WO2014154191A1 - Alliage de cuivre - Google Patents

Alliage de cuivre Download PDF

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Publication number
WO2014154191A1
WO2014154191A1 PCT/DE2014/000084 DE2014000084W WO2014154191A1 WO 2014154191 A1 WO2014154191 A1 WO 2014154191A1 DE 2014000084 W DE2014000084 W DE 2014000084W WO 2014154191 A1 WO2014154191 A1 WO 2014154191A1
Authority
WO
WIPO (PCT)
Prior art keywords
max
tellurium
copper alloy
sulfur
copper
Prior art date
Application number
PCT/DE2014/000084
Other languages
German (de)
English (en)
Inventor
Hark Schulze
Dirk Rode
Original Assignee
Kme Germany Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kme Germany Gmbh & Co. Kg filed Critical Kme Germany Gmbh & Co. Kg
Publication of WO2014154191A1 publication Critical patent/WO2014154191A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Definitions

  • the invention relates to a copper alloy with the features in the preamble of claim 1 and the use of such a copper alloy with the features of claim. 9
  • copper with the exception of silver, has the lowest electrical resistance of all known metals, copper alloys are preferred and used for electrical contact components merely because of the frequency of copper and the associated price advantage over silver.
  • Such contact components include, for example, mechanically connectable and separable fasteners and crimp connections.
  • Copper alloys such as CuNi1, 5Si (C19010), CuNi2SiZn (C64725) and CuNi3Si (C70250) are primarily used for plug-in contacts, as these have a high relaxation resistance.
  • the aforementioned copper alloy have a poor machinability, so that they are not or only poorly suited for the production of contact components by machining.
  • the alloys used in the prior art also sometimes contain components of lead (Pb) or beryllium (Be), so that these copper alloys can not be safely used for all applications due to the known toxicity of these alloying elements.
  • Pb lead
  • Be beryllium
  • the invention has for its object to provide a both relaxation-resistant and machinable copper alloy available, which is free of the alloying elements beryllium and lead. Furthermore, the use of such a relaxation-resistant and machinable as well as lead and beryllium-free copper alloy for products to be produced from it is to be shown.
  • a copper alloy is proposed, with proportions in weight%
  • Nickel (Ni) 0.50 - 4.0 In order to achieve the required machinability, fractions are still involved in the formation of chip-breaking phases
  • the alloy is free of beryllium (Be) and lead (Pb) to avoid toxic properties.
  • sulfur (S) or tellurium (Te) may be added alone or in combination within the stated limits.
  • the alloy is free of beryllium (Be) and lead (Pb) to avoid toxic properties.
  • the copper alloy contains to improve the respective required properties:
  • the above group are optional alloying elements. If necessary, they can be included individually or in combination within the specified limits.
  • the alloy contains copper (Cu) as the remainder and may contain common impurities caused by melting.
  • the copper alloy according to the invention combines good machinability and high relaxation resistance. Especially with respect to lead (Pb), it has been found that its addition of not more than 0.1% does not improve the machinability. When lead is added, the risk of hot cracking predominates due to lead smelting on the grain boundaries of the crystallites.
  • the machinability of the copper materials known in the art is usually due to the addition of lead (Pb) in metallic form.
  • Manganese (Mn) acts as a hardening agent and serves as a deoxidizer within the copper alloy. Furthermore, by manganese (Mn), the grain of the copper alloy can be refined.
  • S Sulfur
  • Mn Manganese
  • the copper alloy according to the invention has a good electrical conductivity, which ranges from 24 MS / m for example CuNi3SiS or CuNi3SiTe to 32 MS / m for example CuNMSiS or CuNMSiTe depending on the investigated composition.
  • Advantageous developments of the inventive concept are the subject of the dependent claims 2 to 8.
  • the alloy components of the above group may be contained in a range of 0.01 - 2.50 wt% each with respect to zinc (Zn) and tin (Sn).
  • Manganese (Mn) may be contained in a range of 0.01-0.80%.
  • the proportions of aluminum (Al), boron (B), chromium (Cr), iron (Fe) and magnesium (Mg), silver (Ag) and zirconium (Zr) can each be 0.01% -0.5% ,
  • Phosphorus (P) may be included in a range of 0.001% -0.05%.
  • phosphorus (P) and / or boron (B) serve to counteract the hydrogen disease.
  • the oxygen dissolved in the copper mixed crystal is bound thereto by the addition of phosphorus (P) and / or boron (B).
  • Phosphorus (P) and / or boron (B) act as deoxidizers.
  • phosphorus (P) prevents the oxidation of individual alloying elements. Moreover, the flow properties of the copper alloy during casting can also be improved by the addition of phosphorus (P).
  • Aluminum (Al) is an alloying element which can improve the strength, machinability and wear resistance of the copper alloy at high temperatures. Incidentally, this also applies to an improvement in the oxidation resistance of the copper alloy by the addition of aluminum (Al).
  • the addition of chromium (Cr) and magnesium (Mg) also serves to improve the oxidation resistance of the copper alloy at high temperatures. Particularly good results are observed in this context when chromium (Cr) and magnesium (Mg) are added in combination with aluminum (Al). In this way, an advantageous synergy effect of these components can be achieved.
  • Iron (Fe) generally serves to increase the corrosion resistance of the copper alloy.
  • Zircon (Zr) can improve the hot workability of the copper material according to the invention.
  • Zinc (Zn) improves the adhesion of the tin-plating or improves the resistance to the peel-off behavior of peelings.
  • Tin (Sn) can further increase the solid solution hardening of the copper alloy according to the invention.
  • S and / or tellurium (Te) as chip breakers may preferably be combined with manganese (Mn).
  • Sulfur and manganese form manganese sulfides, which increase the machinability towards copper sulfides.
  • the copper alloy preferably has, for the alloying elements Si, Ni, S, Te and Mn, the following alternative compositions, each with the remainder of copper and melting-related impurities:
  • Tellurium (Te) 0.15-0.85 and each optionally with
  • Manganese (Mn) 0.10 - 0.40 0.10 - 0.40.
  • Chip forming class of the copper alloy according to the invention Chip forming class of the copper alloy according to the invention.
  • FIG. 2 Examination results on the copper alloys CuSP, CuTeP and CuSMn with a view to the chip forming classes by mechanical processing in the form of external longitudinal rotation with variation of the cutting speed;
  • FIG. 3 shows the examination results on the materials from FIG. 2 with respect to the chipform classes in the case of variants of the depth of cut;
  • FIG. 4 shows the results of the chipforming classes of FIGS. 2 and 3 in FIG.
  • Figure 5 is a tabular overview of the material properties of individual im
  • FIG. 6 shows a microsection through the microstructure of the copper alloy CuSP known in the prior art
  • FIG. 7 shows a microsection through the microstructure of the copper alloy CuTeP known in the prior art
  • FIG. 8 shows a further microsection through the microstructure of the copper alloy CuSMn known in the prior art
  • FIG. 9 shows a microsection through the microstructure of the copper alloy CuNi2.5Si known in the prior art
  • FIG. 10 shows an illustration of the mechanical processing of the
  • FIG. 12 shows an illustration of the chip formation resulting from the mechanical processing of the copper alloy according to the invention from FIG. 11;
  • FIG. 13 Diagram for variation of the Ni and Si contents at a constant content of the chipbreaker S or S + Mn and / or Te and
  • FIG. 14 Diagram for varying the contents of the chipbreaker S or S + Mn and / or Te at a constant content of the base elements Ni and Si.
  • FIG. 1 shows a steel-iron test sheet 1178-90 in order to relate the chip configurations of the chips resulting from machining to the group investigated in the present case.
  • the resulting chip image was classified into one of eight chipforming classes (1 - 8), as can be seen in the first column, to the left of the chips shown schematically.
  • the individual chip images are associated with appropriate terminology according to their design, ranging from "band chips" to "shavings".
  • the chip space number R is listed, which indicates the relationship between the space requirement of a disordered chip quantity (V span ) and the material volume of the same chip quantity (V).
  • V span disordered chip quantity
  • V material volume of the same chip quantity
  • chipforming classes and the respective chip space numbers R are given a judgment in the rightmost column in FIG. 1, the chipforming classes 7 and 8 having their respective chip space number R being classified as “usable” while the chipforming classes 5 and 6 are combined with their respective chip space numbers R are judged to be "good”. On the other hand, the remaining chip forming classes 1 to 4 in connection with their respective chip space number R are classified as "unfavorable", with a smooth transition to "good” occurring in chipform classes 3 and 4.
  • Figure 2 shows the results of mechanical working of the examined group of known copper alloys with respect to the resulting chip forming classes in external longitudinal turning of a workpiece thereof.
  • the results presented in FIG. 2 are based on a constant cutting depth a p of 1.5 mm and a feed f of 0.2 mm.
  • the respective cutting speed V c was varied from 450 m / min (v c1 ) to 150 m / min (v c2 ).
  • the respective chip form classes of the materials from the group (CuSP, CuTeP and CuSMn) are all between 3 and 5.
  • the resulting chip images are also shown schematically in the present table. For better clarity, they are each assigned a single line for 20mm as a reference in order to be able to better estimate the results in the form of the chip sizes set during the examination.
  • FIG. 3 shows the results of further processing steps of the group from FIG. 2.
  • v c 450 m / min
  • a p of 1.5 mm (a p i) after 0.75 mm (a P 2 ) varies.
  • f 0.2 mm
  • the chip form class in particular of the copper alloy CuSMn, thus remains constant both in the case of variation of the cutting speed and in the case of variation of the cutting depth in the respectively present areas.
  • the group of investigated copper alloys also moves with variation of the cutting depth a p in a range of chipforming classes 3 to 5.
  • the reference value used was the well-known copper alloy CuZn39Pb3, which is considered to be the main alloy for machining, especially in Germany. Said copper alloy is used everywhere, where it increasingly depends on a cutting and cutting shaping. In connection with the CuZn39Pb3 copper alloy used herein as reference, its machinability is assumed to be 100%.
  • pure copper material achieves a stress index of 20% to a maximum of 30%.
  • chip-breaking elements such as sulfur (S), tellurium (Te), sulfur (S) and manganese (Mn), and lead (Pb).
  • FIG. 5 shows a tabular comparison of the materials contained therein with respect to their respective material properties.
  • the present table in FIG. 5 is constructed in such a way that it reflects the approximate production costs of the individually listed materials, starting with the cheapest material at the top.
  • the copper alloy according to the invention with the orders of magnitude of their individual alloy components listed there again, more specifically CuNM, 5Si0.2S0.35.
  • this copper alloy has a high 0.2% proof strength and tensile strength R m in direct comparison with the other materials.
  • the alloy according to the invention has a very high relaxation resistance, which is indicated in the table by "+++” and thus is usually clearly superior to the particular relaxation resistance of the other materials listed similarly good relaxation resistance, however, has a significantly poorer machinability of only 25% compared to the copper alloy according to the invention CuNM, 5Si0.2S0.35 on.
  • the determination of the mechanical characteristic values for the present table was carried out according to DIN ISO 6892-1.
  • the respective sample shape corresponded to the form A according to DIN 50125.
  • the respective conductivity was determined using a Sigmatester from Förster.
  • the respective relaxation behavior was extrapolated on the basis of internal measurements on the related materials, which, however, compared to the copper alloy of the invention contained no chip-breaking elements according to the invention.
  • FIGS. 6 to 9 each show a micrograph of the microstructures from the group of individual copper materials underlying the investigations.
  • FIG. 6 shows the material CuSP with its arrangement of the chip-breaking elements. Its microstructure shows in part closely spaced and each dark copper sulfides, which serve here as a chip breaker.
  • FIG. 7 shows the material CuTeP, which in its microstructure contains darkened copper cell fluorates as chip breakers. These are in their arrangement largely isolated and further apart.
  • FIG. 8 shows the microstructure of the material CuSMn, which contains manganese sulphides as a chip breaker.
  • CuSMn has a high cutting index with a mostly good chipforming class, which is due to the uniform distribution of its chipbreakers shown in FIG.
  • FIG. 9 shows the etched microstructure of this standardized material CuNi2.5Si (C1800) without chip-breaking phases.
  • nickel silicides are present.
  • the nickel silicides have no chipbreaking effect.
  • machining the material unfavorably long chips (Fig. 10) which can wrap around the chip tools and can cause the stoppage of a lathes.
  • FIG. 11 shows the microstructure of the material according to the invention CuNi1, 5Si0.2S0.35. This also has copper sulfide as a chip breaker. As can be seen, this one of the copper material CuSMn shown in Figure 8 has similar good distribution of its chip breaker, which manifests itself in a good machinability.
  • FIG. 12 shows the chip formation after the mechanical processing of the copper material CuNi1, 5Si0.25S0.35 according to the invention from FIG. 9.
  • CuNi1, 5Si0.25S0.35 On the basis of the microstructure of FIG. 9 and the chipform class of the present material CuNM, 5Si0.25S0.35 in comparison with the investigations on the previous ones Materials CuSP, CuTeP and CuSMn can be concluded to a Zerhovsindex greater than 70%.
  • the copper alloy according to the invention has both a sufficient cold workability and a very good hot workability.
  • the invention is also directed to the use of such a copper alloy for the production of a product to be machined according to claim 9.
  • the invention is directed to the use of such a copper alloy for the production of a non-cutting to be manufactured semi-finished product according to claim 10.
  • This may in particular be a rolled, pressed, drawn, forged or cast product.
  • rods and wires can be delivered from press and pull sequences as semi-finished products.
  • FIG. 13 shows a diagram for varying the contents of Ni and Si at a constant content of the chipbreaker S or S + Mn and / or Te
  • FIG. 14 shows a diagram for varying the contents of the chipbreaker S or S + Mn and / or Te at constant Content of the basic elements Ni and Si.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

L'invention concerne un alliage de cuivre comportant, en termes de proportions exprimées en pourcentage en poids, du silicium (Si) 0,10-2,0, du nickel (Ni) 0,50-4,0 ainsi que 1.1) du soufre (S) 0,10-0,80 ou 1.2) du tellure (Te) 0,10-1,00 ou 1.3) du soufre (S) 0,10-0,80, du tellure (Te) 0,10-1,00, ledit alliage étant dans tous les cas exempt de béryllium (Be) et de plomb (Pb) alors qu'il contient sélectivement du phosphore (P) max. 0,05, de l'aluminium (Al) max.0,50, du bore (B) max.0,50, du chrome (Cr) max.0,50, du fer (Fe) max.0,50, du magnésium (Mg) max.0,50, du manganèse (Mn) max.0,80, de l'argent (Ag) max.0,50, du zirconium (Zr) max.0,50, du zinc (Zn) max.2,50, de l'étain (Sn) max.2,50, le reste étant du cuivre ainsi que des impuretés résultant des procédés métallurgiques.
PCT/DE2014/000084 2013-03-26 2014-03-04 Alliage de cuivre WO2014154191A1 (fr)

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DE102013005158.4 2013-03-26
DE201310005158 DE102013005158A1 (de) 2013-03-26 2013-03-26 Kupferlegierung

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104313388A (zh) * 2014-10-29 2015-01-28 王健英 一种铜合金
CN107263029A (zh) * 2017-06-23 2017-10-20 扬中市第蝶阀厂有限公司 一种耐腐蚀铜合金阀体制造工艺
CN113502408A (zh) * 2021-06-17 2021-10-15 四川科派新材料有限公司 一种含碲镍的高导铜合金及其制备方法
CN115404379A (zh) * 2022-08-29 2022-11-29 江阴电工合金股份有限公司 一种高稳定低导电硅合金铜的制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107497880B (zh) * 2017-08-17 2019-04-05 南京禹智智能科技有限公司 一种碲硒铜棒的生产方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1224937B (de) * 1963-06-07 1966-09-15 Kurt Dies Dr Ing Verwendung von Kupferlegierungen fuer auf Gleitung, Reibung und Verschleiss beanspruchte Gegenstaende und Verfahren zur Herstellung derselben
USRE30854E (en) * 1977-12-30 1982-01-26 Bell Telephone Laboratories, Incorporated Free machining Cu--Ni--Sn alloys
JPS62253743A (ja) * 1986-04-24 1987-11-05 Daido Steel Co Ltd 快削無酸素銅
JPH10152737A (ja) * 1996-11-25 1998-06-09 Hitachi Cable Ltd 銅合金材及びその製造方法
JP2004307905A (ja) * 2003-04-03 2004-11-04 Sumitomo Metal Ind Ltd Ｃｕ合金およびその製造方法
JP2007146293A (ja) * 2006-11-20 2007-06-14 Nikko Kinzoku Kk Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条
DE102006019826B3 (de) * 2006-04-28 2007-08-09 Wieland-Werke Ag Bandförmiger Werkstoffverbund und dessen Verwendung, Verbundgleitelement
EP2128282A1 (fr) * 2007-02-16 2009-12-02 Kabushiki Kaisha Kobe Seiko Sho Feuille d'alliage de cuivre pour pièces électriques et électroniques excellente en termes de résistance mécanique et d'aptitude au formage
EP2557187A1 (fr) * 2010-04-07 2013-02-13 Furukawa Electric Co., Ltd. Alliage de cuivre corroyé, partie d'alliage de cuivre et procédé de production d'un alliage de cuivre corroyé

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1224937B (de) * 1963-06-07 1966-09-15 Kurt Dies Dr Ing Verwendung von Kupferlegierungen fuer auf Gleitung, Reibung und Verschleiss beanspruchte Gegenstaende und Verfahren zur Herstellung derselben
USRE30854E (en) * 1977-12-30 1982-01-26 Bell Telephone Laboratories, Incorporated Free machining Cu--Ni--Sn alloys
JPS62253743A (ja) * 1986-04-24 1987-11-05 Daido Steel Co Ltd 快削無酸素銅
JPH10152737A (ja) * 1996-11-25 1998-06-09 Hitachi Cable Ltd 銅合金材及びその製造方法
JP2004307905A (ja) * 2003-04-03 2004-11-04 Sumitomo Metal Ind Ltd Ｃｕ合金およびその製造方法
DE102006019826B3 (de) * 2006-04-28 2007-08-09 Wieland-Werke Ag Bandförmiger Werkstoffverbund und dessen Verwendung, Verbundgleitelement
JP2007146293A (ja) * 2006-11-20 2007-06-14 Nikko Kinzoku Kk Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条
EP2128282A1 (fr) * 2007-02-16 2009-12-02 Kabushiki Kaisha Kobe Seiko Sho Feuille d'alliage de cuivre pour pièces électriques et électroniques excellente en termes de résistance mécanique et d'aptitude au formage
EP2557187A1 (fr) * 2010-04-07 2013-02-13 Furukawa Electric Co., Ltd. Alliage de cuivre corroyé, partie d'alliage de cuivre et procédé de production d'un alliage de cuivre corroyé

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"COPPER AND ITS ALLOYS", 1 January 1992, ELLIS HORWOOD LIMITED, Chichester, ISBN: 978-0-85-312505-1, article E G WEST: "COPPER AND ITS ALLOYS", pages: 84 - 85, XP055129795 *
COHEN, ARTHUR: "Copper and Copper Alloys", ASTM STANDARDIZATION NEWS MARCH 1990, 1 March 1990 (1990-03-01), pages 44 - 49, XP009179154 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104313388A (zh) * 2014-10-29 2015-01-28 王健英 一种铜合金
CN107263029A (zh) * 2017-06-23 2017-10-20 扬中市第蝶阀厂有限公司 一种耐腐蚀铜合金阀体制造工艺
CN113502408A (zh) * 2021-06-17 2021-10-15 四川科派新材料有限公司 一种含碲镍的高导铜合金及其制备方法
CN113502408B (zh) * 2021-06-17 2022-06-07 四川科派新材料有限公司 一种含碲镍的高导铜合金及其制备方法
CN115404379A (zh) * 2022-08-29 2022-11-29 江阴电工合金股份有限公司 一种高稳定低导电硅合金铜的制备方法

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