EP3041966B1 - Alliage de cuivre, que contient de fer et phosphore - Google Patents

Alliage de cuivre, que contient de fer et phosphore Download PDF

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Publication number
EP3041966B1
EP3041966B1 EP14809274.5A EP14809274A EP3041966B1 EP 3041966 B1 EP3041966 B1 EP 3041966B1 EP 14809274 A EP14809274 A EP 14809274A EP 3041966 B1 EP3041966 B1 EP 3041966B1
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EP
European Patent Office
Prior art keywords
copper alloy
copper
max
chip
manganese
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP14809274.5A
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German (de)
English (en)
Other versions
EP3041966A2 (fr
Inventor
Hark Schulze
Dirk Rode
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KME Special Products GmbH and Co KG
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KME Germany GmbH
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Priority to PL14809274T priority Critical patent/PL3041966T3/pl
Publication of EP3041966A2 publication Critical patent/EP3041966A2/fr
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent

Definitions

  • the invention relates to a copper alloy having the features in the preamble of claim 1 and the use of such a copper alloy according to the features of claim 7 or 8.
  • copper with the exception of silver, has the lowest electrical resistance of all known metals, copper alloys are preferred and used for electrical contact components merely because of the frequency of copper and the associated price advantage over silver.
  • Such contact components include, for example, mechanically connectable and separable fasteners and crimp connections.
  • Copper alloys such as CuFe0.1P (C19210) and CuFe2P (C19400) are mainly used for plug-in contacts, as they have a high solid solution and medium relaxation resistance. In contrast, the aforementioned copper alloys have a poor machinability, so that they are not or only badly suitable for the production of contact components by machining.
  • the alloys used in the prior art also sometimes contain components of lead (Pb) or beryllium (Be), so that these copper alloys can not be safely used for all applications due to the known toxicity of these alloying elements.
  • Pb lead
  • Be beryllium
  • a copper-Cu alloy which contains 0.68% Fe and 0.38% Mn, 0.20% P, remainder copper.
  • a Cu alloy is described which contains 0.021% P, 0.07% Fe, 0.0045% Ni, 1.59% Zn, 0.006% Cr, 0.003% As, 0.06% S and balance copper contains.
  • the invention has for its object to provide a both relaxation-resistant and machinable copper alloy available, which is free of the alloying elements beryllium and lead. Furthermore, the use of such a relaxation-resistant and machinable as well as lead and beryllium-free Copper alloy for non-cutting to produce semifinished products and resulting machined products are shown.
  • a copper alloy is proposed, with proportions in weight% Iron (Fe) 0.07 - 4.00 Phosphorus (P) 0.015 - 0.50 Sulfur (S) 0.10 - 0.80
  • At least one element from the following group is furthermore contained for the formation of chip-breaking phases: Manganese (Mn) 0.01 - 0.80 Tellurium (Te) 0.10 - 1.00
  • the alloy is free of beryllium (Be) and lead (Pb) to avoid toxic properties.
  • manganese (Mn) or tellurium (Te) may be contained alone or in combination within the specified limits.
  • the copper alloy contains to improve the respective required properties: Aluminum (AI) Max. 0.50 Chrome (Cr) Max. 0.50 Magnesium (Mg) Max. 0.50 Zircon (Zr) Max. 0.50 Zinc (Zn) Max. 2.50 Tin (Sn) Max. 2.50 Boron (B) Max. 0.50 Silver (Ag) Max. 0.50
  • the aforementioned group are optional alloying elements. If necessary, they can be included individually or in combination within the specified limits.
  • the alloy contains copper (Cu) as the remainder and may contain common impurities caused by melting.
  • the copper alloy according to the invention combines good machinability and high relaxation resistance. Especially with respect to lead (Pb), it has been found that its addition of not more than 0.1% does not improve the machinability. In the case of lead addition, the hot cracking risk is predominated by lead smelting on the grain boundaries of the crystallites. This is remarkable because in the case of the copper materials known in the prior art, the improvement in machinability is generally attributable to the addition of lead (Pb) in metallic form.
  • Phosphorus (P) forms iron phosphide precipitates with iron (Fe).
  • Iron (Fe) generally serves to increase the corrosion resistance of the copper alloy.
  • the machinability of the alloy according to the invention is also improved without the addition of lead (Pb) by forming chip-breaking phases.
  • Manganese (Mn) acts as a hardening agent and serves as a deoxidizer within the copper alloy. Furthermore, by manganese (Mn), the grain of the copper alloy can be refined.
  • S Sulfur
  • Mn Manganese
  • the copper alloy according to the invention has good electrical conductivity, which, depending on the composition tested, reaches up to 52 MS / m for CuFe0.02PS.
  • the alloy components of the above group may be contained in a range of 0.01 - 2.50 wt% each with respect to zinc (Zn) and tin (Sn).
  • amounts of aluminum (Al), boron (B), chromium (Cr), magnesium (Mg), silver (Ag), and zircon (Zr) may each be 0.01% - 0.5% by weight.
  • Phosphorus (P) and boron (B) have the property of counteracting hydrogen disease.
  • the oxygen dissolved in the copper mixed crystal is bound to these alloying elements by the addition of phosphorus (P) and optionally boron (B).
  • Phosphorus (P) and boron (B) act as deoxidizers.
  • phosphorus (P) prevents the oxidation of individual alloying elements. Moreover, the tile properties of the copper alloy during casting can be improved by adding phosphorus (P).
  • Aluminum (Al) is an alloying element by which the strength, machinability and wear resistance of the copper alloy at high temperatures can be improved. Incidentally, this also applies to the improvement of the oxidation resistance of the copper alloy.
  • chromium (Cr) and magnesium (Mg) also serves to improve the oxidation resistance of the copper alloy at high temperatures. Particularly good results are observed in this context when chromium (Cr) and magnesium (Mg) are added in combination with aluminum (Al). In this way, an advantageous synergy effect of these components can be achieved.
  • Zircon (Zr) can improve the hot workability of the copper material according to the invention.
  • Zinc (Zn) improves the adhesion of the tin-plating or improves the resistance to the peel-off behavior of peelings.
  • Tin (Sn) can further increase the solid solution hardening of the copper alloy according to the invention.
  • S and Te as chip breakers may preferably be combined with manganese (Mn).
  • Sulfur and manganese form manganese sulfides, which increase the machinability towards copper sulfides.
  • compositions in relation to the alloying elements phosphorus (P), sulfur (S), manganese (Mn) and tellurium (Te) are given, wherein in addition the other alloying elements specified in claim 1 may be contained in the copper alloy.
  • FIG. 1 A steel iron test sheet 1178-90 is given to refer to the resulting in the machining machining embodiments of the chips analogously to the group under investigation.
  • the resulting chip image was classified into one of eight chipforming classes (1 - 8), as can be seen in the first column, to the left of the chips shown schematically.
  • the individual chip images are associated with appropriate terminology according to their design, ranging from “band chips” to "shavings”.
  • the chip space number R is listed, which indicates the relationship between the space requirement of a disordered chip quantity (V span ) and the material volume of the same chip quantity (V).
  • V span disordered chip quantity
  • V material volume of the same chip quantity
  • the chipform classes and the respective chip space numbers R are in the far right column in FIG. 1 judging the chip forming classes 7 and 8 with their respective chip space R as “usable”, while the chip forming classes 5 and 6 are judged in combination with their respective Spanraumhot R as "good”. On the other hand, the remaining chip forming classes 1 to 4 in connection with their respective chip space number R are classified as "unfavorable", with a smooth transition to "good” occurring in chipform classes 3 and 4.
  • FIG. 2 Figure 3 shows the results of mechanical working of the examined group of known copper alloys with respect to the resulting chip forming classes in outboard turning of a workpiece thereof.
  • FIG. 2 present results are based on a constant depth of cut a p of 1.5 mm and a feed f of 0.2 mm.
  • the respective cutting speed v c was varied from 450 m / min (v c1 ) to 150 m / min (v c2 ).
  • the respective chip form classes of the materials from the group (CuSP, CuTeP and CuSMn) are all between 3 and 5.
  • the resulting chip images are also shown schematically in the present table. For better clarity, they are each assigned a single line for 20mm as a reference in order to be able to better estimate the results in the form of the chip sizes set during the examination.
  • FIG. 3 shows the results of further processing steps of the group FIG. 2 .
  • v c 450 m / min
  • the respective cutting depth a p was varied from 1.5 mm (a p1 ) to 0.75 mm (a p2 ).
  • a constant feed rate of f 0.2 mm was observed.
  • FIG. 3 shows that the variation of the depth of cut (a p ), in particular for the materials CuSP and CuTeP, leads to a change in the chipforming class, with an increase in the cutting depth a p indicating a deterioration of the chipforming class.
  • the chipform class of CuSMn remains during the variation of the depth of cut a p constant, as was the case with the variation of the cutting speed v c (see FIG. 2 ).
  • the chip form class in particular of the copper alloy CuSMn, thus remains constant both in the case of variation of the cutting speed and in the case of variation of the cutting depth in the respectively present areas.
  • the group of investigated copper alloys also moves with variation of the cutting depth a p in a range of chipforming classes 3 to 5.
  • FIG. 4 the result of the variation of the feed f results in its effect on the chip forming class of the respective copper alloys from the group studied.
  • the chipforming class of the group deteriorates with decreasing feed f as a whole.
  • the resulting feed f of 0.2 mm all three copper alloys of the test group are close to each other. Only the copper alloy CuSMn improves its chipbreaker class with increasing feed f, which was tested to 0.3 mm in the present case.
  • the respective resulting chip forms also result from the diagrams shown schematically in combination with the present table.
  • the reference value used was the well-known copper alloy CuZn39Pb3, which is considered to be the main alloy for machining, especially in Germany. Said copper alloy is used everywhere, where it increasingly depends on a cutting and cutting shaping. In connection with the CuZn39Pb3 copper alloy used herein as reference, its machinability is assumed to be 100%.
  • pure copper material achieves a stress index of 20% to a maximum of 30%.
  • These types of copper are low alloyed and hardenable copper materials which do not contain chip-breaking elements such as sulfur (S), tellurium (Te) and sulfur (S) and manganese (Mn) and lead (Pb).
  • the group investigated here is such that CuSP has a stress index of 70%, while CuTeP has a stress index of 80%. Finally, CuSMn achieves the highest stress index in the group of 90%.
  • FIG. 5 shows a tabular comparison of the materials contained therein in relation to their respective material properties.
  • the present table in FIG. 5 is constructed so that it reflects the approximate manufacturing cost of the individually listed materials, starting with the cheapest material above.
  • the table shows the copper alloy according to the invention with the orders of magnitude of its individual alloy components listed there, more specifically CuFe0.1PS0.35 and CuFe2PS0.35.
  • the copper alloy CuFe0.1PS0.35 in direct comparison with only chip-breaking alloyed materials has a somewhat lower 0.2% yield strength and tensile strength R m .
  • the elongation at break is 17% and the relaxation with "o" better than CuSP, CuTeP and CuSMn.
  • the alloy CuFe2PS0,35 has higher mechanical properties Characteristics and a higher relaxation resistance, which is indicated in the table with "+", on.
  • the determination of the mechanical characteristic values for the present table was carried out according to DIN ISO 6892-1.
  • the respective sample shape corresponded to the form A according to DIN 50125.
  • the respective conductivity was determined using a Sigmatester from Förster.
  • the respective relaxation behavior was extrapolated on the basis of internal measurements on the related materials, which, however, compared to the copper alloy of the invention contained no chip-breaking elements according to the invention.
  • FIGS. 6 to 9 each show a micrograph of the microstructures from the group of individual copper materials underlying the investigations.
  • FIG. 6 shows the material CuSP with its arrangement of the chip-breaking elements. Its microstructure shows in part closely spaced and each dark copper sulfides, which serve here as a chip breaker.
  • FIG. 7 shows in contrast the material CuTeP, which contains in its microstructure darkened Kupfertellurieden as a chip breaker. These are in their arrangement largely isolated and further apart.
  • FIG. 8 shows the microstructure of the material CuSMn, which contains manganese sulphides as a chipbreaker.
  • CuSMn contains manganese sulphides as a chipbreaker.
  • FIG. 9 shows for comparison the etched microstructure of the standardized material CuFe0.1P (C19210) without chip breaking phases.
  • iron phosphors that are not visible under light microscopy are present.
  • the iron phosphides have no chipbreaking effect.
  • FIG. 11 shows the microstructure of the material CuFe0,1PS0,35 invention. This also has copper chip sulphide as chipbreaker. As you can see, this one has the in FIG. 8 shown copper material CuSMn similarly good distribution of its chipbreaker, which manifests itself in a good machinability.
  • the copper alloy according to the invention has both a sufficient cold workability and a very good hot workability.
  • the invention is also directed to the use of such a copper alloy for the production of a product to be machined according to claim 7.
  • the invention is directed to the use of such a copper alloy for the production of a semi-finished to be produced according to claim 8.
  • This may in particular be a rolled, pressed, drawn, forged or cast product.
  • rods and wires can be delivered from press and pull sequences as semi-finished products.
  • the following products can be produced by machining: plug contacts, crimping sleeves, crimp connectors, drilled shaft nails, motor parts, screws, locating pins, clamps, welding nozzles, cutting torch nozzles, valves, fittings, nuts, fittings, contraelectrons, contact pins.
  • FIG. 13 shows a diagram for varying the Fe and P content at a constant content of the chip breaker S or S + Mn and / or Te
  • FIG. 14 shows a diagram for varying the contents of the chip breaker S or S + Mn and / or Te at a constant content of the basic elements Fe and P.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
  • Soft Magnetic Materials (AREA)

Claims (8)

  1. Alliage de cuivre, avec les éléments suivants, en % en poids : fer (Fe) 0,07 - 4,00 phosphore (P) 0,015 - 0,50 soufre (S) 0,10 - 0,80
    dans lequel l'alliage est exempt de béryllium (Be) et de plomb (Pb) et contient facultativement : aluminium (AI) max. 0,50 chrome (Cr) max. 0,50 magnésium (Mg) max. 0,50 zircon (Zr) max. 0,50 zinc (Zn) max. 2,50 étain (Sn) max. 2,50 bore (B) max. 0,50 argent (Ag) max. 0,50 manganèse (Mn) 0,01 - 0,80 tellure (Te) 0,10 - 1,00
    et, pour le reste, du cuivre (Cu) ainsi que des impuretés dues à la fabrication.
  2. Alliage de cuivre selon la revendication 1, caractérisé en ce qu'il contient facultativement au moins l'un des éléments d'alliage suivants, en % en poids : aluminium (Al) 0,01 - 0,50 chrome (Cr) 0,01 - 0,50 magnésium (Mg) 0,01 - 0,50 zircon (Zr) 0,01 - 0,50 zinc (Zn) 0,01 - 2,50 étain (Sn) 0,01 - 2,50 bore (B) 0,01 - 0,50 argent (Ag) 0,01 - 0,50
  3. Alliage de cuivre selon la revendication 1 ou 2, caractérisé par les éléments suivants, en % en poids : fer (Fe) 0,07 - 3,50 phosphore (P) 0,015 - 0,40 soufre (S) 0,15 - 0,70
    et au moins un élément pris dans le groupe suivant : manganèse (Mn) 0,03 - 0,75 tellure (Te) 0,05 - 0,90
  4. Alliage de cuivre selon la revendication 1 ou 2, caractérisé par les éléments suivants, en % en poids : fer (Fe) 0,20 - 3,20 phosphore (P) 0,017 - 0,30 soufre (S) 0,20 - 0,62
    et au moins un élément pris dans le groupe suivant : manganèse (Mn) 0,05 - 0,70 tellure (Te) 0,20 - 0,80
  5. Alliage de cuivre selon la revendication 1 ou 2, caractérisé par les éléments suivants, en % en poids : fer (Fe) 0,40 - 3,00 phosphore (P) 0,022 - 0,20 soufre (S) 0,25 - 0,57
    et au moins un élément pris dans le groupe suivant : manganèse (Mn) 0,08 - 0,55 tellure (Te) 0,30 - 0,70
  6. Alliage de cuivre selon la revendication 1 ou 2, caractérisé par les éléments suivants, en % en poids : fer (Fe) 0,75 - 2,60 phosphore (P) 0,025 - 0,15 soufre (S) 0,30 - 0,50
    et au moins un élément pris dans le groupe suivant : manganèse (Mn) 0,10-0,40 tellure (Te) 0,40-0,60
  7. Utilisation d'un alliage de cuivre selon l'une quelconque des revendications 1 à 6 pour la fabrication d'un produit à fabriquer par enlèvement de copeaux.
  8. Utilisation d'un alliage de cuivre selon l'une quelconque des revendications 1 à 6 pour la fabrication d'un produit à fabriquer non par enlèvement de copeaux mais en particulier par laminage, pressage, étirage, forgeage ou coulage.
EP14809274.5A 2013-09-02 2014-08-29 Alliage de cuivre, que contient de fer et phosphore Not-in-force EP3041966B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL14809274T PL3041966T3 (pl) 2013-09-02 2014-08-29 Stop miedzi, który zawiera żelazo i fosfor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201310014501 DE102013014501A1 (de) 2013-09-02 2013-09-02 Kupferlegierung
PCT/DE2014/000435 WO2015027975A2 (fr) 2013-09-02 2014-08-29 Alliage de cuivre

Publications (2)

Publication Number Publication Date
EP3041966A2 EP3041966A2 (fr) 2016-07-13
EP3041966B1 true EP3041966B1 (fr) 2018-05-30

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EP14809274.5A Not-in-force EP3041966B1 (fr) 2013-09-02 2014-08-29 Alliage de cuivre, que contient de fer et phosphore

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EP (1) EP3041966B1 (fr)
DE (1) DE102013014501A1 (fr)
ES (1) ES2675143T3 (fr)
HU (1) HUE038253T4 (fr)
PL (1) PL3041966T3 (fr)
WO (1) WO2015027975A2 (fr)

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Publication number Priority date Publication date Assignee Title
DE202018104958U1 (de) 2018-08-30 2018-09-12 Harting Electric Gmbh & Co. Kg Steckverbinder mit Komponenten aus verbessertem Material

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Publication number Priority date Publication date Assignee Title
JPH108167A (ja) * 1996-06-18 1998-01-13 Mitsubishi Shindoh Co Ltd 熱間加工性に優れた銅合金
WO2005087957A1 (fr) * 2004-03-12 2005-09-22 Sumitomo Metal Industries, Ltd. Alliage de cuivre et méthode de production de celui-ci
JP4542008B2 (ja) * 2005-06-07 2010-09-08 株式会社神戸製鋼所 表示デバイス
CN102690972A (zh) * 2011-03-22 2012-09-26 日立电线株式会社 热交换器用铜合金管

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Also Published As

Publication number Publication date
WO2015027975A2 (fr) 2015-03-05
HUE038253T4 (hu) 2018-11-28
HUE038253T2 (hu) 2018-10-29
WO2015027975A3 (fr) 2015-11-12
PL3041966T3 (pl) 2018-09-28
ES2675143T3 (es) 2018-07-09
EP3041966A2 (fr) 2016-07-13
DE102013014501A1 (de) 2015-03-05

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