it does not break when tightened with screws when connecting to other circuit system elements.
実施の形態４．
　次に、本発明の実施の形態４にかかる端子台付きパワーモジュールについて説明する。図１７は、本発明の実施の形態４にかかる端子台付きパワーモジュールから配線基板をはずした状態を示す上面図の断面図である。実施の形態４に係る端子台付きパワーモジュール１Ｑが、実施の形態３の端子台付きパワーモジュール１Ｐと異なる点は、パワーモジュールの樹脂パッケージ１０１の相対向する長辺の２辺に加え、短辺側の１辺にも端子台３００が、装着され、１辺を除きすべての辺に端子台３００が装着されている点である。相対向する２辺とこの２辺に隣接する１辺から第１のリード端子１１０が導出されており、第１のリード端子１１０にはそれぞれ端子台３００が装着されている。そして残る１辺から第２のリード端子１２０が導出され、配線基板あるいは他のデバイスとの接続がなされる。第１のリード端子１１０と端子台３００との接続は実施の形態１または２と同様にすればよく、ここでは説明を省略する。 Embodiment 4 FIG.
Next, a power module with a terminal block according to Embodiment 4 of the present invention will be described. FIG. 17: is sectional drawing of the top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 4 of this invention. The power module 1Q with a terminal block according to the fourth embodiment is different from the power module 1P with a terminal block according to the third embodiment in that in addition to the two opposite long sides of the resin package 101 of the power module, the short side The terminal block 300 is mounted on one side of the side, and the terminal block 300 is mounted on all sides except for one side. A first lead terminal 110 is led out from two opposite sides and one side adjacent to the two sides, and a terminal block 300 is attached to each of the first lead terminals 110. Then, the second lead terminal 120 is led out from the remaining one side and connected to the wiring board or another device. The connection between the first lead terminal 110 and the terminal block 300 may be the same as in the first or second embodiment, and the description thereof is omitted here.
　以上のようにして形成された端子台付きパワーモジュール１Ｑは、電源、あるいはモータを初めとする複数の負荷との間の接続が端子台３００を介して行われ、大電流が流れる部分での配線長の合計を最小限に抑えることができるという特徴を有する。また、配線基板あるいは他のデバイスとの接続が必要な場合は、第２のリード端子を用いて接続すればよい。 The power module 1Q with a terminal block formed as described above is connected to a power source or a plurality of loads such as a motor through the terminal block 300, and wiring at a portion where a large current flows. The feature is that the total length can be minimized. If connection to a wiring board or another device is necessary, the connection may be made using the second lead terminal.
　さらにはパワー半導体チップが３個以上用いられる場合にも、パワーモジュール内でのパワー半導体チップのレイアウトをできるだけ端子台に近い位置に配置することで、大電流が流れる部分での配線長を最小限に抑えることができる。 Furthermore, even when three or more power semiconductor chips are used, the power semiconductor chip layout in the power module is arranged as close to the terminal block as possible, thereby minimizing the wiring length in the portion where a large current flows. Can be suppressed.
　実施の形態４の構成によれば、インバータ回路などのパワーモジュールを、回路システム内に接続する際、設計に自由度をもたせながら、大電流が流れる部分での配線長を短くすることができ、かつ端子台と負荷あるいは電源などの回路システムの要素との接続時のネジ締め時に割れることもなく、信頼性が高いという効果を奏功する。 According to the configuration of the fourth embodiment, when connecting a power module such as an inverter circuit in a circuit system, the wiring length in a portion where a large current flows can be shortened while allowing a degree of freedom in design, In addition, the terminal block and a load or a circuit system element such as a power source are not cracked at the time of screw connection, and the effect of high reliability is achieved.
実施の形態５．
　次に、本発明の実施の形態５にかかる端子台付きパワーモジュールについて説明する。図１８は、本発明の実施の形態５にかかる端子台付きパワーモジュールから配線基板をはずした状態を示す上面図の断面図である。実施の形態５に係る端子台付きパワーモジュール１Ｒが、実施の形態４の端子台付きパワーモジュール１Ｑと異なる点は、パワーモジュールの樹脂パッケージ１０１の３辺に加え、残る１辺にも端子台３００が、装着されている点である。４辺すべてから第１のリード端子１１０が導出されており、第１のリード端子１１０にはそれぞれ端子台３００が装着されている。第１のリード端子１１０と端子台３００との接続は実施の形態１または２と同様にすればよく、ここでは説明を省略する。 Embodiment 5 FIG.
Next, a power module with a terminal block according to Embodiment 5 of the present invention will be described. FIG. 18: is sectional drawing of the top view which shows the state which removed the wiring board from the power module with a terminal block concerning Embodiment 5 of this invention. The power module 1R with a terminal block according to the fifth embodiment is different from the power module 1Q with a terminal block according to the fourth embodiment in that in addition to the three sides of the resin package 101 of the power module, the terminal block 300 is also provided on the remaining one side. This is the point that is attached. First lead terminals 110 are led out from all four sides, and terminal blocks 300 are attached to the first lead terminals 110, respectively. The connection between the first lead terminal 110 and the terminal block 300 may be the same as in the first or second embodiment, and the description thereof is omitted here.
　以上のようにして形成された端子台付きパワーモジュール１Ｒは、電源、あるいはモータを初めとする複数の負荷との間の接続が端子台３００を介して行われ、大電流が流れる部分での配線長の合計を最小限に抑えることができるという特徴を有する。また、配線基板あるいは他のデバイスとの接続が必要な場合は、端子台を介して接続しても良いし、必要な辺に第２のリード端子１２０を並置してもよい。 The power module 1R with a terminal block formed as described above is connected to a plurality of loads such as a power source or a motor via the terminal block 300, and wiring at a portion where a large current flows. The feature is that the total length can be minimized. When connection with a wiring board or other devices is necessary, the connection may be made via a terminal block, or the second lead terminal 120 may be juxtaposed on a necessary side.
　さらにはパワー半導体チップが４個以上用いられる場合にも、パワーモジュール内でのパワー半導体チップのレイアウトをできるだけ端子台に近い位置に配置することで、大電流が流れる部分での配線長を最小限に抑えることができる。 Furthermore, even when four or more power semiconductor chips are used, the power semiconductor chip layout in the power module is arranged as close to the terminal block as possible, thereby minimizing the wiring length in the portion where a large current flows. Can be suppressed.
　実施の形態５の構成によれば、インバータ回路などのパワーモジュールを、回路システム内に接続する際、設計に自由度をもたせながら、大電流が流れる部分での配線長を短くすることができ、かつ端子台と負荷あるいは電源などの回路システムの要素との接続時のネジ締め時に割れることもなく、信頼性が高いという効果を奏功する。 According to the configuration of the fifth embodiment, when connecting a power module such as an inverter circuit in a circuit system, the wiring length in a portion where a large current flows can be shortened while giving a degree of freedom in design, In addition, the terminal block and a load or a circuit system element such as a power source are not cracked at the time of screw connection, and the effect of high reliability is achieved.
　以上説明してきたように、実施の形態１から５では、第１のリード端子１１０を曲げることなくまっすぐにしているため、端子台３００，３００Ｓと第１のリード端子１１０との接続のための配線長を最小限にすることができるが、必要に応じて曲げてもよい。 As described above, in the first to fifth embodiments, since the first lead terminal 110 is straightened without being bent, the wiring for connecting the terminal blocks 300 and 300S to the first lead terminal 110 is used. The length can be minimized, but may be bent as required.
　また、第１のリード端子１１０と端子台３００との接続をリードフレーム上で実現できるため、作業性が良好で位置ずれが生じにくいという利点がある。特に実施の形態３から５の場合、複数の辺上で端子台３００を接続するため、支持が難しいが、リードフレーム上で実施することで、作業がし易い。 In addition, since the connection between the first lead terminal 110 and the terminal block 300 can be realized on the lead frame, there is an advantage that workability is good and misalignment hardly occurs. In particular, in the case of Embodiments 3 to 5, since the terminal block 300 is connected on a plurality of sides, it is difficult to support the terminal block 300, but it is easy to work on the lead frame.
　また、端子台先端リードと第１のリード端子１１０との接続は、実施の形態１および２の構成に限定されることなく、適宜変更可能である。 Further, the connection between the terminal block tip lead and the first lead terminal 110 is not limited to the configuration of the first and second embodiments, and can be appropriately changed.
　なお実施の形態１から５では、インバータ回路のパワーモジュールについて説明したが、インバータ回路に限定されることなく、大電流に用いられるパワー半導体チップをもつパワーモジュールを用いた回路システムであればいかなるシステムにも適用可能である。 In the first to fifth embodiments, the power module of the inverter circuit has been described. However, the present invention is not limited to the inverter circuit, and any system can be used as long as it is a circuit system using a power module having a power semiconductor chip used for a large current. It is also applicable to.
　また、実施の形態１から５ではパワーモジュール内に、複数個の半導体チップを搭載したリードフレームを一括封止した例について説明したが、１個のパワー半導体チップを封止したものでもよいことはいうまでもない。また、リードフレームの形状についても適宜変更可能である。例えば、リード端子にタイバーを設けない構造も有効である。また、ダイパッド１３０は図８に破線で示したように、パワー半導体チップ搭載領域を分割構造としたが、一つのダイパッド１３０に複数の半導体チップを搭載する例についても有効である。さらにダイパッドなしのリードフレームを用い、フィンベースに直接半導体チップを搭載してもよい。 Further, in the first to fifth embodiments, the example in which the lead frame on which a plurality of semiconductor chips are mounted is collectively sealed in the power module has been described. However, one power semiconductor chip may be sealed. Needless to say. Also, the shape of the lead frame can be changed as appropriate. For example, a structure in which a tie bar is not provided on the lead terminal is also effective. Further, the die pad 130 has a divided structure of the power semiconductor chip mounting region as shown by a broken line in FIG. 8, but it is also effective in an example in which a plurality of semiconductor chips are mounted on one die pad 130. Further, a lead frame without a die pad may be used, and a semiconductor chip may be directly mounted on the fin base.
　さらに実施の形態１から５ではダイパッド１３０上への半導体チップの搭載は、素子搭載面を上方すなわち、フエースアップで行ったが、素子搭載面を下方、すなわちフェースダウンで接続するいわゆるフリップチップ接続としてもよい。フリップチップ接続とした場合は、ワイヤボンディングが不要となる。 Further, in the first to fifth embodiments, the mounting of the semiconductor chip on the die pad 130 is performed with the element mounting surface upward, that is, face-up. However, as the so-called flip chip connection in which the element mounting surface is connected downward, that is, face-down. Also good. In the case of flip chip connection, wire bonding is not necessary.
　また、パワーモジュール内に搭載する半導体素子は、ベアチップに限定されることなく、パッケージ化された半導体素子であってもよく、適宜変更可能である。 Further, the semiconductor element mounted in the power module is not limited to the bare chip, but may be a packaged semiconductor element and can be changed as appropriate.
　また、リードフレームを形成する条材の材料としては、銅または銅合金にニッケルめっきを施したものを用いたが、別の材料を用いても良く、また、第１および第２のリード端子の先端にのみはんだめっき層を形成したものなど、適宜変形可能であることは言うまでもない。 In addition, as the material of the strip material for forming the lead frame, copper or copper alloy plated with nickel is used, but another material may be used, and the first and second lead terminals may be used. Needless to say, a solder plating layer formed only at the tip can be appropriately modified.
　また、実施の形態１から５では、フィン装着用の溝部を有するフィンベースをパワー半導体チップと一体的に樹脂封止し、フィンをフィンベースの溝部に装着する構成について説明したが、一部を樹脂封止された底面が平坦なフィンベースに放熱用グリースでフィンを接着してもよい。あるいは、パワー半導体チップの底面を露出させて樹脂封止し、パワー半導体チップの底面に当接するように放熱フィンを接着するなど、放熱フィンの装着は適宜選択可能である。 In the first to fifth embodiments, the configuration in which the fin base having the fin mounting groove portion is resin-sealed integrally with the power semiconductor chip and the fin is mounted in the fin base groove portion is described. The fins may be bonded to the fin base with a flat bottom surface sealed with resin with heat-dissipating grease. Alternatively, the mounting of the radiation fins can be selected as appropriate, such as exposing the bottom surface of the power semiconductor chip and sealing with resin, and adhering the radiation fin so as to contact the bottom surface of the power semiconductor chip.
　また、端子台と接続するための第１のリード端子の導出方向については、回路設計に応じて、リードフレームのパターンを調整すればよく、容易に複数の辺に端子台を備えた端子台付きパワーモジュールを形成することができ、他の回路装置との接続部の小型化をはかることができる。 In addition, as for the lead-out direction of the first lead terminal for connection with the terminal block, the lead frame pattern may be adjusted according to the circuit design, and a terminal block with terminal blocks on a plurality of sides can be easily attached. A power module can be formed, and the size of a connection portion with another circuit device can be reduced.
　たとえば太陽光発電システムに用いた場合には、インバータ回路と、太陽電池モジュールおよび負荷との間の接続部の小型化および接続抵抗の低減をはかることができ、システム全体の小型化、省電力化が実現される。 For example, when used in a photovoltaic power generation system, the connection between the inverter circuit, the solar cell module and the load can be reduced in size and the connection resistance can be reduced. Is realized.
　以上の実施の形態に示した構成は、本発明の内容の一例を示すものであり、別の公知の技術と組み合わせることも可能であるし、本発明の要旨を逸脱しない範囲で、構成の一部を省略、変更することも可能である。 The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.
　１，１Ｐ，１Ｑ，１Ｒ，１Ｓ　端子台付きパワーモジュール、２　電源、３　モータ、１００，１００Ｓ　樹脂封止型パワー素子、１０１　樹脂パッケージ、１０２　パワー半導体チップ、１０３　半導体チップ、１０４　ボンディングワイヤ、１０６　導電性接着剤、１１０　第１のリード端子、１１１　端子台リード挿通孔、１２０　第２のリード端子、１３０　ダイパッド、１３１　サイドバー、１３２　サポートバー、１３３　タイバー、１３４　送り穴、１４０　フィンベース、１４１　溝部、１４２　フィン、２００　配線基板、２０１　切り欠き、３００，３００Ｓ　端子台、３０１　端子台本体、３０２，３０２Ｓ　端子板、３０３　端子ネジ、３０４　ワッシャ、３０５　圧着端子、３０６　はんだ、３０７，３０７Ｓ　端子台リード。 1,1P, 1Q, 1R, 1S Power module with terminal block, 2 power supply, 3 motor, 100, 100S resin-encapsulated power element, 101 resin package, 102 power semiconductor chip, 103 semiconductor chip, 104 bonding wire, 106 conductive Adhesive, 110 first lead terminal, 111 terminal block lead insertion hole, 120 second lead terminal, 130 die pad, 131 side bar, 132 support bar, 133 tie bar, 134 feed hole, 140 fin base, 141 groove, 142 fin, 200 wiring board, 201 notch, 300, 300S terminal block, 301 terminal block body, 302, 302S terminal plate, 303 terminal screw, 304 washer, 305 crimp terminal, 306 solder, 307, 307S Terminal block lead.

Claims (11)

  1. 　樹脂パッケージと前記樹脂パッケージから導出されたリード端子とを備えた樹脂封止型パワー素子と、
    　前記樹脂封止型パワー素子が搭載される配線基板と、
    　端子台とを備え、
    　前記樹脂封止型パワー素子の前記リード端子が、
    　前記端子台に直接接続される第１のリード端子と、
    　前記配線基板に接続される第２のリード端子と
    　を備えたことを特徴とする端子台付きパワーモジュール。     A resin-encapsulated power element comprising a resin package and lead terminals derived from the resin package;
    A wiring board on which the resin-encapsulated power element is mounted;
    A terminal block,
    The lead terminal of the resin-encapsulated power element is
    A first lead terminal directly connected to the terminal block;
    A power module with a terminal block, comprising: a second lead terminal connected to the wiring board.
  2. 　前記第１のリード端子は、前記樹脂パッケージからの導出位置と、前記端子台との接続位置とが同一面上にあり、曲げ部を持たないことを特徴とする請求項１に記載の端子台付きパワーモジュール。 2. The terminal block according to claim 1, wherein the first lead terminal has a lead-out position from the resin package and a connection position with the terminal block on the same plane, and has no bent portion. With power module.
  3. 　前記第１および第２のリード端子は前記樹脂パッケージの同一辺上に搭載されたことを特徴とする請求項１または２に記載の端子台付きパワーモジュール。 The power module with a terminal block according to claim 1 or 2, wherein the first and second lead terminals are mounted on the same side of the resin package.
  4. 　前記第１のリード端子は、前記樹脂パッケージの相対向する２辺から導出されたことを特徴とする請求項１から３のいずれか１項に記載の端子台付きパワーモジュール。 The power module with a terminal block according to any one of claims 1 to 3, wherein the first lead terminal is led out from two opposite sides of the resin package.
  5. 　前記第２のリード端子は、前記樹脂パッケージの相対向する２辺から導出されたことを特徴とする請求項１から４のいずれか１項に記載の端子台付きパワーモジュール。 The power module with a terminal block according to any one of claims 1 to 4, wherein the second lead terminal is led out from two opposite sides of the resin package.
  6. 　前記端子台は、一列に配列された複数の端子部を備え、
    　前記端子部は、導電板を介して、前記パワーモジュールに接続されており、
    　前記第１のリード端子は、端部にリード挿通孔を有し、前記導電板の先端部が前記リード挿通孔に挿通されることを特徴とする請求項１から５のいずれか１項に記載の端子台付きパワーモジュール。     The terminal block includes a plurality of terminal portions arranged in a row,
    The terminal portion is connected to the power module via a conductive plate,
    The said 1st lead terminal has a lead insertion hole in an edge part, and the front-end | tip part of the said electrically conductive plate is penetrated by the said lead insertion hole, The any one of Claim 1 to 5 characterized by the above-mentioned. Power module with terminal block.
  7. 　前記端子台は、一列に配列された複数の端子部を備え、
    　前記端子部は、導電板を介して、前記パワーモジュールに接続されており、
    　前記導電板の先端は、前記パワーモジュール側に導出され、前記第１のリード端子の先端と重ね合わせて接続されたことを特徴とする請求項１から５のいずれか１項に記載の端子台付きパワーモジュール。     The terminal block includes a plurality of terminal portions arranged in a row,
    The terminal portion is connected to the power module via a conductive plate,
    6. The terminal block according to claim 1, wherein a leading end of the conductive plate is led out to the power module side and connected to be overlapped with a leading end of the first lead terminal. With power module.
  8. 　端子台に直接接続される複数本の第１のリード端子と、配線基板に接続される、複数本の第２のリード端子と、パワー半導体チップを搭載する素子搭載部とが、フレーム構造体で接続され、連続的に形成されたリードフレームを形成する工程と、
    　前記リードフレームの前記素子搭載部にパワー半導体チップを搭載し、前記半導体チップと前記第１のリード端子および第２のリード端子とを電気的に接続する工程と、
    　前記パワー半導体チップを前記第１のリード端子および前記第２のリード端子の先端を残して樹脂封止し、樹脂パッケージを形成する工程と、
    　前記第１のリード端子の先端に端子台を接続する工程と、
    　前記第２のリード端子を前記配線基板に接続する工程と、
    　前記リードフレームからフレーム構造体を切除し、前記端子台付きパワーモジュールを個片化する工程と
    　を含むことを特徴とする端子台付きパワーモジュールの製造方法。     The frame structure includes a plurality of first lead terminals directly connected to the terminal block, a plurality of second lead terminals connected to the wiring board, and an element mounting portion on which the power semiconductor chip is mounted. Forming a connected and continuously formed lead frame;
    Mounting a power semiconductor chip on the element mounting portion of the lead frame, and electrically connecting the semiconductor chip to the first lead terminal and the second lead terminal;
    Forming a resin package by sealing the power semiconductor chip with resin leaving the tips of the first lead terminal and the second lead terminal; and
    Connecting a terminal block to the tip of the first lead terminal;
    Connecting the second lead terminal to the wiring board;
    Cutting the frame structure from the lead frame and separating the power module with terminal block into individual pieces.
  9. 　前記第１のリード端子は先端にリード挿通孔を有し、
    　前記端子台を接続する工程は、
    　前記端子台から導出された導電板の先端部を前記リード挿通孔に挿通し、接合する工程を含むことを特徴とする請求項８に記載の端子台付きパワーモジュールの製造方法。     The first lead terminal has a lead insertion hole at the tip,
    The step of connecting the terminal block includes:
    The method for manufacturing a power module with a terminal block according to claim 8, further comprising a step of inserting and joining the leading end portion of the conductive plate led out from the terminal block through the lead insertion hole.
  10. 　前記端子台は、前記パワーモジュール側に導出された導電板を有し、
    　前記端子台から導出された導電板の先端部を前記第１のリード端子の先端に重ね、接合する工程を含むことを特徴とする請求項８に記載の端子台付きパワーモジュールの製造方法。     The terminal block has a conductive plate led out to the power module side,
    The method for manufacturing a power module with a terminal block according to claim 8, further comprising a step of overlapping and joining a leading end portion of the conductive plate led out from the terminal block on a leading end of the first lead terminal.
  11. 　前記個片化する工程は、前記端子台および前記配線基板の接続工程を経て実施されることを特徴とする請求項９または１０に記載の端子台付きパワーモジュールの製造方法。 The method for manufacturing a power module with a terminal block according to claim 9 or 10, wherein the step of dividing into pieces is performed through a step of connecting the terminal block and the wiring board.
PCT/JP2015/067086 2015-06-12 2015-06-12 Power module with terminal block and method for manufacturing power module with terminal block WO2016199306A1 (en)

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