EP2915640B1 - Verfahren und Vorrichtung zur Herstellung einer OSB-Platte - Google Patents

Verfahren und Vorrichtung zur Herstellung einer OSB-Platte Download PDF

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Publication number
EP2915640B1
EP2915640B1 EP14000794.9A EP14000794A EP2915640B1 EP 2915640 B1 EP2915640 B1 EP 2915640B1 EP 14000794 A EP14000794 A EP 14000794A EP 2915640 B1 EP2915640 B1 EP 2915640B1
Authority
EP
European Patent Office
Prior art keywords
chip
chips
covering layer
strands
middle layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14000794.9A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2915640A1 (de
Inventor
Stanislaw Dobras
Krzysztof Przygodzki
Bartlomiej Maracz
Miroslaw Janiszewski
Joanna Jastrzab
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Swiss Krono Tec AG
Original Assignee
Swiss Krono Tec AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to LTEP14000794.9T priority Critical patent/LT2915640T/lt
Priority to DK14000794.9T priority patent/DK2915640T3/da
Priority to HUE14000794A priority patent/HUE031057T2/en
Priority to EP14000794.9A priority patent/EP2915640B1/de
Priority to PT140007949T priority patent/PT2915640T/pt
Priority to ES14000794.9T priority patent/ES2603423T3/es
Application filed by Swiss Krono Tec AG filed Critical Swiss Krono Tec AG
Priority to PL14000794T priority patent/PL2915640T3/pl
Priority to RU2015107522A priority patent/RU2668328C2/ru
Publication of EP2915640A1 publication Critical patent/EP2915640A1/de
Application granted granted Critical
Publication of EP2915640B1 publication Critical patent/EP2915640B1/de
Priority to HRP20161496TT priority patent/HRP20161496T1/hr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B27N3/14—Distributing or orienting the particles or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/04—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres

Definitions

  • the invention further relates to a method for producing an OSB board on a plant for producing a chipboard, which is operated in a normal operation as described above, and a cover layer spreading device for use in the method.
  • chipboard and OSB Oriented Strands Board
  • a company that wants to produce both chipboard and OSB boards needs to acquire and install both a particleboard plant and an OSB board plant. Due to the longer strands, the strength values of an OSB board are greater than those of a chipboard. It is known that the neutral fiber of a wood-based panel symmetrical to the center plane runs and the stability of the wood-based panel is determined essentially by their outer layers.
  • OSB panels are typically used as structural panels
  • particleboard is typically used as furniture panels.
  • the demand for OSB boards is not constant throughout the year. When the weather is bad, the demand goes back, in good weather it rises, so there are large fluctuation margins. The manufacturer must compensate for this fluctuation range either by appropriate storage and / or an extension or shortening of the operating times of the OSB plant. Both are costly.
  • the invention has for its object to provide a method for producing an OSB board including a system for producing a particle board and, where appropriate, a plant for producing an OSB board.
  • the OSB beach gluing device preferably includes a beach scale and a beach gluing device.
  • topsheet strands and the middle layer chips can be glued with a melamine-urea-phenol-formaldehyde (MUPF) glue or with a polymeric diphenylmethane diisocyanate (PMDI) glue. It is also possible to glaze the top layer strands with polymeric diphenylmethane diisocyanate (PMDI) and the middle layer with a melamine-urea-phenol-formaldehyde (MUPF) glue or vice versa.
  • MUPF melamine-urea-phenol-formaldehyde
  • topsheet strands and the middlecoat blend may be glued with a melamine-urea-phenol-formaldehyde (MUPF) glue or a polymeric diphenylmethane diisocyanate (PMDI) glue. It is also possible to glaze the top layer strands with polymeric diphenylmethane diisocyanate (PMDI) and the middle layer mixture with a melamine-urea-phenol-formaldehyde (MUPF) glue or vice versa.
  • MUPF melamine-urea-phenol-formaldehyde
  • FIG. 1 shows the schematic representation of a plant for the production of OSB boards.
  • a beach chipper 1 first log wood is cut to wet strands 200.
  • the strands 200 are transported by the beach scraper 1 into a wet beach bunker 2 and transported from there into a beach dryer 3.
  • the wet strands 200 are dried.
  • the dried strands 200 are transported by the beach dryer 3 into a beach sorter 5 where they are sorted into top layer strands DS200, middle strands MS200 and fines F.
  • the cover layer strands DS200 are transported from the beach sorting installation 5 into a cover layer bunker 6 and the middle layer strands MS200 are transported into a middle layer bunker 7.
  • Both the cover layer strands DS200 and the middle layer strands MS200 are each in a gluing device 6 ', 7' with a glue KL, on melamine-urea-phenol-formaldehyde (MUPF) - and / or diphenylmethane diisocyanate (PMDI) -based glued.
  • Top coat strands DS200 and middle coat strands MS200 can be glued with the same or a different glue.
  • the cover layer strands DS200 are transported into at least one cover layer strander 8 and the middle layer strands MS200 are transported into at least one middle layer strandshift device 9.
  • the cover layer spreader 8 and the middle layer beach spreader 9 are arranged above an endlessly circulating strand forming belt 76.
  • the strandshape 76 is first spread with overlay strands DS200 to form a lower overlay DSOSB.
  • the middle layer strands MS200 are scattered to a middle layer MSOSB, on which in turn an upper cover layer DSOSB with cover layer strands DS200 is scattered.
  • the strip forming belt 76 transports the scattered beach cake to the hot press 170, where it is pressed into an OSB plate 600 of desired thickness.
  • a release agent can be applied to the beach cake 900 via an application device 159, which is particularly advantageous when a PMDI glue is used. It is also conceivable to apply the release agent to the (not shown here) press plate of the hot press 170.
  • FIG. 1 shows the schematic representation of a conventional plant for the production of chipboard.
  • chip chipper 10 wood chippings are first cut to wet chips 100. From here, the wet chips 100 are then transported into a wet chip bunker 20, from which they are subsequently transported into a chip dryer 30 in order to dry them. The dried chips 100 are transferred from the chip dryer 30 into the chip hopper 40, from where they are transferred to a Spansortierstrom 50. In the chip sorting plant 50, the chips 100 are sorted into coarse chips GS, surface layer chips DS100, middle layer chips MS100 and dust St. The cover shavings DS100 are transported from the chip sorting plant 50 to a top layer chip bunker 60 and the middle layer chips MS100 are transported to a middle layer chip bunker 70.
  • a gluing device 60 ', 70' in which they are glued with a MUPF glue or PMDI glue (each also called Kunststoffharzleim KL).
  • PMDI glue each also called Kunststoffharzleim KL
  • the middle layer chips MS100 and the cover layer chips DS100 can also be glued to a urea-formaldehyde (UF) glue, as is customary in chipboard production.
  • the cover shavings DS100 are transported from the gluing device 60 'into the cover layer spreading devices 80 and the middle layer chips MS100 are transported from the gluing device 70' into the middle layer scattering devices 90.
  • the cover layer scattering devices 80 and the middle layer scattering devices 90 are arranged above the chip forming strip 75, on which first a lower cover layer DS of covering layer chips DS100 is scattered. On the lower cover layer DS, a middle layer MS of middle-layer chips MS100 is scattered, onto which in turn an upper cover layer DS of covering layer chips DS100 is scattered.
  • the chip cake consisting of lower cover layer DS, middle layer MS and upper cover layer DS is transported by the forming belt 75 to the hot press 150, in which it is pressed into a chip bar 500 of the desired thickness. Even before the hot press 150 can be applied to the chip cake via an applicator 149 a release agent. It is also conceivable to apply the release agent to the (not shown here) press plate of the hot press 150.
  • FIG. 1 a shows that transferred in the gluing device 6 'with the previously described Kunststoffharzleim KL glued Deck Anlagenstrands DS200 in the cover layer scattering devices 80 of the particle board system.
  • middle layer chips 100 can be guided into the middle layer beach bunker 7.
  • the amount of middle-layer chips 100 essentially corresponds to the amount of cover layer strand DS200.
  • a lower cover layer DSOSB from cover layer DS200, onto which cover layer DS a middle layer MS consisting of middle layer chips MS100 and in turn an upper cover layer DS from cover layer strands DS200 were scattered.
  • this beach / chip cake 850 is then transported into the hot press 150, where it is pressed into an OSB board of desired thickness.
  • the middle layer MS can also be sprinkled from middle layer chips MS100 at the same time and the strand / chip cake 800 is transported there from the strip forming belt 76 into the hot press 170, where it is also pressed into an OSB plate 600 of desired thickness.
  • the middle layer strands bunker 7 promoted middle layer chips MS100 are preferably mixed with the middle layer strands MS200 to form a middle layer mixture MS100 + MS200, wherein the term "mixing" does not necessarily mean an active method step, but the combination of middle layer chips MS100 and middle layer strip MS200 can certainly be sufficient.
  • This middle layer mixture MS100 + MS200 is then transported into the middle layer beach scattering device 9.
  • at least one middle layer MS + MSOSB is then scattered on the lower cover layer DSOSB.
  • a Strandszerspaner 110 is first Round wood to wet strands 300 machined.
  • the beach sweeper 110 then transports the strands 300 into a wet end bunker 120 and from there into the chip dryer 30, mixes wet strands 300 with the wet chips 100 from the wet chip bunker 20, and then mixes wet strands 300 and wet chips 100 is dried.
  • the dried mixture is then transported to chip hopper 40.
  • the maximum level of chip hopper 40 should not exceed 5% of its volume.
  • the chips 100 and strands 300 must be continuously discharged from the chip bunker 40.
  • snails (not shown) are provided in the chip bunker 40, which must rotate around so fast that chips 100 / strands 300 in the chip bunker 40 can not collect.
  • the mixture of dried chips 100 and dried strands 300 is then transported to the chip sorting plant 50.
  • the mixture is sorted at least in top layer chips DS300 and middle-layer chips MS100.
  • the cover layer chips DS300 are then transported into the cover layer bunker 160 and from there into the glueing device 160 '.
  • the glued top layer strands DS300 are subsequently transferred into the cover layer scattering devices 80.
  • the MS100 middle layer chips sorted out in the chip sorting plant 50 proceed as described above, and the strand / chip cake 850 scattered from cover layer DS300 and middle layer chips MS100 is pressed by the hot press 150 to an OSB plate 600 of desired thickness as described above.
  • the Beleimvoruzeen 6 ', 160' may be provided with a beach scale and a drum mixer. Any other special Beleimvoriques for the beach gluing is conceivable.
  • the cover layer scattering device 80 is disposed above the chip-forming belt 75, which revolves endlessly in the working direction A (that is, the transport direction of the beach / chip cake 850). It essentially consists of a chip bunker 88 with a bunker bottom belt 81 arranged therein, which has a first end 811 and a second end 812.
  • the bunker bottom band 81 is reversibly drivable in two opposite directions (working direction A and opposite thereto).
  • ejector rollers 83 which can each be driven about an axis of rotation D 1 and scraper rollers 82 which can be driven reversibly in each case about an axis of rotation D are arranged.
  • sieves 84 are arranged underneath the bunker bottom belt 81.
  • FIG. 2 shows the cover layer scattering device 80 for spreading the lower cover layer DS in chip operation.
  • the cover shavings DS100 are input to the chip hopper 88 via the feeder 86. There they fall on the scraper rollers 82, which rotate in the same direction to the working direction A about the axis of rotation D. About the rotating scraper rollers 82 pass the cover chips DS100 on the bunker floor belt 81, which also rotates endlessly in the direction of A. At the first end 811 of the bunker bottom band 81, the cover shavings DS100 fall down therefrom and strike the first sieve 84 arranged beneath the bunker bottom belt 81.
  • the air stream generated by the fan 87 blows the cover shavings DS100 through the sieves 84 and then to a lower cover layer DS sprinkled on the forming belt 75.
  • An upper cover layer DS is then sprinkled onto the scattered middle layer MS.
  • the cover layer scatterer In order for the upper cover layer DS to be scattered, the cover layer scatterer must be mirror-inverted to the cover layer diffuser 80, which means that everything is rotating in the opposite direction.
  • FIG. 3 shows the beach operation of the cover layer spreading device 80 for spreading the lower cover layer DSOSB.
  • the cover layer scattering device 80 must be formed in mirror image to scatter the upper cover layer DSOSB, so everything must turn in the opposite direction.
  • the cover layer strands DS200 / DS300 pass via the feed device 86 into the chip bunker 88.
  • a portion of the scraper rollers 82 is - since it is not needed - removed or shut down. It can scraper roles 82 different sizes are used, but it can also as in FIG. 2 shown pawl rollers 82 identical size find use.
  • the illustration here is purely schematic.
  • the chip forming belt 75 continues to run in the direction of A. Now the bunker bottom belt 81 is driven in rotation against the working direction A.
  • the cover layer strands DS200 / DS300 fall on the scraper rollers 82, which rotate in opposite directions to the working direction A, and are transported by these in the direction of the second end 812 of the bunker bottom belt 81 to the ejector rollers 83 driven in the same direction as the scraper rollers 80. Chips falling past the scraper rollers 82 are also transported by the bunker bottom belt 81 in the direction of the ejector rollers 83 and then thrown onto the disk heads 85 which are also driven in opposite directions to the working direction A, from where they are then sprinkled onto the chip forming belt 75 for the lower or upper cover layer DSOSB become.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
EP14000794.9A 2014-03-05 2014-03-05 Verfahren und Vorrichtung zur Herstellung einer OSB-Platte Active EP2915640B1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
HUE14000794A HUE031057T2 (en) 2014-03-05 2014-03-05 Procedure and apparatus for producing OSB plate
EP14000794.9A EP2915640B1 (de) 2014-03-05 2014-03-05 Verfahren und Vorrichtung zur Herstellung einer OSB-Platte
PT140007949T PT2915640T (pt) 2014-03-05 2014-03-05 Método e dispositivo para produção de um painel osb
ES14000794.9T ES2603423T3 (es) 2014-03-05 2014-03-05 Procedimiento y equipo para fabricar un panel OSB
LTEP14000794.9T LT2915640T (lt) 2014-03-05 2014-03-05 Būdas ir aparatas osb plokštei gaminti
PL14000794T PL2915640T3 (pl) 2014-03-05 2014-03-05 Sposób i urządzenie do wytwarzania płyty OSB
DK14000794.9T DK2915640T3 (da) 2014-03-05 2014-03-05 Fremgangsmåde og indretning til fremstilling af en OSB-plade
RU2015107522A RU2668328C2 (ru) 2014-03-05 2015-03-04 Способ изготовления ориентировано-стружечной плиты
HRP20161496TT HRP20161496T1 (hr) 2014-03-05 2016-11-11 Postupak i uređaj za proizvodnju osb panela

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP14000794.9A EP2915640B1 (de) 2014-03-05 2014-03-05 Verfahren und Vorrichtung zur Herstellung einer OSB-Platte

Publications (2)

Publication Number Publication Date
EP2915640A1 EP2915640A1 (de) 2015-09-09
EP2915640B1 true EP2915640B1 (de) 2016-08-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP14000794.9A Active EP2915640B1 (de) 2014-03-05 2014-03-05 Verfahren und Vorrichtung zur Herstellung einer OSB-Platte

Country Status (9)

Country Link
EP (1) EP2915640B1 (ru)
DK (1) DK2915640T3 (ru)
ES (1) ES2603423T3 (ru)
HR (1) HRP20161496T1 (ru)
HU (1) HUE031057T2 (ru)
LT (1) LT2915640T (ru)
PL (1) PL2915640T3 (ru)
PT (1) PT2915640T (ru)
RU (1) RU2668328C2 (ru)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL3216574T3 (pl) 2016-03-10 2020-04-30 SWISS KRONO Tec AG Sposób produkcji płyty OSB
DE102016110070A1 (de) * 2016-05-31 2017-11-30 Dieffenbacher GmbH Maschinen- und Anlagenbau Anlage und Verfahren zur Herstellung einer Werkstoffplatte
DE102017111134B4 (de) * 2017-05-22 2018-12-27 Dieffenbacher GmbH Maschinen- und Anlagenbau Verfahren und Anlage zur Herstellung einer Spanplatte
DE102017124063A1 (de) * 2017-10-16 2019-04-18 Dieffenbacher GmbH Maschinen- und Anlagenbau Streuanlage und Verfahren zur Herstellung einer Streugutmatte im Zuge der Herstellung von Werkstoffplatten
RU2763720C1 (ru) * 2021-05-13 2021-12-30 Бранимир Плазинич Установка для производства строительных плит из отходов или многослойных частично полимерных материалов и способ производства
CN113843863A (zh) * 2021-07-28 2021-12-28 湖州高裕家居科技有限公司 用于家具的人造木板及使用该木板的床架

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE346945B (ru) * 1970-04-24 1972-07-24 Karlstadplattan Ab
DE3346469A1 (de) * 1983-12-22 1985-07-18 Heggenstaller, Anton, 8892 Kühbach Verfahren und vorrichtung zum strangpressen von mit bindemittel vermengten pflanzlichen kleinteilen, insbesondere holzkleinteilen
DE4021939A1 (de) * 1990-07-10 1992-01-16 Siempelkamp Gmbh & Co Streuanlage zum streuen von spanplatten-rohmaterial
EP0543052A1 (en) * 1991-11-22 1993-05-26 CERIT S.a.r.L Plant to make biodegradable and non-biodegradable products, and the relative method
US5641819A (en) * 1992-03-06 1997-06-24 Campbell; Craig C. Method and novel composition board products
DE4212000C2 (de) * 1992-04-09 1999-05-27 Kvaerner Panel Sys Gmbh Vorrichtung zur Entstaubung in einer Deckschichtstreuvorrichtung für eine Formstation
DE20209991U1 (de) * 2002-06-28 2003-10-30 Metso Paper Inc Doppelbandpresse zur Herstellung von Plattenwerkstoffen
DE20305236U1 (de) * 2003-04-01 2003-07-17 Kronospan Tech Co Ltd Vorrichtung zum Bedampfen
US20070144663A1 (en) * 2005-12-23 2007-06-28 Huber Engineered Woods L.L.C. Process for manufacture of oriented strand lumber products
SE533803C2 (sv) * 2008-10-16 2011-01-18 Swedwood Internat Ab Spånskiva med mittskikt av defibrerande träspån
DE102011118009A1 (de) * 2011-07-07 2013-01-10 Binos Gmbh Verfahren zur Herstellung von OSB-Platten und Wafer-Platten aus Palmen

Also Published As

Publication number Publication date
LT2915640T (lt) 2017-01-10
ES2603423T3 (es) 2017-02-27
HRP20161496T1 (hr) 2016-12-16
HUE031057T2 (en) 2017-06-28
PT2915640T (pt) 2016-11-25
RU2015107522A3 (ru) 2018-07-31
RU2668328C2 (ru) 2018-09-28
PL2915640T3 (pl) 2017-07-31
DK2915640T3 (da) 2017-01-02
EP2915640A1 (de) 2015-09-09
RU2015107522A (ru) 2016-09-27

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