AU1692088A - A resin sealed semiconductor device and a method for making the same - Google Patents
A resin sealed semiconductor device and a method for making the sameInfo
- Publication number
- AU1692088A AU1692088A AU16920/88A AU1692088A AU1692088A AU 1692088 A AU1692088 A AU 1692088A AU 16920/88 A AU16920/88 A AU 16920/88A AU 1692088 A AU1692088 A AU 1692088A AU 1692088 A AU1692088 A AU 1692088A
- Authority
- AU
- Australia
- Prior art keywords
- making
- semiconductor device
- same
- sealed semiconductor
- resin sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-142043 | 1987-06-05 | ||
| JP14204387 | 1987-06-05 | ||
| JP63-108520 | 1988-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU1692088A true AU1692088A (en) | 1989-02-09 |
| AU604904B2 AU604904B2 (en) | 1991-01-03 |
Family
ID=15306059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU16920/88A Ceased AU604904B2 (en) | 1987-06-05 | 1988-05-31 | A resin sealed semiconductor device and a method for making the same |
Country Status (1)
| Country | Link |
|---|---|
| AU (1) | AU604904B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4339768A (en) * | 1980-01-18 | 1982-07-13 | Amp Incorporated | Transistors and manufacture thereof |
-
1988
- 1988-05-31 AU AU16920/88A patent/AU604904B2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| AU604904B2 (en) | 1991-01-03 |
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