JPS53104857A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS53104857A JPS53104857A JP1927677A JP1927677A JPS53104857A JP S53104857 A JPS53104857 A JP S53104857A JP 1927677 A JP1927677 A JP 1927677A JP 1927677 A JP1927677 A JP 1927677A JP S53104857 A JPS53104857 A JP S53104857A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- producing printed
- producing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1927677A JPS53104857A (en) | 1977-02-25 | 1977-02-25 | Method of producing printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1927677A JPS53104857A (en) | 1977-02-25 | 1977-02-25 | Method of producing printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53104857A true JPS53104857A (en) | 1978-09-12 |
Family
ID=11994914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1927677A Pending JPS53104857A (en) | 1977-02-25 | 1977-02-25 | Method of producing printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53104857A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
US6921505B2 (en) | 2000-05-31 | 2005-07-26 | Ttm Advanced Circuits, Inc. | Hole filling using an etched hole-fill stand-off |
US6995321B2 (en) | 2000-05-31 | 2006-02-07 | Honeywell Advanced Circuits | Etched hole-fill stand-off |
-
1977
- 1977-02-25 JP JP1927677A patent/JPS53104857A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
US6921505B2 (en) | 2000-05-31 | 2005-07-26 | Ttm Advanced Circuits, Inc. | Hole filling using an etched hole-fill stand-off |
US6995321B2 (en) | 2000-05-31 | 2006-02-07 | Honeywell Advanced Circuits | Etched hole-fill stand-off |
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