JPS53128765A - Printed circuit board and method of producing same - Google Patents

Printed circuit board and method of producing same

Info

Publication number
JPS53128765A
JPS53128765A JP4375778A JP4375778A JPS53128765A JP S53128765 A JPS53128765 A JP S53128765A JP 4375778 A JP4375778 A JP 4375778A JP 4375778 A JP4375778 A JP 4375778A JP S53128765 A JPS53128765 A JP S53128765A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
producing same
producing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4375778A
Other languages
Japanese (ja)
Inventor
Haadaasubetsuku Hansu
Tsukiiru Fuuberuto
Andorasutsuetsuku Erunsuto
Gureebaa Arufureeto
Haaze Uorufugangu
Hatsuke Hansuyurugen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS53128765A publication Critical patent/JPS53128765A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP4375778A 1977-04-14 1978-04-13 Printed circuit board and method of producing same Pending JPS53128765A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772716545 DE2716545A1 (en) 1977-04-14 1977-04-14 PRINTED CIRCUIT BOARD WITH AT LEAST TWO LAYERS OF WIRING

Publications (1)

Publication Number Publication Date
JPS53128765A true JPS53128765A (en) 1978-11-10

Family

ID=6006294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4375778A Pending JPS53128765A (en) 1977-04-14 1978-04-13 Printed circuit board and method of producing same

Country Status (9)

Country Link
JP (1) JPS53128765A (en)
BE (1) BE866001A (en)
CH (1) CH628195A5 (en)
DE (1) DE2716545A1 (en)
FR (1) FR2387568A1 (en)
GB (1) GB1577713A (en)
IT (1) IT1096057B (en)
NL (1) NL7803993A (en)
SE (1) SE7804192L (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797970U (en) * 1980-12-08 1982-06-16
EP0062084A1 (en) * 1981-04-06 1982-10-13 Herbert Irwin Schachter Multi-level circuit and method of making same
JPS60137092A (en) * 1983-12-19 1985-07-20 株式会社東芝 Circuit board
JPS60140897A (en) * 1983-12-28 1985-07-25 日本電気株式会社 Resin insulated multilayer board
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
KR950003244B1 (en) * 1986-12-17 1995-04-06 더 폭스보로 컴패니 Multilayer circuit board fabrication process
AT398877B (en) * 1991-10-31 1995-02-27 Philips Nv TWO OR MULTILAYERED CIRCUIT BOARD, METHOD FOR PRODUCING SUCH A CIRCUIT BOARD AND LAMINATE FOR PRODUCING SUCH A CIRCUIT BOARD BY SUCH A PROCESS
DE4135839A1 (en) * 1991-10-31 1993-05-06 Huels Troisdorf Ag, 5210 Troisdorf, De METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT AND MULTI-LAYER PRINTED CIRCUIT
AT398876B (en) * 1991-10-31 1995-02-27 Philips Nv TWO OR MULTILAYER PCB
EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Process for producing multilayer printed circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3528173A (en) * 1966-08-15 1970-09-15 Andrew S Gall Making circuit boards

Also Published As

Publication number Publication date
IT1096057B (en) 1985-08-17
DE2716545A1 (en) 1978-10-19
GB1577713A (en) 1980-10-29
BE866001A (en) 1978-07-31
CH628195A5 (en) 1982-02-15
FR2387568A1 (en) 1978-11-10
NL7803993A (en) 1978-10-17
IT7822145A0 (en) 1978-04-10
SE7804192L (en) 1978-10-15
FR2387568B1 (en) 1982-06-04

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