Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/60—Piezoelectric or electrostrictive devices having a coaxial cable structure
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/01—Manufacture or treatment
  • H10N30/02—Forming enclosures or casings
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
  • H10N30/302—Sensors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/80—Constructional details
  • H10N30/85—Piezoelectric or electrostrictive active materials
  • H10N30/857—Macromolecular compositions
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/80—Constructional details
  • H10N30/88—Mounts; Supports; Enclosures; Casings
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L1/00—Measuring force or stress, in general
  • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices

Definitions

• the present invention relates to a piezoelectric coaxial sensor in which deterioration of output characteristics is suppressed, and a method for manufacturing the piezoelectric coaxial sensor.
• a piezoelectric coaxial sensor in which a piezoelectric element is arranged between a center conductor and an outer conductor of a coaxial cable is known.
• the piezoelectric coaxial sensor by sensing a voltage of the piezoelectric element generated when a force is applied from an outer peripheral surface of the sensor via the center conductor and the outer conductor, detects the force. Using this property, deformation of an object to be measured on which the piezoelectric coaxial sensor is provided, a force applied to the object to be measured, vibrations, and the like are detected.
• a piezoelectric element of such a piezoelectric coaxial sensor a piezoelectric element using a polymer piezoelectric body made of polyvinylidene fluoride (PVDF) is known.
• PVDF polyvinylidene fluoride
• Patent Literature 1 describes such a piezoelectric coaxial sensor.
• the piezoelectric coaxial sensor includes a center conductor, a polymer piezoelectric layer including PVDF covering an outer peripheral surface of the center conductor, an outer conductor surrounding an outer peripheral surface of the polymer piezoelectric layer, and an insulating layer that is a jacket layer covering an outer peripheral surface of the outer conductor.
• the jacket layer is formed by extrusion molding. Further piezoelectric coaxial sensors may be found in Patent Literature 2 and 3.
• the piezoelectric coaxial sensor described in Patent Literature 1 above tends to have a small output. This is considered to be because the polarization of PVDF decreases when the jacket layer is formed by extrusion molding. Therefore, there is a demand for forming the jacket layer by tape winding. In the case of tape winding, at least a tape constituting the jacket exposed to the outside needs to be fixed by adhesion. In the case of using a tape having adhesiveness, there is a demand for using an adhesive including a thermoplastic resin due to a manufacturing problem, but when such an adhesive is used, there is a concern about deterioration of output characteristics due to a decrease in polarization of PVDF at the time of heating.
• a piezoelectric coaxial sensor of the present invention includes: a sensor portion including a center conductor having a linear shape, a polymer piezoelectric layer containing polyvinylidene fluoride and configured to cover an outer peripheral surface of the center conductor, and a first outer conductor configured to surround an outer peripheral surface of the polymer piezoelectric layer; and at least one jacket layer configured to include a film having a tape shape wound so as to surround an outer peripheral surface of the sensor portion, in which the film of the jacket layer exposed to outside among the jacket layers is adhered to a member in contact with an adhesive layer including a thermoplastic resin having a melting point of 120°C or lower by the adhesive layer.
• the present inventor fixed the film to the sensor portion at various temperatures using an adhesive layer including a thermoplastic resin as an adhesive.
• an adhesive layer including a thermoplastic resin as an adhesive.
• the method for manufacturing the piezoelectric coaxial sensor of the present invention since the jacket layer exposed to the outside by heating at 120°C or lower is formed, it is possible to manufacture the piezoelectric coaxial sensor with which it is possible to suppress a decrease in polarization of PVDF and in which deterioration of output characteristics is suppressed.
• the piezoelectric coaxial sensor described above includes a first jacket layer configured to include one or more of the jacket layers and cover the outer peripheral surface of the sensor portion; a second outer conductor configured to surround an outer peripheral surface of the first jacket layer; and a second jacket layer configured to include one or more of the jacket layers and cover an outer peripheral surface of the second outer conductor, in which an outermost jacket layer of the second jacket layer is the jacket layer exposed to the outside.
• a piezoelectric coaxial sensor in which deterioration of output characteristics is suppressed, and a method for manufacturing the piezoelectric coaxial sensor are provided.
• FIG. 1 is a diagram illustrating a piezoelectric coaxial sensor according to the present embodiment.
• a piezoelectric coaxial sensor 1 of the present embodiment includes a center conductor 11, a polymer piezoelectric layer 12, a first outer conductor 13, a first jacket layer 14, a second outer conductor 15, and a second jacket layer 16.
• the center conductor 11 is a conductor having a linear shape including stranded wires of a plurality of conductive wire materials.
• the center conductor 11 is not particularly limited as long as it is a conductor, and examples thereof include a conductor including copper, aluminum, a tin-plated soft copper alloy, or the like. Note that FIG. 1 illustrates an example in which the center conductor 11 includes the stranded wires of the plurality of conductive wire materials as described above, but the center conductor 11 may be a conductor having a linear shape including a conductive single wire.
• the polymer piezoelectric layer 12 is a layer covering the outer peripheral surface of the center conductor 11. In the present embodiment, the polymer piezoelectric layer 12 is in contact with the outer peripheral surface of the center conductor 11.
• the polymer piezoelectric layer 12 exhibits piezoelectricity and includes a polymer containing PVDF.
• the polymer piezoelectric layer 12 is formed to have a substantially circular outer shape in cross section by extrusion molding or the like.
• the polymer piezoelectric layer 12 may be constituted by winding a film having a tape shape including a polymer piezoelectric body containing PVDF around the center conductor 11. In this case, the film may be wound in a spiral winding or in a longitudinal winding.
• the first outer conductor 13 is a conductor surrounding the outer peripheral surface of the polymer piezoelectric layer 12. In the present embodiment, the first outer conductor 13 is in contact with the outer peripheral surface of the polymer piezoelectric layer 12.
• the first outer conductor 13 has a configuration in which a plurality of conductive wires is spirally wound in the same direction.
• Such a first outer conductor 13 is not particularly limited as long as it includes a conductor, but includes, for example, the same conductor as the center conductor 11. Note that FIG. 1 illustrates an example in which the plurality of conductive wires is spirally wound as the first outer conductor 13, and the first outer conductor 13 may be a mesh wire in which a plurality of conductive wires is braided.
• the center conductor 11, the polymer piezoelectric layer 12, and the first outer conductor 13 configured as described above constitute a sensor portion S.
• the polymer piezoelectric layer 12 is in contact with the outer peripheral surface of the center conductor 11, and the first outer conductor 13 is in contact with the outer peripheral surface of the polymer piezoelectric layer 12. Therefore, in the sensor portion S, when an external force applied to the piezoelectric coaxial sensor 1 is transmitted to the polymer piezoelectric layer 12 and an inductive charge is generated in the polymer piezoelectric layer 12, a voltage is generated between the center conductor 11 and the first outer conductor 13 on the basis of the inductive charge generated in the polymer piezoelectric layer 12. Therefore, by inducing the voltage between the center conductor 11 and the first outer conductor 13 to the outside of the piezoelectric coaxial sensor 1 and measuring the voltage, it is possible to measure the force applied to the piezoelectric coaxial sensor 1.
• FIG. 2 is a diagram illustrating a structure in a cross section perpendicular to a longitudinal direction of the piezoelectric coaxial sensor 1 in FIG. 1 .
• the first jacket layer 14 is a layer covering the outer peripheral surface of the first outer conductor 13. Thus, the first jacket layer 14 covers the outer peripheral surface of the sensor portion S. As illustrated in FIGS. 1 and 2 , in the present embodiment, the first jacket layer 14 includes two jacket layers: an inner first jacket layer 14a and an outer first jacket layer 14b.
• the inner first jacket layer 14a includes a film 14at having a tape shape including resin, and the film 14at is spirally wound on the outer peripheral surface of the first outer conductor 13. No adhesive layer is provided on any surface of the film 14at, and the inner first jacket layer 14a is not adhered to the first outer conductor 13.
• the material of the film 14at is not particularly limited, and examples thereof include insulating resins such as polyethylene terephthalate, polyethylene naphthalate, polyimide, polyvinyl chloride, polypropylene, polyetheretherketone, polyetherimide, polyphenylene sulfide, and the like.
• the outer first jacket layer 14b is the outermost jacket layer of the first jacket layer 14, and includes a film 14bt having a tape shape including resin and an adhesive layer 14ba provided on one surface of the film 14bt.
• the adhesive layer 14ba faces the inner first jacket layer 14a side, and the film 14bt is spirally wound on the outer peripheral surface of the inner first jacket layer 14a.
• the adhesive layer 14ba is in contact with the inner first jacket layer 14a, and the film 14bt is adhered to the inner first jacket layer 14a by the adhesive layer 14ba. Note that, in the example of FIG.
• the film 14bt of the outer first jacket layer 14b is wound in the same direction as the film 14at of the inner first jacket layer 14a, but the film 14bt of the outer first jacket layer 14b and the film 14at of the inner first jacket layer 14a may be wound in the opposite directions. In addition, at least one of the film 14at and the film 14bt may be wound in a longitudinal winding.
• the material of the film 14bt is not particularly limited, and examples thereof include the same material as the film 14at.
• the adhesive used for the adhesive layer 14ba includes a thermoplastic resin having a melting point of 120°C or lower. Examples of such a resin include an ethylene-vinyl acetate copolymer (EVA). By containing EVA, the melting point of the thermoplastic resin can be 120°C or lower.
• the adhesive layer when the adhesive layer is provided on the surface of the film 14at that is the outer side of the inner first jacket layer 14a, since the adhesive layer is exposed on the outer peripheral surface of the inner first jacket layer 14a, the adhesive layer may not be provided on any surface of the film 14bt, and the adhesive layer 14ba may be provided on the surface of the film 14bt on the inner first jacket layer 14a side as described above.
• the adhesive layer 14ba even when the adhesive layer is not provided on any surface of the film 14at, the adhesive layer 14ba may not be provided, but from the viewpoint of suppressing the film 14bt from being unraveled when the piezoelectric coaxial sensor 1 is repeatedly bent, it is preferable to provide the adhesive layer 14ba as described above.
• the outer second jacket layer 16b is the outermost jacket layer of the second jacket layer 16 and is a jacket layer exposed to the outside.
• the outer second jacket layer 16b includes a film 16bt having a tape shape including resin and an adhesive layer 16ba provided on one surface of the film 16bt.
• the adhesive layer 16ba faces the inner second jacket layer 16a side, and the film 16bt is spirally wound on the outer peripheral surface of the inner second jacket layer 16a.
• the adhesive layer 16ba is in contact with the inner second jacket layer 16a, and the film 16bt is adhered to the inner second jacket layer 16a by the adhesive layer 16ba. Note that, in the example of FIG.
• the film 14bt when the film 14bt is wound in a longitudinal winding, the film 14bt is wound in a longitudinal winding on the outer peripheral surface of the inner first jacket layer 14a so that the adhesive layer 14ba is in contact with the inner first jacket layer 14a. In this way, the adhesive layer 14ba is in contact with the inner first jacket layer 14a, and the film 14bt is in a state of being wound on the outer peripheral surface of the inner first jacket layer 14a. Note that, in this step, the film 14bt surrounds the outer peripheral surface of the sensor portion S via the inner first jacket layer 14a.
• the film 14bt not provided with the adhesive layer 14ba may be wound on the outer peripheral surface of the inner first jacket layer 14a via the adhesive layer on the film 14at, and the film 14bt provided with the adhesive layer 14ba may be wound on the outer peripheral surface of the inner first jacket layer 14a as described above.
• the film 14bt which is to be the outer first jacket layer 14b, is wound around the outer peripheral surface of the inner first jacket layer 14a via the adhesive layer.
• This step is a step of adhering the film 14bt of the outer first jacket layer 14b to the inner first jacket layer 14a by the adhesive layer 14ba.
• the inner first jacket layer 14a around which the film 14bt is wound and the sensor portion S are heated at 120°C or lower, so that the film 14bt is adhered to the inner first jacket layer 14a by the adhesive layer 14ba.
• FIG. 7 is a diagram illustrating a state of this step.
• a heating target body 1a including the film 14bt, the inner first jacket layer 14a, and the sensor portion S is passed through a heating furnace H to heat the heating target body 1a.
• the heating target body 1a thus heated is wound around a reel R1 before passing through the heating furnace H.
• the heating target body 1a fed from the reel R1 is changed in direction by a guide roller G1 and is passed through the heating furnace H.
• the temperature in the heating furnace H is adjusted so as to be equal to or higher than the melting point of the adhesive layer 14ba and 120°C or lower.
• the temperature in the heating furnace H is adjusted to be, for example, 100°C or higher and 120°C or lower.
• the melting point of EVA is 110°C.
• the length of the heating furnace H is, for example, 1 m or more and 2 m or less.
• the film 14bt of the outer first jacket layer 14b is adhered to the inner first jacket layer 14a by the adhesive layer 14ba, and the first jacket layer 14 is formed.
• the film 14bt of the outer first jacket layer 14b is adhered to the inner first jacket layer 14a by the adhesive layer provided on the film 14at.
• the adhesive layer is provided on the surface of the film 14at and the adhesive layer 14ba is also provided on the film 14bt, the film 14bt of the outer first jacket layer 14b is adhered to the inner first jacket layer 14a by the adhesive layer provided on the film 14at and the adhesive layer 14ba provided on the film 14bt.
• This step is a step of forming the second outer conductor 15 surrounding the outer peripheral surface of the first jacket layer 14.
• the plurality of conductive wires is spirally wound on the outer peripheral surface of the first jacket layer 14.
• the second outer conductor 15 is a mesh wire in which a plurality of conductive wires is braided
• the plurality of conductive wires is interwoven on the outer peripheral surface of the first jacket layer 14 to form a mesh wire. In this way, the second outer conductor 15 is formed as illustrated in FIG. 8 .
• This step is a step of forming the second jacket layer 16. As illustrated in FIG. 3 , this step includes an inner second jacket layer forming step P4a and an outer second jacket layer forming step P4b.
• This step is a step of winding the film 16bt provided with the adhesive layer 16ba around the outer peripheral surface of the inner second jacket layer 16a.
• FIG. 10 is a diagram illustrating a state of this step. As illustrated in FIG. 10 , in this step, the film 16bt provided with the adhesive layer 16ba is prepared, and the film 16bt is wound on the outer peripheral surface of the inner second jacket layer 16a in a spiral winding so that the adhesive layer 16ba is in contact with the inner second jacket layer 16a. Note that, unlike FIG.
• the film 16bt when the film 16bt is wound in a longitudinal winding, the film 16bt is wound in a longitudinal winding on the outer peripheral surface of the inner second jacket layer 16a so that the adhesive layer 16ba is in contact with the inner second jacket layer 16a. In this way, the adhesive layer 16ba is in contact with the inner second jacket layer 16a, and the film 16bt is in a state of being wound on the outer peripheral surface of the inner second jacket layer 16a. Note that, in this step, the film 16bt surrounds the outer peripheral surface of the sensor portion S via the inner second jacket layer 16a, the second outer conductor 15, and the first jacket layer 14.
• the film 16bt not provided with the adhesive layer 16ba may be wound on the outer peripheral surface of the inner second jacket layer 16a via the adhesive layer on the film 16at, and the film 16bt provided with the adhesive layer 16ba may be wound on the outer peripheral surface of the inner second jacket layer 16a as described above.
• the film 16bt which is to be the outer second jacket layer 16b, is wound around the outer peripheral surface of the inner second jacket layer 16a via the adhesive layer.
• This step is a step of adhering the film 16bt of the outer second jacket layer 16b to the inner second jacket layer 16a by the adhesive layer 16ba.
• the inner second jacket layer 16a around which the film 16bt is wound, the second outer conductor 15, the first jacket layer 14, and the sensor portion S are heated at 120°C or lower, so that the film 16bt is adhered to the inner second jacket layer 16a by the adhesive layer 16ba.
• the outer first jacket layer adhering step P2ba illustrated in FIG. 7 is similarly performed.
• the heating target body 1a includes the inner second jacket layer 16a around which the film 16bt is wound, the second outer conductor 15, the first jacket layer 14, and the sensor portion S.
• the temperature in the heating furnace H, the length of the heating furnace H, and the speed of movement of the heating target body 1a in this step are not particularly limited as long as the adhesive layer 16ba is heated to the melting point or higher and 120°C or lower in the heating furnace H, and may be different from the temperature in the heating furnace H, the length of the heating furnace H, and the speed of movement of the heating target body 1a in the outer first jacket layer adhering step P2ba.
• the film 16bt of the outer second jacket layer 16b is adhered to the inner second jacket layer 16a by the adhesive layer 16ba, and the piezoelectric coaxial sensor 1 illustrated in FIGS. 1 and 2 is manufactured.
• the film 16bt of the outer second jacket layer 16b is adhered to the inner second jacket layer 16a by the adhesive layer provided on the film 16at.
• the adhesive layer is provided on the surface of the film 16at and the adhesive layer 16ba is also provided on the film 16bt, the film 16bt of the outer second jacket layer 16b is adhered to the inner second jacket layer 16a by the adhesive layer provided on the film 16at and the adhesive layer 16ba provided on the film 16bt.
• the present manufacturing method includes a jacket layer forming step of forming a plurality of jacket layers. That is, the jacket layer forming step of forming a plurality of jacket layers includes the inner first jacket layer forming step P2a, the outer first jacket layer forming step P2b, the inner second jacket layer forming step P4a, and the outer second jacket layer forming step P4b.
• the method for manufacturing the piezoelectric coaxial sensor 1 of the present embodiment includes the preparation step P1 of preparing the sensor portion S, and the jacket layer forming step of forming at least one jacket layer including the film having a tape shape wound so as to surround the outer peripheral surface of the sensor portion S.
• the jacket layer forming step includes the outer second jacket layer forming step P4b, which is an exposed jacket forming step, of forming a jacket layer exposed to the outside among the jacket layers.
• the outer second jacket layer forming step P4b includes the outer second jacket layer winding step P4bw of winding the film 16bt provided with the adhesive layer 16ba including a thermoplastic resin having a melting point of 120°C or lower so as to surround the outer peripheral surface of the sensor portion S, and the outer second jacket layer adhering step P4ba of heating the sensor portion S around which the film 16bt is wound at 120°C or lower and adhering the film 16bt to the inner second jacket layer 16a, which is a member in contact with the adhesive layer 16ba, by the adhesive layer 16ba.
• the thermoplastic resin of the adhesive layer 16ba contains an ethylene-vinyl acetate copolymer
• the adhesive layer can have a melting point of 120 degrees or lower.
• the method for manufacturing the piezoelectric coaxial sensor 1 of the present embodiment includes the first jacket layer forming step P2 of forming the first jacket layer 14 including the plurality of jacket layers and covering the outer peripheral surface of the sensor portion S, the second outer conductor forming step P3 of forming the second outer conductor 15 surrounding the outer peripheral surface of the first jacket layer 14, and the second jacket layer forming step P4 of forming the second jacket layer 16 including the plurality of jacket layers and covering the outer peripheral surface of the second outer conductor 15.
• the outer second jacket layer 16b which is the outermost jacket layer of the second jacket layer 16, is a jacket layer exposed to the outside.
• the piezoelectric coaxial sensor 1 in which the second outer conductor 15 acts as a shield layer, has excellent noise resistance characteristics, and the outer peripheral surface of the second outer conductor 15 acting as the shield layer can be insulated from the outside by the second jacket layer 16.
• the first jacket layer forming step P2 includes the inner first jacket layer forming step P2a of forming the inner first jacket layer 14a that covers the outer peripheral surface of the sensor portion S and in which the film 14at is not adhered to the sensor portion S, and the outer first jacket layer forming step P2b of forming the outer first jacket layer 14b that covers the outer peripheral surface of the inner first jacket layer 14a and in which the film 14bt is adhered to the inner first jacket layer 14a by the adhesive layer 14ba, and the outer first jacket layer forming step P2b includes the outer first jacket layer winding step P2bw of winding the film 14bt provided with the adhesive layer 14ba around the outer peripheral surface of the inner first jacket layer 14a, and the outer first jacket layer adhering step P2ba of heating the inner first jacket layer 14a around which the film 14bt is wound in the outer first jacket layer winding step P2bw and the sensor portion S at 120°C or lower
• the piezoelectric coaxial sensor 1 According to such a method for manufacturing the piezoelectric coaxial sensor 1, it is possible to manufacture the piezoelectric coaxial sensor 1 in which since the inner first jacket layer 14a is not adhered to the sensor portion S, the sensor portion S is easily led out, and since the outer first jacket layer 14b is adhered to the inner first jacket layer 14a, the first jacket layer 14 is prevented from unraveling even when the piezoelectric coaxial sensor 1 is bent.
• the method for manufacturing the piezoelectric coaxial sensor 1 of the present embodiment since the first jacket layer 14 is formed by heating at 120°C or lower, it is possible to suppress a decrease in polarization of PVDF.
• the second jacket layer forming step P4 includes the inner second jacket layer forming step P4a of forming the inner second jacket layer 16a that covers the outer peripheral surface of the second outer conductor 15 and in which the film 16at is not adhered to the second outer conductor 15, and the outer second jacket layer forming step P4b of forming the outer second jacket layer 16b that is the outermost jacket layer of the second jacket layer 16, covers the outer peripheral surface of the inner second jacket layer 16a, and in which the film 16bt is adhered to the inner second jacket layer 16a by the adhesive layer 16ba.
• the piezoelectric coaxial sensor 1 According to such a method for manufacturing the piezoelectric coaxial sensor 1, it is possible to manufacture the piezoelectric coaxial sensor 1 in which since the inner second jacket layer 16a is not adhered to the second outer conductor 15, the second outer conductor 15 is easily led out, and since the outer second jacket layer 16b is adhered to the inner second jacket layer 16a, the second jacket layer 16 is prevented from unraveling even when the piezoelectric coaxial sensor 1 is bent.
• the second jacket layer 16 since the second jacket layer 16 is formed by heating at 120°C or lower, it is possible to suppress a decrease in polarization of PVDF.
• the present embodiment has been described by taking the embodiment as an example, the present invention is not limited to the above embodiment.
• the second outer conductor 15 and the second jacket layer 16 are not essential configurations.
• the outer first jacket layer 14b of the first jacket layer 14 is the jacket layer exposed to the outside.
• the film 14bt is adhered to the member in contact with the adhesive layer 14ba by the adhesive layer 14ba.
• the adhesive layer 14ba is heated to the melting point or higher of the adhesive layer 14ba and 120°C or lower, and the film 14bt is adhered to the member in contact with the adhesive layer 14ba.
• This member is the inner first jacket layer 14a in the above example, but is the sensor portion S when the inner first jacket layer 14a is omitted.
• the outer first jacket layer forming step P2b is the exposed jacket forming step of forming the jacket layer exposed to the outside.
• the inner first jacket layer forming step P2a is omitted, and the film 14bt of the outer first jacket layer is adhered to the sensor portion S by the adhesive layer 14ba.
• the outer first jacket layer forming step P2b is omitted.
• the second jacket layer 16 is an essential configuration.
• the inner second jacket layer forming step P4a is omitted, and the film 16bt of the outer second jacket layer is adhered to the second outer conductor 15 by the adhesive layer 16ba.
• the outer second jacket layer 16b is an essential configuration.
• a piezoelectric coaxial sensor having substantially the same configuration as the piezoelectric coaxial sensor 1 illustrated in FIGS. 1 and 2 and a length of 100 cm was manufactured.
• the sensor portion S was prepared in substantially the same manner as in the preparation step P1 described above.
• the center conductor 11 stranded wires including seven soft copper wires having a diameter of about 0.05 mm and having an outer diameter of about 0.15 mm were used.
• the polymer piezoelectric layer 12 has a configuration in which a film having a tape shape including PVDF is spirally wound on the outer peripheral surface of the center conductor 11. At this time, the film was wound so that a part of the film overlapped to form two layers.
• the outer diameter of the polymer piezoelectric layer 12 was 0.3 mm.
• the first outer conductor 13 has a configuration in which a plurality of tin-plated soft copper alloy wires having a diameter of 0.03 mm is spirally wound on the outer peripheral surface of the polymer piezoelectric layer 12.
• the outer diameter of the first outer conductor 13 was 0.36 mm. In this way, the sensor portion S was prepared.
• the first jacket layer 14 was formed to include the inner first jacket layer 14a and the outer first jacket layer 14b in the same manner as in the first jacket layer forming step P2 described above.
• the inner first jacket layer 14a was formed in the inner first jacket layer forming step P2a.
• the inner first jacket layer 14a was formed by spirally winding the film 14at including polyethylene terephthalate (PET) on the outer peripheral surface of the first outer conductor 13. At this time, the film 14at was wound so that a part of the film 14at overlapped to form two layers.
• the outer diameter of the inner first jacket layer 14a was 0.38 mm.
• the outer first jacket layer 14b was formed in the same manner as in the outer first jacket layer forming step P2b.
• the outer first jacket layer 14b was formed by spirally winding the film 14bt including PET on the outer peripheral surface of the inner first jacket layer 14a with the adhesive layer 14ba provided on one surface in the same manner as in the outer first jacket layer winding step P2bw. At this time, the film 14bt was wound so that a part of the film 14bt overlapped to form two layers. The outer diameter of the outer first jacket layer 14b was 0.39 mm.
• the adhesive layer 14ba includes a thermoplastic resin containing EVA. Thereafter, in the same manner as in the outer first jacket layer adhering step P2ba, the film 14bt of the outer first jacket layer 14b was adhered to the inner first jacket layer 14a by the adhesive layer 14ba. At this time, the set temperature of the heating furnace H was set to 120°C, the length of the heating furnace was set to 1.1 m, and the linear velocity of the heating target body 1a was set to 3 m/min.
• the second outer conductor 15 was formed in the second outer conductor forming step P3.
• the second outer conductor 15 has a configuration in which a plurality of tin-plated soft copper alloy wires having a diameter of 0.03 mm is spirally wound on the outer peripheral surface of the first jacket layer 14.
• the outer diameter of the second outer conductor 15 was 0.45 mm.
• the inner second jacket layer 16a and the outer second jacket layer 16b were formed in the same manner as in the second jacket layer forming step P4 described above.
• the inner second jacket layer 16a was formed in the inner second jacket layer forming step P4a.
• the inner second jacket layer 16a was formed by spirally winding the film 16at including PET on the outer peripheral surface of the second outer conductor 15. At this time, the film 16at was wound so that a part of the film 16at overlapped to form two layers.
• the outer diameter of the inner second jacket layer 16a was 0.47 mm.
• the outer second jacket layer 16b was formed in the same manner as in the outer second jacket layer forming step P4b.
• the outer second jacket layer 16b was formed by spirally winding the film 16bt including PET on the outer peripheral surface of the inner second jacket layer 16a with the adhesive layer 16ba provided on one surface in the same manner as in the outer second jacket layer winding step P4bw. At this time, the film 16bt was wound so that a part of the film 16bt overlapped to form two layers.
• the outer diameter of the outer second jacket layer 16b was 0.54 mm.
• the adhesive layer 16ba includes a thermoplastic resin containing EVA.
• the film 16bt of the outer second jacket layer 16b was adhered to the inner second jacket layer 16a by the adhesive layer 16ba.
• the set temperature of the heating furnace H was set to 120°C
• the length of the heating furnace was set to 1.1 m
• the linear velocity of the heating target body 1a was set to 3 m/min.
• a piezoelectric coaxial sensor was manufactured in the same manner as in the first example except that the adhesive layer 14ba of the outer first jacket layer 14b and the adhesive layer 16ba of the outer second jacket layer 16b included a polyester thermoplastic resin, and the set temperature of the heating furnace H in the outer first jacket layer adhering step P2ba and the outer second jacket layer adhering step P4ba was 150°C. The melting point of this thermoplastic resin was 140°C.
• a piezoelectric coaxial sensor was manufactured in the same manner as in the first example except that the adhesive layer 14ba of the outer first jacket layer 14b and the adhesive layer 16ba of the outer second jacket layer 16b included a polyamide thermoplastic resin, and the set temperature of the heating furnace H in the outer first jacket layer adhering step P2ba and the outer second jacket layer adhering step P4ba was 160°C. The melting point of this thermoplastic resin was 150°C.
• the outer second jacket layer 16b of the first example was adhered with sufficient strength, and the outer second jacket layer 16b could not be easily separated.
• the outer second jacket layer 16b of the first comparative example was not adhered with sufficient strength, and the outer second jacket layer 16b was easily separated. Note that even when the set temperature of the heating furnace H in the outer first jacket layer adhering step P2ba and the outer second jacket layer adhering step P4ba of the first comparative example was increased to 170°C, the same results were obtained.
• the outer second jacket layer 16b of the second comparative example was adhered with sufficient strength, and the outer second jacket layer 16b could not be easily separated. Note that when the set temperature of the heating furnace H in the outer first jacket layer adhering step P2ba and the outer second jacket layer adhering step P4ba of the second comparative example was set to 120°C, the films 14bt and 16bt were not adhered.
• the outer second jacket layer 16b of the third comparative example was adhered with sufficient strength, and the outer second jacket layer 16b could not be easily separated. Note that when the set temperature of the heating furnace H in the outer first jacket layer adhering step P2ba and the outer second jacket layer adhering step P4ba of the third comparative example was set to 120°C, the films 14bt and 16bt were not adhered.
• a piezoelectric coaxial sensor having the same configuration as in the first example was manufactured by changing the set temperature of the heating furnace H in the outer first jacket layer adhering step P2ba and the outer second jacket layer adhering step P4ba.
• an external force was applied to each of the manufactured piezoelectric coaxial sensors from the side surface over a length of 10 mm at a pressing pressure of 10 N, and the voltage generated between the center conductor 11 and the first outer conductor 13 was amplified 20 times and measured. The results are illustrated in FIG. 11 .
• FIG. 11 is a diagram illustrating a relationship with the measurement result of the voltage generated in the piezoelectric coaxial sensor when the set temperature of the heating furnace H is changed to 100°C, 110°C, 120°C, 130°C, and 140°C. As illustrated in FIG. 11 , it has been found that when the set temperature of the heating furnace is 120°C or lower, a sufficiently high voltage is obtained.
• the method for manufacturing the piezoelectric coaxial sensor of the present invention it is possible to manufacture a piezoelectric coaxial sensor in which deterioration of output characteristics is suppressed, and since the piezoelectric coaxial sensor of the present invention can be manufactured by heating at 120°C or lower, it is possible to provide a piezoelectric coaxial sensor in which deterioration of output characteristics is suppressed.
• a piezoelectric coaxial sensor in which deterioration of output characteristics is suppressed, a method for manufacturing the piezoelectric coaxial sensor are provided, and they are expected to be used in the field of device measurement or the like.

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• 2021
  • 2021-03-03 US US17/910,236 patent/US12543502B2/en active Active
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