EP3080872B1 - Kontaktanbindung von geschirmten datenleitungen an einer platine sowie verfahren zur kontaktierung mehrerer geschirmter datenleitungen an einer platine - Google Patents

Kontaktanbindung von geschirmten datenleitungen an einer platine sowie verfahren zur kontaktierung mehrerer geschirmter datenleitungen an einer platine Download PDF

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Publication number
EP3080872B1
EP3080872B1 EP14824800.8A EP14824800A EP3080872B1 EP 3080872 B1 EP3080872 B1 EP 3080872B1 EP 14824800 A EP14824800 A EP 14824800A EP 3080872 B1 EP3080872 B1 EP 3080872B1
Authority
EP
European Patent Office
Prior art keywords
ground
pair
data lines
contact zone
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14824800.8A
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German (de)
English (en)
French (fr)
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EP3080872A1 (de
Inventor
Bernd Janssen
Christoph UNTIEDT
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leoni Kabel GmbH
Original Assignee
Leoni Kabel GmbH
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Filing date
Publication date
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Publication of EP3080872A1 publication Critical patent/EP3080872A1/de
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6592—Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/65912—Specific features or arrangements of connection of shield to conductive members for shielded multiconductor cable
    • H01R13/65914—Connection of shield to additional grounding conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/65912—Specific features or arrangements of connection of shield to conductive members for shielded multiconductor cable
    • H01R13/65915—Twisted pair of conductors surrounded by shield
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H01R13/6595—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members with separate members fixing the shield to the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6596—Specific features or arrangements of connection of shield to conductive members the conductive member being a metal grounding panel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board

Definitions

  • the invention relates to a contact connection of shielded data lines on a circuit board and a method for contacting several shielded data lines on a circuit board.
  • data cables are used for data transmission, in which typically several data lines are combined in a common cable sheath.
  • shielded wire pairs are used as data lines, the two wires in particular running parallel to one another or alternatively being twisted with one another.
  • a respective wire consists of the actual conductor, for example a solid conductor wire or a stranded wire, each of which is surrounded by insulation.
  • the wire pair of a respective data line is surrounded by a (pair) shield.
  • the data cables typically have a large number of wire pairs shielded in this way, which are surrounded by a common cable sheath.
  • Such data cables are pre-assembled and connected to plugs.
  • the plugs are often designed as so-called small form pluggable plugs, or SFP plugs for short.
  • SFP plugs There are different design variants, for example so-called SFP, SFP +, or CXP-QSFP connectors.
  • These connectors have special connector housings, such as those from WO 2011 072 869 A1 or the WO 2011 089 003 A1 can be found.
  • connector housings of this type have a printed circuit board or circuit board partially with integrated electronics.
  • the respective data cable must be connected to the rear of the connector on this circuit board.
  • the individual wires of the Data cable soldered to the circuit board.
  • this typically forms a plug-in tongue with connection contacts, which is plugged into a mating connector.
  • Such boards are also referred to as paddle cards.
  • drain wire is arranged in a respective data line, which is electrically connected to the shield and via which the electrical contacting of the shield to a ground connection of the circuit board is ultimately made.
  • a drain wire is provided for each pair of wires, which are typically stranded together in pairs like a twisted pair, and several pairs of wires are connected.
  • Such a data line with drain wire is, for example, from EP 2 112 669 A2 refer to.
  • the contacting of the filler wire is, however, associated with production engineering expense, and the individual contacting of the additional wires of the various data lines requires a certain amount of space, which is disruptive with the comparatively small connectors. Alignment of the drain wire is also necessary in order to guide it to the desired connection position.
  • the US 2013/0264107 A1 shows a contact connection of several lines provided with shields on a circuit board which has a middle plane which protrudes on one contact side. On an overhanging section The ends of the cables with the shields lie on the middle level.
  • the invention is based on the object of enabling an easy-to-manufacture and compact contact connection of shielded data lines of a data cable to a circuit board, in particular during the manufacture of such plugs.
  • the object is achieved according to the invention by a contact connection with the features of claim 1.
  • the board in particular a plug board of a plug of the small form pluggable type, is typically multilayered and has at least one conductor track plane, in particular with integrated electronics, and a ground plane.
  • the ground plane of the board is designed to protrude in the direction of the data lines to be connected in the manner of a tongue and has a ground contact zone in the protruding partial area with which the at least one, preferably several data lines are in contact with their shielding.
  • the shielding is suitably fixed to the ground contact zone and pressed against the ground contact zone.
  • the contact connection is basically suitable for all connector types, those with so-called paddle cards are equipped, in which the conductors of the line are contacted directly on a circuit board.
  • the data lines are each a wire pair surrounded by a pair of shielding, several such wire pairs surrounded by a pair of shielding being combined in a data cable and being surrounded by a common cable sheath.
  • the pair shielding is typically a multilayer film structure with at least one metallic film which is attached around the pair of wires, preferably folded lengthways.
  • this foil shielding has an additional plastic foil, for example polyester foil, which is often made adhesive for assembly purposes.
  • the wires are preferably run parallel to one another.
  • the use of a drain wire is dispensed with.
  • the additional advantage of reducing the diameter of the entire data cable compared to a data cable with drain wires is achieved. Due to the simple connection of the shields to the ground contact zone, such a drain wire is no longer required for a reliable ground connection. Rather, this is ensured via the flat ground contact zone.
  • the ground contact zone expediently extends at least over a large part of the width and preferably over the entire width of the board.
  • it is designed in a simple manner as a metal layer, for example, sprayed on.
  • the ground contact zone is formed by vapor deposition or also by applying, in particular gluing on, a film. Overall, therefore, a very large ground contact zone is formed. There are therefore no special positioning requirements for the contact connection.
  • the shields of the data lines are, for example, by means of a material connection, for example by means of gluing. Soldering or welding connected to the ground contact zone.
  • the shields are generally pressed against the ground contact zone by means of a common clamping element.
  • the use of a common clamping element also enables simple assembly.
  • the individual data lines only need to be first placed with their shields on the ground contact zone and then connected to the circuit board in a clamping manner with a fastening element designed as a clamping element.
  • the clamping element is expediently conductive and in particular designed as a metal strip which runs transversely to the longitudinal direction of the plate.
  • This metal strip is used for additional shield contact and is preferably also connected to the ground contact zone or to another ground conductor.
  • a ground conductor can also be a housing part of a plug in which the circuit board rests.
  • the counter bearing to which the clamping element is screwed for example, is a housing part.
  • the clamping element is preferably designed in the manner of an arch, which is bent slightly downwards towards the ground plane at its opposite ends and preferably on the board in these opposite end areas, in particular is attached to the ground plane.
  • fastening holes for screw fastening are arranged, for example, in the opposite end regions.
  • this metal arch can also be soldered or glued on.
  • the clamping element preferably has guides for the individual data lines and, for this purpose, is embodied in particular in the shape of a wave or a pinnacle.
  • An individual guide for a respective wire of the data line is therefore provided by a corresponding wave trough.
  • the individual wave troughs preferably have the same radius as the shielded wires.
  • the shielding is expediently designed as a multilayer film with a metal film, in particular aluminum film, and with an insulating film, or also designed as a metallized insulating film.
  • a metal film in particular aluminum film
  • an insulating film or also designed as a metallized insulating film.
  • the shielding is expediently folded over or turned inside out, so that the shielding is designed with two layers in the area of the ground contact zone, that is to say in a ground contact area.
  • this is comparatively simple in terms of production technology and, moreover, a high level of contact reliability is achieved.
  • the insulation film In applications in which the insulation film is oriented inwards to the pair of wires, it would be oriented towards the outside due to being folded over and would act as insulation to the ground contact zone. In this case in particular, the insulation film has been removed in the area of the ground contact zone. This is expediently done, for example, with the aid of a laser by local thermal sensors Treatment. Alternatively, in this case in which the conductive layer is already facing outwards, preferably no flipping over and the conductive layer is contacted directly.
  • the individual data conductors are connected to the board in an electrically conductive manner. For this purpose, these are guided in the longitudinal direction of the data cable or the circuit board over the ground contact zone and contacted with a conductor track of the conductor track level.
  • the contact is usually made by means of a soldered connection.
  • the core insulation of each core is removed beforehand so that a bare data conductor is present in the conductor contact area.
  • the ground plane is expediently formed by a middle plane of the circuit board, on which further planes, in particular the conductor track planes with conductor tracks and / or integrated electronics, are arranged on both sides. As already mentioned, this middle level is guided in a tongue-like manner in the rearward direction beyond the other conductor track levels.
  • This ground plane expediently has a ground contact zone on both sides with shields connected to it. The multiple data lines of the data cable are therefore connected to the ground contact zone on both sides. The same preferably also applies to the individual data conductors, which are each connected to opposite outer layers (conductor track planes). Overall, this results in a compact structure.
  • the ground plane is preferably a mechanical carrier, for example made of a non-conductive carrier material, in particular a printed circuit board material, for example with the material identifier FR4.
  • a ground conductor is preferably applied to both sides of this non-conductive carrier.
  • the ground conductor is in particular applied as a full-area metallization layer on both sides of the carrier.
  • the ground conductor is preferably made of copper.
  • a conductive carrier in particular made of solid metal, is used, which then itself acts as a ground conductor.
  • the carrier extends, preferably together with the ground conductor attached to it, beyond the further layer structure in a tongue-like manner.
  • the ground conductor itself forms the ground contact zone.
  • an additional metal or contact layer made of a material with very high conductivity and good contact properties is applied in the area of the ground contact zone.
  • a gold layer is applied as an additional metal layer.
  • At least the ground contact zone is enclosed by a sealing compound together with the shielding contacted thereon.
  • a sealing compound together with the shielding contacted thereon.
  • This reliably avoids corrosion problems which can occur in the event of moisture due to the material pairing between the different metals of the ground contact zone, usually gold, and the shield, usually aluminum.
  • the adjoining area is expediently also enclosed by the sealing compound, in which the individual conductor cores are in contact with the circuit board, in particular are soldered on.
  • the shields and the ground contact zone are expediently embedded in the sealing compound. This is preferably designed as a casting or injection molding compound, as an adhesive, as an epoxy resin or also as a so-called hot melt.
  • the object is also achieved according to the invention by a method for making contact with a plurality of shielded data lines on a circuit board having the features of claim 13.
  • the contact connection described comprises a circuit board 2 and a plurality of data lines with electrical contact thereon and each designed as shielded wire pairs 4.
  • a shielded pair of wires 4 is in particular also based on the Fig. 4 shown.
  • the shielded wire pair 4 comprises data conductors 6, each of which is surrounded by insulation 8.
  • the wire pair 4 is surrounded by a common pair shield 10, which is designed as a foil shield.
  • the pair shield 10 typically has a multilayer structure made up of a metal layer (aluminum) and a plastic layer.
  • the metal layer is applied to a plastic layer by metallization.
  • the plastic layer can be a plastic film, in particular a PET film.
  • the individual wires consisting of the data conductor 6 with the respective insulation 8 run parallel to one another.
  • the pair shield 10 is designed as a longitudinally folded film, an overlap area being formed in the interstice area between the two wires.
  • the shielded wire pair 4 does not have an otherwise customary drain wire, which is typically also arranged in the longitudinal direction of the wire pair 4, for example in the crotch area between the individual wires.
  • the circuit board 2 has a multilayer or multilayer structure and is designed symmetrically to a center plane.
  • the layer structure comprises a centrally arranged carrier 12 on which a layer sequence is built up on both sides.
  • the carrier itself consists of a conventional, insulating printed circuit board material, for example with the material identification FR 4. Additional insulation layers 16 and conductor track planes 18 alternately adjoin the ground conductor 14. The further insulation layers 16 preferably consist of a special insulating printed circuit board material which is suitable for high-frequency applications.
  • the outermost conductor track layer 18 is equipped in a central area with electronic components 20, which are electrically contacted with one another via the individual conductor tracks 20. Furthermore, the outermost conductor track layer 18 has a plurality of connection pads 24 to which the data conductors 6 of the individual wire pairs 4 are connected. On the front side of the circuit board 2 opposite the wire pairs 4, connection pads 24 are also formed. This is used to establish an electrical connection with corresponding contact elements of a contact plug, into which the circuit board 2 is inserted to form a plug connection.
  • the connection pads 24 are preferably here formed by applying an additional metal layer, in particular gold layer.
  • the carrier 12 is drawn beyond the rest of the layer structure in a rear region of the circuit board 2, which is oriented towards the wire pairs 4, so that a kind of protruding tongue is formed. Together with the carrier 12, the ground conductor 14 is also pulled out into this protruding area.
  • the carrier 12 forms a ground plane 26 with the ground conductor 14.
  • the protruding partial area forms a ground contact zone 28 of the ground plane 26.
  • the respective wire pair 4 rests on this ground contact zone 28 in a contacting manner with the pair shielding 10.
  • a clamping element 32 is arranged on the opposite side of the ground contact zone 28, which is in the Fig. 1 and 2 is shown only schematically and greatly simplified. With this clamping element, the wire pair 4 is pressed against the circuit board 2 in the area of the exposed pair shielding 10.
  • the clamping element 32 is embodied in particular to be conductive, so that additional contact is made with the pair shielding 10 via the clamping element 32.
  • the clamping element 32 is designed, for example, as a metal strip or metal bracket, which is connected, for example, to the circuit board in order to exert the desired clamping force. For this purpose, a screw fastening or an adhesive fastening can be provided.
  • this measure enables the pair shielding 10 to be connected to the ground plane 26 of the circuit board 2 in a simple manner.
  • a plurality of wire pairs 4 only need to be placed next to one another on the ground contact zone 28 and braced against the ground contact zone 28 with the clamping element 32.
  • the individual data conductors 6 are also connected to the respective connection pads 24 in an electrically contacting manner, for example by soldering.
  • the possibly disruptive plastic film of the pair shield 10 is removed if necessary.
  • the plastic film can represent the inner or outer layer of the pair shielding 10. If this plastic film is on the outside, it is removed before the screen is connected. For this purpose, a thermal laser treatment is provided in particular.
  • the pair shielding 10 is expediently turned back in the front area, so that it has a total of two layers.
  • a seal formed by a sealing compound 33 is formed, which is indicated by a dashed line. This surrounds, in particular, the ground contact zone 28 with the shields 10 that are in contact thereon, which are therefore embedded together in the sealing compound 33.
  • the clamping element 32 is also embedded in the exemplary embodiment.
  • the sealing compound 33 is applied, for example, by an (injection) casting process or also in the form of an adhesive as epoxy resin or a hotmelt.
  • the sealing compound 33 is applied exclusively in the contact area where the data conductors 6 and the shielding 10 are in contact with the circuit board 2.
  • the contact connection described here between wire pairs 4 and a circuit board 2 is used in particular in high-speed data cables where a corresponding data cable 34 (cf. Fig. 3 ) a plug 36 is connected.
  • These plugs 36 are, in particular, so-called small form plugable plugs, which are known under the abbreviations SFP, SFP +, QSFP or also CXP plugs.
  • Such a connector 36 is in Fig. 3 shown in greatly simplified form.
  • Such a plug 36 takes the circuit board 2 in its interior.
  • the data cable 34 comprises a cable jacket 38 and preferably several of the in Fig. 4 wire pairs 4 shown. In the case of a QSFP connector, for example, a data cable 34 with a total of eight wire pairs 4 is used. All wire pairs 4 of the data cable 34 are connected to the circuit board 2 in the plug 36. In this case, both the pair shielding 10 is contacted with the ground plane 26 and each individual data conductor 6 is electrically connected to the corresponding connection pads 24.
  • Such pre-assembled cables with connected plugs 36 are used, for example, as so-called patch cables in computer networks.
  • the plugs 36 are inserted into plug sockets.
  • the data connection is established automatically.
  • the connection pads 24 on the front (cf. Fig. 2 ) automatically contacted by the corresponding contact element of the contact socket.
  • the circuit board 2 is therefore designed as a whole in the manner of a plug-in circuit board.
EP14824800.8A 2013-12-12 2014-12-12 Kontaktanbindung von geschirmten datenleitungen an einer platine sowie verfahren zur kontaktierung mehrerer geschirmter datenleitungen an einer platine Active EP3080872B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013225794.5A DE102013225794A1 (de) 2013-12-12 2013-12-12 Kontaktanbindung von geschirmten Datenleitungen an einer Platine sowie Verfahren zur Kontaktierung mehrerer geschirmter Datenleitungen an einer Platine
PCT/EP2014/077610 WO2015086833A1 (de) 2013-12-12 2014-12-12 Kontaktanbindung von geschirmten datenleitungen an einer platine sowie verfahren zur kontaktierung mehrerer geschirmter datenleitungen an einer platine

Publications (2)

Publication Number Publication Date
EP3080872A1 EP3080872A1 (de) 2016-10-19
EP3080872B1 true EP3080872B1 (de) 2021-06-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP14824800.8A Active EP3080872B1 (de) 2013-12-12 2014-12-12 Kontaktanbindung von geschirmten datenleitungen an einer platine sowie verfahren zur kontaktierung mehrerer geschirmter datenleitungen an einer platine

Country Status (5)

Country Link
US (1) US9887496B2 (zh)
EP (1) EP3080872B1 (zh)
CN (1) CN105814743B (zh)
DE (1) DE102013225794A1 (zh)
WO (1) WO2015086833A1 (zh)

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CA2946798A1 (en) 2014-04-25 2015-10-29 Leoni Kabel Holding Gmbh Data cable
CN205724021U (zh) * 2016-04-12 2016-11-23 通普康电子（昆山）有限公司 线缆连接器及其承载模块
US11374361B2 (en) * 2018-02-16 2022-06-28 Junkosha Inc. Plug connector, connector system, and flying body

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EP3080872A1 (de) 2016-10-19
CN105814743B (zh) 2019-04-19
US9887496B2 (en) 2018-02-06
WO2015086833A1 (de) 2015-06-18
DE102013225794A1 (de) 2015-06-18
CN105814743A (zh) 2016-07-27
US20160294122A1 (en) 2016-10-06

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