ES2119854T3 - Partes ceramicas de multicapas. - Google Patents

Partes ceramicas de multicapas.

Info

Publication number
ES2119854T3
ES2119854T3 ES93120964T ES93120964T ES2119854T3 ES 2119854 T3 ES2119854 T3 ES 2119854T3 ES 93120964 T ES93120964 T ES 93120964T ES 93120964 T ES93120964 T ES 93120964T ES 2119854 T3 ES2119854 T3 ES 2119854T3
Authority
ES
Spain
Prior art keywords
internal
dielectric ceramic
perfected
dielectric
ceramic layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93120964T
Other languages
English (en)
Inventor
Kazuaki Suzuki
Makoto Kobayashi
Taro Miura
Keizou Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26548110&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2119854(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by TDK Corp filed Critical TDK Corp
Application granted granted Critical
Publication of ES2119854T3 publication Critical patent/ES2119854T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/008—Manufacturing resonators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Products (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Inorganic Insulating Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

SE PREPARA UNA PIEZA DE CERAMICA DE CAPAS MULTIPLES, INCLUYENDO CAPAS DE CERAMICA DIELECTRICAS Y CAPAS CONDUCTORAS INTERNAS, FORMANDO CAPAS DE CERAMICA DIELECTRICAS DE UN MATERIAL DE CERAMICA DIELECTRICA DE SISTEMA OXIDO, QUE TIENE UNA TEMPERATURA DE TERMINO DE LA SINTERIZACION ENTRE EL PUNTO DE FUSION Y EL PUNTO DE EBULLICION DEL CONDUCTOR INTERNO. SE FORMA UN PATRON DEL CONDUCTOR INTERNO SOBRE CAPAS DE CERAMICA DIELECTRICA. LAS CAPAS DE CERAMICA DIELECTRICA SE COLOCAN UNA SOBRE OTRA, DE FORMA QUE INTERCALEN ENTRE ELLAS EL PATRON DEL CONDUCTOR INTERNO. EL LAMINADO SE CALDEA A, O POR ENCIMA DE, EL PUNTO DE FUSION DEL CONDUCTOR INTERNO, OPCIONALMENTE EN UNA ATMOSFERA QUE TIENE UNA PRESION PARCIAL DE OXIGENO CONTROLADA. DEBIDO A QUE EL MATERIAL DE CERAMICA DIELECTRICA TIENE PERDIDA DIELECTRICA Y UNA CONSTANTE DIELECTRICA PERFECCIONADA, Y A QUE EL CONDUCTOR INTERNO ESTA DENSIFICADO Y PERFECCIONADO EN SU PROPIEDAD SUPERFICIAL, LA PIEZA SE PERFECCIONA EN VALOR Q RESONADOR Y EN OTRAS PROPIEDADES.ESTO REDUCE AL MINIMO EL HECHO DE QUE SE PRODUZCAN PIEZAS DEFECTUOSAS, EN LAS QUE EL CONDUCTOR INTERNO SE SEPARA DE LA CAPA DE CERAMICA DIELECTRICA, Y TAMBIEN REDUCE AL MINIMO UN FALLO EN LA CAPA CONDUCTORA INTERNA.
ES93120964T 1992-12-28 1993-12-27 Partes ceramicas de multicapas. Expired - Lifetime ES2119854T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36137792 1992-12-28
JP5267971A JP2858073B2 (ja) 1992-12-28 1993-09-30 多層セラミック部品

Publications (1)

Publication Number Publication Date
ES2119854T3 true ES2119854T3 (es) 1998-10-16

Family

ID=26548110

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93120964T Expired - Lifetime ES2119854T3 (es) 1992-12-28 1993-12-27 Partes ceramicas de multicapas.

Country Status (6)

Country Link
US (1) US5683790A (es)
EP (1) EP0604952B1 (es)
JP (1) JP2858073B2 (es)
KR (1) KR100288831B1 (es)
DE (1) DE69318954T2 (es)
ES (1) ES2119854T3 (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998005045A1 (en) * 1996-07-26 1998-02-05 Tdk Corporation Conductor paste and multilayer ceramic part using the same
JP3302594B2 (ja) * 1997-02-10 2002-07-15 太陽誘電株式会社 積層電子部品及びその製造方法
JPH11154805A (ja) 1997-09-22 1999-06-08 Tdk Corp 積層セラミック部品
FI106585B (fi) 1997-10-22 2001-02-28 Nokia Mobile Phones Ltd Koaksiaalijohto, menetelmä koaksiaalijohdon valmistamiseksi ja langaton viestin
JP2001130957A (ja) * 1999-11-02 2001-05-15 Murata Mfg Co Ltd 半導体磁器、半導体磁器の製造方法およびサーミスタ
JP2002326866A (ja) * 2001-05-01 2002-11-12 Samsung Electro Mech Co Ltd 誘電体磁器組成物及びそれを用いた磁器コンデンサ並びにそれらの製造方法
JP2002326868A (ja) * 2001-05-01 2002-11-12 Samsung Electro Mech Co Ltd 誘電体磁器組成物及びそれを用いた磁器コンデンサ並びにそれらの製造方法
JP2002326867A (ja) * 2001-05-01 2002-11-12 Samsung Electro Mech Co Ltd 誘電体磁器組成物及びそれを用いた磁器コンデンサ並びにそれらの製造方法
US20030034124A1 (en) * 2001-06-19 2003-02-20 Yasuhiro Sugaya Dielectric resonator, dielectric filter and method of producing the same, filter device combined to a transmit-receive antenna and communication apparatus using the same
DE60220687T2 (de) 2001-10-01 2007-12-27 Heraeus, Inc. Ungesintertes niedertemperaturglaskeramikband für elektronische mikrobauteile, verfahren zur herstellung und verwendung
JP4004046B2 (ja) * 2003-03-17 2007-11-07 Ｔｄｋ株式会社 誘電体磁器組成物及びそれを用いた誘電体共振器
WO2004087614A1 (ja) * 2003-03-31 2004-10-14 Tdk Corporation グリーンシート用塗料、グリーンシート、グリーンシートの製造方法および電子部品の製造方法
JP4182016B2 (ja) 2004-03-11 2008-11-19 日本電気株式会社 伝送線路型素子及びその作製方法
US20080131673A1 (en) * 2005-12-13 2008-06-05 Yasuyuki Yamamoto Method for Producing Metallized Ceramic Substrate
CN103508731B (zh) * 2012-06-14 2015-08-26 Tdk株式会社 电介质陶瓷组合物以及电子部件

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4109377A (en) * 1976-02-03 1978-08-29 International Business Machines Corporation Method for preparing a multilayer ceramic
JPS5353774A (en) * 1976-10-26 1978-05-16 Fujitsu Ltd Method of producing printed board
JPH0785495B2 (ja) * 1985-03-18 1995-09-13 ティーディーケイ株式会社 酸化物セラミツク上の銅電極形成法
US5223462A (en) * 1985-03-18 1993-06-29 Kyocera Corporation Dielectric ceramic composition
US4627160A (en) * 1985-08-02 1986-12-09 International Business Machines Corporation Method for removal of carbonaceous residues from ceramic structures having internal metallurgy
DE3725455A1 (de) * 1987-07-31 1989-02-09 Siemens Ag Elektrisches vielschichtbauelement mit einem gesinterten, monolithischen keramikkoerper und verfahren zur herstellung des elektrischen vielschichtbauelementes
JPH02122598A (ja) * 1988-10-31 1990-05-10 Taiyo Yuden Co Ltd セラミック多層配線基板とその製造方法
JP2765885B2 (ja) * 1988-11-14 1998-06-18 新光電気工業株式会社 窒化アルミニウム回路基板及びその製造方法
EP0412440B1 (en) * 1989-08-09 1993-11-03 Oki Electric Industry Co., Ltd. Dielectric ceramic for microwave applications
US5138298A (en) * 1989-11-02 1992-08-11 Sanken Electric Co., Ltd. Metallic oxide resistive bodies having a nonlinear volt-ampere characteristic and method of fabrication
GB9005990D0 (en) * 1990-03-16 1990-05-09 Ecco Ltd Varistor powder compositions
JP2692332B2 (ja) * 1990-03-27 1997-12-17 富士通株式会社 窒化アルミニウム基板の製造方法
JPH0717444B2 (ja) * 1990-04-04 1995-03-01 住友金属工業株式会社 誘電体磁器組成物
JP2536225B2 (ja) * 1990-04-04 1996-09-18 住友金属工業株式会社 誘電体磁器組成物
JP2515611B2 (ja) * 1990-04-11 1996-07-10 住友金属工業株式会社 誘電体磁器組成物
JP2526702B2 (ja) * 1990-04-11 1996-08-21 住友金属工業株式会社 誘電体磁器組成物
JPH03295859A (ja) * 1990-04-11 1991-12-26 Ohara Inc Ｐｌｚｔセラミックスの製造方法
JP2526701B2 (ja) * 1990-04-11 1996-08-21 住友金属工業株式会社 誘電体磁器組成物
JPH064509B2 (ja) * 1990-04-16 1994-01-19 新日本製鐵株式会社 連続鋳造用耐火物
JPH04146478A (ja) * 1990-10-09 1992-05-20 Clarion Co Ltd 表示装置
JP3142010B2 (ja) * 1991-07-26 2001-03-07 日本電信電話株式会社 マイクロ波結合線路
US5350639A (en) * 1991-09-10 1994-09-27 Matsushita Electric Industrial Co., Ltd. Dielectric ceramic for use in microwave device, a microwave dielectric ceramic resonator dielectric ceramics
US5175518A (en) * 1991-10-15 1992-12-29 Watkins-Johnson Company Wide percentage bandwidth microwave filter network and method of manufacturing same
JP3223199B2 (ja) * 1991-10-25 2001-10-29 ティーディーケイ株式会社 多層セラミック部品の製造方法および多層セラミック部品
US5316985A (en) * 1991-12-09 1994-05-31 Aluminum Company Of America Suppression of crystal growth in low dielectric inorganic composition using ultrafine alumina
JP3523280B2 (ja) * 1991-12-28 2004-04-26 Ｔｄｋ株式会社 多層セラミック部品の製造方法

Also Published As

Publication number Publication date
US5683790A (en) 1997-11-04
KR940017122A (ko) 1994-07-25
KR100288831B1 (ko) 2001-05-02
EP0604952A1 (en) 1994-07-06
JP2858073B2 (ja) 1999-02-17
EP0604952B1 (en) 1998-06-03
DE69318954T2 (de) 1999-02-11
DE69318954D1 (de) 1998-07-09
JPH06252618A (ja) 1994-09-09

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