EP3026143A1 - Plattierbad und Verfahren zur stromlosen Abscheidung von Nickelschichten - Google Patents

Plattierbad und Verfahren zur stromlosen Abscheidung von Nickelschichten Download PDF

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Publication number
EP3026143A1
EP3026143A1 EP14194890.1A EP14194890A EP3026143A1 EP 3026143 A1 EP3026143 A1 EP 3026143A1 EP 14194890 A EP14194890 A EP 14194890A EP 3026143 A1 EP3026143 A1 EP 3026143A1
Authority
EP
European Patent Office
Prior art keywords
nickel
plating bath
bath composition
ion
aqueous plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14194890.1A
Other languages
English (en)
French (fr)
Inventor
Jan Dr. Picalek
Holger Dr. Bera
Shakeel Akhtar
Iulia Dr. Bejan
Jennifer Pinnau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to EP14194890.1A priority Critical patent/EP3026143A1/de
Priority to PCT/EP2015/076822 priority patent/WO2016083195A1/en
Priority to JP2017528538A priority patent/JP6667525B2/ja
Priority to CA2968437A priority patent/CA2968437C/en
Priority to KR1020177014492A priority patent/KR102497590B1/ko
Priority to US15/520,558 priority patent/US20170335462A1/en
Priority to EP15797992.3A priority patent/EP3224388B1/de
Priority to CN201580058168.0A priority patent/CN107109654B/zh
Priority to ES15797992T priority patent/ES2705430T3/es
Priority to MYPI2017701361A priority patent/MY186470A/en
Priority to TW104139483A priority patent/TWI683927B/zh
Publication of EP3026143A1 publication Critical patent/EP3026143A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
EP14194890.1A 2014-11-26 2014-11-26 Plattierbad und Verfahren zur stromlosen Abscheidung von Nickelschichten Withdrawn EP3026143A1 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
EP14194890.1A EP3026143A1 (de) 2014-11-26 2014-11-26 Plattierbad und Verfahren zur stromlosen Abscheidung von Nickelschichten
PCT/EP2015/076822 WO2016083195A1 (en) 2014-11-26 2015-11-17 Plating bath and method for electroless deposition of nickel layers
JP2017528538A JP6667525B2 (ja) 2014-11-26 2015-11-17 ニッケル層の無電解析出のためのめっき浴および方法
CA2968437A CA2968437C (en) 2014-11-26 2015-11-17 Plating bath and method for electroless deposition of nickel layers
KR1020177014492A KR102497590B1 (ko) 2014-11-26 2015-11-17 니켈 층들의 무전해 성막을 위한 도금욕 및 방법
US15/520,558 US20170335462A1 (en) 2014-11-26 2015-11-17 Plating bath and method for electroless deposition of nickel layers
EP15797992.3A EP3224388B1 (de) 2014-11-26 2015-11-17 Plattierbad und verfahren zur stromlosen abscheidung von nickelschichten
CN201580058168.0A CN107109654B (zh) 2014-11-26 2015-11-17 用于镍层无电沉积的镀浴及方法
ES15797992T ES2705430T3 (es) 2014-11-26 2015-11-17 Baño de chapado y método para la deposición no electrolítica de capas de níquel
MYPI2017701361A MY186470A (en) 2014-11-26 2015-11-17 Plating bath and method for electroless deposition of nickel layers
TW104139483A TWI683927B (zh) 2014-11-26 2015-11-26 用於鎳層無電沉積之鍍浴及方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP14194890.1A EP3026143A1 (de) 2014-11-26 2014-11-26 Plattierbad und Verfahren zur stromlosen Abscheidung von Nickelschichten

Publications (1)

Publication Number Publication Date
EP3026143A1 true EP3026143A1 (de) 2016-06-01

Family

ID=51999271

Family Applications (2)

Application Number Title Priority Date Filing Date
EP14194890.1A Withdrawn EP3026143A1 (de) 2014-11-26 2014-11-26 Plattierbad und Verfahren zur stromlosen Abscheidung von Nickelschichten
EP15797992.3A Active EP3224388B1 (de) 2014-11-26 2015-11-17 Plattierbad und verfahren zur stromlosen abscheidung von nickelschichten

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP15797992.3A Active EP3224388B1 (de) 2014-11-26 2015-11-17 Plattierbad und verfahren zur stromlosen abscheidung von nickelschichten

Country Status (10)

Country Link
US (1) US20170335462A1 (de)
EP (2) EP3026143A1 (de)
JP (1) JP6667525B2 (de)
KR (1) KR102497590B1 (de)
CN (1) CN107109654B (de)
CA (1) CA2968437C (de)
ES (1) ES2705430T3 (de)
MY (1) MY186470A (de)
TW (1) TWI683927B (de)
WO (1) WO2016083195A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020229082A1 (de) * 2019-05-16 2020-11-19 Pac Tech - Packaging Technologies Gmbh Beschichtungsbad zur stromlosen beschichtung eines substrats

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201913013PA (en) * 2015-07-17 2020-03-30 Coventya Inc Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use
JP2022185929A (ja) * 2021-06-03 2022-12-15 東洋鋼鈑株式会社 ニッケル－リン合金被覆基板、ニッケル－リン合金膜の無電解めっきのための溶液、及びニッケル－リン合金被覆基板の製造方法

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2658841A (en) 1950-11-08 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2658842A (en) 1951-01-04 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2762723A (en) 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
US2935425A (en) 1954-12-29 1960-05-03 Gen Am Transport Chemical nickel plating processes and baths therefor
US3338726A (en) 1958-10-01 1967-08-29 Du Pont Chemical reduction plating process and bath
US3597266A (en) 1968-09-23 1971-08-03 Enthone Electroless nickel plating
US3915716A (en) 1969-04-17 1975-10-28 Schering Ag Chemical nickel plating bath
US3953654A (en) 1973-08-13 1976-04-27 Rca Corporation Temperature-stable non-magnetic alloy
US4189324A (en) 1978-06-02 1980-02-19 Michael Gulla Stabilized electroless plating solutions
US4780342A (en) 1987-07-20 1988-10-25 General Electric Company Electroless nickel plating composition and method for its preparation and use
JP2005194562A (ja) 2004-01-06 2005-07-21 Murata Mfg Co Ltd 無電解ニッケルめっき液、及びセラミック電子部品の製造方法
WO2010045559A1 (en) 2008-10-16 2010-04-22 Atotech Deutschland Gmbh Metal plating additive, and method for plating substrates and products therefrom
EP2194156A1 (de) * 2008-12-03 2010-06-09 C. Uyemura & Co., Ltd. Bad zum stromlosen Vernickeln und Verfahren zum stromlosen Vernickeln
EP2671969A1 (de) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plattierbad zur stromlosen Abscheidung von Nickelschichten

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3719508A (en) * 1971-11-16 1973-03-06 Shipley Co Electroless nickel solution
JP3455709B2 (ja) * 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体
CN1132963C (zh) * 2000-03-03 2003-12-31 北京航空航天大学 一种化学镀镍液及其应用
US6800121B2 (en) * 2002-06-18 2004-10-05 Atotech Deutschland Gmbh Electroless nickel plating solutions
CN100476026C (zh) * 2005-07-11 2009-04-08 佛山市顺德区汉达精密电子科技有限公司 铜合金化学镀镍工艺
US8404369B2 (en) * 2010-08-03 2013-03-26 WD Media, LLC Electroless coated disks for high temperature applications and methods of making the same
KR101365457B1 (ko) * 2012-03-15 2014-02-21 한국기계연구원 니켈 코팅 나노카본의 제조 방법
CN103952687B (zh) * 2014-05-05 2017-02-15 广东东硕科技有限公司 印制线路板化学镀镍的防止渗镀方法
CN104103433B (zh) * 2014-07-21 2016-02-17 南通万德科技有限公司 一种耐电弧烧蚀的开关触点及其制备方法

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2658841A (en) 1950-11-08 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2658842A (en) 1951-01-04 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2762723A (en) 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
US2935425A (en) 1954-12-29 1960-05-03 Gen Am Transport Chemical nickel plating processes and baths therefor
US3338726A (en) 1958-10-01 1967-08-29 Du Pont Chemical reduction plating process and bath
US3597266A (en) 1968-09-23 1971-08-03 Enthone Electroless nickel plating
US3915716A (en) 1969-04-17 1975-10-28 Schering Ag Chemical nickel plating bath
US3953654A (en) 1973-08-13 1976-04-27 Rca Corporation Temperature-stable non-magnetic alloy
US4189324A (en) 1978-06-02 1980-02-19 Michael Gulla Stabilized electroless plating solutions
US4780342A (en) 1987-07-20 1988-10-25 General Electric Company Electroless nickel plating composition and method for its preparation and use
JP2005194562A (ja) 2004-01-06 2005-07-21 Murata Mfg Co Ltd 無電解ニッケルめっき液、及びセラミック電子部品の製造方法
WO2010045559A1 (en) 2008-10-16 2010-04-22 Atotech Deutschland Gmbh Metal plating additive, and method for plating substrates and products therefrom
EP2194156A1 (de) * 2008-12-03 2010-06-09 C. Uyemura & Co., Ltd. Bad zum stromlosen Vernickeln und Verfahren zum stromlosen Vernickeln
EP2671969A1 (de) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plattierbad zur stromlosen Abscheidung von Nickelschichten

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020229082A1 (de) * 2019-05-16 2020-11-19 Pac Tech - Packaging Technologies Gmbh Beschichtungsbad zur stromlosen beschichtung eines substrats

Also Published As

Publication number Publication date
CA2968437A1 (en) 2016-06-02
CN107109654A (zh) 2017-08-29
JP6667525B2 (ja) 2020-03-18
EP3224388B1 (de) 2018-10-17
JP2017535674A (ja) 2017-11-30
TW201623686A (zh) 2016-07-01
US20170335462A1 (en) 2017-11-23
WO2016083195A1 (en) 2016-06-02
CA2968437C (en) 2022-11-22
EP3224388A1 (de) 2017-10-04
KR102497590B1 (ko) 2023-02-07
TWI683927B (zh) 2020-02-01
CN107109654B (zh) 2019-08-27
KR20170086051A (ko) 2017-07-25
ES2705430T3 (es) 2019-03-25
MY186470A (en) 2021-07-22

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