EP3080872B1 - Liaison de contact de lignes de données blindées à une carte de circuits et procédé de mise en contact d'une pluralité de lignes de données blindées avec une carte de circuits - Google Patents

Liaison de contact de lignes de données blindées à une carte de circuits et procédé de mise en contact d'une pluralité de lignes de données blindées avec une carte de circuits Download PDF

Info

Publication number
EP3080872B1
EP3080872B1 EP14824800.8A EP14824800A EP3080872B1 EP 3080872 B1 EP3080872 B1 EP 3080872B1 EP 14824800 A EP14824800 A EP 14824800A EP 3080872 B1 EP3080872 B1 EP 3080872B1
Authority
EP
European Patent Office
Prior art keywords
ground
pair
data lines
contact zone
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14824800.8A
Other languages
German (de)
English (en)
Other versions
EP3080872A1 (fr
Inventor
Bernd Janssen
Christoph UNTIEDT
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leoni Kabel GmbH
Original Assignee
Leoni Kabel GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leoni Kabel GmbH filed Critical Leoni Kabel GmbH
Publication of EP3080872A1 publication Critical patent/EP3080872A1/fr
Application granted granted Critical
Publication of EP3080872B1 publication Critical patent/EP3080872B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/6592Specific features or arrangements of connection of shield to conductive members the conductive member being a shielded cable
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/65912Specific features or arrangements of connection of shield to conductive members for shielded multiconductor cable
    • H01R13/65914Connection of shield to additional grounding conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/65912Specific features or arrangements of connection of shield to conductive members for shielded multiconductor cable
    • H01R13/65915Twisted pair of conductors surrounded by shield
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H01R13/6595Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members with separate members fixing the shield to the PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/6596Specific features or arrangements of connection of shield to conductive members the conductive member being a metal grounding panel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28Clamped connections, spring connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/53Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658Structural association with built-in electrical component with built-in electronic circuit on printed circuit board

Claims (13)

  1. Connexion par contact d'une pluralité lignes de données blindées combinées dans un câble de données (34) à une carte de circuit imprimé (2), dans laquelle une paire de fils (4) entourée d'un blindage de paire (10) est utilisée respectivement comme ligne de données, et la carte de circuit imprimé (2) est multicouche et comprend un plan de pistes conductrices et un plan de masse (26), et le plan de masse (26) formé au moyen d'un plan central dépasse du plan de pistes conductrices avec une zone de contact de masse (28) à la manière d'une languette en direction vers les lignes de données connectées, et les lignes de données reposent avec leur blindage (10) sur la zone de contact de masse (28) et sont contactées avec celle-ci, dans laquelle les blindages de paire (10) des lignes de données sont pressées contre la zone de contact de masse (28) au moyen d'un élément de serrage (32) et l'élément de serrage (32) - vu dans une direction longitudinale de la ligne de données - ne dépasse pas les blindages de pair (10).
  2. Connexion de contact selon la revendication 1,
    caractérisée en ce
    que la ligne de données respective n'a pas de fil de remplissage.
  3. Connexion de contact selon l'une des revendications précédentes,
    caractérisée en ce
    que la zone de contact de masse (28) est une couche métallique s'étendant de manière continue sur au moins une grande partie de la largeur de la carte de circuit imprimé (2).
  4. Connexion de contact selon l'une des revendications précédentes,
    caractérisée en ce
    que l'élément de serrage (32) est conducteur et sert complémentairement à la mise en contact des blindages de pair (10).
  5. Connexion de contact selon l'une quelconque des revendications précédentes,
    caractérisée en ce
    que l'élément de serrage (32) est conçu comme une bande et comprend des zones d'extrémité opposées au moyen desquelles il est fixé à une butée, en particulier au plan de masse (26).
  6. Connexion de contact selon l'une des revendications précédentes,
    caractérisée en ce
    que l'élément de serrage (32) comprend des guides pour les différentes lignes de données et est à cet effet de forme ondulée ou crénelée, vu en coupe transversale, dans laquelle une auge ondulée correspondante forme un guide individuel pour un noyau respectif de la ligne de données.
  7. Connexion de contact selon l'une des revendications précédentes,
    caractérisée en ce
    que le blindage de paire (10) comprend un film multicouche avec une couche métallique ainsi qu'une couche d'isolation, et le blindage de paire (10) est à double couche dans la région de la zone de contact de masse (28) en raison d'un rabattement inverse.
  8. Connexion de contact selon la revendication précédente,
    caractérisée en ce
    que la couche d'isolation dans la région de la zone de contact de masse (28) est enlevée, de préférence au moyen d'un laser.
  9. Connexion de contact selon l'une des revendications précédentes,
    caractérisée en ce
    que le plan de masse (26) constitue un plan central de la carte de circuit imprimé (2) et une zone de contact de masse respective (28) avec des blindages de paire (10) connectés à celle-ci est formée sur des côtés opposés.
  10. Connexion de contact selon l'une des revendications précédentes,
    caractérisée en ce
    que le plan de masse (26) comprend un support (12) avec un conducteur de masse (14) monté sur celui-ci, dans laquelle le conducteur de masse (14) est en particulier une couche de métallisation.
  11. Connexion de contact selon l'une des revendications précédentes,
    caractérisée en ce
    que la zone de contact de masse (28) ainsi que le blindage (10) contacté avec elle sont entourés d'une masse d'étanchéité (33) et en particulier noyés dans celle-ci.
  12. Connexion de contact selon la revendication précédente,
    caractérisée en ce
    que la masse de d'étanchéité (33) n'est appliquée que dans la région de la zone de contact de masse (28) et, si nécessaire, en plus dans une région de contact de conducteur, dans laquelle un conducteur de données respectif (6) de la ligne de données est contacté avec la carte de circuit imprimé (2).
  13. Procédé pour la mise en contact d'une pluralité de lignes de données blindées réunies dans un câble de données (34) à une carte de circuit imprimé (2), dans lequel une carte de circuit imprimé multicouche (2) avec un plan de pistes conductrices ainsi que d'un plan de masse (26) est prévue et le plan de masse (26) formé par un plan central dépasse à la manière d'une languette le plan de pistes conductrices en direction vers les lignes de données connectées et forme une zone de contact de masse, dans lequel une paire de fils (4) entourée d'un blindage de paire (10) est utilisée respectivement comme ligne de données et le blindage de paire (10) est contacté avec la zone de contact de masse (28), dans lequel les blindages de paire (10) des lignes de données sont pressés contre la zone de contact de masse (28) au moyen d'un élément de serrage (32) et l'élément de serrage (32) - vu dans une direction longitudinale des lignes de données - ne dépasse pas les blindages de paire (10).
EP14824800.8A 2013-12-12 2014-12-12 Liaison de contact de lignes de données blindées à une carte de circuits et procédé de mise en contact d'une pluralité de lignes de données blindées avec une carte de circuits Active EP3080872B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013225794.5A DE102013225794A1 (de) 2013-12-12 2013-12-12 Kontaktanbindung von geschirmten Datenleitungen an einer Platine sowie Verfahren zur Kontaktierung mehrerer geschirmter Datenleitungen an einer Platine
PCT/EP2014/077610 WO2015086833A1 (fr) 2013-12-12 2014-12-12 Liaison de contact de lignes de données blindées à une carte de circuits et procédé de mise en contact d'une pluralité de lignes de données blindées avec une carte de circuits

Publications (2)

Publication Number Publication Date
EP3080872A1 EP3080872A1 (fr) 2016-10-19
EP3080872B1 true EP3080872B1 (fr) 2021-06-30

Family

ID=52302186

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14824800.8A Active EP3080872B1 (fr) 2013-12-12 2014-12-12 Liaison de contact de lignes de données blindées à une carte de circuits et procédé de mise en contact d'une pluralité de lignes de données blindées avec une carte de circuits

Country Status (5)

Country Link
US (1) US9887496B2 (fr)
EP (1) EP3080872B1 (fr)
CN (1) CN105814743B (fr)
DE (1) DE102013225794A1 (fr)
WO (1) WO2015086833A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2946798A1 (fr) 2014-04-25 2015-10-29 Leoni Kabel Holding Gmbh Cable de donnees
CN205724021U (zh) * 2016-04-12 2016-11-23 通普康电子(昆山)有限公司 线缆连接器及其承载模块
WO2019160149A1 (fr) * 2018-02-16 2019-08-22 株式会社 潤工社 Connecteur mâle, système de connecteur et corps volant

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29621580U1 (de) * 1996-12-13 1997-02-20 Fuba Automotive Gmbh Leitungs-Steckverbindung
US20130225004A1 (en) * 2012-02-24 2013-08-29 Tyco Electronics Corporation Electrical connector assembly and printed circuit board configured to electrically couple to a communication cable

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3365549B2 (ja) * 1998-11-19 2003-01-14 住友電装株式会社 シールド端子
US6575772B1 (en) * 2002-04-09 2003-06-10 The Ludlow Company Lp Shielded cable terminal with contact pins mounted to printed circuit board
US7371128B2 (en) * 2003-10-14 2008-05-13 Precision Interconnect, Inc. Cable terminal with air-enhanced contact pins
JP4673191B2 (ja) * 2005-11-15 2011-04-20 富士通コンポーネント株式会社 ケーブルコネクタ
TWI371141B (en) * 2007-02-26 2012-08-21 Hon Hai Prec Ind Co Ltd Cable connector assembly
DE102008019968A1 (de) 2008-04-21 2009-10-22 Leoni Kabel Holding Gmbh Datenübertragungskabel sowie Verfahren zur Herstellung eines Datenübertragungskabels
EP2922154B1 (fr) * 2008-06-04 2019-09-11 Hosiden Corporation Connecteur électrique
US8011950B2 (en) * 2009-02-18 2011-09-06 Cinch Connectors, Inc. Electrical connector
TWI391037B (zh) * 2009-11-09 2013-03-21 Advance Materials Corp 接墊結構及其製法
DE102009059685A1 (de) 2009-12-19 2011-06-22 FCT electronic GmbH, 81829 Steckerelement mit einem Verriegelungsmechanismus
EP2526591B1 (fr) 2010-01-22 2016-05-11 LEONI Kabel Holding GmbH Élément de connecteur avec mécanisme de verrouillage
TWI446664B (zh) * 2010-05-18 2014-07-21 Hon Hai Prec Ind Co Ltd 線纜連接器組件
US8327536B2 (en) * 2010-06-30 2012-12-11 Apple Inc. Method of manufacturing high-speed connector inserts and cables
JP5589778B2 (ja) * 2010-11-05 2014-09-17 日立金属株式会社 差動信号伝送用ケーブルと回路基板の接続構造及び接続方法
JP5611864B2 (ja) * 2011-03-09 2014-10-22 アルプス電気株式会社 入力装置及び入力装置の製造方法
US20130264107A1 (en) * 2012-04-05 2013-10-10 Tyco Electronics Corporation Circuit board and wire assembly
US9350126B2 (en) * 2013-07-19 2016-05-24 Foxconn Interconnect Technology Limited Electrical connector having a receptacle with a shielding plate and a mating plug with metallic side arms

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29621580U1 (de) * 1996-12-13 1997-02-20 Fuba Automotive Gmbh Leitungs-Steckverbindung
US20130225004A1 (en) * 2012-02-24 2013-08-29 Tyco Electronics Corporation Electrical connector assembly and printed circuit board configured to electrically couple to a communication cable

Also Published As

Publication number Publication date
US9887496B2 (en) 2018-02-06
CN105814743A (zh) 2016-07-27
DE102013225794A1 (de) 2015-06-18
US20160294122A1 (en) 2016-10-06
CN105814743B (zh) 2019-04-19
WO2015086833A1 (fr) 2015-06-18
EP3080872A1 (fr) 2016-10-19

Similar Documents

Publication Publication Date Title
DE3790062C2 (fr)
EP3134905B1 (fr) Câble de données
DE2524582A1 (de) Kabelanschlusselement fuer ein kabel mit innen- und aussenleiter
DE112008003375T5 (de) Wasserabdichtverfahren für einen Draht und Draht, welcher ein wasserdichtes Teil aufweist, welches durch das Wasserabdichtverfahren gebildet ist
EP2684253B1 (fr) Dispositif et procédé de connexion pour signaux digitaux à haute fréquence
EP3435482B1 (fr) Liaison de connexion comprenant un système de câble et un système de plaque, procédé de fabrication d'une telle liaison de connexion
DE2112449A1 (de) Modulare Verkabelung
DE112008001298T5 (de) Abgeschirmter Verbinder
WO2015158726A1 (fr) Dispositif et procédé de transmission de signaux de données différentiels
EP3729562B1 (fr) Ensemble formant carte de circuit imprimé, élément de liaison et procédé de montage d'au moins un élément de liaison
EP1656717B1 (fr) Dispositif de raccord a cable plat
EP3080872B1 (fr) Liaison de contact de lignes de données blindées à une carte de circuits et procédé de mise en contact d'une pluralité de lignes de données blindées avec une carte de circuits
DE102019121329B4 (de) Koaxialverbinder
DE102004056866A1 (de) Extrudierte Flachleitung sowie Verfahren zum Erzeugen einer extrudierten Flachleitung
EP3163688B1 (fr) Élément de connexion destiné à connecter un premier câble de données à un second câble de données et ligne de données comportant un tel élément de connexion.
DE202018100521U1 (de) Elektrische Verbindungseinrichtung
DE102010000822B4 (de) Kabelverbindungseinheit
EP3367514A1 (fr) Connecteur enfichable pour applications haute fréquence, par exemple, pour application ethernet
DE202013010545U1 (de) Elektrisches Kontaktelement
DE10301227A1 (de) Umformen von Leiterenden eines Flachbandkabels
DE60210978T2 (de) Steckverbinder für eine mehrzahl von anschlussbuchsen für koaxialkabel
EP3025397A1 (fr) Système constitué d'une carte de circuits imprimés et d'une enveloppe tubulaire
EP0891646B1 (fr) Circuit de signaux
DE19825684A1 (de) Verfahren zum Anschließen elektronischer Bauelemente
DE102009047223B3 (de) Kabel

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20160711

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: LEONI KABEL GMBH

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20180430

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: LEONI KABEL GMBH

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 502014015710

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01R0012530000

Ipc: H01R0013660000

RIC1 Information provided on ipc code assigned before grant

Ipc: H01R 13/6591 20110101ALI20201222BHEP

Ipc: H01R 13/66 20060101AFI20201222BHEP

Ipc: H01R 12/57 20110101ALI20201222BHEP

Ipc: H01R 13/6596 20110101ALI20201222BHEP

Ipc: H01R 12/53 20110101ALI20201222BHEP

Ipc: H01R 13/6595 20110101ALI20201222BHEP

Ipc: H01R 13/6592 20110101ALI20201222BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20210202

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502014015710

Country of ref document: DE

Ref country code: AT

Ref legal event code: REF

Ref document number: 1407222

Country of ref document: AT

Kind code of ref document: T

Effective date: 20210715

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210930

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20210630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210930

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211001

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211102

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502014015710

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

REG Reference to a national code

Ref country code: DE

Ref legal event code: R081

Ref document number: 502014015710

Country of ref document: DE

Owner name: BIZLINK INDUSTRY GERMANY GMBH, DE

Free format text: FORMER OWNER: LEONI KABEL GMBH, 91154 ROTH, DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

26N No opposition filed

Effective date: 20220331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20211212

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20211231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211212

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211212

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211231

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211231

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211231

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 1407222

Country of ref document: AT

Kind code of ref document: T

Effective date: 20211212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20141212

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230505

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20231214

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210630