EP3320122A1 - Alliage de laiton - Google Patents
Alliage de laitonInfo
- Publication number
- EP3320122A1 EP3320122A1 EP16736855.4A EP16736855A EP3320122A1 EP 3320122 A1 EP3320122 A1 EP 3320122A1 EP 16736855 A EP16736855 A EP 16736855A EP 3320122 A1 EP3320122 A1 EP 3320122A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- weight
- brass alloy
- proportion
- weight percent
- alloy according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 79
- 239000000956 alloy Substances 0.000 title claims abstract description 79
- 229910001369 Brass Inorganic materials 0.000 title claims abstract description 50
- 239000010951 brass Substances 0.000 title claims abstract description 50
- 229910052738 indium Inorganic materials 0.000 claims abstract description 30
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052742 iron Inorganic materials 0.000 claims description 25
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- 229910052718 tin Inorganic materials 0.000 claims description 18
- 229910052725 zinc Inorganic materials 0.000 claims description 18
- 238000005275 alloying Methods 0.000 claims description 17
- 229910052748 manganese Inorganic materials 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 229910052791 calcium Inorganic materials 0.000 claims description 15
- 239000013078 crystal Substances 0.000 claims description 15
- 239000002244 precipitate Substances 0.000 claims description 14
- 229910052793 cadmium Inorganic materials 0.000 claims description 13
- 229910052787 antimony Inorganic materials 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 229910052711 selenium Inorganic materials 0.000 claims description 11
- 229910052749 magnesium Inorganic materials 0.000 claims description 9
- 229910052745 lead Inorganic materials 0.000 claims description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- -1 0.03 to 0.06 % Inorganic materials 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 239000011701 zinc Substances 0.000 abstract description 16
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 13
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 2
- 229910001297 Zn alloy Inorganic materials 0.000 abstract description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 37
- 239000011133 lead Substances 0.000 description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- 229910052797 bismuth Inorganic materials 0.000 description 14
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 14
- 239000011135 tin Substances 0.000 description 14
- 239000010949 copper Substances 0.000 description 13
- 239000011572 manganese Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 10
- 239000011575 calcium Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 8
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 8
- 239000011777 magnesium Substances 0.000 description 8
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 7
- 238000000137 annealing Methods 0.000 description 7
- 230000008092 positive effect Effects 0.000 description 7
- 239000011669 selenium Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000011265 semifinished product Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 5
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 230000009931 harmful effect Effects 0.000 description 3
- 238000007670 refining Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 206010011906 Death Diseases 0.000 description 1
- 229910001340 Leaded brass Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000029142 excretion Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
Definitions
- the invention relates to a brass alloy with the features of the preamble of claim 1.
- Corresponding brass alloys are often produced as semi-finished products in strips, wire form, rods, sheets or plates and then further processed into finished products. The further processing takes place frequently by application of cutting operations.
- lead When machining brass, it has proven advantageous in the past to add lead to the alloy in an amount of up to four percent by weight.
- the lead has a positive effect as a chipbreaker, extends the tool life and reduces the cutting forces.
- Important material parameters such as strength and corrosion resistance are not adversely affected by lead addition.
- Object of the present invention is therefore to provide an alternative brass alloy, which has a good machinability, sufficient mechanical properties and causes the lowest possible wear on the cutting tools used.
- the brass alloy has an indium content of 0.005 to 1.0 weight percent and an addition of at least one of FE, Sn, Ni or Mn of 0.01, 3.0 percent by weight and no bismuth added ,
- indium makes the chip breaking properties of the brass alloy positive can be influenced, so that the processability of the brass alloy can be improved.
- the indium virtually replaces the previously used lead while achieving the same advantages, so that the lead content in the brass alloy can be reduced to zero in extreme cases, and the brass alloy can still be machined very well.
- the indium content is preferably 0.005 to 1.0 weight percent, whereby the benefits to be achieved can already be achieved.
- the indium content may be less than 0.25 weight percent, which already favorable structural properties can be achieved.
- the indium content should be chosen rather low, since indium is a relatively expensive element.
- the indium content should be chosen as low as possible, and the favorable structural properties can still be achieved, to which an indium content of at least 0.05 and not more than 0.25 percent by weight has been found to be useful.
- the brass alloy contains a proportion of zinc of 36.0 to 46 weight percent and the proportion of copper is between 54 and 64 weight percent.
- the alloy preferably has a mixed crystal with portions of an alpha microstructure or alpha / beta microstructure.
- a brass alloy of 100% pha microstructure is conceivable if the zinc content is close to or equal to 36% by weight.
- the proportion of copper may preferably be at most 60 percent by weight, and the zinc content may preferably be between 36 and 40 percent by weight, whereby a microstructure which is particularly favorable in terms of machinability can be achieved.
- a mixed structure with particularly good properties can be realized by the weight fraction of the beta-structure 20 to 80 weight percent, preferably 50 weight percent, is.
- At least one additional alloying component may be provided in a proportion of at most 3.0 percent by weight, the sum of the proportions of all additional alloying components being preferably at least 0.2 percent by weight.
- the proportion of copper is preferably 54 to 64.0 percent by weight, and the proportion of zinc is preferably about 42 percent by weight.
- the idea is based on the following approaches essential to the invention in order to achieve the desired material properties: a) The addition of indium has a positive effect on the chip-breaking properties. b) The microstructure is influenced by the proposed copper / zinc ratio such that an alpha / beta crystal mixture is present in which the proportion of beta phase is about 20 to 80%.
- a fourth advantage can be achieved by influencing the arrangement or orientation of the two phases alpha and beta and / or the precipitates, so as to adjust the processing properties specifically (eg by a combination of forming and heat treatment).
- the chip-breaking properties are deliberately achieved by the alloying additives and in particular by the indium, so that an addition of bismuth is deliberately not provided.
- the solution according to the invention has the advantage that the chipbreaking own properties instead of the avoidable components lead and bismuth are now achieved with alloying additives, which are far more harmless in terms of possible health damage.
- the precipitates contained in the microstructure support the machining behavior positively.
- the alpha microstructure of the mixed crystal forms a cubic face-centered spatial structure.
- the beta-mixed crystal structure forms a cubic-body-centered structure It proves to be particularly advantageous if the proportion of the beta structure is at least 50%. This is particularly supported by the fact that a zinc content of about 42 percent by weight is present.
- the elements iron and nickel have a regulative influence on the grain growth of the alpha and beta phase, with nickel additionally promoting the stabilization of the alpha structure. Too high levels lead to embrittlement of the alloy.
- the elements tin, silicon, manganese and iron stabilize and increase the proportion of the beta phase.
- phosphorus may be provided.
- a maximum proportion of phosphorus in the range of 0.1% by weight is intended.
- the content of copper is 54 to 64.0% by weight.
- a first additional alloying component is defined by the proportion of iron being from 0.05 to 0.5% by weight, preferably from 0.2 to 0.3% by weight. Iron is used to control the grain size of the alpha and beta hare. Contents less than 0.01% do not have a sufficient effect. Shares greater than 0.5% would lead to very large iron precipitates, which have a negative effect on the mechanical properties of the alloy.
- a second additional alloying component is defined by the proportion of nickel being 0.05 to 0.5 weight percent, preferably 0.2 to 0.3 percent by weight, which advantageously stabilizes the alpha phase.
- a third additional alloying component is defined by the proportion of silicon being from 0.01 to 0.20% by weight, preferably from 0.03 to 0.08% by weight. Silicon stabilizes the beta phase and, together with other elements, forms fine precipitates, which have a positive effect on the chipping behavior and are responsible for grain refining.
- a fourth additional alloying component is defined by the proportion of manganese being 0.01 to 0.20% by weight, preferably 0.03 to 0.08% by weight.
- Manganese stabilizes the beta phase and, together with other elements, forms fine precipitates, which have a positive effect on the chipping behavior and are responsible for grain fines, similar to the proposed additional alloy component silicon.
- a fifth additional alloy component is defined by the content of tin being 0.05 to 0.5% by weight, preferably 0.2 to 0.3% by weight.
- a sixth additional alloying component is defined by the proportion of Cr being from 0.01 to 0.2% by weight.
- calcium and / or magnesium may be additionally provided in a proportion of 0.05 to 1.0% by weight, respectively Phosphor leads to an improved corrosion resistance of the alloy, in particular, P also acts against dezincification.
- composition of the alloy it contributes that the proportion of elements other than copper, zinc, indium, iron, nickel, silicon, manganese, antimony, calcium, cadmium, selenium, magnesium, lead or tin is less than 0.2 Weight percent.
- a preferred embodiment of the alloy preferably has the following percentages by weight with respect to its composition. Copper in the range of 54% to 64%, zinc in the range of 36% to 40.5%, iron in the range of 0.1% to 0.5%, nickel in the range of 0.1% to 0.5%, Silicon in the range of 0.01% to 0.2%, manganese in the range of 0.01% to 0.2%, antimony, calcium, cadmium, magnesium and selenium in the range to 0.1%, and tin in the range from 0.1% to 0.5% and lead with a maximum content of 0.1%.
- the content of indium preferably has 0.005 to 0.5%.
- the lead content of the alloy also due to the use of scrap in the production of such alloys, is max. 0.1%.
- components of copper and / or zinc are optionally reduced.
- the proportion of copper is 57.0% to 57.5%, the proportion of zinc 41.9 to 42.5%, the proportion of nickel 0.2% to 0.3%, the proportion of Iron 0.2% to 0.3%, the proportion of silicon 0.03% to 0.08%, the proportion of manganese 0.03% to 0.08%, antimony, Kai cium, cadmium, magnesium and selenium in the Range up to 0.1% and the proportion of tin 0.2% to 0.3% and the proportion of Lead and indium less than 0.1% each.
- the sum of the weight proportions of all other possible components is not more than 0.2%.
- the proportion of copper is 54 to 58%, zinc 41 to 45%, nickel 0.2 to 0.3%, iron 0.2 to 0.3%, silicon 0.03 to 0.06% , Manganese 0.03 to 0.08%, calcium 0.3 to 0.5%, magnesium 0.6 to 0.9%, antimony ⁇ 0.1%, cadmium ⁇ 0.1%, selenium ⁇ 0.1 %, the sum of lead and indium ⁇ 0.1%, other components
- the lead content is in an interval of 0.005% to 0.1%.
- the indium content should also be 0.005% to 0.5%.
- the inventive relationship between the alpha-mixed crystal and the beta-mixed crystal the desired material properties can be achieved even at reduced lead or indium.
- the alpha-mixed crystal leads to a relatively good deformability of the alloy and gives this tough properties.
- the beta-mixed crystal is relatively poorly deformable and brittle. These properties are desirable for good machinability. Due to the inventive relation of the alpha and beta shares become thus giving the alloy sufficient toughness to aid ductility and sufficient brittleness to aid machinability.
- a preferred production process can be carried out such that initially a hot working (eg hot rolling or extrusion) in a temperature range of 600 to 750 ° C is performed. It is thereby produced a structure having a proportion of the beta mixed crystal of about 50 weight percent.
- a hot working eg hot rolling or extrusion
- an intermediate annealing with a temperature of about 400 to 600 ° C. is carried out after a first forming step.
- The> intermediate annealing leads to a recrystallization tion and thus to a grain new formation. As a result, a fine-grained microstructure is supported.
- the brass alloy of copper and zinc with a lead content of 0.005 to 0.1%, an indium content of 0.005 to 0.5% and with at least one further alloying component.
- This additional alloying component influences the microstructure of the mixed crystal in order to achieve the respective desired material properties depending on the application.
- Another preferred embodiment is provided in terms of weight percent by the following alloy.
- the brass alloy according to the invention is used for the production of so-called semi-finished products which are subjected to at least one additional processing step.
- the semi-finished products are typically produced by a casting process. Typical embodiments of such semi-finished products are tapes, wires, profiles and / or rods.
- the further processing step includes at least one machining operation. Likewise, the further processing step may comprise a combination of shaping and machining.
- the shaping can be carried out both at room temperature and at an elevated temperature. At the elevated temperatures, a warm temperature of up to about 450 ° C and a hot working temperature in a range of 600 ° C to 850 ° C can be distinguished.
- the addition of the alloying elements iron, nickel, magnesium, calcium or chromium precipitates can be produced in the solid solution, which in turn favor the chip breaking in a subsequent mechanical processing, so that these alloying ingredients have a similar beneficial effect as previously used and where possible have avoiding lead.
- the chip breaking can be favorably influenced in particular by a specific ratio of the alloy constituents iron and tin, since the ratio of these two alloy constituents to one another particularly promotes the formation of the precipitates.
- a favorable ratio of iron to tin would be, for example, 1.0 to 1.2.
- the formation of the precipitates or grain refining and thus chip breaking can be favorably influenced if the brass alloy contains chromium in an amount of 0.01 to 0.2 percent by weight and / or calcium and / or magnesium in an amount of 0 in each case , 0.05 to 1.0 percent by weight is added.
- the proportion of bismuth is equal to 0.0 percent, ie the brass alloy is free of bismuth.
- the chip-breaking properties are achieved solely by the indium content and the other alloying constituents, such as iron, tin, nickel, manganese, magnesium, calcium or chromium.
- This is desirable because bismuth should be avoided as far as possible on account of its health-damaging properties or should at least be used in the least possible amount.
- the proportion of bismuth in the brass alloy according to the invention is already limited to a maximum value of 0.1 percent by weight, wherein it is desirable to keep the proportion of bismuth as low as possible. So it is possible, for example, that a small amount of bismuth through the use of contaminated scrap into the brass alloy.
- This proportion of actually unwanted bismuth is used by the inventive solution equal to the formation of precipitates and grain refining and thus to positively influence the Zerspanungs s, and it can be dispensed at least on the previously used also harmful lead in the alloy. If the proportion of bismuth can not be completely reduced to 0.0, for example due to impurities of added scrap, the proportion should preferably not exceed a maximum value of ⁇ 0.003 percent by weight. Alternatively, however, a lead content of not more than 0.1 percent by weight may be provided in this case in order to set the desired chip breaking. In any case, no bismuth is actively added to the brass alloy according to the invention, but it is instead only accepted if it is unavoidable for technical reasons. However, as it may well have positive effects on the material properties of the brass alloy, despite its harmful properties, even very small quantities can be accepted.
- the structural properties in particular the formation of the needle-like beta phase, by pressing or pulling or at least to reinforce the formation of the beta phase or to emboss it in a desired direction.
- the pressing, annealing, and drawing operations in this order, or pressing, drawing, annealing, drawing, the appearance of a more globular morphology of the beta phase in the solid solution may be promoted, with the size of the grains and constituents of the beta phase passing through the selected process temperature can be adjusted during annealing, pressing or drawing. The higher the process temperature, the larger the grains and the coarser the microstructure.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Contacts (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RS20201316A RS61025B1 (sr) | 2015-07-10 | 2016-07-07 | Legura mesinga |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015212937.3A DE102015212937A1 (de) | 2015-07-10 | 2015-07-10 | Messinglegierung |
PCT/EP2016/066143 WO2017009176A1 (fr) | 2015-07-10 | 2016-07-07 | Alliage de laiton |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3320122A1 true EP3320122A1 (fr) | 2018-05-16 |
EP3320122B1 EP3320122B1 (fr) | 2020-08-12 |
Family
ID=56404110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16736855.4A Active EP3320122B1 (fr) | 2015-07-10 | 2016-07-07 | Alliage de laiton |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3320122B1 (fr) |
DE (1) | DE102015212937A1 (fr) |
ES (1) | ES2828578T3 (fr) |
PT (1) | PT3320122T (fr) |
RS (1) | RS61025B1 (fr) |
WO (1) | WO2017009176A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202018104958U1 (de) | 2018-08-30 | 2018-09-12 | Harting Electric Gmbh & Co. Kg | Steckverbinder mit Komponenten aus verbessertem Material |
EP3971312A1 (fr) | 2020-09-17 | 2022-03-23 | Société BIC | Alliage de laiton pour pointes d'instrument d'écriture |
DE102020128955A1 (de) | 2020-11-03 | 2022-05-05 | Aurubis Stolberg Gmbh & Co. Kg | Messinglegierung |
DE102021102120A1 (de) * | 2021-01-29 | 2022-08-04 | HME Brass Germany GmbH | Messinglegierung und Verfahren zum Herstellen eines Halbzeugs aus dieser Messinglegierung |
DE102021103686A1 (de) | 2021-02-17 | 2022-08-18 | Diehl Metall Stiftung & Co. Kg | Messinglegierung |
DE102021119474A1 (de) | 2021-07-27 | 2023-02-02 | Diehl Brass Solutions Stiftung & Co. Kg | Blei- und Antimonfreie Messinglegierung |
CN113981269B (zh) * | 2021-10-29 | 2022-10-04 | 宁波金田铜业(集团)股份有限公司 | 一种黄铜合金及其制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4110132A (en) * | 1976-09-29 | 1978-08-29 | Olin Corporation | Improved copper base alloys |
JPS62274036A (ja) * | 1986-05-23 | 1987-11-28 | Nippon Mining Co Ltd | 耐磨耗性及び耐食性に優れた銅合金 |
JPH0368733A (ja) * | 1989-08-08 | 1991-03-25 | Nippon Mining Co Ltd | ラジエータープレート用銅合金および銅合金材の製造法 |
JPH04120229A (ja) * | 1990-09-10 | 1992-04-21 | Sumitomo Metal Mining Co Ltd | Inが添加された耐腐食性に優れる黄銅 |
JPH04120231A (ja) * | 1990-09-10 | 1992-04-21 | Sumitomo Metal Mining Co Ltd | InとSbとPが添加された耐腐食性に優れる黄銅 |
JPH04120230A (ja) * | 1990-09-10 | 1992-04-21 | Sumitomo Metal Mining Co Ltd | InとSbが添加された耐腐食性に優れる黄銅 |
JPH04236735A (ja) * | 1991-01-14 | 1992-08-25 | Sumitomo Metal Mining Co Ltd | In、Mg及びPが添加された耐腐食性に優れる黄銅 |
US5137685B1 (en) * | 1991-03-01 | 1995-09-26 | Olin Corp | Machinable copper alloys having reduced lead content |
US5360591A (en) * | 1993-05-17 | 1994-11-01 | Kohler Co. | Reduced lead bismuth yellow brass |
DE102009038657A1 (de) * | 2009-08-18 | 2011-02-24 | Aurubis Stolberg Gmbh & Co. Kg | Messinglegierung |
-
2015
- 2015-07-10 DE DE102015212937.3A patent/DE102015212937A1/de active Pending
-
2016
- 2016-07-07 ES ES16736855T patent/ES2828578T3/es active Active
- 2016-07-07 WO PCT/EP2016/066143 patent/WO2017009176A1/fr active Application Filing
- 2016-07-07 EP EP16736855.4A patent/EP3320122B1/fr active Active
- 2016-07-07 PT PT167368554T patent/PT3320122T/pt unknown
- 2016-07-07 RS RS20201316A patent/RS61025B1/sr unknown
Also Published As
Publication number | Publication date |
---|---|
RS61025B1 (sr) | 2020-12-31 |
DE102015212937A1 (de) | 2017-01-12 |
WO2017009176A1 (fr) | 2017-01-19 |
EP3320122B1 (fr) | 2020-08-12 |
PT3320122T (pt) | 2020-11-03 |
ES2828578T3 (es) | 2021-05-26 |
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