EP3091483B1 - Dispositif de communication sans fil ainsi que procédé de fabrication de celui-ci, et joint avec puce radiofréquence ainsi que procédé de production de celui-ci - Google Patents

Dispositif de communication sans fil ainsi que procédé de fabrication de celui-ci, et joint avec puce radiofréquence ainsi que procédé de production de celui-ci Download PDF

Info

Publication number
EP3091483B1
EP3091483B1 EP15856392.4A EP15856392A EP3091483B1 EP 3091483 B1 EP3091483 B1 EP 3091483B1 EP 15856392 A EP15856392 A EP 15856392A EP 3091483 B1 EP3091483 B1 EP 3091483B1
Authority
EP
European Patent Office
Prior art keywords
radiation conductor
base material
seal
rfic
rfic element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15856392.4A
Other languages
German (de)
English (en)
Other versions
EP3091483A1 (fr
EP3091483A4 (fr
Inventor
Noboru Kato
Kunihiro Komaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to EP20174965.2A priority Critical patent/EP3719707B1/fr
Publication of EP3091483A1 publication Critical patent/EP3091483A1/fr
Publication of EP3091483A4 publication Critical patent/EP3091483A4/fr
Application granted granted Critical
Publication of EP3091483B1 publication Critical patent/EP3091483B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit

Definitions

  • the present invention relates to a wireless communication device and a method for manufacturing the same and, more particularly, to a wireless communication device, such as an RFID (radio frequency identifier) tag including a radiation conductor base material having a principal surface on which a radiation conductor is formed and an RFIC (radio frequency integrated circuit) element having a principal surface on which a terminal electrode is formed, and a method for manufacturing the same.
  • a wireless communication device such as an RFID (radio frequency identifier) tag including a radiation conductor base material having a principal surface on which a radiation conductor is formed and an RFIC (radio frequency integrated circuit) element having a principal surface on which a terminal electrode is formed
  • the present invention also relates to a seal fitted with an RFIC element and a method for manufacturing the same and, more particularly, to a seal fitted with an RFIC element including an RFIC element having a principal surface on which a terminal electrode is formed and a seal having an adhesive surface of a size larger than that of the principal surface of the RFIC element, and a method for producing the same.
  • An RFID inlay or an RFID tag are manufactured by mounting an RFIC element (a package or a strap with an RFIC chip sealed therein) on a radiation conductor base material provided with a radiation conductor (radiation pattern).
  • an RFIC element a package or a strap with an RFIC chip sealed therein
  • a radiation conductor base material provided with a radiation conductor (radiation pattern).
  • connection by heating and melting of solder see JP No. 2009-87068 A or JP NO. 2009-129093 A
  • connection by ultrasonic bonding see JP No. 2012-32931 A or JP No. 2013-45780 A
  • US 2009/079568 A1 describes an RFID interposer having a conductive material that includes an impedance matching structure.
  • the impedance matching structure aids in matching impedance between a chip that is to be mounted to the interposer, and an antenna that the interposer is to be coupled to.
  • the impedance matching structure may be part of the chip mounting bond pads, may be part of the conductive electrical connection between the chip bond pads and antenna bond pads, may be part of connections between the chip bond pads and the antenna bond pads, and/or may be only indirectly electrically coupled to the antenna bond pads.
  • JP 2010 267150 A describes a contactless information recording medium formed with an electrically conductive antenna on a base substrate, and disposed with the IC chip allowing writing or reading of the information in a non-contact state by connection with the antenna.
  • the contactless information recording medium is disposed with the IC chip in a position wherein bumps face the antenna patterns, holds the IC chip on the base substrate such that the bumps come into a non-contact state to the antenna patterns, and has a covering film capable of being deformable in a direction to which the bumps contact with the antenna patterns by external force, and restoring to an original shape when application of the external force is lost.
  • connection portion In the case of the connection by heating and melting of solder, a connection portion must be heated to the melting point of solder or higher. Since a radiation conductor base material is required to have high heat resistance, an inexpensive material such as PET cannot be employed for the radiation conductor base material. In the case of the connection by ultrasonic bonding, a bump must be melted with ultrasonic and therefore it takes a time for completing the bonding.
  • a stress may concentrate on a connection part between an RFIC element and a radiation conductor, resulting in destruction of the connection part.
  • the present invention provides a seal fitted with an RFIC element enabling simplified manufacturing of the wireless communication device and capable of reducing the risk of reduction in reliability of connection between an RFIC element and a radiation conductor, and a method for producing the same.
  • a wireless communication device comprises a radiation conductor base material including a radiation conductor and having a principal surface on which at least a portion of the radiation conductor is formed; an RFIC element having a principal surface on which a terminal electrode is formed; and a seal having an adhesive surface on a seal base material, the RFIC element being disposed on the principal surface of the radiation conductor base material such that the terminal electrode directly or indirectly and slidably contacts with the portion of the radiation conductor, the seal being affixed with the adhesive surface to the radiation conductor base material to cover at least a portion of the RFIC element so as to fix the RFIC element to the radiation conductor base material.
  • the seal includes a protective material disposed on a principal surface of the seal base material and is affixed to the radiation conductor base material such that the protective material overlaps with the terminal electrode in a planar view.
  • the portion of the radiation conductor has a first slit
  • the protective material of the seal has a second slit and is affixed to the radiation conductor base material such that the second slit overlaps with the first slit in a planar view.
  • the adhesive surface has a first adhesive surface and a second adhesive surface surrounding the first adhesive surface, and the first adhesive surface and the second adhesive surface adhere to the RFIC element and the radiation conductor base material, respectively.
  • the radiation conductor base material, the RFIC element, and the seal are flexible.
  • the RFIC element has an RFIC chip processing a high-frequency signal, a power feeding circuit having a resonance frequency corresponding to a communication frequency, and a substrate having the RFIC chip mounted thereon and the power feeding circuit built therein, and the terminal electrode is formed on a principal surface of the substrate and connected through the power feeding circuit to the RFIC chip.
  • a seal fitted with an RFIC element according to the present invention is a seal fitted with an RFIC element comprising an RFIC element having a principal surface on which a terminal electrode is formed; and a seal having an adhesive surface on a seal base material, the seal fitted with an RFIC element being formed by affixing the RFIC element to a partial region of the adhesive surface such that the terminal electrode is exposed, and another partial region of the adhesive surface is a region adhering to a radiation conductor base material such that the terminal electrode directly or indirectly and slidably contacts with a portion of a radiation conductor formed on a principal surface of the radiation conductor base material.
  • a method for manufacturing a wireless communication device comprises a preparing step of preparing a radiation conductor base material including a radiation conductor and having a principal surface on which at least a portion of the radiation conductor is formed, an RFIC element having a principal surface on which a terminal electrode is formed, and a seal having an adhesive surface on a seal base material; a first affixing step of producing a seal fitted with an RFIC element by affixing the RFIC element to a partial region of the adhesive surface of the seal such that the terminal electrode is exposed; and a second affixing step of affixing another partial region of the adhesive surface of the seal fitted with an RFIC element to the principal surface of the radiation conductor base material such that the terminal electrode directly or indirectly and slidably contacts with the portion of the radiation conductor.
  • a method for manufacturing a wireless communication device is a method for manufacturing an RFID tag by using a seal fitted with an RFIC element including an RFIC element having a principal surface on which a terminal electrode is formed and a seal having an adhesive surface on a seal base material, the seal fitted with an RFIC element being formed by affixing the RFIC element to the adhesive surface such that the terminal electrode is exposed, the method comprising a preparing step of preparing a radiation conductor base material including a radiation conductor and having a principal surface on which at least a portion of the radiation conductor is formed; and an affixing step of affixing the seal fitted with an RFIC element to the principal surface of the radiation conductor base material such that the terminal electrode directly or indirectly and slidably contacts with the portion of the radiation conductor.
  • a method for producing a seal fitted with an RFIC element comprises a preparing step of preparing an RFIC element having a principal surface on which a terminal electrode is formed and a seal having an adhesive surface on a seal base material; and an affixing step of affixing the RFIC element to the adhesive surface of the seal such that the terminal electrode is exposed, wherein the seal fitted with an RFIC element is a member affixed to a radiation conductor base material such that the terminal electrode directly or indirectly and slidably contacts with at least a portion of a radiation conductor formed on a principal surface of the radiation conductor base material.
  • the RFIC element is connected to the radiation conductor by using the seal, an inexpensive material such as PET can be employed for the radiation conductor base material and a time required for connecting the RFIC element to the radiation conductor can be reduced. As a result, the wireless communication device can be manufactured in a simplified manner.
  • the terminal electrode of the RFIC element since the terminal electrode of the RFIC element only contacts with the radiation conductor, even when the radiation conductor base material is bent, no stress concentrates on a contact part between a terminal electrode and an end part. This reduces the risk of reduction in reliability of connection between the RFIC element and the radiation conductor.
  • an RFID tag 10 of a first embodiment is an example of a wireless communication device that is an RFID tag typically using the 900 MHz band as a communication frequency, and includes a plate-shaped radiation conductor base material 12 having a rectangular principal surface, a plate-shaped RFIC element 16 having a rectangular principal surface considerably smaller than the principal surface of the radiation conductor base material 12, and a thin film-like seal 18 having a truly circular principal surface larger than the principal surface of the RFIC element 16.
  • an X-axis is assigned to a longitudinal direction of the radiation conductor base material 12
  • a Y-axis is assigned to a width direction of the radiation conductor base material 12
  • a Z-axis is assigned to a thickness direction of the radiation conductor base material 12.
  • the radiation conductor base material 12 has flexibility, and belt-shaped radiation conductors 14a and 14b are formed on a principal surface thereof (in particular, an upper surface).
  • Each of the radiation conductors 14a and 14b has a length less than a half of the length of the radiation conductor base material 12 and a width less than a half of the width of the radiation conductor base material 12 and extends along the X-axis through a center position in the Y-axis direction on the upper surface of the radiation conductor base material 12.
  • the radiation conductor 14a is located on the negative side in the X-axis direction and the radiation conductor 14b is located on the positive side in the X-axis direction.
  • an end part of the radiation conductor 14a on the positive side in the X-axis direction is defined as a "first end part 141a” and an end part of the radiation conductor 14b on the negative side in the X-axis direction is defined as a "second end part 141b," an absent part CT1 absent of both the radiation conductors 14a and 14b is formed between the first end part 141a and the second end part 141b.
  • the RFIC element 16 has a flexible substrate 16c made of a thermoplastics resin with high heat resistance such as an LCP resin or a polyimide resin.
  • a first terminal electrode 16a and a second terminal electrode 16b are formed on a principal surface (in particular, a lower surface) of the substrate 16c.
  • the first terminal electrode 16a is disposed on an end part on the negative side of the X-axis direction and the second terminal electrode 16b is disposed on an end part on the positive side of the X-axis direction such that an interval between the first terminal electrode 16a and the second terminal electrode 16b is substantially identical to an interval between the first end part 141a and the second end part 141b.
  • the seal 18 has a flexible seal base material 18a made of paper or resin etc.
  • An adhesive 18b such as an acrylic resin or an epoxy resin is applied to a lower surface of the seal base material 18a and the lower surface acts as an adhesive surface.
  • a rectangular first adhesive region R1 is assigned that has substantially the same size as that of the principal surface of the substrate 16c.
  • a second adhesive region R2 is assigned around the first adhesive region R1 so that the first adhesive region R1 is surrounded by the second adhesive region R2.
  • first adhesive region R1 Long sides and short sides of a rectangular formed by the first adhesive region R1 extend along the X-axis and the Y-axis, respectively. Based on this fact, a reference line LN1 extending along the X-axis is drawn at the center in the X-axis direction of the upper surface of the seal base material 18a. A reference line LN2 indicative of an outer edge of the first adhesive region R1 is drawn on the lower surface of the seal base material 18a. The location of the first adhesive region R1 can easily be comprehended from the upper and lower surface sides of the seal 18 by reference to the reference lines LN1 and LN2.
  • the RFIC element 16 is disposed on the upper surface of the radiation conductor base material 12 (in particular, on the absent part CT1) such that the first terminal electrode 16a slidably contacts with the first end part 141a while the second terminal electrode 16b slidably contacts with the second end part 141b.
  • the radiation conductors 14a and 14b act as a dipole antenna. Therefore, although being electrically connected, the terminal electrodes of the RFIC element and an RFIC-element connection part of the radiation conductor are not mechanically connected (are slidable).
  • the seal 18 is affixed to the radiation conductor base material 12 to cover the RFIC element 16 disposed on the upper surface of the radiation conductor base material 12.
  • the first adhesive region R1 adheres to the substrate 16c and the second adhesive region R2 adheres to the radiation conductor base material 12 and the radiation conductors 14a, 14b formed on the upper surface thereof. Since the first adhesive region R1 is surrounded by the second adhesive region R2, the RFIC element 16 is strongly fixed to the radiation conductor base material 12. In the RFIC element 16, the terminal electrodes 16a, 16b are most projected portions for the seal 18.
  • the seal 18 If the seal 18 is affixed to the radiation conductor base material 12, the seal 18 curves to cover the RFIC element 16 when being affixed to the radiation conductor base material 12 and, therefore, the affixed seal 18 generates a stress in an attempt to return to the original planar state. Since this stress acts as a pressure pressing the terminal electrodes 16a, 16b of the RFIC element 16 against the radiation conductors 14a, 14b, the electric connection is stably maintained between the terminal electrodes 16a, 16b and the radiation conductors 14a, 14b. As a result, the RFIC element 16 can create a state of stable electric connection while being slidable.
  • the radiation conductor base material 12 and/or the seal 18 are made transparent, whether the first and second terminal electrodes 16a and 16b of the RFIC element 16 are connected to the radiation conductors 14a and 14b can easily be confirmed.
  • an RFIC chip 16e and a power feeding circuit 16d are mounted on the substrate 16c making up the RFIC element 16.
  • the RFIC chip 16e is a circuit processing an RFID signal (high-frequency signal) and has a first input/output terminal and a second input/output terminal (both not shown).
  • the power feeding circuit 16d has a resonance circuit with a resonance frequency corresponding to a communication frequency (carrier frequency) and is a circuit for widening a passband of a communication signal.
  • the RFIC chip 16e is connected via the power feeding circuit 16d to the radiation conductors 14a, 14b. Since the power feeding circuit 16d built into the substrate 16c has a resonance frequency corresponding to a communication frequency, the communication characteristics of the RFID tag 10 do not significantly depend on a size of the radiation conductors 14a, 14b, a material of an object to which the RFID tag 10 is attached, a bonding state between the radiation conductors 14a, 14b and the RFIC element 16, etc. Therefore, the radiation conductors 14a, 14b may not necessarily need to have an electrical length that is an integral multiple of ⁇ /2.
  • the power feeding circuit 16d must be made of a material with high electric conductivity since the circuit resonates and a current intensively flows through the circuit, the radiation conductors are conductors having an electric field (voltage) distribution and, therefore, the electrical properties of the RFID tag 10 are hardly degraded if the terminal electrodes 16a, 16b of the power feeding circuit and the radiation conductors 14a, 14b have a contact resistance of several dozen ⁇ or less.
  • the first terminal electrode 16a and the second terminal electrode 16b formed on the lower surface of the substrate 16c are connected via the power feeding circuit 16d to the first input/output terminal and the second input/output terminal, respectively, of the RFIC chip 16e.
  • the RFIC element 16 is affixed to the lower surface of the seal 18. Particularly, the upper surface of the substrate 16c making up the RFIC element 16 is affixed to the first adhesive region R1 of the seal 18. As a result, a seal 20 fitted with an RFIC element is produced that has the first and second terminal electrodes 16a and 16b exposed outside.
  • the seal 20 fitted with an RFIC element is subsequently affixed to the radiation conductor base material 12.
  • the first terminal electrode 16a is brought into contact with or pressed against the first end part 141a of the radiation conductor 14a
  • the second terminal electrode 16b is brought into contact with or pressed against the second end part 141b of the radiation conductor 14b.
  • the second adhesive region R2 adheres to the radiation conductor base material 12 and the radiation conductors 14a, 14b.
  • the RFID tag 10 is completed.
  • a state of the first terminal electrode 16a being in contact with the first end part 141a of the radiation conductor 14a is shown in Fig. 8 on an enlarged scale.
  • the seal 18 curves to cover the RFIC element 16 when being affixed to the radiation conductor base material 12, the affixed seal 18 generates a stress in an attempt to return to the original planar state.
  • This stress acts as a pressure pressing the terminal electrode 16a of the RFIC element 16 against the radiation conductor 14a, and the electric connection of the terminal electrode 16a to the radiation conductor 14a is stably maintained by this pressure after the seal is affixed.
  • the RFIC element 16 can create a state of stable electric connection while being slidable.
  • a PET film or paper may be used as a material of the seal 18, and a paste of a strongly adhesive agent may be used as an adhesive material.
  • the seals 20 fitted with RFIC elements may be affixed to a mount 22 as shown in Fig. 9 .
  • a business operator responsible for production of the seals 20 fitted with RFIC elements may be separated from a business operator manufacturing the RFID tags 10 by using the seals 20 fitted with RFIC elements.
  • the business operator manufacturing the RFID tags 10 can freely change the shape of the tags and can design the tags according to a use application. Since RFID tags can be made by only manually affixing the seals 20 to the radiation conductors 14, the RFID tags can be made even without dedicated equipment.
  • the RFID tag 10 can be manufactured in a simplified manner.
  • employing the seal 18 as in the first embodiment enables employment of an inexpensive conductor material such as an aluminum foil for a radiation conductor and an inexpensive material such as PET for the radiation conductor base material 12 and also enables a reduction in time of connecting the RFIC element 16 to the radiation conductors 14a, 14b.
  • paper may be used as the radiation conductor base material to utilize as a radiation conductor a conductive pattern drawn on the paper with a conductive ink containing a conductive material, such as Ag, as a main component.
  • the RFIC element 16 is provided with the power feeding circuit 16d widening a resonance frequency band, desired communication characteristics are acquired even with a simple mounting method such as fixing the RFIC element 16 by the seal 18.
  • first terminal electrodes 16a and 16b of the RFIC element 16 only contact with the first end part 141a of the radiation conductor 14a and the second end part 141b of the radiation conductor 14b. Therefore, although being electrically connected, the first terminal electrodes 16a and 16b are not physically or mechanically bonded to the first end part 141a and the second end part 141b.
  • the radiation conductors 14a and 14b are formed to extend linearly along the X-axis.
  • the radiation conductors 14a and 14b may be formed to serpentine with respect to the X-axis (see Fig. 10 ).
  • the RFIC element 16 is disposed to stretch between the first end part 141a of the radiation conductor 14a and the second end part 141b of the radiation conductor 14b so that the radiation conductors 14a and 14b act as a dipole antenna.
  • a loop-shaped radiation conductor 14 shown in Fig. 11 is formed on the upper surface of the radiation conductor base material 12 and the RFIC element 16 is disposed to stretch between the both ends of the radiation conductor 14, the radiation conductor 14 acts as a loop antenna.
  • the lower surface of the seal 18 is made as the adhesive surface.
  • an adhesive agent may be applied to a region of the upper surface of the radiation conductor base material 12 other than the formation regions of the radiation conductors 14a and 14b to make the upper surface of the radiation conductor base material 12 as an additional adhesive surface.
  • the RFID tag 10 can be affixed to another article.
  • the radiation conductor base material 12 and/or the seal 18 are not transparent, it may be troublesome to confirm relative positions between the RFIC element 16 and the radiation conductors 14a, 14b when the seal 20 fitted with an RFIC element is affixed to the radiation conductor base material 12.
  • Such a problem can be solved by drawing a reference line LN3 on the upper surface of the radiation conductor base material 12 in a manner shown in Fig. 12 .
  • the shape of the principal surface of the seal 18 may be an ellipse or a rectangle with the longer axis or the long sides aligned with the X-axis. As a result, the location of the first adhesive region R1 can easily be comprehended from the upper surface side of the seal 18 even without the reference line LN1.
  • the radiation conductors 14a and 14b are formed on the upper surface of the radiation conductor base material 12, and the first terminal electrode 16a and the second terminal electrode 16b are formed on the lower surface of the substrate 16c.
  • the radiation conductor 14b is eliminated from the upper surface of the radiation conductor base material 12, and the second terminal electrode 16b is eliminated from the lower surface of the substrate 16c.
  • the radiation conductors 14a and 14b are formed only on the upper surface of the radiation conductor base material 12.
  • the radiation conductors 14a and 14b may be formed on the lower surface of the radiation conductor base material 12 except the first end part 141a and the second end part 141b, and the first end part 141a and the second end part 141b may be led out to the upper surface of the radiation conductor base material 12.
  • the size of the principal surface of the seal 18 exceeds the size of the principal surface of the RFIC element 16.
  • the size of the principal surface of the seal 18 may not necessarily need to exceed the size of the principal surface of the RFIC element 16 (may not entirely cover the RFIC element 16) as long as the RFIC element 16 can be fixed to the radiation conductor base material 12.
  • the first terminal electrode 16a is in direct contact (conductive in terms of a direct current with) the first end part 141a of the radiation conductor 14a
  • the second terminal electrode 16b is in direct contact with (conductive in terms of a direct current with) the second end part 141b of the radiation conductor 14b
  • the first terminal electrode 16a and the second terminal electrode 16b may be in indirect contact with (capacitively coupled via a dielectric to) the first end part 141a and the second end part 141b.
  • an RFID tag 10' of a second embodiment is an example of a wireless communication device that is an RFID tag typically using the 900 MHz band as a communication frequency, and includes the plate-shaped radiation conductor base material 12 having a rectangular principal surface, the plate-shaped RFIC element 16 having a rectangular principal surface considerably smaller than the principal surface of the radiation conductor base material 12, and a thin film-like seal 181 having a truly circular principal surface larger than the principal surface of the RFIC element 16.
  • the X-axis is assigned to a longitudinal direction of the radiation conductor base material 12
  • the Y-axis is assigned to a width direction of the radiation conductor base material 12
  • the Z-axis is assigned to a thickness direction of the radiation conductor base material 12.
  • the RFIC element 16 is affixed to the seal 181 before being disposed on the radiation conductor base material 12. Therefore, the RFIC element 16 makes up a seal 20' fitted with an RFIC element together with the seal 181.
  • a belt-shaped radiation conductor 14c is formed on the principal surface (in particular, the upper surface) of the radiation conductor base material 12.
  • the radiation conductor 14c extends in a loop-shape in the vicinity of an outer edge of the upper surface of the radiation conductor base material 12, and a slit SLT1 is formed between both ends thereof.
  • the slit SLT1 is disposed at a center position in the X-axis direction located on the positive side in the Y-axis direction on the upper surface of the radiation conductor base material 12.
  • the slit SLT1 has a uniform width over the entire length of the slit SLT1.
  • the seal 181 has a flexible seal base material 181b.
  • a protective material 181a is disposed on an upper surface of the seal base material 181b, and an adhesive 181c is applied to a lower surface of the seal base material 181b.
  • a principal surface of the seal base material 181b forms a true circle.
  • the protective material 181a is produced by preparing a protective material having a principal surface of the same size as that of the principal surface of the seal base material 181b and by forming a slit SLT2 extending linearly through the center of the principal surface in the protective material.
  • the width of the slit SLT2 is preferably substantially identical to the width of the slit SLT1.
  • the protective material 181a produced in this way is disposed on the upper surface of the seal base material 181b in a posture in which the circular arc thereof extends along the outer edge of the seal base material 181b such that the shape of the slit SLT2 is kept.
  • the diameter of the principal surface of the seal 181 slightly exceeds the length of the RFIC element 16.
  • the RFIC element 16 is affixed to the lower surface of the seal 181 in a posture in which the upper surface thereof faces the lower surface of the seal 181 and the longitudinal direction thereof becomes orthogonal to an extending direction of the slit SLT2. Therefore, when viewed in the Z-axis direction, the first terminal electrode 16a and the second terminal electrode 16b overlap with the protective material 181a.
  • the RFIC chip 16e embedded in the RFIC element 16 is housed in a region of the slit SLT2 when viewed in the Z-axis direction.
  • the seal 20' fitted with an RFIC element having the structure as described above is affixed to the upper surface of the radiation conductor base material 12 such that the slit SLT2 overlaps with the slit SLT1 when viewed in the Z-axis direction.
  • the RFIC element 16 is disposed on the upper surface of the radiation conductor base material 12 (in particular, at a position straddling the slit SLT1) such that the first terminal electrode 16a and the second terminal electrode 16b respectively come into contact with the both ends of the radiation conductor 14c.
  • the radiation conductor 14c acts as a loop antenna.
  • the slit SLT 2 is used as a positioning mark when the seal 20' fitted with an RFIC element is affixed to the upper surface of the radiation conductor base material 12. As a result, the work burden required for manufacturing the RFID tag 10' is reduced.
  • first terminal electrode 16a and the second terminal electrode 16b overlap with the protective material 181a when viewed in the Z-axis direction, a strong bonding force can be applied to the first terminal electrode 16a and the second terminal electrode 16b as well as the both ends of the radiation conductor 14c when the seal 20' fitted with an RFIC element is affixed to the upper surface of the radiation conductor base material 12. This consequently reduces the risk that the first terminal electrode 16a and the second terminal electrode 16b depart from the radiation conductor 14c during use.
  • the RFIC chip 16e Since the RFIC chip 16e is housed in the region of the slit SLT1 or SLT2 when viewed in the Z-axis direction, the risk of an excessive stress applied to the RFIC element 16 can be reduced when the seal 20' fitted with an RFIC element is affixed to the upper surface of the radiation conductor base material 12.
  • an RFIC element 100 of a third embodiment is an RFIC element typically corresponding to a communication frequency of the 900 MHz band, i.e., the UHF band, and has a multilayer substrate 120 with a principal surface forming a rectangle.
  • the multilayer substrate 120 has a base body that is a laminated body acquired by laminating flexible resin insulation layers of polyimide, liquid crystal polymer, etc., and the multilayer substrate 120 itself exhibits flexibility.
  • the insulation layers made of these materials have the permittivity smaller than that of ceramic base material layers represented by LTCC.
  • the X-axis is assigned to a longitudinal direction of the multilayer substrate 120
  • the Y-axis is assigned to a width direction of the multilayer substrate 120
  • the Z-axis is assigned to a thickness direction of the multilayer substrate 120.
  • the RFIC element 100 of the third embodiment can obviously be used as the RFIC element 16 of the first or second embodiment.
  • an RFIC chip 160 and a power feeding circuit 180 are built into the multilayer substrate 120, and a first terminal electrode 140a and a second terminal electrode 140b are formed on one principal surface of the multilayer substrate 120.
  • the RFIC chip 160 has a structure in which various elements are built into a hard semiconductor substrate made of a semiconductor such as silicon, and has the one principal surface and the other principal surface drawing a square.
  • a first input/output terminal 160a and a second input/output terminal 160b are formed on the other principal surface of the RFIC chip 160 (described in detail later).
  • the RFIC chip 160 is located at the center in each of the X-, Y-, and Z-axis directions inside the multilayer substrate 120 in a posture in which the sides of the square extends along the X-axis or the Y-axis and the one principal surface and the other principal surface face the positive side and the negative side, respectively, in the Z-axis direction.
  • the power feeding circuit 180 is made up of a coil conductor 200 and interlayer connection conductors 240a and 240b (described in detail later).
  • the coil conductor 200 is made up of coil patterns 200a to 200c.
  • a first coil part CIL1 forms a portion of the coil pattern 200a
  • a second coil part CIL2 forms a portion of the coil pattern 200b
  • a third coil part CIL3 and a fourth coil part CIL4 form portions of the coil pattern 200c.
  • the first coil part CIL1, the third coil part CIL3, and the interlayer connection conductor 240a are arranged in the Z-axis direction at positions on the negative side in the X-axis direction
  • the second coil part CIL2, the fourth coil part CIL4, and the interlayer connection conductor 240b are arranged in the Z-axis direction at positions on the positive side in the X-axis direction.
  • the RFIC chip 160 is located between the first coil part CIL1 and the second coil part CIL2 and between the third coil part CIL3 and the fourth coil part CIL4 when the multilayer substrate 120 is viewed in each of the Z- and Y-axis directions.
  • the first terminal electrode 140a is disposed at a position on the negative side in the X-axis direction
  • the second terminal electrode 140b is disposed at a position on the positive side in the X-axis direction.
  • Both the first terminal electrode 140a and the second terminal electrode 140b are formed of flexible copper foil into a strip shape and have the respective principal surface sizes identical to each other.
  • the short sides of the strip extend along the X-axis, and the long sides of the strip extend along the Y-axis.
  • the RFIC chip 160 is interposed between a portion of the power feeding circuit 180 and another portion of the power feeding circuit 180.
  • the RFIC chip 160 overlaps with the power feeding circuit 180.
  • the power feeding circuit 180 partially overlaps with each of the first and second terminal electrodes 140a, 140b.
  • each of the insulation layers making up the laminated body is as thin as 10 ⁇ m or greater and 100 ⁇ m or less, the RFIC chip 160 and the power feeding circuit 180 built into the multilayer substrate 120 can be seen through on the outside. Therefore, the connection state (presence of a broken wire) of the RFIC chip 160 and the power feeding circuit 180 can easily be confirmed.
  • the multilayer substrate 120 is made up of three laminated sheet-shaped insulation layers 120a to 120c. Among these layers, the insulation layer 120a forms an upper layer, the insulation layer 120b forms an intermediate layer, and the insulation layer 120c forms a lower layer.
  • the first terminal electrode 140a and the second terminal electrode 140b are formed on one principal surface of the insulation layer 120a. As described above, the first terminal electrode 140a is disposed on the negative side in the X-axis direction and the second terminal electrode 140b is disposed on the positive side in the X-axis direction.
  • a rectangular through-hole HL1 is formed, reaching the other principal surface.
  • the size of the through-hole HL1 is matched to the size of the RFIC chip 160.
  • the coil pattern 200c made of flexible copper foil and extending in a belt shape is formed around the through-hole HL1 on the one principal surface of the insulation layer 120b.
  • One end of the coil pattern 200c is disposed at a position overlapping with the first terminal electrode 140a in the planar view and is connected to the first terminal electrode 140a by an interlayer connection conductor 220a extending in the Z-axis direction.
  • the other end of the coil pattern 200c is disposed at a position overlapping with the second terminal electrode 140b in the planar view and is connected to the second terminal electrode 140b by an interlayer connection conductor 220b extending in the Z-axis direction.
  • the interlayer connection conductors 220a, 220b and the interlayer connection conductors 240a, 240b described later are hard metal bulks containing Sn as a main component.
  • the coil pattern 200c goes round the one end twice in the counterclockwise direction, extends to near the end part of the negative side in the Y-axis direction, and then extends into the positive side in the X-axis direction.
  • the coil pattern 200c subsequently bends near the end part of the positive side in the X-axis direction toward the positive side in the Y-axis direction and goes round the other end twice in the counterclockwise direction before reaching the other end.
  • the coil patterns 200a and 200b made of flexible copper foil and extending in a belt shape are formed on one principal surface of the insulation layer 120c.
  • Both the first coil end T1 and the second coil end T2 are rectangular in the planar view of the insulation layer 120c.
  • the coil pattern 200a goes round the one end 2.5 times in the clockwise direction and subsequently bends toward the negative side in the Y-axis direction to reach the other end.
  • the coil pattern 200b goes round the one end 2.5 times in the anticlockwise direction and subsequently bends toward the negative side in the Y-axis direction to reach the other end.
  • the one end of the coil pattern 200a is connected to the one end of the coil pattern 200c by the interlayer connection conductor 240a extending in the Z-axis direction
  • the one end of the coil pattern 200b is connected to the other end of the coil pattern 200c by the interlayer connection conductor 240b extending in the Z-axis direction.
  • a section of the coil pattern 200a overlaps with a section of the coil pattern 200c, and a section of the coil pattern 200b overlaps with another section of the coil pattern 200c.
  • the power feeding circuit 180 is made up of the coil patterns 200a to 200c arranged in this way as well as the interlayer connection conductors 240a and 240b.
  • the section of the coil pattern 200a is defined as a "first coil part CIL1" and the section of the coil pattern 200c is defined as a "third coil part CIL3.”
  • the section of the coil pattern 200b is defined as a "second coil part CIL2" and the section of the coil pattern 200c is defined as a "fourth coil part CIL4.”
  • the position of the one end of the coil pattern 200a or the one end of the coil pattern 200c is defined as a "first position P1" and the position of the one end of the coil pattern 200b or the other end of the coil pattern 200c is defined as a "second position P2.”
  • Rectangular dummy conductors 260a and 260b made of flexible copper foil are also formed on the one principal surface of the insulation layer 120c.
  • the dummy conductors 260a and 260b are disposed to overlap with two respective corners arranged in the X-axis direction on the negative side in the Y-axis direction out of the four corners of the rectangle drawn by the through-hole HL1.
  • the RFIC chip 160 is mounted on the insulation layer 120c such that the four corners of the other principal surface respectively face the first coil end T1, the second coil end T2, and the dummy conductors 260a, 260b.
  • the first input/output terminal 160a is disposed on the other principal surface of the RFIC chip 160 to overlap with the first coil end T1 in the planar view.
  • the second input/output terminal 160b is disposed on the other principal surface of the RFIC chip 160 to overlap with the second coil end T2 in the planar view.
  • the RFIC chip 160 is connected to the first coil end T1 by the first input/output terminal 160a and is connected to the second coil end T2 by the second input/output terminal 160b.
  • An equivalent circuit of the RFIC element 100 configured in this way is shown in Fig. 16 .
  • An inductor L1 corresponds to the first coil part CIL1
  • an inductor L2 corresponds to the second coil part CIL2.
  • An inductor L3 corresponds to the third coil part CIL3, and an inductor L4 corresponds to the fourth coil part CIL4.
  • the characteristics of impedance matching by the power feeding circuit 180 are specified by the values of the inductors L1 to L4.
  • One end of the inductor L1 and one end of the inductor L2 are connected to the first input/output terminal 160a and the second input/output terminal 160b, respectively, disposed on the RFIC chip 160.
  • the other end of the inductor L1 is connected to one end of the inductor L3, and the other end of the inductor L2 is connected to one end of the inductor L4.
  • the other end of the inductor L3 is connected to the other end of the inductor L4.
  • the first terminal electrode 140a is connected to a connection point between the inductors L1 and L3, and the second terminal electrode 140b is connected to a connection point between the inductors L2 and L4.
  • the first coil part CIL1, the second coil part CIL2, the third coil part CIL3, and the fourth coil part CIL4 are wound to form magnetic fields in phase and are connected in series to each other. Therefore, the magnetic fields are generated toward a direction indicted by arrows of Fig. 20 at a certain time point and are generated toward a direction opposite to the arrows at another time point.
  • the first coil part CIL1 and the third coil part CIL3 have substantially the same loop shape and a same first winding axis
  • the second coil part CIL2 and the fourth coil part CIL4 have substantially the same loop shape and a same second winding axis.
  • the first winding axis and the second winding axis are disposed at positions where the RFIC chip 160 is interposed therebetween.
  • the first coil part CIL1 and the third coil part CIL3 are magnetically and capacitively coupled, while the second coil part CIL2 and the fourth coil part CIL4 are magnetically and capacitively coupled.
  • the RFIC chip 160 has the first input/output terminal 160a and the second input/output terminal 160b and is built into the multilayer substrate 120.
  • the power feeding circuit 180 includes the coil patterns 200a to 200c and is built into the multilayer substrate 120.
  • the first coil part CIL1 is present in a section from the first coil end T1 to the first position P1 and has the first winding axis in the direction intersecting with the one principal surface of the multilayer substrate 120.
  • the second coil part CIL2 is present in a section from the second coil end T2 to the second position P2 and has the second winding axis in the direction intersecting with the one principal surface of the multilayer substrate 120.
  • the third coil part CIL3 is disposed to overlap with the first coil part CIL1 in the planar view and the fourth coil part CIL4 is disposed to overlap with the second coil part CIL2 in the planar view.
  • the first coil part CIL1/the third coil part CIL3 and the second coil part CIL2/the fourth coil part CIL4 are disposed at positions where the RFIC chip 160 is interposed therebetween in the planar view of the multilayer substrate 120.
  • the RFIC chip 160 is also built into the multilayer substrate 120, and the first coil part CIL1/the third coil part CIL3 and the second coil part CIL2/the fourth coil part CIL4 are disposed at positions where the RFIC chip 160 is interposed therebetween in the planar view of the multilayer substrate 120.
  • the RFIC chip 160 Since the RFIC chip 160 is made up of the semiconductor substrate, the RFIC chip 160 acts as a ground or a shield for the first coil part CIL1, the second coil part CIL2, the third coil part CIL3, and the fourth coil part CIL4, so that the first coil part CIL1 and the second coil part CIL2 are hardly magnetically or capacitively coupled to each other while the third coil part CIL3 and the fourth coil part CIL4 are hardly magnetically or capacitively coupled to each other. This enables the reduction in the risk of narrowing the passband of communication signals.
  • FIG. 21(A) and 21(B) An example of an RFID tag having the RFIC element 100 of the third embodiment mounted thereon is shown in Figs. 21(A) and 21(B) .
  • This RFID tag is a dipole type RFID tag, and a radiation element 300a is made up of a radiation conductor base material 320a and radiation conductors 340a, 340b disposed thereon.
  • the radiation conductor base material 320a is a belt-shaped flexible base material made of PET.
  • Each of the radiation conductors 340a and 340b is a belt-shaped flexible conductor made of aluminum foil or copper foil.
  • the radiation conductors 340a and 340b have common width and length. The width of each of the radiation conductors 340a and 340b is smaller than the width of the radiation conductor base material 320a, and the length of each of the radiation conductors 340a and 340b is less than a half of the length of the radiation conductor base material 320a.
  • the RFIC element 100 is mounted on the surface of the radiation conductor base material 320a at a center position in a posture with one principal surface thereof facing the surface of the radiation conductor base material 320a.
  • the first terminal electrode 140a is connected to the one end of the radiation conductor 340a
  • the second terminal electrode 140b is connected to the one end of the radiation conductor 340b.
  • the first terminal electrode 140a is fixed to the radiation conductor 340a by a conductive bonding material 360a
  • the second terminal electrode 140b is fixed to the radiation conductor 340b by a conductive bonding material 360b (see Fig. 23 ).
  • an insulation bonding material may be employed for capacitive connection.
  • the first terminal electrode 140a and the second terminal electrode 140b may electrically be connected to the radiation conductors 340a and 340b.
  • the multilayer substrate 120 is made of flexible polyimide or liquid crystal polymer, and the coil patterns 200a to 200c, the first terminal electrode 140a, and the second terminal electrode 140b are made of flexible copper foil.
  • the interlayer connection conductors 220a, 220b, 240a, 240b are hard conductors made of Sn
  • the substrate of the RFIC chip 160 is also a hard substrate made of silicon.
  • the first and second terminal electrodes 140a, 140b having a large area make the flexibility of the copper foil smaller and, moreover, the flexibility is lost by applying a plating film of Ni/Au or Ni/Sn etc.
  • the respective regions disposed with the first terminal electrode 140a, the second terminal electrode 140b, and the RFIC chip 160 are define as the rigid regions, and the other regions are defined as the flexible regions.
  • the flexible regions are formed between the first terminal electrode 140a and the RFIC chip 160 and between the second terminal electrode 140b and the RFIC chip 160.
  • the interlayer connection conductors 220a, 220b, 240a, 240b are disposed in the rigid regions.
  • the RFIC element 100 is bent as shown in Fig. 23 , for example.
  • the RFIC chip 160 itself has a parasitic capacitance (stray capacitance) Cp present between the first input/output terminal 160a and the second input/output terminal 160b, and two resonances are generated in the RFIC element 100.
  • the first resonance is the resonance generated in a current path made up of the radiation conductors 340a, 340b, the inductor L3, and the inductor L4, and the second resonance is the resonance generated in a current path (current loop) made up of the inductors L1 to L4 and the parasitic capacitance Cp.
  • These two resonances are coupled by the inductors L3 to L4 shared by the current paths, and two respective currents I1 and I2 corresponding to the two resonances flow in a manner as shown in Fig. 24 .
  • Both a first resonance frequency and a second resonance frequency are affected by the inductors L3 to L4.
  • a difference of several dozen MHz (specifically, about 5 to 50 MHz) is generated between the first resonance frequency and the second resonance frequency.
  • the resonance frequency characteristics thereof are represented by curves A and B in Fig. 25 .
  • broadband resonance frequency characteristics are produced as indicated by a curve C in Fig. 25 .

Claims (9)

  1. Dispositif de communication sans fil, comprenant :
    un matériau de base de conducteur de rayonnement (12) incluant un conducteur de rayonnement (14a, 14b) et présentant une surface principale sur laquelle au moins une partie du conducteur de rayonnement (14a, 14b) est formée ;
    un élément de circuit intégré radiofréquence, RFIC, (16), présentant une surface principale sur laquelle une électrode terminale (16a, 16b) est formée ; et
    un joint (18, 181),
    caractérisé en ce que :
    le joint (18, 181) présente une surface adhésive sur un matériau de base de joint souple (18a, 181b), la surface adhésive étant d'une taille supérieure à celle de la surface principale de l'élément de circuit RFIC (16) ;
    l'élément de circuit RFIC (16) est disposé sur la surface principale du matériau de base de conducteur de rayonnement (12), de sorte que l'électrode terminale (16a, 16b) est en contact direct et coulissant, ou indirect et coulissant, avec la partie du conducteur de rayonnement (14a, 14b) ; et
    le joint (18, 181) est fixé avec la surface adhésive au matériau de base de conducteur de rayonnement (12) en vue de couvrir au moins une partie de l'élément de circuit RFIC (16) de manière à fixer l'élément de circuit RFIC (16) au matériau de base de conducteur de rayonnement (12).
  2. Dispositif de communication sans fil selon la revendication 1, dans lequel l'élément de circuit RFIC (16) présente un matériau de base souple présentant l'électrode terminale (16a, 16b), et une puce de circuit RFIC (16e, 160) montée sur le matériau de base souple, et dans lequel la puce de circuit RFIC (16e, 160) et l'électrode terminale (16a, 16b) ne se chevauchent pas mutuellement dans une vue en plan.
  3. Dispositif de communication sans fil selon la revendication 2, dans lequel l'électrode terminale (16a, 16b) est en saillie à partir d'une surface du matériau de base souple.
  4. Dispositif de communication sans fil selon la revendication 1, dans lequel le joint (18, 181) inclut un matériau de protection (181a) disposé sur une surface principale du matériau de base de joint souple (181b), et est fixé au matériau de base de conducteur de rayonnement (12) de sorte que le matériau de protection (181a) chevauche l'électrode terminale (16a, 16b) dans une vue en plan.
  5. Dispositif de communication sans fil selon la revendication 4, dans lequel
    la partie du conducteur de rayonnement (14a, 14b) présente une première fente, et dans lequel
    le matériau de protection (181a) du joint (18, 181) présente une seconde fente et est fixé au matériau de base de conducteur de rayonnement (12) de sorte que la seconde fente chevauche la première fente dans une vue en plan.
  6. Dispositif de communication sans fil selon l'une quelconque des revendications 1 à 5, dans lequel
    la surface adhésive présente une première surface adhésive, et une seconde surface adhésive entourant la première surface adhésive, et dans lequel
    la première surface adhésive et la seconde surface adhésive adhèrent respectivement à l'élément de circuit RFIC (16) et au matériau de base de conducteur de rayonnement (12).
  7. Dispositif de communication sans fil selon l'une quelconque des revendications 1 à 6, dans lequel le matériau de base de conducteur de rayonnement (12), l'élément de circuit RFIC (16) et le joint (18, 181) sont souples.
  8. Dispositif de communication sans fil selon l'une quelconque des revendications 1 à 6, dans lequel :
    l'élément de circuit RFIC (16) présente une puce de circuit RFIC (16e, 160) traitant un signal haute fréquence, un circuit d'alimentation en énergie (16d, 180) présentant une fréquence de résonance correspondant à une fréquence de communication, et un substrat (16c) sur lequel est montée la puce de circuit RFIC (16e, 160) et dans lequel est intégré le circuit d'alimentation en énergie (16d, 180), et dans lequel
    l'électrode terminale (16a, 16b) est formée sur une surface principale du substrat (16c) et est connectée à travers le circuit d'alimentation en énergie (16d, 180) à la puce de circuit RFIC (16e, 160).
  9. Procédé de fabrication d'un dispositif de communication sans fil au moyen d'un joint (18, 181) muni d'un élément de circuit RFIC (16) incluant :
    un élément de circuit intégré radiofréquence, RFIC, présentant une surface principale sur laquelle est formée une électrode terminale (16a, 16b) ; et
    un joint (18, 181) ;
    caractérisé en ce que :
    le joint (18, 181) présente une surface adhésive sur un matériau de base de joint souple (18a, 181b), la surface adhésive étant d'une taille supérieure à celle de la surface principale de l'élément de circuit RFIC (16) ;
    le joint (18, 181) muni d'un élément de circuit RFIC (16) est formé en fixant l'élément de circuit RFIC (16) à la surface adhésive de sorte que l'électrode terminale (16a, 16b) est exposée ; et
    le procédé comprend :
    une étape de préparation consistant à préparer un matériau de base de conducteur de rayonnement (12) incluant un conducteur de rayonnement (14a, 14b) et présentant une surface principale sur laquelle au moins une partie du conducteur de rayonnement (14a, 14b) est formée ;
    une étape de fixation consistant à fixer le joint (18, 181), muni d'un élément de circuit RFIC (16), à la surface principale du matériau de base de conducteur de rayonnement (12), de sorte que l'électrode terminale (16a, 16b) est en contact direct et coulissant, ou indirect et coulissant, avec la partie du conducteur de rayonnement (14a, 14b).
EP15856392.4A 2014-11-07 2015-10-28 Dispositif de communication sans fil ainsi que procédé de fabrication de celui-ci, et joint avec puce radiofréquence ainsi que procédé de production de celui-ci Active EP3091483B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20174965.2A EP3719707B1 (fr) 2014-11-07 2015-10-28 Dispositif de communication sans fil, son procédé de fabrication

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014227195 2014-11-07
JP2015044178 2015-03-06
PCT/JP2015/080449 WO2016072335A1 (fr) 2014-11-07 2015-10-28 Dispositif de communication sans fil ainsi que procédé de fabrication de celui-ci, et joint avec puce radiofréquence ainsi que procédé de production de celui-ci

Related Child Applications (2)

Application Number Title Priority Date Filing Date
EP20174965.2A Division EP3719707B1 (fr) 2014-11-07 2015-10-28 Dispositif de communication sans fil, son procédé de fabrication
EP20174965.2A Division-Into EP3719707B1 (fr) 2014-11-07 2015-10-28 Dispositif de communication sans fil, son procédé de fabrication

Publications (3)

Publication Number Publication Date
EP3091483A1 EP3091483A1 (fr) 2016-11-09
EP3091483A4 EP3091483A4 (fr) 2017-10-25
EP3091483B1 true EP3091483B1 (fr) 2020-08-12

Family

ID=55909061

Family Applications (2)

Application Number Title Priority Date Filing Date
EP15856392.4A Active EP3091483B1 (fr) 2014-11-07 2015-10-28 Dispositif de communication sans fil ainsi que procédé de fabrication de celui-ci, et joint avec puce radiofréquence ainsi que procédé de production de celui-ci
EP20174965.2A Active EP3719707B1 (fr) 2014-11-07 2015-10-28 Dispositif de communication sans fil, son procédé de fabrication

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP20174965.2A Active EP3719707B1 (fr) 2014-11-07 2015-10-28 Dispositif de communication sans fil, son procédé de fabrication

Country Status (5)

Country Link
US (3) US9836686B2 (fr)
EP (2) EP3091483B1 (fr)
JP (1) JP6176350B2 (fr)
CN (2) CN106030618B (fr)
WO (1) WO2016072335A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102668241B (zh) * 2010-03-24 2015-01-28 株式会社村田制作所 Rfid系统
EP3091483B1 (fr) * 2014-11-07 2020-08-12 Murata Manufacturing Co., Ltd. Dispositif de communication sans fil ainsi que procédé de fabrication de celui-ci, et joint avec puce radiofréquence ainsi que procédé de production de celui-ci
US10654365B2 (en) * 2015-04-29 2020-05-19 Aptiv Technologies Limited Bifurcated balanced electromagnetic resonator
JP6614364B2 (ja) * 2016-12-02 2019-12-04 株式会社村田製作所 Ｒｆｉｄタグ付き包装袋および包装袋の開封管理システム、並びに、ｒｆｉｄタグ付き貼付シートおよび貼付シートを貼付した容器の開封管理システム
DE112018000095T5 (de) 2017-02-21 2019-05-09 Murata Manufacturing Co., Ltd. Rfid-etikett
JP6424995B1 (ja) * 2017-07-14 2018-11-21 株式会社村田製作所 Ｒｆｉｄタグ
CN209183745U (zh) 2017-07-14 2019-07-30 株式会社村田制作所 Rfid标签
JP6531873B1 (ja) * 2017-07-14 2019-06-19 株式会社村田製作所 Ｒｆｉｄタグ付きメガネおよびｒｆｉｄタグ付き物品
JP6504324B1 (ja) * 2017-07-21 2019-04-24 株式会社村田製作所 無線通信デバイス
CN113348469A (zh) * 2019-01-25 2021-09-03 株式会社村田制作所 无线通信器件及其制造方法
CN215266637U (zh) * 2019-11-08 2021-12-21 株式会社村田制作所 Rfic模块和rfid标签
JP6838688B1 (ja) 2019-11-25 2021-03-03 株式会社村田製作所 Ｒｆｉｃモジュール、ｒｆｉｄタグ及びそれらの製造方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7710273B2 (en) * 1999-09-02 2010-05-04 Round Rock Research, Llc Remote communication devices, radio frequency identification devices, wireless communication systems, wireless communication methods, radio frequency identification device communication methods, and methods of forming a remote communication device
US6606247B2 (en) * 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
US6940408B2 (en) * 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
TWI339358B (en) * 2005-07-04 2011-03-21 Hitachi Ltd Rfid tag and manufacturing method thereof
CN101948025B (zh) * 2006-02-22 2012-05-30 东洋制罐株式会社 带rfid标签的金属盖及使用其的金属物品
WO2007119304A1 (fr) * 2006-04-14 2007-10-25 Murata Manufacturing Co., Ltd. Composant a circuit integre sans fil
JPWO2008132785A1 (ja) * 2007-04-12 2010-07-22 パナソニック株式会社 アンテナ装置
EP2166490B1 (fr) * 2007-07-17 2015-04-01 Murata Manufacturing Co. Ltd. Dispositif ci sans fil et appareil électronique
ITTO20070563A1 (it) 2007-07-30 2009-01-31 St Microelectronics Srl Dispositivo di identificazione a radiofrequenza con antenna accoppiata in near field
US7880614B2 (en) * 2007-09-26 2011-02-01 Avery Dennison Corporation RFID interposer with impedance matching
JP5037286B2 (ja) 2007-09-28 2012-09-26 富士通株式会社 Ｒｆｉｄタグおよびｒｆｉｄタグの製造方法
WO2009049264A1 (fr) 2007-10-10 2009-04-16 Kovio, Inc. Dispositifs sans fil incluant des circuits intégrés imprimés et procédés pour fabriquer et utiliser ceux-ci
JP5050803B2 (ja) 2007-11-21 2012-10-17 富士通株式会社 Ｒｆｉｄタグおよびｒｆｉｄタグ製造方法
JP5018488B2 (ja) * 2008-01-15 2012-09-05 Ｔｄｋ株式会社 アンテナモジュール
JP5414996B2 (ja) * 2008-01-21 2014-02-12 株式会社フジクラ アンテナ及び無線通信装置
JP5267463B2 (ja) * 2008-03-03 2013-08-21 株式会社村田製作所 無線ｉｃデバイス及び無線通信システム
DE112009000712B4 (de) 2008-04-15 2020-01-09 Borgwarner Inc. Haubenleitschaufeln eines Motorkühllüfters mit offenen Flügeln
CN102007644B (zh) * 2008-04-24 2013-10-16 东丽株式会社 非接触ic标签
JP4609604B2 (ja) * 2008-05-21 2011-01-12 株式会社村田製作所 無線ｉｃデバイス
JP2010267150A (ja) * 2009-05-15 2010-11-25 Toppan Forms Co Ltd 非接触型情報記録媒体
JP5447515B2 (ja) * 2009-06-03 2014-03-19 株式会社村田製作所 無線ｉｃデバイス及びその製造方法
US20110169641A1 (en) * 2010-01-14 2011-07-14 Rfmarq, Inc. System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
US8851388B2 (en) * 2010-07-06 2014-10-07 Chin Hua Lin RFID (radio frequency identification) tag
JP2012032931A (ja) 2010-07-29 2012-02-16 Hitachi Ltd Ｒｆｉｄタグ及びｒｆｉｄタグの製造方法
JP2012043282A (ja) * 2010-08-20 2012-03-01 Toppan Forms Co Ltd 非接触型データ受送信体
JP2012108695A (ja) * 2010-11-17 2012-06-07 Toppan Printing Co Ltd 非接触通信用ｉｃカード
WO2012096365A1 (fr) 2011-01-14 2012-07-19 株式会社村田製作所 Boîtier de puce rfid et étiquette rfid
JP2013045780A (ja) 2011-08-22 2013-03-04 Hitachi Ltd 半導体装置及びその製造方法
JP2013242698A (ja) * 2012-05-21 2013-12-05 Murata Mfg Co Ltd 無線ｉｃモジュール付き基材シートの製造方法
JP2014081828A (ja) * 2012-10-17 2014-05-08 Fujitsu Ltd Ｒｆｉｄタグ
EP2736001A1 (fr) * 2012-11-27 2014-05-28 Gemalto SA Module électronique à interface de communication tridimensionnelle
JP5907365B1 (ja) * 2014-11-07 2016-04-26 株式会社村田製作所 無線通信デバイスおよびその製造方法、ならびにｒｆｉｃ素子付きシールおよびその作製方法
EP3091483B1 (fr) * 2014-11-07 2020-08-12 Murata Manufacturing Co., Ltd. Dispositif de communication sans fil ainsi que procédé de fabrication de celui-ci, et joint avec puce radiofréquence ainsi que procédé de production de celui-ci
JP6551007B2 (ja) * 2015-07-27 2019-07-31 富士通株式会社 Ｒｆｉｄタグ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
US20190138873A1 (en) 2019-05-09
JP6176350B2 (ja) 2017-08-09
CN106030618B (zh) 2018-11-20
US10210449B2 (en) 2019-02-19
US20180060717A1 (en) 2018-03-01
EP3091483A1 (fr) 2016-11-09
CN106030618A (zh) 2016-10-12
US9836686B2 (en) 2017-12-05
WO2016072335A1 (fr) 2016-05-12
JP2016167274A (ja) 2016-09-15
CN109376837A (zh) 2019-02-22
EP3719707B1 (fr) 2021-11-10
EP3091483A4 (fr) 2017-10-25
US20160350638A1 (en) 2016-12-01
EP3719707A1 (fr) 2020-10-07

Similar Documents

Publication Publication Date Title
EP3091483B1 (fr) Dispositif de communication sans fil ainsi que procédé de fabrication de celui-ci, et joint avec puce radiofréquence ainsi que procédé de production de celui-ci
JP6057042B1 (ja) キャリアテープ及びその製造方法、並びにｒｆｉｄタグの製造方法
EP3089079B1 (fr) Ruban porteur ainsi que procédé de fabrication de celui-ci, et procédé de fabrication d'étiquette rfid
US9881248B2 (en) RFIC module and RFID tag including the same
JP5703977B2 (ja) 無線通信デバイス付き金属物品
US9627759B2 (en) Antenna device antenna module
JP5170156B2 (ja) 無線ｉｃデバイス
JP5904316B1 (ja) キャリアテープ及びその製造方法、並びにｒｆｉｄタグの製造方法
US10467516B2 (en) Component built-in device
US20210350199A1 (en) Wireless communication device and method of manufacturing same
US8905296B2 (en) Wireless integrated circuit device and method of manufacturing the same
JP5907365B1 (ja) 無線通信デバイスおよびその製造方法、ならびにｒｆｉｃ素子付きシールおよびその作製方法
JP5786618B2 (ja) 無線ｉｃデバイス及びその製造方法
JP5896594B2 (ja) 無線ｉｃデバイス
JPWO2020012726A1 (ja) 無線通信デバイスおよびその製造方法
JP2017116997A (ja) 部品内蔵デバイス、ｒｆｉｄタグ、および部品内蔵デバイスの製造方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20160804

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

A4 Supplementary search report drawn up and despatched

Effective date: 20170921

RIC1 Information provided on ipc code assigned before grant

Ipc: G06K 19/077 20060101AFI20170915BHEP

Ipc: G06K 19/07 20060101ALI20170915BHEP

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20190218

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20200302

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602015057502

Country of ref document: DE

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1302272

Country of ref document: AT

Kind code of ref document: T

Effective date: 20200915

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20200812

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201112

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201113

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201112

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1302272

Country of ref document: AT

Kind code of ref document: T

Effective date: 20200812

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602015057502

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201028

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20201031

26N No opposition filed

Effective date: 20210514

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20201112

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201031

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201031

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201028

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201112

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201212

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20231020

Year of fee payment: 9