DE69500550D1 - Verfahren zur metallisierung von kunststoffen und auf diese weise hergestellte produkte - Google Patents
Verfahren zur metallisierung von kunststoffen und auf diese weise hergestellte produkteInfo
- Publication number
- DE69500550D1 DE69500550D1 DE69500550T DE69500550T DE69500550D1 DE 69500550 D1 DE69500550 D1 DE 69500550D1 DE 69500550 T DE69500550 T DE 69500550T DE 69500550 T DE69500550 T DE 69500550T DE 69500550 D1 DE69500550 D1 DE 69500550D1
- Authority
- DE
- Germany
- Prior art keywords
- pct
- piece
- step consists
- sec
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920003023 plastic Polymers 0.000 title abstract 5
- 239000004033 plastic Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910021645 metal ion Inorganic materials 0.000 abstract 2
- 239000002131 composite material Substances 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE9400105A BE1008038A5 (fr) | 1994-01-31 | 1994-01-31 | Procede de metallisation de matieres plastiques, et produits ainsi obtenus. |
PCT/EP1995/000346 WO1995020689A1 (fr) | 1994-01-31 | 1995-01-31 | Procede de metallisation de matieres plastiques, et produits ainsi obtenus |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69500550D1 true DE69500550D1 (de) | 1997-09-18 |
DE69500550T2 DE69500550T2 (de) | 1998-03-05 |
Family
ID=3887928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69500550T Expired - Lifetime DE69500550T2 (de) | 1994-01-31 | 1995-01-31 | Verfahren zur metallisierung von kunststoffen und auf diese weise hergestellte produkte |
Country Status (7)
Country | Link |
---|---|
US (1) | US5599592A (de) |
EP (1) | EP0693138B1 (de) |
AT (1) | ATE156868T1 (de) |
BE (1) | BE1008038A5 (de) |
DE (1) | DE69500550T2 (de) |
ES (1) | ES2108570T3 (de) |
WO (1) | WO1995020689A1 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE1011624A4 (fr) * | 1997-12-17 | 1999-11-09 | Laude Lucien Diego | Supports de circuit electrique. |
DE19852776A1 (de) * | 1998-11-16 | 2000-05-18 | Fraunhofer Ges Forschung | Verfahren zur Metallisierung von Kunststoffen |
US6417486B1 (en) * | 1999-04-12 | 2002-07-09 | Ticona Gmbh | Production of conductor tracks on plastics by means of laser energy |
SG102588A1 (en) * | 2000-08-03 | 2004-03-26 | Inst Materials Research & Eng | A process for modifying chip assembly substrates |
US6569517B1 (en) | 2000-11-17 | 2003-05-27 | 3M Innovative Properties Company | Color tailorable pigmented optical bodies with surface metalization |
FR2822167B1 (fr) * | 2001-03-15 | 2004-07-16 | Nexans | Procede de metallisation d'une piece substrat |
DE10300476A1 (de) * | 2003-01-09 | 2004-07-22 | Braun Gmbh | Verfahren zum Herstellen einer partiellen Beschichtung auf der Oberfläche eines Kunststoffteils |
CA2522647A1 (en) * | 2003-04-16 | 2004-10-28 | Hartmut Sauer | Use of an object as an electronic component |
US8771805B2 (en) | 2005-11-10 | 2014-07-08 | Second Sight Medical Products, Inc. | Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same |
US7750076B2 (en) | 2006-06-07 | 2010-07-06 | Second Sight Medical Products, Inc. | Polymer comprising silicone and at least one metal trace |
US7749608B2 (en) * | 2006-06-06 | 2010-07-06 | Second Sight Medical Products, Inc. | Molded polymer comprising silicone and at least one metal trace |
US9185810B2 (en) * | 2006-06-06 | 2015-11-10 | Second Sight Medical Products, Inc. | Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same |
CN102978593B (zh) * | 2009-12-17 | 2015-07-22 | 比亚迪股份有限公司 | 塑料表面选择性金属化的方法 |
DK2584065T3 (da) * | 2009-12-17 | 2014-07-14 | Byd Co Ltd | Overflademetalliseringsmetode, metode til fremstilling af plastgenstand og plastgenstand fremstillet derved |
CN102409319B (zh) * | 2009-12-30 | 2013-01-09 | 比亚迪股份有限公司 | 塑料制品的制备方法及塑料制品 |
US9435035B2 (en) * | 2010-01-15 | 2016-09-06 | Byd Company Limited | Metalized plastic articles and methods thereof |
CN102071424B (zh) * | 2010-02-26 | 2012-05-09 | 比亚迪股份有限公司 | 一种塑料制品的制备方法及一种塑料制品 |
CN102071411B (zh) * | 2010-08-19 | 2012-05-30 | 比亚迪股份有限公司 | 一种塑料制品的制备方法及一种塑料制品 |
US20130168133A1 (en) † | 2011-03-18 | 2013-07-04 | Mitsubishi Chemical Europe Gmbh | Process for producing a circuit carrier |
CN102242354A (zh) * | 2011-05-26 | 2011-11-16 | 深圳市泛友科技有限公司 | 选择性化学镀工艺和相应的激光涂料及其制备方法 |
CN102543855B (zh) * | 2012-01-19 | 2014-07-09 | 讯创(天津)电子有限公司 | 三维集成电路结构及材料的制造方法 |
CN106519740B (zh) * | 2012-10-26 | 2019-01-11 | 比亚迪股份有限公司 | 白色涂料组合物、绝缘基材表面选择性金属化的方法及复合制品 |
KR101574736B1 (ko) * | 2013-04-26 | 2015-12-07 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
KR101610346B1 (ko) * | 2013-04-26 | 2016-04-07 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
CN104178751A (zh) * | 2013-05-23 | 2014-12-03 | 比亚迪股份有限公司 | 一种聚合物制品表面选择性金属化方法和一种聚合物制品 |
TW201445006A (zh) * | 2013-05-23 | 2014-12-01 | Byd Co Ltd | 聚合物製品表面選擇性金屬化方法及其製備的聚合物製品 |
JP6254272B2 (ja) * | 2013-09-27 | 2017-12-27 | エルジー・ケム・リミテッド | 導電性パターン形成用組成物、これを用いた導電性パターン形成方法と、導電性パターンを有する樹脂構造体 |
KR101631701B1 (ko) * | 2013-12-30 | 2016-06-24 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물 및 도전성 패턴을 갖는 수지 구조체 |
EP3188908B1 (de) * | 2014-09-04 | 2019-12-04 | BYD Company Limited | Polymerprodukt, verfahren zur selektiven metallisierung eines polymersubstrats |
CN104275886B (zh) * | 2014-09-04 | 2015-09-02 | 比亚迪股份有限公司 | 一种聚合物制品以及一种聚合物基材表面选择性金属化方法 |
CN105568266B (zh) * | 2014-10-10 | 2017-12-12 | 比亚迪股份有限公司 | 塑料制品和塑料基材表面选择性金属化方法 |
WO2017038409A1 (ja) * | 2015-09-03 | 2017-03-09 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング用ポリエステル系樹脂組成物 |
US20170075473A1 (en) | 2015-09-15 | 2017-03-16 | Hyundai Motor Company | Touch input device and method for manufacturing the same |
DE102021117567A1 (de) | 2021-07-07 | 2023-01-12 | Leibniz-Institut Für Polymerforschung Dresden E.V. | Verfahren zur selektiven Beschichtung von Mehrkomponenten-Kunststoffverbunden und Bauteile aus selektiv beschichteten Mehrkomponenten-Kunststoffverbunden |
CN115160623A (zh) * | 2022-07-11 | 2022-10-11 | 深圳原驰三维技术有限公司 | 一种使聚碳酸酯表面区域选择性吸附金属离子的方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4440801A (en) * | 1982-07-09 | 1984-04-03 | International Business Machines Corporation | Method for depositing a metal layer on polyesters |
US4639378A (en) * | 1984-01-17 | 1987-01-27 | Inoue Japax Research Incorporated | Auto-selective metal deposition on dielectric surfaces |
US4615907A (en) * | 1984-11-23 | 1986-10-07 | Phillips Petroleum Company | Plating poly(arylene sulfide) surfaces |
JPH0684543B2 (ja) * | 1985-12-18 | 1994-10-26 | 呉羽化学工業株式会社 | 選択的化学メッキ法 |
EP0272420A3 (de) * | 1986-12-22 | 1989-11-02 | General Electric Company | Photographisch aufgebrachtes Muster auf aromatischen, polymeren Substraten sowie Herstellungsverfahren und Verwendung |
JPS63186877A (ja) * | 1987-01-28 | 1988-08-02 | Nitto Electric Ind Co Ltd | レ−ザ−メツキ法 |
EP0501095A1 (de) * | 1991-03-01 | 1992-09-02 | Lucien Diégo Laude | Verfahren zur Metallisierung metallhaltiger dielektrischer Oberflächen |
BE1004844A7 (fr) * | 1991-04-12 | 1993-02-09 | Laude Lucien Diego | Methodes de metallisation de surfaces a l'aide de poudres metalliques. |
BE1007242A3 (fr) * | 1993-07-13 | 1995-05-02 | Laude Lucien Diego | Procede de production d'une couche metallique fortement adherente sur de l'alumine frittee et produit metallise ainsi obtenu. |
-
1994
- 1994-01-31 BE BE9400105A patent/BE1008038A5/fr not_active IP Right Cessation
-
1995
- 1995-01-31 WO PCT/EP1995/000346 patent/WO1995020689A1/fr active IP Right Grant
- 1995-01-31 US US08/530,315 patent/US5599592A/en not_active Expired - Lifetime
- 1995-01-31 ES ES95908237T patent/ES2108570T3/es not_active Expired - Lifetime
- 1995-01-31 AT AT95908237T patent/ATE156868T1/de not_active IP Right Cessation
- 1995-01-31 DE DE69500550T patent/DE69500550T2/de not_active Expired - Lifetime
- 1995-01-31 EP EP95908237A patent/EP0693138B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ES2108570T3 (es) | 1997-12-16 |
BE1008038A5 (fr) | 1996-01-03 |
EP0693138B1 (de) | 1997-08-13 |
ATE156868T1 (de) | 1997-08-15 |
WO1995020689A1 (fr) | 1995-08-03 |
EP0693138A1 (de) | 1996-01-24 |
DE69500550T2 (de) | 1998-03-05 |
US5599592A (en) | 1997-02-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69500550T2 (de) | Verfahren zur metallisierung von kunststoffen und auf diese weise hergestellte produkte | |
DE59608706D1 (de) | Verfahren zur herstellung von metallisierten werkstoffen | |
ATE87752T1 (de) | Verfahren zur herstellung von reflexionshologrammen in photopolymerisierbaren schichten. | |
ATE155613T1 (de) | Verfahren zum herstellen von dünnschichten durch gepulste excimerlaser-verdampfung | |
SE9103197L (sv) | Reflekterande alster och foerfaranden foer framstaellning av desamma | |
MY126635A (en) | Pretreating solution for electroless plating, electroless plating bath and electroless plating process | |
ATE154648T1 (de) | Verfahren zur herstellung einer dünnepolymerbeschichtung mittels gepulsten laser verdampfens | |
DE59107376D1 (de) | Verfahren und Vorrichtung zur Herstellung von Mikrostrukturen auf einem lichtempfindlich beschichteten Substrat durch fokussierte Laserstrahlung | |
SE9500571D0 (sv) | Förfarande för katalytisk förbehandling av ett underlag vid strömfri plätering | |
ATE279552T1 (de) | Verfahren zur selektiven metallisierung dielektrischer materialien | |
ATE168327T1 (de) | Verfahren und vorrichtung zur herstellung metallischer flächenelemente auf substraten | |
ATE139581T1 (de) | Verfahren zur herstellung von strukturierten metallisierungen auf oberflächen | |
WO2002036852A3 (en) | Selective fiber metallization | |
AU2521295A (en) | Process and device for producing an upper or lower holding plate and holding plate thus produced | |
ES2141466T3 (es) | Tratamiento de superficie. | |
DE69402319T2 (de) | Verfahren zur metallisierung von nichtleitenden substraten | |
EP0272420A3 (de) | Photographisch aufgebrachtes Muster auf aromatischen, polymeren Substraten sowie Herstellungsverfahren und Verwendung | |
DE3670863D1 (de) | Verfahren zur metallisierung eines substrates. | |
SE8106694L (sv) | Elektropleteringsbad och forfarande for avsettning av vit palladiummetall | |
ATE269170T1 (de) | Verfahren und vorrichtung zur herstellung von dünnen filmen aus polymeren oder verbundmaterialien auf verschiedenen substraten | |
Laude | Process for production of a thick metallic layer and strongly adherent on a substrate of sintered aluminium nitride and metallised product thus obtained | |
DE4293695D2 (de) | Beschichtung für metallische oder nicht-metallische Substrate, Verfahren und Vorrichtung zur deren Herstellung | |
WO2007058975A3 (en) | Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same | |
DE3872505D1 (de) | Verfahren zur herstellung von partiell metallisierten gegossenen gegenstaenden. | |
ATE197746T1 (de) | Verfahren zur verdrahtung eines halbleiterbauelementes |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |