ES2182873T3 - Procedimiento de fabricacion de una tarjeta sin contacto. - Google Patents

Procedimiento de fabricacion de una tarjeta sin contacto.

Info

Publication number
ES2182873T3
ES2182873T3 ES95400365T ES95400365T ES2182873T3 ES 2182873 T3 ES2182873 T3 ES 2182873T3 ES 95400365 T ES95400365 T ES 95400365T ES 95400365 T ES95400365 T ES 95400365T ES 2182873 T3 ES2182873 T3 ES 2182873T3
Authority
ES
Spain
Prior art keywords
cavity
contact
card
applies
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95400365T
Other languages
English (en)
Inventor
Jean Christophe Fidalgo
Christiane Oi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Application granted granted Critical
Publication of ES2182873T3 publication Critical patent/ES2182873T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00—Printed matter
    • Y10S283/904—Credit card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina

Abstract

LA INVENCION SE REFIERE A UN PROCESO DE FABRICACION DE UNA TARJETA (12) SIN CONTACTO QUE COMPRENDE UN CUERPO DE TARJETA Y UN MODULO ELECTRONICO (4) QUE COMPRENDE UN MICROCHIP (6) DE CIRCUITO INTEGRADO CONECTADO A UNA ANTENA, Y QUE SE CARACTERIZA EN QUE: - SE DEPOSITA UN MARCO (1) SOBRE UNA HOJA TERMOPLASTICA INFERIOR (2) DELIMITANDO ENTONCES LOS BORDES DE UNA CAVIDAD (32), - SE POSICIONA EL MODULO ELECTRONICO (4) EN EL FONDO DE DICHA CAVIDAD; - SE RELLENA ESTA CAVIDAD (3) CON UNA RESINA (8) POLIMERIZABLE; Y - SE RECUBRE EL MARCO (19 Y LA CAVIDAD (39 LLENA DE RESINA (8) CON UNA HOJA TERMOPLASTICA SUPERIOR (109 SOBRE LA QUE SE APLICA UNA LIGERA PRESION (11). LA INVENCION SE APLICA A LA FABRICACION DE TARJETAS SIN CONTACTO DESTINADAS A LA REALIZACION DE DIVERSAS OPERACIONES BANCARIAS, COMUNICACIONES TELEFONICAS U OPERACIONES DE IDENTIFICACION.
ES95400365T 1994-02-24 1995-02-21 Procedimiento de fabricacion de una tarjeta sin contacto. Expired - Lifetime ES2182873T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9402130A FR2716555B1 (fr) 1994-02-24 1994-02-24 Procédé de fabrication d'une carte sans contact.

Publications (1)

Publication Number Publication Date
ES2182873T3 true ES2182873T3 (es) 2003-03-16

Family

ID=9460398

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95400365T Expired - Lifetime ES2182873T3 (es) 1994-02-24 1995-02-21 Procedimiento de fabricacion de una tarjeta sin contacto.

Country Status (6)

Country Link
US (1) US5690773A (es)
EP (1) EP0669597B1 (es)
JP (1) JPH0836629A (es)
DE (1) DE69527866T2 (es)
ES (1) ES2182873T3 (es)
FR (1) FR2716555B1 (es)

Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
US6266623B1 (en) 1994-11-21 2001-07-24 Phatrat Technology, Inc. Sport monitoring apparatus for determining loft time, speed, power absorbed and other factors such as height
US7386401B2 (en) 1994-11-21 2008-06-10 Phatrat Technology, Llc Helmet that reports impact information, and associated methods
US8280682B2 (en) 2000-12-15 2012-10-02 Tvipr, Llc Device for monitoring movement of shipped goods
US6465743B1 (en) * 1994-12-05 2002-10-15 Motorola, Inc. Multi-strand substrate for ball-grid array assemblies and method
US5894167A (en) * 1996-05-08 1999-04-13 Micron Technology, Inc. Encapsulant dam standoff for shell-enclosed die assemblies
DE19632117C1 (de) * 1996-08-08 1997-12-18 Siemens Ag Datenträger zur kontaktlosen Übertragung von elektrischen Signalen
US5776798A (en) 1996-09-04 1998-07-07 Motorola, Inc. Semiconductor package and method thereof
JPH10193849A (ja) * 1996-12-27 1998-07-28 Rohm Co Ltd 回路チップ搭載カードおよび回路チップモジュール
EP0973420B1 (fr) * 1997-03-10 2003-04-02 Etablissements Bourgogne Et Grasset Jeton a puce electronique
FR2760331B1 (fr) * 1997-03-10 1999-04-30 Bourgogne Grasset Jeton a puce electronique
FR2761497B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Procede de fabrication d'une carte a puce ou analogue
US6355881B1 (en) * 1997-05-05 2002-03-12 Brant P. Braeges Means for sealing an electronic or optical component within an enclosure housing
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
US6024285A (en) 1997-08-19 2000-02-15 Micron Technology, Inc. Wireless communication devices and methods of forming wireless communication devices
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
JP2001511265A (ja) * 1997-11-29 2001-08-07 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 光ガイドを具えた表示装置
US6256873B1 (en) 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials
US6404643B1 (en) 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
JP2000148959A (ja) * 1998-11-13 2000-05-30 Henkel Japan Ltd Ｉｃカードの製造法
US6239976B1 (en) 1998-11-24 2001-05-29 Comsense Technologies, Ltd. Reinforced micromodule
FR2786902B1 (fr) * 1998-12-04 2001-01-26 Gemplus Card Int Module electronique sans contact, carte a puce comportant un tel module, et leurs procedes de fabrication
FR2791035B1 (fr) * 1999-03-19 2001-07-27 Allibert Equipement Procede de conditionnement d'une etiquette electronique, etiquette et piece plastique correspondantes
EP1052594A1 (de) * 1999-05-14 2000-11-15 Sokymat S.A. Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung
EP1052595B1 (de) 1999-05-14 2001-09-19 Sokymat Sa Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung
US6421013B1 (en) 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
DE60009022T2 (de) * 1999-12-31 2005-03-10 Allibert Equipement Verfahren zum herstellen eines elektronischen etiketts sowie die korrespondierende chipkarte
FI112288B (fi) * 2000-01-17 2003-11-14 Rafsec Oy Menetelmä älytarrasyöttörainan valmistamiseksi
FR2805067B1 (fr) * 2000-02-15 2003-09-12 Bourgogne Grasset Jeton a puce electronique et procedes de fabrication d'un tel jeton
FI112287B (fi) * 2000-03-31 2003-11-14 Rafsec Oy Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi
FI111881B (fi) * 2000-06-06 2003-09-30 Rafsec Oy Älykorttiraina ja menetelmä sen valmistamiseksi
GB0024070D0 (en) * 2000-10-02 2000-11-15 Innavisions Ltd Mpulding apparatus and method
US7501954B1 (en) 2000-10-11 2009-03-10 Avante International Technology, Inc. Dual circuit RF identification tags
FI112121B (fi) 2000-12-11 2003-10-31 Rafsec Oy Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa
US7171331B2 (en) 2001-12-17 2007-01-30 Phatrat Technology, Llc Shoes employing monitoring devices, and associated methods
FI112550B (fi) * 2001-05-31 2003-12-15 Rafsec Oy Älytarra ja älytarraraina
FI117331B (fi) * 2001-07-04 2006-09-15 Rafsec Oy Menetelmä ruiskuvaletun tuotteen valmistamiseksi
US6586078B2 (en) * 2001-07-05 2003-07-01 Soundcraft, Inc. High pressure lamination of electronic cards
US6863219B1 (en) * 2001-08-17 2005-03-08 Alien Technology Corporation Apparatuses and methods for forming electronic assemblies
JP2005533268A (ja) * 2001-12-10 2005-11-04 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 光ガイドを有するディスプレイパネル
FI119401B (fi) * 2001-12-21 2008-10-31 Upm Raflatac Oy Älytarraraina ja menetelmä sen valmistamiseksi
FR2843067B1 (fr) * 2002-08-02 2004-10-15 Technopuce Procede de fabrication d'un moyen d'information, moule pour en mise en oeuvre du procede, et moyen d'information obtenu par ce procede
JP3739752B2 (ja) * 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
NL1022766C2 (nl) * 2003-02-24 2004-09-21 Enschede Sdu Bv Identiteitskaart alsmede reisdocument.
US20030177051A1 (en) * 2003-03-13 2003-09-18 Robin Driscoll Method and system for managing worker resources
US7573048B2 (en) * 2004-10-08 2009-08-11 Patel Gordhanbhai N Tamper resistant self indicating instant alert radiation dosimeter
US7578053B2 (en) * 2004-12-03 2009-08-25 Hallys Corporation Interposer bonding device
US20090217515A1 (en) * 2004-12-03 2009-09-03 Hallys Corporation Electronic component production method and electronic component production equipment
US7237724B2 (en) 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
WO2006109678A1 (ja) 2005-04-06 2006-10-19 Hallys Corporation 電子部品の製造装置
JP5036541B2 (ja) * 2005-04-18 2012-09-26 株式会社 ハリーズ 電子部品及び、この電子部品の製造方法
US7607249B2 (en) 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
FR2890590B1 (fr) * 2005-09-13 2010-01-22 Central Labo Europ Dispositif d'encapsulement d'une pluralite d'etiquette d'identification electronique
WO2007047889A2 (en) 2005-10-18 2007-04-26 Phatrat Technology, Llc Shoe wear-out sensor, body-bar sensing system, unitless activity assessment and associated methods
US7913915B2 (en) * 2005-11-09 2011-03-29 Gaming Partners International Usa, Inc. Token with structure to prevent damage during molding
ATE528975T1 (de) 2006-04-10 2011-10-15 Innovatier Inc Elektronisches einlagemodul für elektronikkarten und etiketten, elektronikkarte und verfahren zur herstellung derartiger elektronischer einlagemodule und karten
US9137309B2 (en) 2006-05-22 2015-09-15 Apple Inc. Calibration techniques for activity sensing devices
US20070271116A1 (en) 2006-05-22 2007-11-22 Apple Computer, Inc. Integrated media jukebox and physiologic data handling application
US8073984B2 (en) 2006-05-22 2011-12-06 Apple Inc. Communication protocol for use with portable electronic devices
US7643895B2 (en) 2006-05-22 2010-01-05 Apple Inc. Portable media device with workout support
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US20080160397A1 (en) * 2006-08-25 2008-07-03 Innovatier, Inc Battery powered device having a protective frame
US20080055824A1 (en) * 2006-08-25 2008-03-06 Innovatier, Inc. Battery powered device having a protective frame
US7813715B2 (en) 2006-08-30 2010-10-12 Apple Inc. Automated pairing of wireless accessories with host devices
US7913297B2 (en) 2006-08-30 2011-03-22 Apple Inc. Pairing of wireless devices using a wired medium
DE102007008487A1 (de) 2007-02-19 2008-08-21 Smartrac Ip B.V. Verfahren und Halbzeug zur Herstellung eines Inlays
US7698101B2 (en) 2007-03-07 2010-04-13 Apple Inc. Smart garment
CA2681665A1 (en) * 2007-03-23 2008-10-02 Innovatier, Inc. A step card and method for making a step card
US20080282540A1 (en) * 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
US20090096614A1 (en) * 2007-10-15 2009-04-16 Innovatier, Inc. Rfid power bracelet and method for manufacturing a rfid power bracelet
US20090181215A1 (en) * 2008-01-15 2009-07-16 Innovatier, Inc. Plastic card and method for making a plastic card
US8090359B2 (en) 2008-09-08 2012-01-03 Proctor Jr James Arthur Exchanging identifiers between wireless communication to determine further information to be exchanged or further services to be provided
PL2556732T3 (pl) 2010-04-05 2019-10-31 Innovatier Inc Rdzeń dla wstępnego laminowania oraz sposób wytwarzania rdzenia dla wstępnego laminowania dla elektronicznych kart oraz etykiet
US9122968B2 (en) * 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
US9439334B2 (en) 2012-04-03 2016-09-06 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
US10032099B2 (en) 2012-07-20 2018-07-24 CPI Card Group—Colorado, Inc. Weighted transaction card
US8857722B2 (en) 2012-07-20 2014-10-14 CPI Card Group—Colorado, Inc. Weighted transaction card
WO2014039183A1 (en) * 2012-09-04 2014-03-13 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making, the same
US10906287B2 (en) * 2013-03-15 2021-02-02 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
EP3036113B1 (en) * 2013-08-21 2022-09-14 X-Card Holdings, LLC Apparatus and method for making information carrying cards through radiation curing, and resulting products
CA2928554C (en) 2013-10-25 2018-04-10 Cpi Card Group-Colorado, Inc. Multi-metal layered card
US10089568B2 (en) 2016-06-01 2018-10-02 CPI Card Group—Colorado, Inc. IC chip card with integrated biometric sensor pads
US11048991B2 (en) 2017-02-14 2021-06-29 CPI Card Group—Colorado, Inc. Edge-to-edge metal card and production method
WO2019173455A1 (en) 2018-03-07 2019-09-12 X-Card Holdings, Llc Metal card
WO2021074658A1 (en) * 2019-10-18 2021-04-22 Linxens Holding Card-type information substrate including a frame

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825349B2 (ja) * 1987-10-22 1996-03-13 日本ユーロテック株式会社 カードの製造法
JPH0230597A (ja) * 1988-07-20 1990-01-31 Mitsubishi Electric Corp 半導体カード用モジュール
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
NL9200618A (nl) * 1992-04-02 1993-11-01 Nedap Nv Hergebruikbaar identificatiekaartje met uitgiftesysteem.
FR2691563B1 (fr) * 1992-05-19 1996-05-31 Francois Droz Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
CH688696A5 (fr) * 1993-03-17 1998-01-15 François Droz Procédé de fabrication d'une carte comprenant au moins un élément électronique.
EP0650620B2 (fr) * 1993-03-18 2001-08-29 NagraID S.A. Procede de fabrication d'une carte comprenant au moins un element electronique et carte obtenue par un tel procede
DE4311493C2 (de) * 1993-04-07 2000-04-06 Amatech Advanced Micromechanic IC-Kartenmodul zur Herstellung einer IC-Karte
NL9301457A (nl) * 1993-08-23 1995-03-16 Nedap Nv Contactloze identificatiekaart of smart card.

Also Published As

Publication number Publication date
EP0669597B1 (fr) 2002-08-28
US5690773A (en) 1997-11-25
EP0669597A1 (fr) 1995-08-30
JPH0836629A (ja) 1996-02-06
DE69527866T2 (de) 2003-04-10
FR2716555A1 (fr) 1995-08-25
DE69527866D1 (de) 2002-10-02
FR2716555B1 (fr) 1996-05-15

Similar Documents

Publication Publication Date Title
ES2182873T3 (es) Procedimiento de fabricacion de una tarjeta sin contacto.
EP1243442A4 (en) INTEGRATED CIRCUIT BOARD WITHOUT CONTACT
US6239976B1 (en) Reinforced micromodule
CN101248446B (zh) 存储器的胶合尺寸规格适配器及其制造方法
RU98116793A (ru) Карточка данных и способ изготовления этой карточки данных, а также устройство для изготовления карточки данных
ES2175353T3 (es) Tarjeta de datos y procedimiento para la fabricacion de una tarje de datos, asi como dispositivo para la fabricacion de una tarjeta de datos.
ES2377339T3 (es) Procedimiento para inicializar y/o personalizar un soporte portátil de datos
DE69521173T2 (de) Verbesserte Spielmarke
TWI582703B (zh) 用於安裝先進智慧卡的輔助安裝結構
PL1761883T3 (pl) Element zabezpieczający do identyfikacji za pomocą częstotliwości radiowych
CA2289728A1 (en) Method for making smart cards
DE3752101D1 (de) Baustein mit integrierten Schaltkreisen
FR2769389B1 (fr) Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
IL154106A0 (en) Contactless smartcard with an antenna support and chip support made from a fibrous material
EP0919950A4 (en) MODULE FOR INTEGRATED CIRCUIT CARD, INTEGRATED CIRCUIT CARD, AND METHOD FOR MANUFACTURING SUCH MODULE
DE69808112D1 (de) Herstellungsverfahren einer karte mit gewickelter antenne
JP2013058252A (ja) 表面が拡張したモジュールを有するスマートカード
CA2227340A1 (en) Radio mobile terminal provided with an additional reader of chip cards
AU3845495A (en) Board with at least one built-in electronic element
MX2011012991A (es) Un metodo para fabricar un dispositivo de microcircuito.
US6009315A (en) Card reader for a portable telephone and a portable telephone incorporating the card reader
AU1909601A (en) Esd protecting device for a memory card device
ATE453170T1 (de) Display zur integration in kartenförmige trägermedien
FI105630B (fi) SIM-korttiadapteri
TW201638829A (zh) 用於安裝先進智慧卡的輔助安裝結構