ES2046209T3 - Estructura de contacto a tope de area reducida. - Google Patents

Estructura de contacto a tope de area reducida.

Info

Publication number
ES2046209T3
ES2046209T3 ES87310857T ES87310857T ES2046209T3 ES 2046209 T3 ES2046209 T3 ES 2046209T3 ES 87310857 T ES87310857 T ES 87310857T ES 87310857 T ES87310857 T ES 87310857T ES 2046209 T3 ES2046209 T3 ES 2046209T3
Authority
ES
Spain
Prior art keywords
polysilicon
layers
doped silicon
silicon region
etch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES87310857T
Other languages
English (en)
Inventor
Craig S Sander
Richard K Klein
Tat C Choi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of ES2046209T3 publication Critical patent/ES2046209T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Air Bags (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Multi-Conductor Connections (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

ESTRUCTURA DE CONTACTO A TOPE DE AREA REDUCIDA (10'') QUE SE PROVEE, LA CUAL ES ESPECIALMENTE ADECUADA PARA CELULAS RAM ESTATICAS DE CUATRO TRANSISTORES. SE FORMA UNA ESTRUCTURA LA CUAL INCLUYE UNA REGION DOPADA DE SILICONA Y UNA O MAS CAPAS DE POLISILICONA Y OXIDO COLOCADAS ALLI ENCIMA, PUDIENDO SER UNA DE LAS CAPAS DE POLISILICONA UNA POLISILICONA DE PUERTA. ENTONCES SE REALIZA UN GRABADO POR ATAQUE QUIMICO ANISOTROPICO A TRAVES DE TODAS LAS CAPAS SUPERIORES INCLUYENDO ALGUNA CAPA SUPERIOR DE POLISILICONA LA CUAL PUEDE PRESENTARSE, PERO PARANDO EN LA REGION DOPADA DE SILICONA Y SE PRESENTA ALGUNA CAPA DE POLISILICONA DE LAS PUERTAS, PARA FORMAR UN ORIFICIO DE CONTACTO (26''). EL ORIFICIO DE CONTACTO SE LLENA CON UNA TOMA CONDUCTIVA (32) DE UN MATERIAL TAL COMO TUNGSTENO O POLISILICONA Y QUE ESTA ATACADO POR DETRAS. EN OTRO CASO, SE HACE EL CONTACTO CON TODAS LAS CAPAS DE POLISILICONA PRESENTES Y LA REGION DE SILICONA DOPADA. EN EL PROCESO DE ATAQUE ANISOTROPICO, SE EMPLEA UN ATAQUE EN DOS ETAPAS. EL PRIMER ATAQUE NO ES ESPECIFICO COMO DE UN MATERIAL, ATACANDO TODOS LOS MATERIALES (POLISILICONA Y OXIDO) EN LA MISMA TASA SUBSTANCIALMENTE Y ES CONTINUADO A TRAVES DE ALGUNA CAPA SUPERIOR DE POLISILICONA, PERO SE TERMINA ANTES DE ATACAR LA REGION DE SILICONA DOPADA O ALGUNA DE LAS CAPAS DE POLISILICONA DE LAS PUERTAS (22). EL SEGUNDO ATAQUE ES ESPECIFICO COMO DE UN MATERIAL, ATACANDO EL DIOXIDO DE SILICONA MAS RAPIDO QUE A LA POLISILICONA O A LA SILICONA, Y ASI PARA EN LA CAPA DE POLISILICONA DE LAS PUERTAS Y EN LA REGION DE SILICONA DOPADA.
ES87310857T 1986-12-17 1987-12-10 Estructura de contacto a tope de area reducida. Expired - Lifetime ES2046209T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94415086A 1986-12-17 1986-12-17

Publications (1)

Publication Number Publication Date
ES2046209T3 true ES2046209T3 (es) 1995-04-01

Family

ID=25480890

Family Applications (1)

Application Number Title Priority Date Filing Date
ES87310857T Expired - Lifetime ES2046209T3 (es) 1986-12-17 1987-12-10 Estructura de contacto a tope de area reducida.

Country Status (6)

Country Link
EP (1) EP0272051B1 (es)
JP (1) JPH0752751B2 (es)
AT (1) ATE80750T1 (es)
DE (1) DE3781778T2 (es)
ES (1) ES2046209T3 (es)
GR (1) GR3005727T3 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02202054A (ja) * 1989-01-31 1990-08-10 Texas Instr Japan Ltd 半導体装置及びその製造方法
NL9100094A (nl) * 1991-01-21 1992-08-17 Koninkl Philips Electronics Nv Halfgeleiderinrichting en werkwijze ter vervaardiging van een dergelijke halfgeleiderinrichting.
GB9219268D0 (en) * 1992-09-11 1992-10-28 Inmos Ltd Semiconductor device incorporating a contact and manufacture thereof
WO2003023847A2 (en) * 2001-09-13 2003-03-20 Koninklijke Philips Electronics N.V. Integrated circuit, portable device and method for manufacturing an integrated circuit
DE102008045037B4 (de) * 2008-08-29 2010-12-30 Advanced Micro Devices, Inc., Sunnyvale Statischer RAM-Zellenaufbau und Mehrfachkontaktschema zum Anschluss von Doppelkanaltransistoren

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842257A (ja) * 1981-09-07 1983-03-11 Toshiba Corp 半導体装置
JPS59171140A (ja) * 1983-03-17 1984-09-27 Nec Corp 半導体装置
US4663831A (en) * 1985-10-08 1987-05-12 Motorola, Inc. Method of forming transistors with poly-sidewall contacts utilizing deposition of polycrystalline and insulating layers combined with selective etching and oxidation of said layers

Also Published As

Publication number Publication date
EP0272051A3 (en) 1989-02-01
ATE80750T1 (de) 1992-10-15
EP0272051B1 (en) 1992-09-16
DE3781778D1 (de) 1992-10-22
JPH0752751B2 (ja) 1995-06-05
GR3005727T3 (es) 1993-06-07
EP0272051A2 (en) 1988-06-22
DE3781778T2 (de) 1993-01-28
JPS63164359A (ja) 1988-07-07

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