EP3007858A1 - Tampon de polissage à faible rugosité de surface - Google Patents

Tampon de polissage à faible rugosité de surface

Info

Publication number
EP3007858A1
EP3007858A1 EP14811299.8A EP14811299A EP3007858A1 EP 3007858 A1 EP3007858 A1 EP 3007858A1 EP 14811299 A EP14811299 A EP 14811299A EP 3007858 A1 EP3007858 A1 EP 3007858A1
Authority
EP
European Patent Office
Prior art keywords
polishing
polishing pad
mpa
substrate
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14811299.8A
Other languages
German (de)
English (en)
Other versions
EP3007858A4 (fr
Inventor
Jayakrishnan NAIR
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of EP3007858A1 publication Critical patent/EP3007858A1/fr
Publication of EP3007858A4 publication Critical patent/EP3007858A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Definitions

  • the present invention relates to a polishing pad and a method of polishing a substrate; and in particular, the present invention relates io a polishing pad comprising a polishing pad body comprising a polishing suriace, wherein the polishing body comprises pores, and wherein the polishing surface has a surface roughness of 0. 1 ura to 10 am.
  • C P Chemical-mechanical polishing
  • the process layers can include, by way of example, insulation layers, gate oxide layers, conductive layers, and layers of metal or glass, etc. it is generally desirable in certain steps of the wafer process thai the uppermost surface of the process layers be planar, i.e., flat, for the deposition of subsequent .layers.
  • CMP is used to planari/e process layers wherein a deposited material, such as a conductive or insulating material, is polished to planarize the wafer for subsequent process steps.
  • a wafer is mounted upside down on a carrier in a CMP tool A force pushes the carrier and the wafer downward toward a polishing pad.
  • the carrier and the wafer are rotated above the rotating polishing pad on the CMP tool's polishing table.
  • a polishing composition (also referred to as a polishing slurry) generally is introduced between the rotating wafer and the rotating polishing pad during the polishing process.
  • the polishing composition typically contains a chemical that interacts with or dissolves portions of the uppermost wafer layerfs) and an abrasive material that physically removes portions of the layeris).
  • the wafer and the polishing pad can be rotated in the same direction or in opposite directions, whichever is desirable for the particular polishing process being carried out.
  • the carrier also can oscillate across the polishing pad o the polishing table.
  • 04J Polishi ng pads typically have an initial surface roughness of greater than 15 microns.
  • normal wear on the pad surface results in a change in the surface roughness of the pad.
  • contact between the pad surface and a substrate being pol ished changes, and thus the polishing rate can change.
  • the amount of time required for polishing the substrates to achieve desired surface properties, such as pianarity varies during a production run. Var iances from uniformity between substrates can therefore result.
  • the invention provides a polishing pad comprising a polishing pad bod comprising a polishing surface, wherein the polishing body comprises pores, and wherein th polishing surface has a surface roughness of 0.1 ⁇ to 10 urn.
  • the invention also provides a method of polishing a substrate, which method comprises (i) providing a substrate to be polished, (ii) contactin the substrate with the aforesaid polishing pad and a polishing composition, and (iti) moving the substrate relative to the polishing pad with the polishing composition therebetween to abrade at least a portion of the substrate to polish the substrate.
  • FIG. 1 is a scanning electron microscope image of the surface of polishing pad in accordance wi th an embodiment of the invention.
  • FIG. 2 is a scanning electron microscope image of the surface of a polishing pad in accordance with an embodiment of the invention.
  • FIG. 3 is a scanning electron microscope image of the surface of a conventional polishing pad.
  • FIG. 4 is a graphical representation of the silicon oxide removal rate versus the number of wafers polished using a polishing pad in accordance wi h an embodiment of the invention in comparison with a conventional polishing pad.
  • the invention provides a polishmg pad comprising a polishing pad body comprising a polishing surface, wherein the polishing pad body comprises pores, and wherein the polishing surface has a. surface roughness of 0.1 ⁇ to 1.0 pm.
  • the polishing pad bod can have an suitable dimensions.
  • the polishing pad body is circular in shape (as is used in rotary polishing tools) or is produced as a looped linear belt (as is used in linear polishing tools).
  • the polishing pad body is circular.
  • the polishing pad body can comprise, consist essentially of. or consist of any suitable material.
  • the polishing pad body comprises, consists essentially of, or consists of a polymer resin.
  • the polymer resin can be any suitable polymer resin.
  • the polymer resin is selected from the group consisting of thermoplastic elastomers, thermoset polymers, po yurethanes (e.g., thermoplastic polyorethanes), polyolefins (e.g., thermoplastic polyolefins ⁇ , polycarbonates, polyvinylaieoho!s, nylons, elastomeric rubbers, elastomeric polyethylenes, polyfetrafluoroethylenes, polyethyleneterephthalates, polyimides, polyaraniides, poiyaxylenes, polyacryiates, polystyrenes, polymemylmethacrylates, copolymers thereof and mixtures thereof.
  • th polymer resin i a po!yuretfiane, more preferably a thermoplastic polyurethane.
  • the polishing pad body comprises pores.
  • the pores can have an average pore diameter of 2 ⁇ or more, 3 pm or more, 4 pm or more, 5 ⁇ or more, 6 um or more, 7 pm or more, 8 pm or more, 9 pm or more, 10 pm or more, 3 5 pm or more, 20 pm or more, 25 ⁇ or more, 30 pm or more, 35 pm or more, 40 pin or more, 45 pra or more, or 50 pm or more.
  • the pores can have an average pore diameter of .150 pm or less, 125 pm or less, 100 pm or less, 90 ⁇ or less, 80 pro.
  • the pores can have an average pore diameter bounded by any two of the endpoints recited for the average pore diameter .
  • the polishing pad body can have an average pore diameter of 2 pni to 1.50 pm, 3 um to 125 pm, 4 pm to 100 pm, 5 pm to 90 pm, 5 pm to 80 pm, 5 pm to 70 pm, 5 pm to 60 pm, 5 pm to 50 pm, 5 pm to 45 pm, 5 pm to 40 pm, 5 pm to 35 pm, 5 pm.
  • the polishing surface can have a surface roughness of 0.1 pm or more, 0.2 pm or more, 0.3 pm or more, 0.4 pm or more, 0.5 p.m or more, 0.6 um or more, 0.7 pm or more, 0.8 pm or more, 0.9 pm or more, or 1 pm or more.
  • the polishing surface ca ' have a surface roughness of 4 pm or less, 3.8 pm or less, 3.6 pm or less, 3.5 pm or less, 3.4 pm or less, 3.2 pm or less, 3 pm or less, 2.8 pm or less, 2.6 pm or less, 2.5 pro or less, 2,4 pm or less, 2.2 pm or less, 2 pm or less, 1.8 pm or less, or 1 .6pm or less.
  • the polishing surface can have a surface roughness bounded by any two of the endpoints recited for the surface roughness.
  • the polishing pad body can have a surface roughness of 0.1 pm to 4 p.m, 0.1 pm lo 3,8 pm, 0. i pm to 3.6 pm, 0. i pm to 3.4 pm, 0. 1 pm to 3.2 pm. 0.1 ⁇ 3 ⁇ 4 to 3 ⁇ 0.1 ⁇ to 2.8 ⁇ , 0.1 ⁇ to 2.6 ⁇ , 0.1 ⁇ to 2.4 ⁇ ».
  • the surface roughness can be expressed as the average surface roughness as determined at several regions of the polishing surface.
  • A. non-limiting example of a suitable method for determining the surface roughness of the polishing surface or of a region thereof is 18013565,
  • the polishing pad body can be produced using any suitable technique, many of which are known in the art.
  • the pol ishing pad can be formed by methods such as casting and extrusion.
  • the polymer resin may be a thermoplastic material which is heated to a temperature at which it will flow and is then formed into a desired shape by easting or extrusion.
  • the polymer resi may provide a porous structure by its natural configuration.
  • the porous structure may be introduced through the use of various production techniques known in the art (e.g., foaming, blowing, and the like).
  • Representative methods of providing a porous structure comprising closed-cell pores include foaming processes such as a mucell process, a phase inversion process, a spinodal or bimodal decomposition -process, or a pressurized gas injection process, all of which are well known in the art.
  • a re resentative method providing a porous structure comprising open-cell pores comprises sintering particles of a thermoplastic polymer, such as a potyorethane, to provide an open-cell porous structure.
  • the polishing surface can be produced using any suitable method.
  • the polishing surface is produced by skiving the polishing pad body.
  • the polishing pad body can have a storage modulus of elasticity at 30° C of 5 MPa or more, 10 MPa or more, 20 MPa or more, 30 MPa or more, 40 MPa or more. 50 MPa or more, 60 MPa or more, 70 MPa or more, 80 MPa or more, 90 MPa or more, iOC) MPa or more, 200 MPa or more, 300 MPa or more, 400 MPa or more, or 500 MPa or more.
  • the polishing pad body can have a storage modulus of elasticity at 30° C of 600 MPa or less, 550 MPa or less, 500 MPa or less, 450 MPa or less, 400 MPa or less, 350 M a or less, or 300 MPa or less.
  • the polishing pad body can have a storage modulus of elasticity at W C bounded by any two of the eadpornis recited for the storage modulus of elasticity at 30° C .
  • the polishing pad body can have a storage modulus of elasticity at 30° C of 5 MPa to 600 MPa, 20 MPa to 600 MPa, 30 MPa to 600 MPa, 40 MP to 550 MPa, SO MPa to 500 MPa, 60 MPa to 450 MPa, 70 MPa to 400 MPa, 80 MPa to 350 MPa. 90 MPa to 300 MPa, 5 MPa to 500 MPa, 10 MPa to 500 MPa, 20 MPa to 400 MPa, or 20 MPa to 300 MPa.
  • a polishing pad in accordance with the invention can be used alone or optionally can be used as one layer of a multi -layer stacked polishing pad.
  • the inventive polishing pad can be used in combination with a subpad.
  • the subpad can be any suitable subpad. Suitable subpads include poiyurethane foam subpads, impregnated felt subpads, microporous poiyurethane subpads, or sintered urethane subpads.
  • the subpad typically is softer than the polishing pad of the invention and therefore is more compressible than the polishing pad. In some embodiments, the subpad is harder and is less compressible than, the polishing pad.
  • the subpad optionall comprises grooves, channels, hollow sections, and the like.
  • polishing pad of the invention When used in combination with, a subpad, typically there is an intermediate backing layer, such as a polyethy!eneterephthaiate film, coextensive with and between the polishing pad and the subpad.
  • an intermediate backing layer such as a polyethy!eneterephthaiate film
  • the polishing pad is prepared by sandwiching the polishing pad body between two layers of a backing material.
  • the resulting sandwiched polishing pad body can then be skived to produce two polishing pads.
  • the sandwiched polishing pad body can be produced by curing a prepolymer, for example, a thermoplastic poiyurethane, between two backing layers.
  • the backing material can be any suitable backing materia! and can comprise a polymeric sheet.
  • the backing material can comprise a subpad as described herein, in. these embodiments, the sandwiched polishing pad can be prepared in the form of an elongated sheet which is then skived and cut. into segments to form the polishing pad in a continuous process.
  • the surface of the inventive polishing pad comprises open pores resulting from the formation of the polishing surface by skiving of the polishing pad body.
  • the surface roughness of the pol ishing surface refers to the surface roughness of the polishing surface exclusive of the pores
  • FIG, 3 illustrates the surface of a con ventional polishing pad for purposes of comparison
  • the surface roughness can be measured with. an. optica! type surface roughness tester, such as three-dimensional surface profiler, laser scanning microscope, electron beam surface profiler, a contact type surface roughness tester, such as a surface roughness tester with contaci stylus, and the like.
  • the surface roughness is determined according to ISO 13565.
  • the invention further provides a method of polishing a substrate, which method comprises (i) providing a substrate to be polished, (ii) contacting the substrate with the inventive polishing pad described herein and a polishing composition, and (iii) moving the substrate relative to the polishing pad, with the polishing composition therebetween, to abrade at least a portion of the substrate to polish the substrate.
  • the polishing composition can be any suitable polishing composition.
  • the polishing composition typically comprises an aqueous carrier, a pH adjuster, and optionally an abrasi ve.
  • the pol ishing composition optionally can further comprise one or more oxidizing agents, organic acids, compSexing agent, pH buffers, surfactants, corrosion inhibitors, anti-foaming agents, biocides, and the like.
  • the comparative polishing pad was a commercial thermoplastic polyurethane pad having a milled surface and an average surface roughness as measured by a confocal.
  • the removal rate was determined for each substrate, and the results are illustrated graphically in FIG, 4.
  • the inventive polishing pad exhibited a silicon oxide removal rate that stabilized at approximately 530 A/min after polishing approximately 40 sisbstrates.
  • the comparative polishing pad exhibited a silicon oxide removal rate that increased during polishing of successive substrates and approached approximatel 370 A/min after polishing over 200 substrates.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

L'invention concerne un tampon de polissage qui comprend un corps de tampon de polissage comprenant une surface de polissage, le corps de polissage comportant des pores, et la surface de polissage ayant une rugosité de surface comprise entre 0,1 µm et 10 µm.
EP14811299.8A 2013-06-13 2014-05-30 Tampon de polissage à faible rugosité de surface Withdrawn EP3007858A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/917,422 US20140370788A1 (en) 2013-06-13 2013-06-13 Low surface roughness polishing pad
PCT/US2014/040226 WO2014200726A1 (fr) 2013-06-13 2014-05-30 Tampon de polissage à faible rugosité de surface

Publications (2)

Publication Number Publication Date
EP3007858A1 true EP3007858A1 (fr) 2016-04-20
EP3007858A4 EP3007858A4 (fr) 2017-03-08

Family

ID=52019618

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14811299.8A Withdrawn EP3007858A4 (fr) 2013-06-13 2014-05-30 Tampon de polissage à faible rugosité de surface

Country Status (8)

Country Link
US (1) US20140370788A1 (fr)
EP (1) EP3007858A4 (fr)
JP (1) JP2016524549A (fr)
KR (1) KR20160019465A (fr)
CN (1) CN105163907B (fr)
SG (1) SG11201508452VA (fr)
TW (1) TWI542442B (fr)
WO (1) WO2014200726A1 (fr)

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US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
SG10202002601QA (en) 2014-10-17 2020-05-28 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
WO2017074773A1 (fr) 2015-10-30 2017-05-04 Applied Materials, Inc. Appareil et procédé de formation d'article de polissage ayant un potentiel zêta souhaité
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
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KR101835090B1 (ko) * 2017-05-29 2018-03-06 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이를 사용하여 반도체 소자를 제조하는 방법
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Also Published As

Publication number Publication date
KR20160019465A (ko) 2016-02-19
WO2014200726A1 (fr) 2014-12-18
US20140370788A1 (en) 2014-12-18
SG11201508452VA (en) 2015-12-30
CN105163907B (zh) 2017-11-28
EP3007858A4 (fr) 2017-03-08
TW201501865A (zh) 2015-01-16
JP2016524549A (ja) 2016-08-18
CN105163907A (zh) 2015-12-16
TWI542442B (zh) 2016-07-21

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