MY186470A - Plating bath and method for electroless deposition of nickel layers - Google Patents

Plating bath and method for electroless deposition of nickel layers

Info

Publication number
MY186470A
MY186470A MYPI2017701361A MYPI2017701361A MY186470A MY 186470 A MY186470 A MY 186470A MY PI2017701361 A MYPI2017701361 A MY PI2017701361A MY PI2017701361 A MYPI2017701361 A MY PI2017701361A MY 186470 A MY186470 A MY 186470A
Authority
MY
Malaysia
Prior art keywords
plating bath
electroless deposition
nickel layers
nickel
deposition
Prior art date
Application number
MYPI2017701361A
Other languages
English (en)
Inventor
Jan Picalek Dr
Holger Bera Dr
Akhtar Shakeel
Iulia Bejan Dr
PINNAU Jennifer
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of MY186470A publication Critical patent/MY186470A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
MYPI2017701361A 2014-11-26 2015-11-17 Plating bath and method for electroless deposition of nickel layers MY186470A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP14194890.1A EP3026143A1 (de) 2014-11-26 2014-11-26 Plattierbad und Verfahren zur stromlosen Abscheidung von Nickelschichten
PCT/EP2015/076822 WO2016083195A1 (en) 2014-11-26 2015-11-17 Plating bath and method for electroless deposition of nickel layers

Publications (1)

Publication Number Publication Date
MY186470A true MY186470A (en) 2021-07-22

Family

ID=51999271

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017701361A MY186470A (en) 2014-11-26 2015-11-17 Plating bath and method for electroless deposition of nickel layers

Country Status (10)

Country Link
US (1) US20170335462A1 (de)
EP (2) EP3026143A1 (de)
JP (1) JP6667525B2 (de)
KR (1) KR102497590B1 (de)
CN (1) CN107109654B (de)
CA (1) CA2968437C (de)
ES (1) ES2705430T3 (de)
MY (1) MY186470A (de)
TW (1) TWI683927B (de)
WO (1) WO2016083195A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3325688B1 (de) * 2015-07-17 2021-02-24 Coventya Inc. Stromloses nickel-phosphor-plattierungsverfahren unter verwendung von bädern mit reduzierter ionenkonzentration
DE102019112883B4 (de) * 2019-05-16 2024-05-16 Pac Tech - Packaging Technologies Gmbh Beschichtungsbad zur stromlosen Beschichtung eines Substrats
JP2022185929A (ja) * 2021-06-03 2022-12-15 東洋鋼鈑株式会社 ニッケル－リン合金被覆基板、ニッケル－リン合金膜の無電解めっきのための溶液、及びニッケル－リン合金被覆基板の製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2658841A (en) 1950-11-08 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2658842A (en) 1951-01-04 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2762723A (en) 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
US2935425A (en) 1954-12-29 1960-05-03 Gen Am Transport Chemical nickel plating processes and baths therefor
US3338726A (en) 1958-10-01 1967-08-29 Du Pont Chemical reduction plating process and bath
US3597266A (en) 1968-09-23 1971-08-03 Enthone Electroless nickel plating
US3915716A (en) 1969-04-17 1975-10-28 Schering Ag Chemical nickel plating bath
US3719508A (en) * 1971-11-16 1973-03-06 Shipley Co Electroless nickel solution
US3953654A (en) 1973-08-13 1976-04-27 Rca Corporation Temperature-stable non-magnetic alloy
US4189324A (en) 1978-06-02 1980-02-19 Michael Gulla Stabilized electroless plating solutions
US4780342A (en) 1987-07-20 1988-10-25 General Electric Company Electroless nickel plating composition and method for its preparation and use
JP3455709B2 (ja) * 1999-04-06 2003-10-14 株式会社大和化成研究所 めっき方法とそれに用いるめっき液前駆体
CN1132963C (zh) * 2000-03-03 2003-12-31 北京航空航天大学 一种化学镀镍液及其应用
US6800121B2 (en) * 2002-06-18 2004-10-05 Atotech Deutschland Gmbh Electroless nickel plating solutions
JP2005194562A (ja) 2004-01-06 2005-07-21 Murata Mfg Co Ltd 無電解ニッケルめっき液、及びセラミック電子部品の製造方法
CN100476026C (zh) * 2005-07-11 2009-04-08 佛山市顺德区汉达精密电子科技有限公司 铜合金化学镀镍工艺
WO2010045559A1 (en) 2008-10-16 2010-04-22 Atotech Deutschland Gmbh Metal plating additive, and method for plating substrates and products therefrom
JP5297171B2 (ja) * 2008-12-03 2013-09-25 上村工業株式会社 無電解ニッケルめっき浴及び無電解ニッケルめっき方法
US8404369B2 (en) * 2010-08-03 2013-03-26 WD Media, LLC Electroless coated disks for high temperature applications and methods of making the same
KR101365457B1 (ko) * 2012-03-15 2014-02-21 한국기계연구원 니켈 코팅 나노카본의 제조 방법
EP2671969A1 (de) * 2012-06-04 2013-12-11 ATOTECH Deutschland GmbH Plattierbad zur stromlosen Abscheidung von Nickelschichten
CN103952687B (zh) * 2014-05-05 2017-02-15 广东东硕科技有限公司 印制线路板化学镀镍的防止渗镀方法
CN104103433B (zh) * 2014-07-21 2016-02-17 南通万德科技有限公司 一种耐电弧烧蚀的开关触点及其制备方法

Also Published As

Publication number Publication date
KR20170086051A (ko) 2017-07-25
EP3026143A1 (de) 2016-06-01
CN107109654A (zh) 2017-08-29
US20170335462A1 (en) 2017-11-23
WO2016083195A1 (en) 2016-06-02
ES2705430T3 (es) 2019-03-25
CN107109654B (zh) 2019-08-27
JP2017535674A (ja) 2017-11-30
EP3224388A1 (de) 2017-10-04
EP3224388B1 (de) 2018-10-17
TWI683927B (zh) 2020-02-01
KR102497590B1 (ko) 2023-02-07
CA2968437C (en) 2022-11-22
JP6667525B2 (ja) 2020-03-18
CA2968437A1 (en) 2016-06-02
TW201623686A (zh) 2016-07-01

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