JPS53104857A - Method of producing printed circuit board - Google Patents

Method of producing printed circuit board

Info

Publication number
JPS53104857A
JPS53104857A JP1927677A JP1927677A JPS53104857A JP S53104857 A JPS53104857 A JP S53104857A JP 1927677 A JP1927677 A JP 1927677A JP 1927677 A JP1927677 A JP 1927677A JP S53104857 A JPS53104857 A JP S53104857A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
producing printed
producing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1927677A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Oosawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1927677A priority Critical patent/JPS53104857A/en
Publication of JPS53104857A publication Critical patent/JPS53104857A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP1927677A 1977-02-25 1977-02-25 Method of producing printed circuit board Pending JPS53104857A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1927677A JPS53104857A (en) 1977-02-25 1977-02-25 Method of producing printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1927677A JPS53104857A (en) 1977-02-25 1977-02-25 Method of producing printed circuit board

Publications (1)

Publication Number Publication Date
JPS53104857A true JPS53104857A (en) 1978-09-12

Family

ID=11994914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1927677A Pending JPS53104857A (en) 1977-02-25 1977-02-25 Method of producing printed circuit board

Country Status (1)

Country Link
JP (1) JPS53104857A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
US6921505B2 (en) 2000-05-31 2005-07-26 Ttm Advanced Circuits, Inc. Hole filling using an etched hole-fill stand-off
US6995321B2 (en) 2000-05-31 2006-02-07 Honeywell Advanced Circuits Etched hole-fill stand-off

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6855385B2 (en) 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
US6921505B2 (en) 2000-05-31 2005-07-26 Ttm Advanced Circuits, Inc. Hole filling using an etched hole-fill stand-off
US6995321B2 (en) 2000-05-31 2006-02-07 Honeywell Advanced Circuits Etched hole-fill stand-off

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