JPS53149673A - Printed circuit board and method of producing same - Google Patents

Printed circuit board and method of producing same

Info

Publication number
JPS53149673A
JPS53149673A JP6502277A JP6502277A JPS53149673A JP S53149673 A JPS53149673 A JP S53149673A JP 6502277 A JP6502277 A JP 6502277A JP 6502277 A JP6502277 A JP 6502277A JP S53149673 A JPS53149673 A JP S53149673A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
producing same
producing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6502277A
Other languages
Japanese (ja)
Inventor
Masaaki Morimitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6502277A priority Critical patent/JPS53149673A/en
Publication of JPS53149673A publication Critical patent/JPS53149673A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP6502277A 1977-06-01 1977-06-01 Printed circuit board and method of producing same Pending JPS53149673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6502277A JPS53149673A (en) 1977-06-01 1977-06-01 Printed circuit board and method of producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6502277A JPS53149673A (en) 1977-06-01 1977-06-01 Printed circuit board and method of producing same

Publications (1)

Publication Number Publication Date
JPS53149673A true JPS53149673A (en) 1978-12-27

Family

ID=13274924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6502277A Pending JPS53149673A (en) 1977-06-01 1977-06-01 Printed circuit board and method of producing same

Country Status (1)

Country Link
JP (1) JPS53149673A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128096A (en) * 1981-01-30 1982-08-09 Elna Co Ltd Method of producing printed circuit board
JPS5974694A (en) * 1982-10-21 1984-04-27 株式会社ケンウッド Flexible printed circuit board
JPS61242095A (en) * 1985-04-19 1986-10-28 ソニー株式会社 Manufacture of printed wiring circuit board
JPH0298993A (en) * 1988-10-06 1990-04-11 Ibiden Co Ltd Formation of solder layer on printed wiring board
JPH05191020A (en) * 1992-07-20 1993-07-30 Ibiden Co Ltd Printed wiring board with solder resist film
US5340639A (en) * 1990-09-26 1994-08-23 Nec Corporation Printed-wiring board
WO2002091810A3 (en) * 2001-05-04 2004-04-01 Thomson Licensing Sa Printed circuit board
JP2004103617A (en) * 2002-07-18 2004-04-02 Hitachi Chem Co Ltd Multilayer wiring board, its manufacturing method, semiconductor device, and radio electronic equipment
US7239013B2 (en) 2002-07-18 2007-07-03 Hitachi Chemical Co., Ltd. Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device
JP2016048786A (en) * 2010-09-28 2016-04-07 三菱製紙株式会社 Method for forming solder resist pattern

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840752B1 (en) * 1968-04-01 1973-12-03

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840752B1 (en) * 1968-04-01 1973-12-03

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128096A (en) * 1981-01-30 1982-08-09 Elna Co Ltd Method of producing printed circuit board
JPH022316B2 (en) * 1981-01-30 1990-01-17 Elna Kk
JPS5974694A (en) * 1982-10-21 1984-04-27 株式会社ケンウッド Flexible printed circuit board
JPS61242095A (en) * 1985-04-19 1986-10-28 ソニー株式会社 Manufacture of printed wiring circuit board
JPH0298993A (en) * 1988-10-06 1990-04-11 Ibiden Co Ltd Formation of solder layer on printed wiring board
US5340639A (en) * 1990-09-26 1994-08-23 Nec Corporation Printed-wiring board
JPH05191020A (en) * 1992-07-20 1993-07-30 Ibiden Co Ltd Printed wiring board with solder resist film
WO2002091810A3 (en) * 2001-05-04 2004-04-01 Thomson Licensing Sa Printed circuit board
JP2004103617A (en) * 2002-07-18 2004-04-02 Hitachi Chem Co Ltd Multilayer wiring board, its manufacturing method, semiconductor device, and radio electronic equipment
US7239013B2 (en) 2002-07-18 2007-07-03 Hitachi Chemical Co., Ltd. Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device
US7592250B2 (en) 2002-07-18 2009-09-22 Hitachi Chemical Company, Ltd. Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device
JP2016048786A (en) * 2010-09-28 2016-04-07 三菱製紙株式会社 Method for forming solder resist pattern

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