TW200621107A - Printed circuit board and semiconductor device - Google Patents

Printed circuit board and semiconductor device

Info

Publication number
TW200621107A
TW200621107A TW094124462A TW94124462A TW200621107A TW 200621107 A TW200621107 A TW 200621107A TW 094124462 A TW094124462 A TW 094124462A TW 94124462 A TW94124462 A TW 94124462A TW 200621107 A TW200621107 A TW 200621107A
Authority
TW
Taiwan
Prior art keywords
resist layer
solder resist
circuit board
printed circuit
lead side
Prior art date
Application number
TW094124462A
Other languages
Chinese (zh)
Inventor
Nobuaki Fujii
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200621107A publication Critical patent/TW200621107A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

This invention provides a printed circuit board which comprises an insulation film, a circuit pattern formed on a surface of the insulation film, and a solder resist layer formed to expose the terminal portions constituted by inner leads and outer leads of the circuit pattern. The solder resist layer is formed into divided regions of an inner lead side solder resist layer and an outer lead side solder resist layer. The inner lead side solder resist layer is formed by a resin composition (1) having a flame-resistant property and a high affinity with a sealing resin of electronic parts mounted on the printed circuit board, while the outer lead side solder resist layer is formed by a resin composition (2) having a flame-resistant property, a softer hardness than the inner lead side solder resist layer formed by the above said resin composition (1), and a low affinity with the sealing resin of the above said electronic parts. Thereby a printed circuit board and a semiconductor device suitable for use in a plasma display panel can be obtained.
TW094124462A 2004-09-06 2005-07-20 Printed circuit board and semiconductor device TW200621107A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004258972A JP2006073966A (en) 2004-09-06 2004-09-06 Printed circuit board and semiconductor device

Publications (1)

Publication Number Publication Date
TW200621107A true TW200621107A (en) 2006-06-16

Family

ID=36154215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124462A TW200621107A (en) 2004-09-06 2005-07-20 Printed circuit board and semiconductor device

Country Status (2)

Country Link
JP (1) JP2006073966A (en)
TW (1) TW200621107A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008210827A (en) * 2007-02-23 2008-09-11 Nec Electronics Corp Semiconductor device and wiring board, and their manufacturing process
KR101259844B1 (en) * 2011-01-31 2013-05-03 엘지이노텍 주식회사 Tap Tape for Electronic Components Reinforced Lead Crack And Method of Manufacture The Same
KR20210105723A (en) 2020-02-19 2021-08-27 삼성전자주식회사 Chip-on-film package, and display module and electronic device comprising the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2509509B2 (en) * 1992-01-20 1996-06-19 三井金属鉱業株式会社 Tape carrier and tape carrier device using the same
JP3491489B2 (en) * 1997-03-25 2004-01-26 日立電線株式会社 Tab tape and manufacturing method thereof
JP3424523B2 (en) * 1997-09-29 2003-07-07 日立電線株式会社 TAB tape carrier and method of manufacturing the same
JP3545178B2 (en) * 1997-10-15 2004-07-21 シャープ株式会社 Disconnection test method
JP3442978B2 (en) * 1997-10-15 2003-09-02 シャープ株式会社 Tape carrier package semiconductor device and liquid crystal panel display device using the same
JP3394029B2 (en) * 2000-03-21 2003-04-07 大塚化学株式会社 Flame-retardant epoxy resin composition, molded product thereof, and electronic component
JP4146990B2 (en) * 2000-09-01 2008-09-10 三井金属鉱業株式会社 Film carrier
JP2003209330A (en) * 2002-01-15 2003-07-25 Ube Ind Ltd Double-sided circuit board and manufacturing method thereof

Also Published As

Publication number Publication date
JP2006073966A (en) 2006-03-16

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