ES1051902U - Tarjeta de circuito impreso. - Google Patents

Tarjeta de circuito impreso.

Info

Publication number
ES1051902U
ES1051902U ES200201089U ES200201089U ES1051902U ES 1051902 U ES1051902 U ES 1051902U ES 200201089 U ES200201089 U ES 200201089U ES 200201089 U ES200201089 U ES 200201089U ES 1051902 U ES1051902 U ES 1051902U
Authority
ES
Spain
Prior art keywords
circuit board
printed circuit
board according
filling material
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
ES200201089U
Other languages
English (en)
Inventor
Hermann Hirt
Hubert Heini
Paul-Heinz Wagner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson Licensing SAS
Original Assignee
Thomson Licensing SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing SAS filed Critical Thomson Licensing SAS
Publication of ES1051902U publication Critical patent/ES1051902U/es
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1. Tarjeta de circuito impreso con una placa de base (1) de material aislante, pistas conductoras impresas (2) aplicadas sobre la misma y espacios intermedios entre pistas conductoras (2), caracterizada porque el espesor de las pistas conductoras (2) se hace apreciablemente mayor de 100 μm y los espacios intermedios entre pistas conductoras (2) se encuentran rellenos por un material de relleno (3) que tiene la mayor adhesión posible a las pistas conductoras (2), a la placa de base (1) y a la máscara resistente a soldadura (4) aplicada al dispositivo, rellenándola así completamente de manera que la tarjeta de circuito impreso tiene una superficie esencialmente plana sin interrupciones o depresiones.
ES200201089U 2001-05-04 2002-04-30 Tarjeta de circuito impreso. Ceased ES1051902U (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10121673A DE10121673A1 (de) 2001-05-04 2001-05-04 Gedruckte Leiterplatte

Publications (1)

Publication Number Publication Date
ES1051902U true ES1051902U (es) 2002-10-16

Family

ID=7683589

Family Applications (2)

Application Number Title Priority Date Filing Date
ES02732644T Expired - Lifetime ES2258629T3 (es) 2001-05-04 2002-04-22 Placa de circuito impreso.
ES200201089U Ceased ES1051902U (es) 2001-05-04 2002-04-30 Tarjeta de circuito impreso.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES02732644T Expired - Lifetime ES2258629T3 (es) 2001-05-04 2002-04-22 Placa de circuito impreso.

Country Status (5)

Country Link
EP (1) EP1425949B1 (es)
AT (1) ATE320168T1 (es)
DE (3) DE10121673A1 (es)
ES (2) ES2258629T3 (es)
WO (1) WO2002091810A2 (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2217952A1 (es) * 2002-12-30 2004-11-01 Lear Automotive (Eeds) Spain, S.L. Procedimiento para la fabricacion de placas de circuito impreso con espacios entre pistas protegidos.

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2858253A1 (fr) * 2003-07-30 2005-02-04 Novatec Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circut imprime
DE10354118A1 (de) * 2003-11-19 2005-06-02 Ruwel Ag Verfahren zur Herstellung von Leiterplatten und Leiterplatte
DE102004016205B4 (de) * 2004-03-30 2008-02-21 Sefar Ag Multilayer-Leiterplatte sowie Verfahren zum Herstellen einer solchen
DE102004021062A1 (de) * 2004-04-29 2005-11-24 Siemens Ag Verfahren zur Herstellung von Leiterplatten und/oder entsprechenden Konstrukten

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1301379B (de) * 1966-01-28 1969-08-21 Kupfer Asbest Co Verfahren zur Herstellung einer Schalterplatte nach Art der gedruckten Schaltungen
US3972755A (en) * 1972-12-14 1976-08-03 The United States Of America As Represented By The Secretary Of The Navy Dielectric circuit board bonding
DE2312482C3 (de) * 1973-03-13 1981-08-20 Rohde & Schwarz GmbH & Co KG, 8000 München Gedruckte Schaltungsplatte und Verfahren zu deren Herstellung
JPS53149673A (en) * 1977-06-01 1978-12-27 Matsushita Electric Ind Co Ltd Printed circuit board and method of producing same
JPH02230792A (ja) * 1989-03-03 1990-09-13 Cmk Corp プリント配線板の製造方法におけるソルダランドの形成方法
JPH0383398A (ja) * 1989-08-26 1991-04-09 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP2587548B2 (ja) * 1991-05-27 1997-03-05 富山日本電気株式会社 印刷配線板の製造方法
JPH0529752A (ja) * 1991-07-24 1993-02-05 Cmk Corp プリント配線板の製造方法
DE4417245A1 (de) * 1994-04-23 1995-10-26 Lpkf Cad Cam Systeme Gmbh Verfahren zur strukturierten Metallisierung der Oberfläche von Substraten
ES1033401Y (es) * 1996-03-07 1997-01-01 Eurocir S A Placa circuito impreso perfeccionada.
US6210746B1 (en) * 1999-05-28 2001-04-03 Unimicron Taiwan Corp. Method of fabricating a solder resist mask

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2217952A1 (es) * 2002-12-30 2004-11-01 Lear Automotive (Eeds) Spain, S.L. Procedimiento para la fabricacion de placas de circuito impreso con espacios entre pistas protegidos.

Also Published As

Publication number Publication date
DE60209712D1 (de) 2006-05-04
DE60209712T2 (de) 2006-11-02
EP1425949B1 (en) 2006-03-08
ATE320168T1 (de) 2006-03-15
ES2258629T3 (es) 2006-09-01
WO2002091810A3 (en) 2004-04-01
DE10121673A1 (de) 2002-11-07
EP1425949A2 (en) 2004-06-09
WO2002091810A2 (en) 2002-11-14
DE20206463U1 (de) 2002-08-22

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Legal Events

Date Code Title Description
FC1K Utility model refused

Effective date: 20030609