ES2524046T3 - Estructura de cierre hermético para dispositivos de visualización - Google Patents
Estructura de cierre hermético para dispositivos de visualización Download PDFInfo
- Publication number
- ES2524046T3 ES2524046T3 ES02785827.3T ES02785827T ES2524046T3 ES 2524046 T3 ES2524046 T3 ES 2524046T3 ES 02785827 T ES02785827 T ES 02785827T ES 2524046 T3 ES2524046 T3 ES 2524046T3
- Authority
- ES
- Spain
- Prior art keywords
- layer
- oxide
- dielectric material
- nitride
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/816—Multilayers, e.g. transparent multilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Abstract
Una estructura de cierre hermético (6) para un dispositivo de visualización (1), caracterizada por que la estructura de cierre hermético (6) comprende una primera capa (7) de un primer material dieléctrico formada sobre dicho dispositivo (1) y una segunda capa (8) de un segundo material dieléctrico formada sobre la primera capa (7), en la que al menos una tercera capa (9) de un tercer material dieléctrico se forma en la parte superior de la segunda capa (8), y que comprende opcionalmente una capa extractora formada entre la segunda capa y la tercera capa, en la que el primer y tercer materiales dieléctricos son nitruro de silicio, y en la que el segundo material dieléctrico se selecciona a partir de óxido de silicio, oxinitruro de silicio, oxifloruro de silicio, óxido de titanio, óxido de tántalo, óxido de zirconio, óxido de hafnio, óxido de aluminio, o cualquier mezcla de los mismos; proporcionando esto una estructura de cierre hermético que comprende una estructura de capa de nitruro - capa de óxido - capa de nitruro o una estructura de capa de nitruro - capa de óxido - capa extractora - capa de nitruro.
Description
Claims (1)
-
imagen1
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01204874 | 2001-12-13 | ||
EP01204874 | 2001-12-13 | ||
PCT/IB2002/005132 WO2003050894A2 (en) | 2001-12-13 | 2002-12-03 | Sealing structure for display devices |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2524046T3 true ES2524046T3 (es) | 2014-12-03 |
Family
ID=8181426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES02785827.3T Expired - Lifetime ES2524046T3 (es) | 2001-12-13 | 2002-12-03 | Estructura de cierre hermético para dispositivos de visualización |
Country Status (9)
Country | Link |
---|---|
US (1) | US7265807B2 (es) |
EP (1) | EP1459394B1 (es) |
JP (1) | JP4464682B2 (es) |
KR (1) | KR20040066898A (es) |
CN (1) | CN100483782C (es) |
AU (1) | AU2002351114A1 (es) |
ES (1) | ES2524046T3 (es) |
TW (1) | TWI265747B (es) |
WO (1) | WO2003050894A2 (es) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005006441A1 (en) * | 2003-07-11 | 2005-01-20 | Koninklijke Philips Electronics N.V. | Encapsulation structure for display devices |
EP1560004B1 (de) * | 2004-01-27 | 2009-12-09 | Mettler-Toledo AG | Spule mit Feuchtigkeitsschutzschichten |
JP2007526601A (ja) | 2004-02-20 | 2007-09-13 | オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト | 拡散バリア層および拡散バリア層の製造方法 |
TWI257269B (en) * | 2004-05-04 | 2006-06-21 | Byoung-Chul Lee | Film-type getter and producing method thereof |
JP5124083B2 (ja) | 2004-06-09 | 2013-01-23 | 三星ディスプレイ株式會社 | 有機電界発光表示装置及びその製造方法 |
JP2006309151A (ja) * | 2005-03-28 | 2006-11-09 | Seiko Epson Corp | 光学ローパスフィルタ |
US20070020451A1 (en) * | 2005-07-20 | 2007-01-25 | 3M Innovative Properties Company | Moisture barrier coatings |
DE102006027393A1 (de) | 2006-06-13 | 2007-12-20 | Applied Materials Gmbh & Co. Kg | Verkapselung für organisches Bauelement |
US20080006819A1 (en) * | 2006-06-19 | 2008-01-10 | 3M Innovative Properties Company | Moisture barrier coatings for organic light emitting diode devices |
WO2008017986A2 (en) * | 2006-08-08 | 2008-02-14 | Koninklijke Philips Electronics N.V. | Integrated device |
JP2008210665A (ja) * | 2007-02-27 | 2008-09-11 | Canon Inc | 有機発光素子及びそれを用いた表示装置 |
NL1033860C2 (nl) * | 2007-05-16 | 2008-11-18 | Otb Group Bv | Werkwijze voor het aanbrengen van een dunnefilm-encapsulatielaagsamenstel op een organisch device en een organisch device voorzien van een dunnefilm-encapsulatielaagsamenstel bij voorkeur aangebracht met een dergelijke werkwijze. |
TW200930135A (en) * | 2007-08-31 | 2009-07-01 | Tokyo Electron Ltd | Organic electronic device, organic electronic device manufacturing method, organic electronic device manufacturing apparatus, substrate processing system, protection film structure and storage medium with control program stored therein |
EP2242948A4 (en) * | 2008-01-16 | 2013-01-23 | Lights Camera Action Llc | UNDERWATER LED LIGHT SOURCE WITH HIGH LIGHTNING POWER |
TWI438953B (zh) | 2008-01-30 | 2014-05-21 | Osram Opto Semiconductors Gmbh | 電子組件之製造方法及電子組件 |
EP2178133B1 (en) | 2008-10-16 | 2019-09-18 | Semiconductor Energy Laboratory Co., Ltd. | Flexible Light-Emitting Device, Electronic Device, and Method for Manufacturing Flexible-Light Emitting Device |
JP4729759B2 (ja) * | 2009-06-29 | 2011-07-20 | 富士電機株式会社 | 有機el素子用封止膜、有機el素子および有機elディスプレイ |
US9862640B2 (en) | 2010-01-16 | 2018-01-09 | Cardinal Cg Company | Tin oxide overcoat indium tin oxide coatings, coated glazings, and production methods |
US10000965B2 (en) | 2010-01-16 | 2018-06-19 | Cardinal Cg Company | Insulating glass unit transparent conductive coating technology |
US10000411B2 (en) | 2010-01-16 | 2018-06-19 | Cardinal Cg Company | Insulating glass unit transparent conductivity and low emissivity coating technology |
US10060180B2 (en) | 2010-01-16 | 2018-08-28 | Cardinal Cg Company | Flash-treated indium tin oxide coatings, production methods, and insulating glass unit transparent conductive coating technology |
US11155493B2 (en) | 2010-01-16 | 2021-10-26 | Cardinal Cg Company | Alloy oxide overcoat indium tin oxide coatings, coated glazings, and production methods |
KR101108166B1 (ko) * | 2010-02-09 | 2012-01-31 | 삼성모바일디스플레이주식회사 | 실리콘 산화물막과 실리콘 리치 실리콘 질화물막을 포함하는 배리어층을 포함하는 유기 발광 장치 |
US9142804B2 (en) | 2010-02-09 | 2015-09-22 | Samsung Display Co., Ltd. | Organic light-emitting device including barrier layer and method of manufacturing the same |
US8304045B2 (en) | 2010-02-26 | 2012-11-06 | Guardian Industries Corp. | Articles including anticondensation coatings and/or methods of making the same |
US8815059B2 (en) * | 2010-08-31 | 2014-08-26 | Guardian Industries Corp. | System and/or method for heat treating conductive coatings using wavelength-tuned infrared radiation |
US8293344B2 (en) | 2010-02-26 | 2012-10-23 | Guardian Industries Corp. | Articles including anticondensation coatings and/or methods of making the same |
US8524337B2 (en) | 2010-02-26 | 2013-09-03 | Guardian Industries Corp. | Heat treated coated article having glass substrate(s) and indium-tin-oxide (ITO) inclusive coating |
JP5577124B2 (ja) * | 2010-03-18 | 2014-08-20 | 株式会社ジャパンディスプレイ | 有機半導体装置及びその製造方法 |
CN102610762A (zh) * | 2011-01-21 | 2012-07-25 | 彩虹显示器件股份有限公司 | 一种有机发光器件的薄膜封装方法 |
JP5781393B2 (ja) * | 2011-08-05 | 2015-09-24 | 株式会社アルバック | 成膜方法 |
CN103855320B (zh) * | 2012-11-30 | 2016-12-21 | 海洋王照明科技股份有限公司 | 一种有机电致发光器件及其制备方法 |
US9831468B2 (en) | 2013-02-14 | 2017-11-28 | Samsung Display Co., Ltd. | Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same |
KR101996436B1 (ko) * | 2013-02-14 | 2019-07-05 | 삼성디스플레이 주식회사 | 박막 봉지 구조를 갖는 유기 전계 발광 소자 및 그 제조 방법 |
US9831466B2 (en) | 2013-06-29 | 2017-11-28 | Aixtron Se | Method for depositing a multi-layer moisture barrier on electronic devices and electronic devices protected by a multi-layer moisture barrier |
FR3023654B1 (fr) * | 2014-07-09 | 2016-08-26 | Commissariat Energie Atomique | Encapsulation d'un composant optoelectronique organique |
TWM512870U (zh) | 2014-07-11 | 2015-11-21 | Ind Tech Res Inst | 基板結構及具有基板結構的電子裝置 |
JP6445358B2 (ja) * | 2015-03-17 | 2018-12-26 | 株式会社ジャパンディスプレイ | 表示装置の製造方法 |
CN104733504A (zh) * | 2015-03-18 | 2015-06-24 | 京东方科技集团股份有限公司 | Oled基板及制备方法、oled面板及显示装置 |
CN107658389B (zh) * | 2017-09-28 | 2019-07-12 | 武汉华星光电半导体显示技术有限公司 | 无机膜及封装薄膜 |
US11028012B2 (en) | 2018-10-31 | 2021-06-08 | Cardinal Cg Company | Low solar heat gain coatings, laminated glass assemblies, and methods of producing same |
JP6844628B2 (ja) * | 2019-01-09 | 2021-03-17 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置の製造方法、有機エレクトロルミネッセンス装置および電子機器 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2755844B2 (ja) * | 1991-09-30 | 1998-05-25 | シャープ株式会社 | プラスチック基板液晶表示素子 |
JPH07109573A (ja) * | 1993-10-12 | 1995-04-25 | Semiconductor Energy Lab Co Ltd | ガラス基板および加熱処理方法 |
US5771562A (en) * | 1995-05-02 | 1998-06-30 | Motorola, Inc. | Passivation of organic devices |
US5686360A (en) * | 1995-11-30 | 1997-11-11 | Motorola | Passivation of organic devices |
JP3290375B2 (ja) * | 1997-05-12 | 2002-06-10 | 松下電器産業株式会社 | 有機電界発光素子 |
US6198220B1 (en) * | 1997-07-11 | 2001-03-06 | Emagin Corporation | Sealing structure for organic light emitting devices |
JPH11109406A (ja) * | 1997-09-30 | 1999-04-23 | Sanyo Electric Co Ltd | 表示装置とその製造方法 |
JP3119228B2 (ja) * | 1998-01-20 | 2000-12-18 | 日本電気株式会社 | 液晶表示パネル及びその製造方法 |
US6146225A (en) | 1998-07-30 | 2000-11-14 | Agilent Technologies, Inc. | Transparent, flexible permeability barrier for organic electroluminescent devices |
AU5334999A (en) | 1998-08-03 | 2000-02-28 | Uniax Corporation | Encapsulation of polymer-based solid state devices with inorganic materials |
TW439308B (en) * | 1998-12-16 | 2001-06-07 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
EP2284605A3 (en) * | 1999-02-23 | 2017-10-18 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device and fabrication method thereof |
JP2000277253A (ja) * | 1999-03-26 | 2000-10-06 | Canon Inc | 発光素子、発光装置、表示装置、露光装置及び画像形成装置 |
US7226798B2 (en) * | 1999-07-19 | 2007-06-05 | United Microelectronics Corp. | Fabrication method for a multi-layered thin film protective layer |
JP2001194662A (ja) * | 2000-01-14 | 2001-07-19 | Nec Corp | 反射型液晶表示装置及びその製造方法 |
US6630980B2 (en) * | 2001-04-17 | 2003-10-07 | General Electric Company | Transparent flexible barrier for liquid crystal display devices and method of making the same |
GB2383178B (en) * | 2001-06-21 | 2005-07-27 | Esm Ltd | Opaque shielding element for liquid crystal display |
US7026758B2 (en) * | 2001-09-28 | 2006-04-11 | Osram Opto Semiconductors Gmbh | Reinforcement of glass substrates in flexible devices |
US6597111B2 (en) * | 2001-11-27 | 2003-07-22 | Universal Display Corporation | Protected organic optoelectronic devices |
-
2002
- 2002-12-03 WO PCT/IB2002/005132 patent/WO2003050894A2/en active Application Filing
- 2002-12-03 ES ES02785827.3T patent/ES2524046T3/es not_active Expired - Lifetime
- 2002-12-03 KR KR10-2004-7009087A patent/KR20040066898A/ko active Search and Examination
- 2002-12-03 JP JP2003551853A patent/JP4464682B2/ja not_active Expired - Lifetime
- 2002-12-03 AU AU2002351114A patent/AU2002351114A1/en not_active Abandoned
- 2002-12-03 EP EP02785827.3A patent/EP1459394B1/en not_active Expired - Lifetime
- 2002-12-03 CN CNB028249860A patent/CN100483782C/zh not_active Expired - Lifetime
- 2002-12-03 US US10/498,138 patent/US7265807B2/en not_active Expired - Lifetime
- 2002-12-12 TW TW091135969A patent/TWI265747B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1636282A (zh) | 2005-07-06 |
JP2005512299A (ja) | 2005-04-28 |
AU2002351114A1 (en) | 2003-06-23 |
EP1459394B1 (en) | 2014-10-29 |
EP1459394A2 (en) | 2004-09-22 |
JP4464682B2 (ja) | 2010-05-19 |
TWI265747B (en) | 2006-11-01 |
US7265807B2 (en) | 2007-09-04 |
KR20040066898A (ko) | 2004-07-27 |
CN100483782C (zh) | 2009-04-29 |
TW200410582A (en) | 2004-06-16 |
WO2003050894A2 (en) | 2003-06-19 |
US20050041193A1 (en) | 2005-02-24 |
WO2003050894A3 (en) | 2003-11-06 |
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