ES2108570T3 - Procedimiento de metalizacion de materias plasticas, y productos asi obtenidos. - Google Patents

Procedimiento de metalizacion de materias plasticas, y productos asi obtenidos.

Info

Publication number
ES2108570T3
ES2108570T3 ES95908237T ES95908237T ES2108570T3 ES 2108570 T3 ES2108570 T3 ES 2108570T3 ES 95908237 T ES95908237 T ES 95908237T ES 95908237 T ES95908237 T ES 95908237T ES 2108570 T3 ES2108570 T3 ES 2108570T3
Authority
ES
Spain
Prior art keywords
products
plastic materials
piece
plastic material
irradiated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95908237T
Other languages
English (en)
Inventor
Lucien Diego Laude
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of ES2108570T3 publication Critical patent/ES2108570T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)

Abstract

PROCESO DE METALIZACION DE TIPO POSITIVO DE UNA PIEZA DE MATERIAL PLASTICO COMPUESTO QUE CONTIENE UN POLIMERO Y GRANOS DE UNO O VARIOS OXIDOS QUE COMPRENDE TRES ETAPAS SUCESIVOS CUYA PRIMERA COSISTE EN LA IRRADIACION DE LA SUPERFICIE A METALIZAR DE LA PIEZA POR HAZ DE LUZ EMITIDO POR UN LASER EXCIMERO, LA SEGUNDA CONSISTE EN LA INMERSION DE LA PIEZA IRRADIADA EN AL MENOS UN BAÑO AUTOCATALITICO QUE CONTIENE IONES METALICOS Y SIN APORTE PREVIO DE PALADIO, CON DEPOSITO DE ESTOS EN UNA CAPA SOBRE LA SUPERFICIE IRRADIADA Y LA TERCERA CONSISTE EN UN TRATAMIENTO TERMICO DE LA PIEZA PLASTICA METALIZADA, DE MANERA A OBTENER UNA DIFUSION DEL METAL DEPOSITADO EN EL MATERIAL PLASTICO.
ES95908237T 1994-01-31 1995-01-31 Procedimiento de metalizacion de materias plasticas, y productos asi obtenidos. Expired - Lifetime ES2108570T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9400105A BE1008038A5 (fr) 1994-01-31 1994-01-31 Procede de metallisation de matieres plastiques, et produits ainsi obtenus.

Publications (1)

Publication Number Publication Date
ES2108570T3 true ES2108570T3 (es) 1997-12-16

Family

ID=3887928

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95908237T Expired - Lifetime ES2108570T3 (es) 1994-01-31 1995-01-31 Procedimiento de metalizacion de materias plasticas, y productos asi obtenidos.

Country Status (7)

Country Link
US (1) US5599592A (es)
EP (1) EP0693138B1 (es)
AT (1) ATE156868T1 (es)
BE (1) BE1008038A5 (es)
DE (1) DE69500550T2 (es)
ES (1) ES2108570T3 (es)
WO (1) WO1995020689A1 (es)

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BE1011624A4 (fr) * 1997-12-17 1999-11-09 Laude Lucien Diego Supports de circuit electrique.
DE19852776A1 (de) * 1998-11-16 2000-05-18 Fraunhofer Ges Forschung Verfahren zur Metallisierung von Kunststoffen
US6417486B1 (en) * 1999-04-12 2002-07-09 Ticona Gmbh Production of conductor tracks on plastics by means of laser energy
SG102588A1 (en) * 2000-08-03 2004-03-26 Inst Materials Research & Eng A process for modifying chip assembly substrates
US6569517B1 (en) 2000-11-17 2003-05-27 3M Innovative Properties Company Color tailorable pigmented optical bodies with surface metalization
FR2822167B1 (fr) 2001-03-15 2004-07-16 Nexans Procede de metallisation d'une piece substrat
DE10300476A1 (de) * 2003-01-09 2004-07-22 Braun Gmbh Verfahren zum Herstellen einer partiellen Beschichtung auf der Oberfläche eines Kunststoffteils
EP1616044A2 (de) * 2003-04-16 2006-01-18 AHC Oberflächentechnik GmbH & Co. OHG Verwendung eines gegenstands als elektronisches bauteil
US8771805B2 (en) * 2005-11-10 2014-07-08 Second Sight Medical Products, Inc. Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same
US7750076B2 (en) * 2006-06-07 2010-07-06 Second Sight Medical Products, Inc. Polymer comprising silicone and at least one metal trace
US7749608B2 (en) * 2006-06-06 2010-07-06 Second Sight Medical Products, Inc. Molded polymer comprising silicone and at least one metal trace
US9185810B2 (en) * 2006-06-06 2015-11-10 Second Sight Medical Products, Inc. Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same
CN102978593B (zh) * 2009-12-17 2015-07-22 比亚迪股份有限公司 塑料表面选择性金属化的方法
KR20130064822A (ko) * 2009-12-17 2013-06-18 비와이디 컴퍼니 리미티드 표면 금속화 방법, 플라스틱 제품 제조 방법 및 이로부터 제조된 플라스틱 제품
CN102409319B (zh) * 2009-12-30 2013-01-09 比亚迪股份有限公司 塑料制品的制备方法及塑料制品
US9435035B2 (en) 2010-01-15 2016-09-06 Byd Company Limited Metalized plastic articles and methods thereof
CN102071424B (zh) * 2010-02-26 2012-05-09 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
CN102071411B (zh) * 2010-08-19 2012-05-30 比亚迪股份有限公司 一种塑料制品的制备方法及一种塑料制品
WO2012126831A1 (en) † 2011-03-18 2012-09-27 Mitsubishi Chemical Europe Gmbh Process for producing a circuit carrier
CN102242354A (zh) * 2011-05-26 2011-11-16 深圳市泛友科技有限公司 选择性化学镀工艺和相应的激光涂料及其制备方法
CN102543855B (zh) * 2012-01-19 2014-07-09 讯创(天津)电子有限公司 三维集成电路结构及材料的制造方法
CN103773143B (zh) * 2012-10-26 2017-02-22 比亚迪股份有限公司 白色涂料组合物、绝缘基材表面选择性金属化的方法及复合制品
KR101574736B1 (ko) * 2013-04-26 2015-12-07 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
KR101610346B1 (ko) * 2013-04-26 2016-04-07 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
CN104178751A (zh) * 2013-05-23 2014-12-03 比亚迪股份有限公司 一种聚合物制品表面选择性金属化方法和一种聚合物制品
TW201445006A (zh) * 2013-05-23 2014-12-01 Byd Co Ltd 聚合物製品表面選擇性金屬化方法及其製備的聚合物製品
US9668342B2 (en) 2013-09-27 2017-05-30 Lg Chem, Ltd. Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
KR101631701B1 (ko) * 2013-12-30 2016-06-24 주식회사 엘지화학 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체
JP6397997B2 (ja) * 2014-09-04 2018-09-26 ビーワイディー カンパニー リミテッドＢｙｄ Ｃｏｍｐａｎｙ Ｌｉｍｉｔｅｄ ポリマー組成物、インク組成物、及び絶縁性基材の選択的金属化方法
CN104275886B (zh) * 2014-09-04 2015-09-02 比亚迪股份有限公司 一种聚合物制品以及一种聚合物基材表面选择性金属化方法
CN105568266B (zh) * 2014-10-10 2017-12-12 比亚迪股份有限公司 塑料制品和塑料基材表面选择性金属化方法
US10604649B2 (en) * 2015-09-03 2020-03-31 Mitsubishi Engineering-Plastics Corporation Polyester resin composition for laser direct structuring
US20170075473A1 (en) * 2015-09-15 2017-03-16 Hyundai Motor Company Touch input device and method for manufacturing the same
DE102021117567A1 (de) 2021-07-07 2023-01-12 Leibniz-Institut Für Polymerforschung Dresden E.V. Verfahren zur selektiven Beschichtung von Mehrkomponenten-Kunststoffverbunden und Bauteile aus selektiv beschichteten Mehrkomponenten-Kunststoffverbunden
CN115160623A (zh) * 2022-07-11 2022-10-11 深圳原驰三维技术有限公司 一种使聚碳酸酯表面区域选择性吸附金属离子的方法
PL442699A1 (pl) * 2022-10-31 2024-05-06 Uniwersytet Kazimierza Wielkiego Sposób wytwarzania i metalizowania kompozytu polimerowego
WO2024202254A1 (ja) * 2023-03-31 2024-10-03 株式会社村田製作所 積層構造体およびプリント基板

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Publication number Priority date Publication date Assignee Title
US4440801A (en) * 1982-07-09 1984-04-03 International Business Machines Corporation Method for depositing a metal layer on polyesters
US4639378A (en) * 1984-01-17 1987-01-27 Inoue Japax Research Incorporated Auto-selective metal deposition on dielectric surfaces
US4615907A (en) * 1984-11-23 1986-10-07 Phillips Petroleum Company Plating poly(arylene sulfide) surfaces
JPH0684543B2 (ja) * 1985-12-18 1994-10-26 呉羽化学工業株式会社 選択的化学メッキ法
EP0272420A3 (en) * 1986-12-22 1989-11-02 General Electric Company Photopatterned aromatic polymeric substrates, method for making same and use
JPS63186877A (ja) * 1987-01-28 1988-08-02 Nitto Electric Ind Co Ltd レ−ザ−メツキ法
EP0501095A1 (fr) * 1991-03-01 1992-09-02 Lucien Diégo Laude Procédé de métallisation de surfaces diélectriques contenant un métal
BE1004844A7 (fr) * 1991-04-12 1993-02-09 Laude Lucien Diego Methodes de metallisation de surfaces a l'aide de poudres metalliques.
BE1007242A3 (fr) * 1993-07-13 1995-05-02 Laude Lucien Diego Procede de production d'une couche metallique fortement adherente sur de l'alumine frittee et produit metallise ainsi obtenu.

Also Published As

Publication number Publication date
WO1995020689A1 (fr) 1995-08-03
DE69500550D1 (de) 1997-09-18
EP0693138B1 (fr) 1997-08-13
EP0693138A1 (fr) 1996-01-24
ATE156868T1 (de) 1997-08-15
BE1008038A5 (fr) 1996-01-03
DE69500550T2 (de) 1998-03-05
US5599592A (en) 1997-02-04

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