EP2915640B1 - Method and apparatus for manufacturing an OSB panel - Google Patents

Method and apparatus for manufacturing an OSB panel Download PDF

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Publication number
EP2915640B1
EP2915640B1 EP14000794.9A EP14000794A EP2915640B1 EP 2915640 B1 EP2915640 B1 EP 2915640B1 EP 14000794 A EP14000794 A EP 14000794A EP 2915640 B1 EP2915640 B1 EP 2915640B1
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EP
European Patent Office
Prior art keywords
chip
chips
covering layer
strands
middle layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14000794.9A
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German (de)
French (fr)
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EP2915640A1 (en
Inventor
Stanislaw Dobras
Krzysztof Przygodzki
Bartlomiej Maracz
Miroslaw Janiszewski
Joanna Jastrzab
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Swiss Krono Tec AG
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Swiss Krono Tec AG
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Publication date
Priority to LTEP14000794.9T priority Critical patent/LT2915640T/en
Priority to DK14000794.9T priority patent/DK2915640T3/en
Priority to EP14000794.9A priority patent/EP2915640B1/en
Priority to PL14000794T priority patent/PL2915640T3/en
Priority to PT140007949T priority patent/PT2915640T/en
Priority to ES14000794.9T priority patent/ES2603423T3/en
Application filed by Swiss Krono Tec AG filed Critical Swiss Krono Tec AG
Priority to HUE14000794A priority patent/HUE031057T2/en
Priority to RU2015107522A priority patent/RU2668328C2/en
Publication of EP2915640A1 publication Critical patent/EP2915640A1/en
Application granted granted Critical
Publication of EP2915640B1 publication Critical patent/EP2915640B1/en
Priority to HRP20161496TT priority patent/HRP20161496T1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B27N3/14—Distributing or orienting the particles or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/04—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres

Definitions

  • the invention further relates to a method for producing an OSB board on a plant for producing a chipboard, which is operated in a normal operation as described above, and a cover layer spreading device for use in the method.
  • chipboard and OSB Oriented Strands Board
  • a company that wants to produce both chipboard and OSB boards needs to acquire and install both a particleboard plant and an OSB board plant. Due to the longer strands, the strength values of an OSB board are greater than those of a chipboard. It is known that the neutral fiber of a wood-based panel symmetrical to the center plane runs and the stability of the wood-based panel is determined essentially by their outer layers.
  • OSB panels are typically used as structural panels
  • particleboard is typically used as furniture panels.
  • the demand for OSB boards is not constant throughout the year. When the weather is bad, the demand goes back, in good weather it rises, so there are large fluctuation margins. The manufacturer must compensate for this fluctuation range either by appropriate storage and / or an extension or shortening of the operating times of the OSB plant. Both are costly.
  • the invention has for its object to provide a method for producing an OSB board including a system for producing a particle board and, where appropriate, a plant for producing an OSB board.
  • the OSB beach gluing device preferably includes a beach scale and a beach gluing device.
  • topsheet strands and the middle layer chips can be glued with a melamine-urea-phenol-formaldehyde (MUPF) glue or with a polymeric diphenylmethane diisocyanate (PMDI) glue. It is also possible to glaze the top layer strands with polymeric diphenylmethane diisocyanate (PMDI) and the middle layer with a melamine-urea-phenol-formaldehyde (MUPF) glue or vice versa.
  • MUPF melamine-urea-phenol-formaldehyde
  • topsheet strands and the middlecoat blend may be glued with a melamine-urea-phenol-formaldehyde (MUPF) glue or a polymeric diphenylmethane diisocyanate (PMDI) glue. It is also possible to glaze the top layer strands with polymeric diphenylmethane diisocyanate (PMDI) and the middle layer mixture with a melamine-urea-phenol-formaldehyde (MUPF) glue or vice versa.
  • MUPF melamine-urea-phenol-formaldehyde
  • FIG. 1 shows the schematic representation of a plant for the production of OSB boards.
  • a beach chipper 1 first log wood is cut to wet strands 200.
  • the strands 200 are transported by the beach scraper 1 into a wet beach bunker 2 and transported from there into a beach dryer 3.
  • the wet strands 200 are dried.
  • the dried strands 200 are transported by the beach dryer 3 into a beach sorter 5 where they are sorted into top layer strands DS200, middle strands MS200 and fines F.
  • the cover layer strands DS200 are transported from the beach sorting installation 5 into a cover layer bunker 6 and the middle layer strands MS200 are transported into a middle layer bunker 7.
  • Both the cover layer strands DS200 and the middle layer strands MS200 are each in a gluing device 6 ', 7' with a glue KL, on melamine-urea-phenol-formaldehyde (MUPF) - and / or diphenylmethane diisocyanate (PMDI) -based glued.
  • Top coat strands DS200 and middle coat strands MS200 can be glued with the same or a different glue.
  • the cover layer strands DS200 are transported into at least one cover layer strander 8 and the middle layer strands MS200 are transported into at least one middle layer strandshift device 9.
  • the cover layer spreader 8 and the middle layer beach spreader 9 are arranged above an endlessly circulating strand forming belt 76.
  • the strandshape 76 is first spread with overlay strands DS200 to form a lower overlay DSOSB.
  • the middle layer strands MS200 are scattered to a middle layer MSOSB, on which in turn an upper cover layer DSOSB with cover layer strands DS200 is scattered.
  • the strip forming belt 76 transports the scattered beach cake to the hot press 170, where it is pressed into an OSB plate 600 of desired thickness.
  • a release agent can be applied to the beach cake 900 via an application device 159, which is particularly advantageous when a PMDI glue is used. It is also conceivable to apply the release agent to the (not shown here) press plate of the hot press 170.
  • FIG. 1 shows the schematic representation of a conventional plant for the production of chipboard.
  • chip chipper 10 wood chippings are first cut to wet chips 100. From here, the wet chips 100 are then transported into a wet chip bunker 20, from which they are subsequently transported into a chip dryer 30 in order to dry them. The dried chips 100 are transferred from the chip dryer 30 into the chip hopper 40, from where they are transferred to a Spansortierstrom 50. In the chip sorting plant 50, the chips 100 are sorted into coarse chips GS, surface layer chips DS100, middle layer chips MS100 and dust St. The cover shavings DS100 are transported from the chip sorting plant 50 to a top layer chip bunker 60 and the middle layer chips MS100 are transported to a middle layer chip bunker 70.
  • a gluing device 60 ', 70' in which they are glued with a MUPF glue or PMDI glue (each also called Kunststoffharzleim KL).
  • PMDI glue each also called Kunststoffharzleim KL
  • the middle layer chips MS100 and the cover layer chips DS100 can also be glued to a urea-formaldehyde (UF) glue, as is customary in chipboard production.
  • the cover shavings DS100 are transported from the gluing device 60 'into the cover layer spreading devices 80 and the middle layer chips MS100 are transported from the gluing device 70' into the middle layer scattering devices 90.
  • the cover layer scattering devices 80 and the middle layer scattering devices 90 are arranged above the chip forming strip 75, on which first a lower cover layer DS of covering layer chips DS100 is scattered. On the lower cover layer DS, a middle layer MS of middle-layer chips MS100 is scattered, onto which in turn an upper cover layer DS of covering layer chips DS100 is scattered.
  • the chip cake consisting of lower cover layer DS, middle layer MS and upper cover layer DS is transported by the forming belt 75 to the hot press 150, in which it is pressed into a chip bar 500 of the desired thickness. Even before the hot press 150 can be applied to the chip cake via an applicator 149 a release agent. It is also conceivable to apply the release agent to the (not shown here) press plate of the hot press 150.
  • FIG. 1 a shows that transferred in the gluing device 6 'with the previously described Kunststoffharzleim KL glued Deck Anlagenstrands DS200 in the cover layer scattering devices 80 of the particle board system.
  • middle layer chips 100 can be guided into the middle layer beach bunker 7.
  • the amount of middle-layer chips 100 essentially corresponds to the amount of cover layer strand DS200.
  • a lower cover layer DSOSB from cover layer DS200, onto which cover layer DS a middle layer MS consisting of middle layer chips MS100 and in turn an upper cover layer DS from cover layer strands DS200 were scattered.
  • this beach / chip cake 850 is then transported into the hot press 150, where it is pressed into an OSB board of desired thickness.
  • the middle layer MS can also be sprinkled from middle layer chips MS100 at the same time and the strand / chip cake 800 is transported there from the strip forming belt 76 into the hot press 170, where it is also pressed into an OSB plate 600 of desired thickness.
  • the middle layer strands bunker 7 promoted middle layer chips MS100 are preferably mixed with the middle layer strands MS200 to form a middle layer mixture MS100 + MS200, wherein the term "mixing" does not necessarily mean an active method step, but the combination of middle layer chips MS100 and middle layer strip MS200 can certainly be sufficient.
  • This middle layer mixture MS100 + MS200 is then transported into the middle layer beach scattering device 9.
  • at least one middle layer MS + MSOSB is then scattered on the lower cover layer DSOSB.
  • a Strandszerspaner 110 is first Round wood to wet strands 300 machined.
  • the beach sweeper 110 then transports the strands 300 into a wet end bunker 120 and from there into the chip dryer 30, mixes wet strands 300 with the wet chips 100 from the wet chip bunker 20, and then mixes wet strands 300 and wet chips 100 is dried.
  • the dried mixture is then transported to chip hopper 40.
  • the maximum level of chip hopper 40 should not exceed 5% of its volume.
  • the chips 100 and strands 300 must be continuously discharged from the chip bunker 40.
  • snails (not shown) are provided in the chip bunker 40, which must rotate around so fast that chips 100 / strands 300 in the chip bunker 40 can not collect.
  • the mixture of dried chips 100 and dried strands 300 is then transported to the chip sorting plant 50.
  • the mixture is sorted at least in top layer chips DS300 and middle-layer chips MS100.
  • the cover layer chips DS300 are then transported into the cover layer bunker 160 and from there into the glueing device 160 '.
  • the glued top layer strands DS300 are subsequently transferred into the cover layer scattering devices 80.
  • the MS100 middle layer chips sorted out in the chip sorting plant 50 proceed as described above, and the strand / chip cake 850 scattered from cover layer DS300 and middle layer chips MS100 is pressed by the hot press 150 to an OSB plate 600 of desired thickness as described above.
  • the Beleimvoruzeen 6 ', 160' may be provided with a beach scale and a drum mixer. Any other special Beleimvoriques for the beach gluing is conceivable.
  • the cover layer scattering device 80 is disposed above the chip-forming belt 75, which revolves endlessly in the working direction A (that is, the transport direction of the beach / chip cake 850). It essentially consists of a chip bunker 88 with a bunker bottom belt 81 arranged therein, which has a first end 811 and a second end 812.
  • the bunker bottom band 81 is reversibly drivable in two opposite directions (working direction A and opposite thereto).
  • ejector rollers 83 which can each be driven about an axis of rotation D 1 and scraper rollers 82 which can be driven reversibly in each case about an axis of rotation D are arranged.
  • sieves 84 are arranged underneath the bunker bottom belt 81.
  • FIG. 2 shows the cover layer scattering device 80 for spreading the lower cover layer DS in chip operation.
  • the cover shavings DS100 are input to the chip hopper 88 via the feeder 86. There they fall on the scraper rollers 82, which rotate in the same direction to the working direction A about the axis of rotation D. About the rotating scraper rollers 82 pass the cover chips DS100 on the bunker floor belt 81, which also rotates endlessly in the direction of A. At the first end 811 of the bunker bottom band 81, the cover shavings DS100 fall down therefrom and strike the first sieve 84 arranged beneath the bunker bottom belt 81.
  • the air stream generated by the fan 87 blows the cover shavings DS100 through the sieves 84 and then to a lower cover layer DS sprinkled on the forming belt 75.
  • An upper cover layer DS is then sprinkled onto the scattered middle layer MS.
  • the cover layer scatterer In order for the upper cover layer DS to be scattered, the cover layer scatterer must be mirror-inverted to the cover layer diffuser 80, which means that everything is rotating in the opposite direction.
  • FIG. 3 shows the beach operation of the cover layer spreading device 80 for spreading the lower cover layer DSOSB.
  • the cover layer scattering device 80 must be formed in mirror image to scatter the upper cover layer DSOSB, so everything must turn in the opposite direction.
  • the cover layer strands DS200 / DS300 pass via the feed device 86 into the chip bunker 88.
  • a portion of the scraper rollers 82 is - since it is not needed - removed or shut down. It can scraper roles 82 different sizes are used, but it can also as in FIG. 2 shown pawl rollers 82 identical size find use.
  • the illustration here is purely schematic.
  • the chip forming belt 75 continues to run in the direction of A. Now the bunker bottom belt 81 is driven in rotation against the working direction A.
  • the cover layer strands DS200 / DS300 fall on the scraper rollers 82, which rotate in opposite directions to the working direction A, and are transported by these in the direction of the second end 812 of the bunker bottom belt 81 to the ejector rollers 83 driven in the same direction as the scraper rollers 80. Chips falling past the scraper rollers 82 are also transported by the bunker bottom belt 81 in the direction of the ejector rollers 83 and then thrown onto the disk heads 85 which are also driven in opposite directions to the working direction A, from where they are then sprinkled onto the chip forming belt 75 for the lower or upper cover layer DSOSB become.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)

Description

Die Erfindung betrifft ein Verfahren zur Herstellung einer OSB-Platte auf einer Anlage zur Herstellung einer Spanplatte unter Einbeziehung einer Anlage zur Herstellung einer OSB-Platte, wobei in einem Normalbetrieb die Anlage für die Spanplattenherstellung wie folgt betrieben wird:

  • Zerspanen von Holzhackschnitzeln in einem Spanzerspaner zu nassen Spänen,
  • Transportieren der nassen Späne von dem Spanzerspaner in einen Nassspanbunker,
  • Transportieren der Späne aus dem Nassspanbunker in einen Spantrockner,
  • Trocknen der Späne im Spantrockner,
  • Transportieren der Späne aus dem Spantrockner in einen Spanbunker,
  • Transportieren der Späne aus dem Spanbunker in eine Spansortieranlage,
  • Sortieren der Späne in der Spansortieranlage in Grobspäne, Deckschichtspäne, Mittelschichtspäne und Staub,
  • Transportieren der Deckschichtspäne aus der Spansortieranlage in einen Deckschichtspänebunker,
  • Transportieren der Mittelschichtspäne aus der Spansortieranlage in einen Mittelschichtspänebunker,
  • Beleimen der Deckschichtspäne und der Mittelschichtspäne mit einem Kunstharzleim,
  • Transportieren der beleimten Deckschichtspäne in mindestens eine Deckschichtstreuvorrichtung,
  • Transportieren der beleimten Mittelschichtspäne in mindestens eine Mittelschichtstreuvorrichtung,
  • Streuen der Deckschichtspäne auf ein Spanformband zu mindestens einer unteren Deckschicht,
  • Streuen der Mittelschichtspäne auf die untere Deckschicht zumindestens einer Mittelschicht,
  • Streuen der Deckschichtspäne auf die Mittelschicht zu mindestens einer oberen Deckschicht,
  • Transportieren des aus unterer Deckschicht, Mittelschicht und oberer Deckschicht bestehenden Spänekuchens zu einer Heißpresse,
  • Verpressen des Spänekuchens in der Heißpresse zu einer Spanplatte gewünschter Dicke;
und wobei in einem Normalbetrieb die Anlage für die OSB-Plattenherstellung wie folgt betrieben wird:
  • Zerspanen von Rundholz in einem Strandszerspaner zu nassen Strands,
  • Transportieren der nassen Strands von dem Strandszerspaner in einen Nassstrandsbunker,
  • Transportieren der Strands aus dem Nassstrandsbunker in einen Strandstrockner,
  • Trocknen der Strands im Strandstrockner,
  • Transportieren der Strands aus dem Strandstrockner in eine Strandssortieranlage,
  • Sortieren der Strands in der Strandssortieranlage in Deckschichtstrands, Mittelschichtstrands und Feingut,
  • Transportieren der Deckschichtstrands aus der Strandssortieranlage in einen Deckschichtstrandsbunker,
  • Transportieren der Mittelschichtstrands aus der Strandssortieranlage in einen Mittelschichtstrandsbunker,
  • Beleimen der Deckschichtstrands und der Mittelschichtstrands in je einer Beleimvorrichtung mit einem Kunstharzleim,
  • Transportieren der beleimten Deckschichtstrands in mindestens eine Deckschichtstrandsstreuvorrichtung,
  • Transportieren der beleimten Mittelschichtstrands in mindestens eine Mittelschichtstrandsstreuvorrichtung,
  • Streuen der Deckschichtstrands auf ein Strandsformband zu mindestens einer unteren Deckschicht,
  • Streuen der Mittelschichtstrands auf die untere Deckschicht zu mindestens einer Mittelschicht,
  • Streuen der Deckschichtstrands auf die Mittelschicht zu mindestens einer oberen Deckschicht,
  • Transportieren des aus unterer Deckschicht, Mittelschicht und oberer Deckschicht bestehenden Strandskuchens zu einer Heißpresse,
  • Verpressen des Strandskuchens in der Heißpresse zu einer OSB-Platte gewünschter Dicke.
The invention relates to a method for producing an OSB board on a plant for the production of a chipboard including a plant for producing an OSB board, wherein in a normal operation, the plant for chipboard production is operated as follows:
  • Cutting woodchips in a chip-breaker to wet chips,
  • Transporting the wet chips from the chip chipper into a wet chip bunker,
  • Transporting the chips from the wet chip bunker into a chip dryer,
  • Drying the chips in the particle dryer,
  • Transporting the chips from the chip dryer into a chip bunker,
  • Transporting the chips from the chip bunker into a chip sorting plant,
  • Sorting of chips in the chip sorting plant in coarse chips, surface shavings, middle-class shavings and dust,
  • Transporting the surface layer chips from the Spansortieranlage in a Deckschichtspänebunker,
  • Transporting the middle layer chips from the Spansortieranlage in a Mittelschichtspänebunker,
  • Gluing the surface layer shavings and the middle layer shavings with a synthetic resin glue,
  • Transporting the glued cover shavings into at least one cover layer spreading device,
  • Transporting the glued middle-layer chips into at least one middle layer spreading device,
  • Scattering the surface layer chips onto a chip-forming strip to at least one lower cover layer,
  • Scattering the middle layer chips onto the lower cover layer of at least one middle layer,
  • Scattering the cover shavings onto the middle layer to at least one upper cover layer,
  • Transporting the chip cake consisting of lower cover layer, middle layer and upper cover layer to a hot press,
  • Pressing the chip cake in the hot press into a chipboard of desired thickness;
and wherein in a normal operation the OSB plate making facility is operated as follows:
  • Cutting round logs in a beach chipper to wet beaches,
  • Transporting the wet beaches from the beach sweeper into a wet beach bunker,
  • Transporting the beaches from the wet-beach bunker into a beach dryer,
  • Drying the beach in the beach dryer,
  • Transporting the beaches from the beach dryer into a beach sorting facility,
  • Sorting the beaches in the beach sorting plant in top layer strands, middle strands and fines,
  • Transporting the topsheet strip from the beach sorter to a top layer bunker,
  • Transporting the middle layer beach from the beach sorter into a middle class beach bunker,
  • Gluing the cover layer strands and the middle layer strands in each case with a gluing device with a synthetic resin glue,
  • Transporting the glued cover layer strands into at least one cover layer strander device,
  • Transporting the glued middle-layer strands into at least one middle-layer beach spreader device,
  • Scattering the cover layer strands onto a strip form band to at least one lower cover layer,
  • Scattering the middle layer strands onto the lower cover layer to at least one middle layer,
  • Spreading the cover layer strands on the middle layer to at least one upper cover layer,
  • Transporting the lower layer, middle layer and upper surface layer beach cake into a hot press,
  • Pressing the strand cake in the hot press to an OSB plate of desired thickness.

Die Erfindung betrifft weiterhin ein Verfahren zur Herstellung einer OSB-Platte auf einer Anlage zur Herstellung einer Spanplatte, die in einem Normalbetrieb wie zuvor beschrieben betrieben wird, sowie eine Deckschichtstreuvorrichtung zur Verwendung in den Verfahren.The invention further relates to a method for producing an OSB board on a plant for producing a chipboard, which is operated in a normal operation as described above, and a cover layer spreading device for use in the method.

Auch wenn die Herstellung von Spanplatten und OSB-Platten (Oriented Strands Board) ähnlich abläuft, so sind die Anlagen unterschiedlich aufgebaut. Ein Unternehmen, das sowohl Spanplatten als auch OSB-Platten herstellen möchte, muss sowohl eine Spanplattenanlage als auch eine OSB-Plattenanlage erwerben und einrichten. Aufgrund der längeren Strands sind die Festigkeitswerte einer OSB-Platte größer als die einer Spanplatte. Es ist bekannt, dass die neutrale Faser einer Holzwerkstoffplatte symmetrisch zur Mittenebene verläuft und die Stabilität der Holzwerkstoffplatte im Wesentlichen durch ihre Deckschichten bestimmt wird.Although the production of chipboard and OSB (Oriented Strands Board) plates is similar, the systems are structured differently. A company that wants to produce both chipboard and OSB boards needs to acquire and install both a particleboard plant and an OSB board plant. Due to the longer strands, the strength values of an OSB board are greater than those of a chipboard. It is known that the neutral fiber of a wood-based panel symmetrical to the center plane runs and the stability of the wood-based panel is determined essentially by their outer layers.

Als mit der Herstellung von OSB-Platten überhaupt begonnen wurde, haben sich die Späne für die Mittelschicht und die Deckschicht nur wenig voneinander unterschieden. Später haben die Suche nach der Verbesserung der Rentabilität, die Verringerung der Verfügbarkeit von gutem Rundholz und der Wunsch nach Steigerung der Produktionskapazität dazu beigetragen, dass die Strands für die Mittelschicht der OSB-Platte den Spänen für die Mittelschicht von Spanplatten immer mehr ähnelten.When the production of OSB boards began, the chips for the middle layer and the top layer differed little from each other. Later, the quest to improve profitability, reduce the availability of good logs, and increase production capacity have made the strands for the middle layer of the OSB board more and more similar to chips for the middle class of chipboard.

Aus diesem Grund werden heute von Herstellern, die sowohl über eine OSB-Plattenanlage als auch über eine Spanplattenanlage verfügen, für die Mittelschicht einer OSB-Platte oftmals Späne verwendet, die für deren Spanplatten bestimmt sind. Dadurch wird die Wirtschaftlichkeit des Produktionsprozesses verbessert und die Produktionskapazität der OSB-Anlage gesteigert. Auch bei Verwendung einer Mittelschicht aus Spänen werden die in der Norm EN-300 festgesetzten Parameter für die OSB-Platten nicht verschlechtert.For this reason, today manufacturers who have both an OSB board system and a chipboard plant often use chips for the middle layer of an OSB board which are intended for their chipboard. This improves the profitability of the production process and increases the production capacity of the OSB plant. Even when using a middle layer of chips, the parameters set for the OSB boards in the EN-300 standard are not worsened.

Während OSB-Platten in der Regel als Bauplatten verwendet werden, werden Spanplatten in der Regel als Möbelplatten verwendet. Der Bedarf an OSB-Platten ist über das Jahr verteilt nicht konstant. Bei schlechtem Wetter geht der Bedarf zurück, bei gutem Wetter steigt er, sodass große Schwankungsbreiten bestehen. Der Hersteller muss diese Schwankungsbreite entweder durch eine entsprechende Lagerhaltung und/oder eine Verlängerung bzw. Verkürzung der Betriebszeiten der OSB-Anlage ausgleichen. Beides ist kostenintensiv.While OSB panels are typically used as structural panels, particleboard is typically used as furniture panels. The demand for OSB boards is not constant throughout the year. When the weather is bad, the demand goes back, in good weather it rises, so there are large fluctuation margins. The manufacturer must compensate for this fluctuation range either by appropriate storage and / or an extension or shortening of the operating times of the OSB plant. Both are costly.

Von dieser Problemstellung ausgehend liegt der Erfindung die Aufgabe zugrunde, ein Verfahren zur Herstellung einer OSB-Platte unter Einbeziehung einer Anlage zur Herstellung einer Spanplatte und gegebenenfalls einer Anlage zur Herstellung einer OSB-Platte zu schaffen.Starting from this problem, the invention has for its object to provide a method for producing an OSB board including a system for producing a particle board and, where appropriate, a plant for producing an OSB board.

Zur Problemlösung ist bei dem eingangs beschriebenen Verfahren vorgesehen, dass zur Herstellung einer OSB-Platte auf der Anlage zur Herstellung von Spanplatten folgende Schritte ausgeführt werden:

  1. a) Transportieren zumindest eines Teils der in der Beleimvorrichtung beleimten Deckschichtstrands in die Deckschichtstreuvorrichtung,
  2. b) Streuen der Deckschichtstrands auf das Spanformband zu mindestens einer unteren Deckschicht,
  3. c) Streuen der beleimten Mittelschichtspäne auf die untere Deckschicht zu einer Mittelschicht,
  4. d) Streuen der Deckschichtstrands auf die Mittelschicht zu mindestens einer oberen Deckschicht,
  5. e) Transportieren des aus der unteren Deckschicht, der Mittelschicht und der oberen Deckschicht bestehenden Strands/Spänekuchens zu der Heißpresse,
  6. f) Verpressen des Strands/Spänekuchens in der Heißpresse zu einer OSB-Platte gewünschter Dicke.
To solve the problem, it is provided in the method described above that the following steps are carried out to produce an OSB board on the plant for the production of particle board:
  1. a) transporting at least part of the cover layer strip glued in the gluing device into the cover layer scattering device,
  2. b) spreading the cover layer strands on the chip-forming strip to at least one lower cover layer,
  3. c) spreading the glued middle-layer chips onto the lower cover layer to form a middle layer,
  4. d) spreading the cover layer strands on the middle layer to at least one upper cover layer,
  5. e) transporting the strands / chip cake consisting of the lower cover layer, the middle layer and the upper cover layer to the hot press,
  6. f) pressing the strand / chip cake in the hot press to an OSB plate of desired thickness.

Durch diese Ausgestaltung ist es für ein Unternehmen, das über eine OSB-Anlage und eine Spanplatten-Anlage verfügt möglich, zur Erhöhung der Kapazität die Spanplatten-Anlage mit zu verwenden. Damit können Bedarfsspitzen kurzfristig aufgefangen werden.With this configuration, it is possible for a company that has an OSB plant and a chipboard plant, to increase the capacity to use the chipboard plant with. Thus, demand peaks can be absorbed in the short term.

Vorzugsweise werden zusätzlich die folgenden weiteren Schritte ausgeführt:

  • g) Transportieren eines dem aus der Beleimvorrichtung entnommenen Teil Deckschichtstrands entsprechenden Teil Mittelschichtspäne aus dem Mittelschichtspänebunker in die Mittelschichtstrandsstreuvorrichtung,
  • h) Transportieren des aus Mittelschichtspäne und Mittelschichtstrands bestehenden Mittelschichtgemisches aus dem Mittelschichtstrandsbunker in die Mittelschichtstrandsstreuvorrichtung,
  • i) Streuen der Deckschichtstrands aus der Deckschichtstrandsstreuvorrichtung auf das Strandsformband zu mindestens einer unteren Deckschicht,
  • j) Streuen des Mittelschichtgemisches aus der Mittelschichtstrandsstreuvorrichtung auf die untere Deckschicht zu mindestens einer Mittelschicht,
  • k) Streuen der Deckschichtstrands aus der Deckschichtstrandsstreuvorrichtung auf die Mittelschicht zu mindestens einer oberen Deckschicht,
  • l) Transportieren des aus der unteren Deckschicht, der Mittelschicht und der oberen Deckschicht bestehenden Strands/Spänekuchen zu der Heißpresse,
  • m) Verpressen des Strand/Spänekuchens in der Heißpresse zu einer OSB-Platte gewünschter Dicke.
Preferably, the following additional steps are additionally carried out:
  • g) transferring middle layer chips from the middle layer chip bunker to the middle layer chip bunker corresponding to the part of the cover layer strand removed from the glueing device,
  • h) transporting the middle-layer chip and middle-layer strip middle layer mixture from the middle-layer beach bunker into the middle-layer strand scattering device,
  • i) spreading the cover layer strands from the cover layer strands scattering device onto the strandshape to at least one lower cover layer,
  • j) scattering the middle layer mixture from the middle layer layer scattering device onto the lower cover layer to at least one middle layer,
  • k) spreading the cover layer strands from the cover layer strands scattering device onto the middle layer to at least one upper cover layer,
  • l) transporting the strand / chip cake consisting of the lower cover layer, the middle layer and the upper cover layer to the hot press,
  • m) pressing the beach / chip cake in the hot press to an OSB plate of desired thickness.

Mit dieser Ausgestaltung ist es möglich, auf der OSB-Anlage und der Spanplatten-Anlage simultan identische OSB-Platten herzustellen.With this configuration, it is possible to produce simultaneously identical OSB boards on the OSB plant and the chipboard plant.

Wenn ein Hersteller nicht über eine Anlage zur Herstellung von OSB-Platten und einer Anlage von Spanplatten verfügt, müssen die Anlage für Spanplatten ergänzt und folgende Schritte durchgeführt werden:

  • 3.1 Zerspanen von Rundholz in einem Strandszerspaner zu nassen Strands,
  • 3.2 Transportieren der nassen Strands von dem Strandszerspaner in einen Nassstrandsbunker,
  • 3.3 Transportieren der Strands aus dem Nassstrandsbunker in den Spänetrockner,
  • 3.4 Trocknen des Gemisches aus Strands und Späne im Spänetrockner,
  • 3.5 Transportieren des Gemisches aus Strands und Späne aus dem Spänetrockner in den Spanbunker,
  • 3.6 Transportieren des Gemisches aus Strands und Späne aus dem Spanbunker in die Spansortieranlage,
  • 3.7 Sortieren des Gemisches aus Strands und Späne in der Spansortieranlage mindestens in Deckschichtstrands und Mittelschichtspäne,
  • 3.8 Transportieren der Deckschichtstrands aus der Spansortieranlage in einen Deckschichtstrandsbunker,
  • 3.9. Transportieren der Mittelschichtspäne aus der Spansortieranlage in den Mittelschichtspänebunker,
  • - 3.10 Transportieren der Deckschichtstrands aus dem Deckschichtstrandsbunker in eine Deckschichtstrandsbeleimvorrichtung,
  • 3.11 Transportieren der Mittelschichtspäne in eine Mittelschichtspänebeleimvorrichtung,
  • 3.12 Transportieren der beleimten Deckschichtspäne in die mindestens eine Deckschichtstreuvorrichtung,
  • 3.13 Transportieren der beleimten Mittelschichtspäne in die mindestens eine Mittelschichtstreuvorrichtung,
  • 3.14 Streuen der Deckschichtstrands auf das Spanformband zu mindestens einer unteren Deckschicht,
  • 3.15 Streuen der beleimten Mittelschichtspäne auf die untere Deckschicht zu einer Mittelschicht,
  • 3.16 Streuen der Deckschichtstrands auf die Mittelschicht zu mindestens einer oberen Deckschicht,
  • 3.17 Transportieren des aus der unteren Deckschicht, der Mittelschicht und der oberen Deckschicht bestehenden Strands/Spänekuchens zu der Heißpresse,
  • 3.18 Verpressen des Strands/Spänekuchens in der Heißpresse zu einer OSB-Platte gewünschter Dicke.
If a manufacturer does not have a plant for the production of OSB boards and a particleboard plant, the chipboard plant must be supplemented and the following steps must be carried out:
  • 3.1 cutting logs in a beach chipper to wet beaches,
  • 3.2 transporting the wet strands from the beach chipper into a wet beach bunker,
  • 3.3 transporting the beaches from the wet-beach bunker into the chip dryer,
  • 3.4 drying the mixture of strands and shavings in the chip dryer,
  • 3.5 transporting the mixture of strands and chips from the chip dryer into the chip bunker,
  • 3.6 transporting the mixture of strands and shavings from the chip bunker into the chip sorting plant,
  • 3.7 sorting of the mixture of strands and shavings in the chip sorting plant at least in cover layer strands and middle layer chips,
  • 3.8 transporting the top layer strands from the spun sorting plant into a top layer beach bunker,
  • 3.9. Transporting the middle layer chips from the Spansortieranlage in the Mittelschichtspänebunker,
  • 3.10 transporting the topsheet strands from the topsheet beach bunker into a topcoat sizing apparatus,
  • 3.11 transporting the middle layer chips into a middle layer chip peening device,
  • 3.12 transporting the glued cover layer chips into the at least one cover layer spreading device,
  • 3.13 transporting the glued middle-layer chips into the at least one middle layer scattering device,
  • 3.14 spreading the cover layer strands on the chipboard strip to at least one lower cover layer,
  • 3.15 sprinkling the glued middle-layer chips on the lower cover layer to a middle layer,
  • 3.16 spreading the cover layer strands on the middle layer to at least one upper cover layer,
  • 3.17 transporting the strands / chip cake consisting of the lower cover layer, the middle layer and the upper cover layer to the hot press,
  • 3.18 Pressing the strand / chip cake in the hot press to an OSB plate of desired thickness.

Die Beleimvorrichtung für die OSB-Strands umfasst vorzugsweise eine Strandswaage und eine Strandsbeleimvorrichtung.The OSB beach gluing device preferably includes a beach scale and a beach gluing device.

Die Deckschichtstrands und die Späne für die Mittelschicht können mit einem Melamin-Harnstoff-Phenol-Formaldehyd-Leim (MUPF) oder mit einem polymeren Diphenylmethandiisocyanat-Leim (PMDI) verleimt werden. Auch ist es möglich, die Deckschichtstrands mit polymeren Diphenylmethandiisocyanat (PMDI) und die Mittelschicht mit einem Melamin-Harnstoff-Phenol-Formaldehyd-Leim (MUPF) zu beleimen oder umgekehrt.The topsheet strands and the middle layer chips can be glued with a melamine-urea-phenol-formaldehyde (MUPF) glue or with a polymeric diphenylmethane diisocyanate (PMDI) glue. It is also possible to glaze the top layer strands with polymeric diphenylmethane diisocyanate (PMDI) and the middle layer with a melamine-urea-phenol-formaldehyde (MUPF) glue or vice versa.

Ebenso können die Deckschichtstrands und das Mittelschichtgemisch mit einem Melamin-Harnstoff-Phenol-Formaldehyd-Leim (MUPF) oder einem polymeren Diphenylmethandiisocyanat-Leim (PMDI) verleimt werden. Auch ist es möglich, die Deckschichtstrands mit polymeren Diphenylmethandiisocyanat (PMDI) und das Mittelschichtgemisch mit einem Melamin-Harnstoff-Phenol-Formaldehyd-Leim (MUPF) zu beleimen oder umgekehrt.Likewise, the topsheet strands and the middlecoat blend may be glued with a melamine-urea-phenol-formaldehyde (MUPF) glue or a polymeric diphenylmethane diisocyanate (PMDI) glue. It is also possible to glaze the top layer strands with polymeric diphenylmethane diisocyanate (PMDI) and the middle layer mixture with a melamine-urea-phenol-formaldehyde (MUPF) glue or vice versa.

Eine Deckschichtstreumaschine zur Verwendung in einer herkömmlichen Anlage für die Spanplattenherstellung, die oberhalb eines Spanformbandes angeordnet ist, weist mindestens folgendes auf:

  • einen Spanbunker mit einem darin angeordneten ein erstes und ein zweites Ende aufweisendes Bunkerbodenband, einer Mehrzahl oberhalb des Bunkerbodenbandes angeordneter Scharrenrollen, einer Mehrzahl oberhalb des Bunkerbodenbandes angeordneter Auswerferrollen, einer Mehrzahl unterhalb des Bunkerbodenbandesangeordneter Siebe und einer Mehrzahl in einer Ebene unterhalb von und seitlich zu dem Bunkerbodenband angeordneter um je eine Drehachse antreibbarer Scheibenköpfe, einer oberhalb der Scharrenrolle angeordneten Zuführeinrichtung und einer unterhalb des Bunkerbodenbandes angeordneten Einrichtung zur Erzeugung eines Luftstromes,
wobei das Bunkerbodenband endlos umlaufend und reversibel antreibbar ist, jede Scharrenrolle um jeweils eine Drehachse drehbar angeordnet und zumindest ein Teil der Scharrenrollen reversibel antreibbar ist, die Zuführeinrichtung über den Scharrenrollen angeordnet ist, die um jeweils eine Drehachse drehbar angeordneten Auswerferrollen im Bereich des ersten Endes des Bunkerbodenbandes und die Siebe im Bereich des zweiten Ende des Bunkerbodenbandes angeordnet sind,
und wobei
  1. 1. Im Spanbetrieb alle Scharrenrollen und das Bunkerbodenband im Drehsinn in Arbeitsrichtung umlaufend in Betrieb sind, die Auswerferrollen und die Scheibenköpfe außer Betrieb sind, sodass die von der Spanzuführeinrichtung zugeführten Späne am ersten Ende von dem Bunkerbodenband herabfallen und dann von dem Luftstrom durch die Siebe hindurchgefördert werden und anschließend auf das Spanformband gestreut werden;
  2. 2. Im Strandbetrieb zumindest ein Teil der Scharrenrollen, das Bunkerbodenband, die Auswerferrollen und die Scheibenköpfe im Drehsinn entgegen der Arbeitsrichtung umlaufend in Betrieb sind, sodass die Strands am zweiten Ende von dem Bunkerbodenband herabfallen und über die Scheibenköpfe auf das Spanformband gestreut werden.
A topcoat spreader for use in a conventional particleboard manufacturing facility located above a chipbreaker has at least the following:
  • a chip bunker having bunker bottom webs disposed therein first and second ends, a plurality of scraper rollers disposed above the bunker bottom web, a plurality of ejector rollers disposed above the bunker bottom web, a plurality of screens disposed below the bunker bottom web, and a plurality in a plane below and laterally of the bunker bottom web arranged around a respective axis of rotation driven disk heads, one above the scraper roller arranged feeder and arranged below the bunker bottom belt means for generating an air flow,
wherein the bunker bottom belt endlessly and reversibly driven, each Scharrenrolle rotatably disposed about a rotation axis and at least a portion of the scraper rollers is reversibly driven, the feed is arranged on the scraper rollers, the rotatably arranged around a rotation axis ejector rollers in the region of the first end of the Bunkerbodenbandes and the sieves are arranged in the region of the second end of the bunker bottom band,
and where
  1. 1. In the chip operation all pawl rollers and the bunker bottom belt in rotation in the direction of rotation are in operation, the ejector rollers and the disk heads are out of service, so that the supplied from the chip supply chips at the first end of the bunker bottom band fall down and then conveyed by the air flow through the wires and then sprinkled on the chipboard;
  2. 2. In beach operation, at least a portion of the plow rollers, the bunker bottom band, the ejector rollers and the disk heads in rotation opposite to the direction of rotation are in operation, so that the strands fall from the bunker bottom band at the second end and are scattered over the disk heads on the chip forming strip.

Mit einer solchen Deckschichtstreumaschine ist es möglich, sowohl OSB-Strands als auch Späne zu streuen, um entweder eine OSB-Platte mit einer Mittelschicht aus Späne oder wie herkömmlich auch eine Spanplatte auf der Spanplattenanlage herzustellen.With such a top layer spreading machine, it is possible to spread both OSB strands and chips to either an OSB board with a middle layer of chips or as traditionally a chipboard on the Chipboard plant produce.

Mit Hilfe einer Zeichnung sollen Ausführungsbeispiele der Erfindung nachfolgend näher beschrieben werden. Es zeigen:

Figur 1 -
die schematische Darstellung einer herkömmlichen Anlage zur Herstellung von OSB-Platten (obere Abbildung) und einer herkömmlichen Anlage zur Herstellung von Spanplatten (untere Abbildung);
Figur 1a -
die Darstellung nach Figur 1 zur Verdeutlichung der Verbindung der beiden Anlagen miteinander;
Figur 2 -
die schematische Schnittdarstellung der Deckschichtstreuvorrichtung in der Anlage zur Spanplattenherstellung im Spanbetrieb;
Figur 3 -
die schematische Schnittdarstellung der Deckschichtstreuvorrichtung in der Anlage zur Spanplattenherstellung im Strandbetrieb.
With the help of a drawing, embodiments of the invention will be described in more detail below. Show it:
FIG. 1 -
the schematic representation of a conventional plant for the production of OSB boards (upper figure) and a conventional plant for the production of particle board (bottom figure);
FIG. 1a
the representation after FIG. 1 to clarify the connection of the two systems with each other;
FIG. 2 -
the schematic sectional view of the cover layer spreading device in the plant for chipboard production in chip operation;
FIG. 3 -
the schematic sectional view of the cover layer scattering device in the plant for particle board production in beach operation.

Die obere Abbildung von Figur 1 zeigt die schematische Darstellung einer Anlage zur Herstellung von OSB-Platten. In einem Strandszerspaner 1 wird zunächst Rundholz zu nassen Strands 200 zerspant. Von dem Strandszerpaner 1 werden die Strands 200 in einen Nassstrandsbunker 2 transportiert und von dort aus in einen Strandstrockner 3 transportiert. In dem Strandstrockner 3 werden die nassen Strands 200 getrocknet. Die getrockneten Strands 200 werden von dem Strandstrockner 3 in eine Strandssortieranlage 5 transportiert, wo sie in Deckschichtstrands DS200, Mittelschichtstrands MS200 und Feingut F sortiert werden. Aus der Strandssortieranlage 5 werden die Deckschichtstrands DS200 in einen Deckschichtstrandsbunker 6 und die Mittelschichtstrands MS200 in einen Mittelschichtstrandsbunker 7 transportiert. Sowohl die Deckschichtstrands DS200 als auch die Mittelschichtstrands MS200 werden in je einer Beleimvorrichtung 6', 7' mit einem Leim KL, auf Melamin-Harnstoff-Phenol-Formaldehyd (MUPF)- und/oder Diphenylmethandiisocyanat (PMDI)-Basis beleimt. Deckschichtstrands DS200 und Mittelschichtstrands MS200 können mit demselben oder einem unterschiedlichen Leim beleimt werden. Nach dem Beleimen mit dem Kunstharz-Leim KL werden die Deckschichtstrands DS200 in mindestens eine Deckschichtstrandsstreuvorrichtung 8 und die Mittelschichtstrands MS200 in mindestens eine Mittelschichtstrandsstreuvorrichtung 9 transportiert. Die Deckschichtstrandsstreuvorrichtung 8 und die Mittelschichtstrandsstreuvorrichtung 9 sind oberhalb eines endlos umlaufenden Strandsformbandes 76 angeordnet. Auf das Strandsformband 76 werden zunächst Deckschichtstrands DS200 zu einer unteren Deckschicht DSOSB gestreut. Auf diese Deckschicht DSOSB werden dann die Mittelschichtstrands MS200 zu einer Mittelschicht MSOSB gestreut, auf die wiederum eine obere Deckschicht DSOSB mit Deckschichtstrands DS200 aufgestreut wird. Das Strandsformband 76 transportiert den gestreuten Strandskuchen zu der Heißpresse 170, in der dieser zu einer OSB-Platte 600 gewünschter Dicke verpresst wird. Vor der Heißpresse 170 kann über eine Auftragsvorrichtung 159 ein Trennmittel auf den Strandskuchen 900 aufgebracht werden, was insbesondere dann vorteilhaft ist, wenn ein PMDI-Leim Verwendung findet. Denkbar ist es auch, das Trennmittel auf das (hier nicht gezeigte) Pressblech der Heißpresse 170 aufzubringen.The upper picture of FIG. 1 shows the schematic representation of a plant for the production of OSB boards. In a beach chipper 1 first log wood is cut to wet strands 200. The strands 200 are transported by the beach scraper 1 into a wet beach bunker 2 and transported from there into a beach dryer 3. In the beach dryer 3, the wet strands 200 are dried. The dried strands 200 are transported by the beach dryer 3 into a beach sorter 5 where they are sorted into top layer strands DS200, middle strands MS200 and fines F. The cover layer strands DS200 are transported from the beach sorting installation 5 into a cover layer bunker 6 and the middle layer strands MS200 are transported into a middle layer bunker 7. Both the cover layer strands DS200 and the middle layer strands MS200 are each in a gluing device 6 ', 7' with a glue KL, on melamine-urea-phenol-formaldehyde (MUPF) - and / or diphenylmethane diisocyanate (PMDI) -based glued. Top coat strands DS200 and middle coat strands MS200 can be glued with the same or a different glue. After the glueing with the synthetic resin size KL, the cover layer strands DS200 are transported into at least one cover layer strander 8 and the middle layer strands MS200 are transported into at least one middle layer strandshift device 9. The cover layer spreader 8 and the middle layer beach spreader 9 are arranged above an endlessly circulating strand forming belt 76. The strandshape 76 is first spread with overlay strands DS200 to form a lower overlay DSOSB. On this cover layer DSOSB then the middle layer strands MS200 are scattered to a middle layer MSOSB, on which in turn an upper cover layer DSOSB with cover layer strands DS200 is scattered. The strip forming belt 76 transports the scattered beach cake to the hot press 170, where it is pressed into an OSB plate 600 of desired thickness. Before the hot press 170, a release agent can be applied to the beach cake 900 via an application device 159, which is particularly advantageous when a PMDI glue is used. It is also conceivable to apply the release agent to the (not shown here) press plate of the hot press 170.

Die untere Abbildung von Figur 1 zeigt die schematische Darstellung einer herkömmlichen Anlage zur Herstellung von Spanplatten.The bottom picture of FIG. 1 shows the schematic representation of a conventional plant for the production of chipboard.

In einem Spanzerspaner 10 werden zunächst Holzhackschnitzel zu nassen Spänen 100 zerspant. Von hier aus werden die nassen Späne 100 dann in einen Nassspanbunker 20 transportiert, von dem aus sie anschließend in einen Spantrockner 30 transportiert werden, um sie zu trocknen. Die getrockneten Späne 100 werden aus dem Spantrockner 30 in den Spanbunker 40 überführt, von wo aus sie in eine Spansortieranlage 50 überführt werden. In der Spansortieranlage 50 werden die Späne 100 in Grobspäne GS, Deckschichtspäne DS100, Mittelschichtspäne MS100 und Staub St sortiert. Die Deckschichtspäne DS100 werden aus der Spansortieranlage 50 in einen Deckschichtspänebunker 60 und die Mittelschichtspäne MS100 in einen Mittelschichtspänebunker 70 transportiert. Von dort aus gelangen sie in jeweils eine Beleimvorrichtung 60', 70', in der sie mit einem MUPF-Leim oder PMDI-Leim (jeder für sich auch Kunstharzleim KL genannt) beleimt werden. Die Mittelschichtspäne MS100 und die Deckschichtspäne DS100 können aber auch wie bei der Spanplattenfertigung an sich üblich mit einem Harnstoff-Formaldehyd-Leim (UF) beleimt werden. Die Deckschichtspäne DS100 werden aus der Beleimvorrichtung 60' in die Deckschichtstreuvorrichtungen 80 und die Mittelschichtspäne MS100 aus der Beleimvorrichtung 70' in die Mittelschichtstreuvorrichtungen 90 transportiert. Die Deckschichtstreuvorrichtungen 80 und die Mittelschichtstreuvorrichtungen 90 sind über dem Spanformband 75 angeordnet, auf das zunächst eine untere Deckschicht DS aus Deckschichtspänen DS100 gestreut wird. Auf die untere Deckschicht DS wird eine Mittelschicht MS aus Mittelschichtspänen MS100 gestreut, auf die wiederum eine obere Deckschicht DS aus Deckschichtspänen DS100 gestreut wird. Der aus unterer Deckschicht DS, Mittelschicht MS und oberer Deckschicht DS bestehende Spänekuchen wird von dem Formband 75 zur Heißpresse 150 transportiert, in der er zu einer Spanlatte 500 gewünschter Dicke gepresst wird. Auch vor der Heißpresse 150 kann auf den Spänekuchen über eine Auftragsvorrichtung 149 ein Trennmittel aufgebracht werden. Denkbar ist es auch, das Trennmittel auf das (hier nicht gezeigte) Pressblech der Heißpresse 150 aufzubringen.In a chip chipper 10 wood chippings are first cut to wet chips 100. From here, the wet chips 100 are then transported into a wet chip bunker 20, from which they are subsequently transported into a chip dryer 30 in order to dry them. The dried chips 100 are transferred from the chip dryer 30 into the chip hopper 40, from where they are transferred to a Spansortieranlage 50. In the chip sorting plant 50, the chips 100 are sorted into coarse chips GS, surface layer chips DS100, middle layer chips MS100 and dust St. The cover shavings DS100 are transported from the chip sorting plant 50 to a top layer chip bunker 60 and the middle layer chips MS100 are transported to a middle layer chip bunker 70. From there they arrive in each case a gluing device 60 ', 70', in which they are glued with a MUPF glue or PMDI glue (each also called Kunstharzleim KL). However, the middle layer chips MS100 and the cover layer chips DS100 can also be glued to a urea-formaldehyde (UF) glue, as is customary in chipboard production. The cover shavings DS100 are transported from the gluing device 60 'into the cover layer spreading devices 80 and the middle layer chips MS100 are transported from the gluing device 70' into the middle layer scattering devices 90. The cover layer scattering devices 80 and the middle layer scattering devices 90 are arranged above the chip forming strip 75, on which first a lower cover layer DS of covering layer chips DS100 is scattered. On the lower cover layer DS, a middle layer MS of middle-layer chips MS100 is scattered, onto which in turn an upper cover layer DS of covering layer chips DS100 is scattered. The chip cake consisting of lower cover layer DS, middle layer MS and upper cover layer DS is transported by the forming belt 75 to the hot press 150, in which it is pressed into a chip bar 500 of the desired thickness. Even before the hot press 150 can be applied to the chip cake via an applicator 149 a release agent. It is also conceivable to apply the release agent to the (not shown here) press plate of the hot press 150.

Um auf der Anlage zur Herstellung von Spanplatten ebenfalls OSB-Platten herstellen zu können, werden, wie Figur 1 a zeigt, die in der Beleimvorrichtung 6' mit dem zuvor beschriebenen Kunstharzleim KL beleimten Deckschichtstrands DS200 in die Deckschichtstreuvorrichtungen 80 der Spanplattenanlage überführt. Aus dem Mittelschichtspänebunker 70 können Mittelschichtspäne 100 in den Mittelschichtstrandbunker 7 geführt werden. Die Menge der Mittelschichtspäne 100 entspricht im Wesentlichen der Menge der Deckschichtstrands DS200. Jetzt werden auf das Spanformband 75 eine untere Deckschicht DSOSB aus Deckschichtstrands DS200, auf diese Deckschciht DS eine Mittelschicht MS aus Mittelschichtspäne MS100 und auf diese wiederum eine obere Deckschicht DS aus Deckschichtstrands DS200 gestreut. Von dem Spanformband 75 wird dieser Strands/Späne-Kuchen 850 dann in die Heißpresse 150 transportiert, wo er zu einer OSB-Platte gewünschter Dicke verpresst wird.In order to be able to produce OSB boards on the plant for the production of chipboard, as well FIG. 1 a shows that transferred in the gluing device 6 'with the previously described Kunstharzleim KL glued Deckschichtstrands DS200 in the cover layer scattering devices 80 of the particle board system. From the middle layer chip bunker 70 middle layer chips 100 can be guided into the middle layer beach bunker 7. The amount of middle-layer chips 100 essentially corresponds to the amount of cover layer strand DS200. Now on the chip forming belt 75, a lower cover layer DSOSB from cover layer DS200, onto which cover layer DS a middle layer MS consisting of middle layer chips MS100 and in turn an upper cover layer DS from cover layer strands DS200 were scattered. From the chip forming belt 75, this beach / chip cake 850 is then transported into the hot press 150, where it is pressed into an OSB board of desired thickness.

In der OSB-Anlage kann die Mittelschicht MS gleichzeitig ebenfalls aus Mittelschichtspäne MS100 gestreut werden und der Strands/Späne-Kuchen 800 dort von dem Strandsformband 76 in die Heißpresse 170 transportiert, wo er ebenfalls zu einer OSB-Platte 600 gewünschter Dicke verpresst wird. Bevorzugt werden die in den Mittelschichtstrandsbunker 7 geförderten Mittelschichtspäne MS100 mit den Mittelschichtstrands MS200 zu einem Mittelschichtgemisch MS100 + MS200 gemischt, wobei unter den Begriff "Mischen" nicht zwingend ein aktiver Verfahrensschritt gemeint ist, sondern das Zusammenführen von Mittelschichtspäne MS100 und Mittelschichtstrands MS200 durchaus genügen kann. Dieses Mittelschichtgemisch MS100 + MS200 wird dann in die Mittelschichtstrandsstreuvorrichtung 9 transportiert. In der OSB-Anlage wird dann auf die untere Deckschicht DSOSB mindestens eine Mittelschicht MS + MSOSB gestreut.In the OSB plant, the middle layer MS can also be sprinkled from middle layer chips MS100 at the same time and the strand / chip cake 800 is transported there from the strip forming belt 76 into the hot press 170, where it is also pressed into an OSB plate 600 of desired thickness. The middle layer strands bunker 7 promoted middle layer chips MS100 are preferably mixed with the middle layer strands MS200 to form a middle layer mixture MS100 + MS200, wherein the term "mixing" does not necessarily mean an active method step, but the combination of middle layer chips MS100 and middle layer strip MS200 can certainly be sufficient. This middle layer mixture MS100 + MS200 is then transported into the middle layer beach scattering device 9. In the OSB plant, at least one middle layer MS + MSOSB is then scattered on the lower cover layer DSOSB.

In beiden Anlagen können vor der Heißpresse 150, 170 über Auftragsvorrichtungen 149, 159 dann auch Trennmittel auf den Strands/Späne-Kuchen 800, 850 oder die (nicht gezeigten) Stahlbänder der Heißpressen 150, 170 aufgebracht werden, um ein Verkleben der Deckschichtstrands DS200 an den (nicht gezeigten) Pressblechen der Heißpressen 150, 170 zu verhindern.In both systems, before the hot press 150, 170 via applicators 149, 159 then also release agent on the strands / chips cake 800, 850 or (not shown) steel strips of the hot presses 150, 170 are applied to gluing the cover layer strands DS200 on prevent the press plates (not shown) of the hot presses 150, 170.

Wenn ein Hersteller nicht sowohl über eine OSB-Plattenanlage und eine Spanplattenanlage verfügt, sondern nur über eine Spanplattenanlage, mit der er auch OSB-Platten herstellen möchte, dann muss die Spanplattenanlage entsprechend ergänzt werden, wie dies im unteren Bild der Figur 1a durch die schraffierten Kästen angegeben ist. In einem Strandszerspaner 110 wird zunächst Rundholz zu nassen Strands 300 zerspant. Von dem Strandszerspaner 110 werden die Strands 300 dann in einen Nasstrandsbunker 120 transportiert und von dort aus in den Spantrockner 30 überführt, in dem nasse Strands 300 mit den nassen Spänen 100 aus dem Nassspanbunker 20 vermischt und dann das Gemisch aus nassen Strands 300 und nassen Spänen 100 getrocknet wird. Das getrocknete Gemisch wird dann in den Spanbunker 40 transportiert. Der maximale Füllstand des Spanbunkers 40 sollte nicht mehr als 5% seines Volumens betragen. Die Späne 100 und Strands 300 müssen laufend aus dem Spanbunker 40 ausgetragen werden. Hierzu sind in dem Spanbunker 40 (nicht dargestellte) Schnecken vorgesehen, die so schnell umlaufen müssen, dass sich Späne 100 / Strands 300 in dem Spanbunker 40 nicht sammeln können. Aus dem Spanbunker 40 wird das Gemisch aus getrockneten Späne 100 und getrockneten Strands 300 dann in die Spansortieranlage 50 transportiert. In der Spansortieranlage 50 wird das Gemisch mindestens in Deckschichtspäne DS300 und Mittelschichtspäne MS100 sortiert. Die Deckschichtspäne DS300 werden dann in den Deckschichtstrandsbunker 160 transportiert und gelangen von dort aus in die Beleimvorrichtung 160'. Die beleimten Deckschichtstrands DS300 werden anschließend in die Deckschichtstreuvorrichtungen 80 überführt. Die in der Spansortieranlage 50 aussortierten Mittelschichtspäne MS100 nehmen ihren Weg wie zuvor beschrieben und der aus Deckschichtstrands DS300 und der Mittelschichtspäne MS100 gestreute Strands/Spänekuchen 850 wird wie zuvor beschrieben von der Heißpresse 150 zu einer OSB-Platte 600 gewünschter Dicke verpresst.If a manufacturer does not have both an OSB board plant and a chipboard plant, but only a chipboard plant with which he also wants to produce OSB boards, then the chipboard plant must be supplemented accordingly, as shown in the bottom picture FIG. 1a indicated by the hatched boxes. In a Strandszerspaner 110 is first Round wood to wet strands 300 machined. The beach sweeper 110 then transports the strands 300 into a wet end bunker 120 and from there into the chip dryer 30, mixes wet strands 300 with the wet chips 100 from the wet chip bunker 20, and then mixes wet strands 300 and wet chips 100 is dried. The dried mixture is then transported to chip hopper 40. The maximum level of chip hopper 40 should not exceed 5% of its volume. The chips 100 and strands 300 must be continuously discharged from the chip bunker 40. For this purpose, snails (not shown) are provided in the chip bunker 40, which must rotate around so fast that chips 100 / strands 300 in the chip bunker 40 can not collect. From the chip hopper 40, the mixture of dried chips 100 and dried strands 300 is then transported to the chip sorting plant 50. In the Spansortieranlage 50, the mixture is sorted at least in top layer chips DS300 and middle-layer chips MS100. The cover layer chips DS300 are then transported into the cover layer bunker 160 and from there into the glueing device 160 '. The glued top layer strands DS300 are subsequently transferred into the cover layer scattering devices 80. The MS100 middle layer chips sorted out in the chip sorting plant 50 proceed as described above, and the strand / chip cake 850 scattered from cover layer DS300 and middle layer chips MS100 is pressed by the hot press 150 to an OSB plate 600 of desired thickness as described above.

Die Beleimvorrichtungen 6', 160' können mit einer Strandswaage und einem Trommelmischer versehen sein. Auch jede andere spezielle Beleimvorrichtung für die Strandsbeleimung ist aber denkbar.The Beleimvorrichtungen 6 ', 160' may be provided with a beach scale and a drum mixer. Any other special Beleimvorrichtung for the beach gluing is conceivable.

Damit über die Deckschichtstreuvorrichtungen 80 der Spanplattenanlage sowohl Deckschichtspäne DS100 als auch Deckschichtstrands DS200, DS300 gestreut werden können, muss diese so umgebaut werden, wie dies in den Figuren 2 und 3 schematisch dargestellt ist.In order to be able to spread over the cover layer scattering devices 80 of the chipboard plant both cover layer chips DS100 and cover layer strands DS200, DS300, this must be rebuilt as shown in the figures 2 and 3 is shown schematically.

Die Deckschichtstreuvorrichtung 80 ist oberhalb des in Arbeitsrichtung A (das ist die Transportrichtung des Strands/Späne-Kuchens 850) endlos umlaufenden Spanformbandes 75 angeordnet. Sie besteht im Wesentlichen aus einem Spanbunker 88 mit einem darin angeordneten Bunkerbodenband 81, das ein erstes Ende 811 und ein zweites Ende 812 aufweist. Das Bunkerbodenband 81 ist in zwei gegenläufige Richtungen (Arbeitsrichtung A und entgegengesetzt dazu) reversibel antreibbar. Oberhalb des Bunkerbodenbandes 81 sind jeweils um eine Drehachse D1 antreibbare Auswerferrollen 83 und jeweils um eine Drehachse D reversibel antreibbare Scharrenrollen 82 angeordnet. Im Bereich des ersten Endes 811 sind unterhalb des Bunkerbodenbandes 81 Siebe 84 angeordnet.The cover layer scattering device 80 is disposed above the chip-forming belt 75, which revolves endlessly in the working direction A (that is, the transport direction of the beach / chip cake 850). It essentially consists of a chip bunker 88 with a bunker bottom belt 81 arranged therein, which has a first end 811 and a second end 812. The bunker bottom band 81 is reversibly drivable in two opposite directions (working direction A and opposite thereto). Above the bunker bottom band 81, ejector rollers 83 which can each be driven about an axis of rotation D 1 and scraper rollers 82 which can be driven reversibly in each case about an axis of rotation D are arranged. In the region of the first end 811, sieves 84 are arranged underneath the bunker bottom belt 81.

Figur 2 zeigt die Deckschichtstreuvorrichtung 80 zum Streuen der unteren Deckschicht DS im Spanbetrieb. Die Deckschichtspäne DS100 werden über die Zuführeinrichtung 86 in den Spanbunker 88 eingegeben. Dort fallen sie auf die Scharrenrollen 82, die gleichsinnig zur Arbeitsrichtung A um die Drehachse D rotieren. Über die sich drehenden Scharrenrollen 82 gelangen die Deckschichtspäne DS100 auf das Bunkerbodenband 81, das ebenfalls in Arbeitsrichtung A endlos umläuft. Am ersten Ende 811 des Bunkerbodenbandes 81 fallen die Deckschichtspäne DS100 von diesem herunter und treffen auf das erste unterhalb des Bunkerbodenbandes 81 angeordnete Sieb 84. Über den von dem Gebläse 87 erzeugten Luftstrom werden die Deckschichtspäne DS100 durch die Siebe 84 hindurchgeblasen und dann zu einer unteren Deckschicht DS auf dem Formband 75 aufgestreut. Auf die gestreute Mittelschicht MS wird anschließend eine obere Deckschicht DS aufgestreut. Damit die obere Deckschicht DS aufgestreut werden kann, muss die Deckschichtstreuvorrichtung spiegelbildlich zu der Deckschichtstreuvorrichtung 80 ausgebildet sein, was bedeutet, dass sich alles in entgegengesetzter Richtung dreht. FIG. 2 shows the cover layer scattering device 80 for spreading the lower cover layer DS in chip operation. The cover shavings DS100 are input to the chip hopper 88 via the feeder 86. There they fall on the scraper rollers 82, which rotate in the same direction to the working direction A about the axis of rotation D. About the rotating scraper rollers 82 pass the cover chips DS100 on the bunker floor belt 81, which also rotates endlessly in the direction of A. At the first end 811 of the bunker bottom band 81, the cover shavings DS100 fall down therefrom and strike the first sieve 84 arranged beneath the bunker bottom belt 81. The air stream generated by the fan 87 blows the cover shavings DS100 through the sieves 84 and then to a lower cover layer DS sprinkled on the forming belt 75. An upper cover layer DS is then sprinkled onto the scattered middle layer MS. In order for the upper cover layer DS to be scattered, the cover layer scatterer must be mirror-inverted to the cover layer diffuser 80, which means that everything is rotating in the opposite direction.

Figur 3 zeigt den Strandbetrieb der Deckschichtstreuvorrichtung 80 zum Streuen der unteren Deckschicht DSOSB. Auch hier gilt, dass die Deckschichtstreuvorrichtung 80 spiegelbildlich ausgebildet sein muss, um die obere Deckschicht DSOSB zu streuen, also sich alles in entgegengesetzter Richtung drehen muss. Die Deckschichtstrands DS200/DS300 gelangen über die Zuführeinrichtung 86 in den Spanbunker 88. Ein Teil der Scharrenrollen 82 ist - da er nicht benötigt wird - ausgebaut oder stillgesetzt. Es können Scharrenrollen 82 unterschiedlicher Größe eingesetzt werden, es können aber auch wie in Figur 2 gezeigt Scharrenrollen 82 identischer Größe Verwendung finden. Die Darstellung hier ist rein schematisch. Das Spanformband 75 läuft weiterhin in Arbeitsrichtung A um. Jetzt wird das Bunkerbodenband 81 entgegen die Arbeitsrichtung A umlaufend angetrieben. Die Deckschichtstrands DS200/DS300 fallen auf die Scharrenrollen 82, die gegensinnig zur Arbeitsrichtung A rotieren und werden von diesen in Richtung des zweiten Endes 812 des Bunkerbodenbandes 81 zu den in derselben Richtung wie die Scharrenrollen 80 angetriebenen Auswerferrollen 83 transportiert. An den Scharrenrollen 82 vorbei fallende Späne werden vom Bunkerbodenband 81 ebenfalls in Richtung der Auswerferrollen 83, transportiert und dann auf die ebenfalls gegensinnig zur Arbeitsrichtung A angetriebenen Scheibenköpfe 85 geworfen, von wo aus sie dann auf das Spanformband 75 zur unteren bzw. oberen Deckschicht DSOSB gestreut werden. FIG. 3 shows the beach operation of the cover layer spreading device 80 for spreading the lower cover layer DSOSB. Again, that the cover layer scattering device 80 must be formed in mirror image to scatter the upper cover layer DSOSB, so everything must turn in the opposite direction. The cover layer strands DS200 / DS300 pass via the feed device 86 into the chip bunker 88. A portion of the scraper rollers 82 is - since it is not needed - removed or shut down. It can scraper roles 82 different sizes are used, but it can also as in FIG. 2 shown pawl rollers 82 identical size find use. The illustration here is purely schematic. The chip forming belt 75 continues to run in the direction of A. Now the bunker bottom belt 81 is driven in rotation against the working direction A. The cover layer strands DS200 / DS300 fall on the scraper rollers 82, which rotate in opposite directions to the working direction A, and are transported by these in the direction of the second end 812 of the bunker bottom belt 81 to the ejector rollers 83 driven in the same direction as the scraper rollers 80. Chips falling past the scraper rollers 82 are also transported by the bunker bottom belt 81 in the direction of the ejector rollers 83 and then thrown onto the disk heads 85 which are also driven in opposite directions to the working direction A, from where they are then sprinkled onto the chip forming belt 75 for the lower or upper cover layer DSOSB become.

Die Drehrichtungen sind in den Figuren jeweils durch Pfeile an den entsprechenden Bauteilen angegeben. Bezugszeichenliste 1 Strandszerspaner 85 Scheibenkopf 2 Nassstrandsbunker 86 Zuführvorrichtung 3 Strandstrockner 87 Gebläse/Einrichtung 5 Strandssortieranlage 90 Mittelschichtstreuvorrichtung 6 Deckschichtstrandsbunker 6' Beleimvorrichtung 100 Späne 7 Mittelschichtstrandsbunker 149 Auftragsvorrichtung 7' Beleimvorrichtung 150 Heißpresse 8 Deckschichtstrandsstreuvorrichtung 159 Auftragsvorrichtung 160 Deckschichtstrandsbunker 9 Mittelschichtstrandsstreuvorrichtung 160' Beleimvorrichtung 170 Heißpresse 10 Spanzerspaner 200 Strands 20 Nassspanbunker 300 Strands 30 Spantrockner 500 Spanplatte 40 Spanbunker 600 OSB-Platte 50 Spansortieranlage 800 Strands/Spänekuchen 60 Deckschichtspänebunker 811 erstes Ende 60' Beleimvorrichtung 812 zweites Ende 70 Mittelschichtspänebunker 850 Strands/Spänekuchen 70' Beleimvorrichtung 900 Strandskuchen 75 Spanformband 950 Spänekuchen 76 Strandsformband A Arbeitsrichtung 80 Deckschichtstreuvorrichtung D Drehachse 81 Bunkerbodenband D1 Drehachse 82 Scharrenrolle D2 Drehachse 83 Auswerferrolle DS100 Deckschichtspäne 84 Sieb DS200 Deckschichtstrand DS300 Deckschichtstrand DSOSB Deckschicht F Feingut GS Grobspäne KL Kunstharzleim MS Mittelschicht MSOSB Mittelschicht MS100 Mittelschichtspäne MS200 Mittelschichtstrands MS100 + MS200 Mittelschichtgemisch St Staub The directions of rotation are indicated in the figures by arrows on the corresponding components. <B><u> REFERENCE LIST </ u></b> 1 Strandszerspaner 85 Scheibenkopf 2 Wet beach bunkers 86 feeder 3 beach dryers 87 Blower / device 5 beach sorting 90 Middle class scattering device 6 Topcoat beach bunkers 6 ' gluing device 100 shavings 7 Middle class beach bunkers 149 applicator 7 ' gluing device 150 hot press 8th Topcoat beach spreader 159 applicator 160 Topcoat beach bunkers 9 Middle class beach spreader 160 ' gluing device 170 hot press 10 Spanzerspaner 200 Strands 20 Wet chip bunker 300 Strands 30 span dryer 500 chipboard 40 span bunker 600 OSB 50 chip sorting 800 Strands / chip cake 60 Top layer chips Bunker 811 first end 60 ' gluing device 812 second end 70 Middle class chips Bunker 850 Strands / chip cake 70 ' gluing device 900 beach cake 75 Span forming belt 950 chip cake 76 Beach forming belt A working direction 80 Top layer scattering device D axis of rotation 81 Bunker floor belt D 1 axis of rotation 82 pawing role D 2 axis of rotation 83 Auswerferrolle DS100 top layer chips 84 scree DS200 topcoat beach DS300 topcoat beach DSOSB topcoat F fines GS coarse chips KL Synthetic resin glue MS middle class MSOSB middle class MS100 Middle class chips MS200 Middle class beach MS100 + MS200 Middle class mixture St dust

Claims (10)

  1. Process for producing an OSB panel on a plant for producing a particle board by incorporating a plant for producing an OSB panel,
    where, in normal operation, the plant for particle board production is operated as follows:
    - cutting wood chippings in a chip cutter (10) to form wet chips (100),
    - transporting the wet chips (100) from the chip cutter (10) into a wet chip bunker (20),
    - transporting the chips .(100) from the wet chip bunker (20) into a chip dryer (30),
    - drying the chips (100) in the chip dryer (30),
    - transporting the chips (100) out of the chip dryer (30) into a chip bunker (40),
    - transporting the chips (100) out of the chip bunker (40) into a chip sorting system (50),
    - sorting the chips (100) in the chip sorting system (50) into coarse chips (GS), covering layer chips (DS100), middle layer chips (MS100) and dust (St),
    - transporting the covering layer chips (DS100) out of the chip sorting system (50) into a covering layer chip bunker (60),
    - transporting the middle layer chips (MS100) out of the chip sorting system (50) into a middle layer chip bunker (70),
    - gluing the covering layer chips (DS100) and the middle layer chips (MS100) with a synthetic resin glue (KL),
    - transporting the glued covering layer chips (DS100) into at least one covering layer scattering apparatus (80),
    - transporting the glued middle layer chips (MS100) into at least one middle layer scattering apparatus (90),
    - scattering the covering layer chips (DS100) onto a chip forming belt (75) to form at least one lower covering layer (DS),
    - scattering the middle layer chips (MS100) onto the lower covering layer (DS) to form at least one middle layer (MS),
    - scattering the covering layer chips (DS100) onto the middle layer (MS) to form at least one upper covering layer (DS),
    - transporting the chip cake (950) consisting of lower covering layer (DS), middle layer (MS) and upper covering layer (DS) to a hot press (150),
    - pressing the chip cake (950) in the hot press (150) to form a particle board (500) of desired thickness;
    and where, in normal operation, the plant for the OSB panel production is operated as follows:
    - cutting roundwood in a strand cutter (1) to form wet strands (200),
    - transporting the wet strands (200) from the strand cutter (1) into a wet strand bunker (2),
    - transporting the strands (200) from the wet strand bunker (2) into a strand dryer (3),
    - drying the strands (200) in the strand dryer (3),
    - transporting the strands (200) from the strand dryer (3) into a strand sorting system (5),
    - sorting the strands (200) in the strand sorting system (5) into covering layer strands (DS200), middle layer strands (MS200) and fines (F),
    - transporting the covering layer strands (DS200) from the strand sorting system (5) into a covering layer strand bunker (6),
    - transporting the middle layer strands (MS200) from the strand sorting system (5) into a middle layer strand bunker (7),
    - gluing the covering layer strands (DS200) and the middle layer strands (MS200) each in a gluing apparatus (6', 7') with a synthetic resin glue,
    - transporting the glued covering layer strands (DS200) into at least one covering layer strand scattering apparatus (8),
    - transporting the glued middle layer strands (MS200) into at least one middle layer strand scattering device (9),
    - scattering the covering layer strands (DS200) onto a strand forming belt (76) to form at least one lower covering layer (DSOSB),
    - scattering the middle layer strands (MS200) onto the lower covering layer (DSOSB) to form at least one middle layer (MSOSB),
    - scattering the covering layer strands (DS200) onto the middle layer (MSOSB) to form at least one upper covering layer (DSOSB),
    - transporting the strand cake (900) consisting of lower covering layer (DSOSB), middle layer (MSOSB) and upper covering layer (DSOSB) to a hot press (170),
    - pressing the strand cake (900) in the hot press (170) to form an OSB panel of desired thickness,
    characterized in that to produce an OSB panel on the plant for producing particle boards, the following steps are carried out:
    a) transporting at least part of the covering layer strands (DS200) glued in the gluing apparatus (6') into the at least one covering layer scattering apparatus (80),
    b) scattering the covering layer strands (DS200) onto the chip forming belt (75) to form at least one lower covering layer (DSOSB),
    c) scattering the glued middle layer chips (MS100) onto the lower covering layer (DSOSB) to form a middle layer (MS),
    d) scattering the covering layer strands (DS200) onto the middle layer (MS) to form at least one upper covering layer (DSOSB),
    e) transporting the strand/chip cake (850) consisting of the lower covering layer (DSOSB), the middle layer (MS) and the upper covering layer (DSOSB) to the hot press (150),
    f) pressing the strand/chip cake (850) in the hot press (150) to form an OSB panel (600) of desired thickness.
  2. Process according to Claim 1, characterized by the following further steps:
    g) transporting a part of the middle layer chips (MS100), corresponding to the part of the covering layer strands (DS200) removed from the gluing apparatus (6'), from the middle layer chip bunker (70) into the middle layer strand bunker (7),
    h) transporting the middle layer mixture (MS100 + MS200) consisting of middle layer chips (MS100) and middle layer strands (MS200) from the middle layer strand bunker (7) into the middle layer strand scattering apparatus (9),
    i) scattering the covering layer strands (DS200) from the covering layer strand scattering apparatus (8) onto the strand forming belt (76) to form at least one lower covering layer (DSOSB),
    j) scattering the middle layer mixture (MS100 + MS200) from the middle layer strand scattering apparatus (9) onto the lower covering layer (DSOSB) to form at least one middle layer (MS + MSOSB),
    k) scattering the covering layer strands (DS200) from the covering layer strand scattering apparatus (8) onto the middle layer (MS + MSOSB) to form at least one upper covering layer (DSOSB),
    1) transporting the strand/chip cake (800) consisting of the lower covering layer (DSOSB), the middle layer (MS + MSOSB) and the upper covering layer (DSOSB) to the hot press (170),
    m) pressing the strand/chip cake (800) in the hot press (170) to form an OSB panel (600) of desired thickness.
  3. Process for producing an OSB panel on a plant for producing a particle board, where, in normal operation, the plant is operated as follows:
    - cutting wood chippings in a chip cutter (10) to form wet chips (100),
    - transporting the wet chips (100) from the chip cutter (10) into a wet chip bunker (20),
    - transporting the chips (100) from the wet chip bunker (20) into a chip dryer (30),
    - drying the chips (100) in the chip dryer (30),
    - transporting the chips (100) out of the chip dryer (30) into a chip bunker (40),
    - transporting the chips (100) out of the chip bunker (40) into a chip sorting system (50),
    - sorting the chips (100) in the chip sorting system (50) into coarse chips (GS), covering layer chips (DS100), middle layer chips (MS100) and dust (St),
    - transporting the covering layer chips (DS100) out of the chip sorting system (50) into a covering layer chip bunker (60),
    - transporting the middle layer chips (MS100) out of the chip sorting system (50) into a middle layer chip bunker (70),
    - gluing the covering layer chips (DS100) and the middle layer chips (MS100) with a synthetic resin glue (KL),
    - transporting the glued covering layer chips (DS100) into at least one covering layer scattering apparatus (80),
    - transporting the glued middle layer chips (MS100) into at least one middle layer scattering apparatus (90),
    - scattering the covering layer chips (DS100) onto a chip forming belt (75) to form at least one lower covering layer (DS),
    - scattering the middle layer chips (MS100) onto the lower covering layer (DS) to form at least one middle layer (MS),
    - scattering the covering layer chips (DS100) onto the middle layer (MS) to form at least one upper covering layer (DS),
    - transporting the chip cake (950) consisting of lower covering layer (DS), middle layer (MS) and upper covering layer (DS) to a hot press (150),
    - pressing the chip cake (950) in the hot press (150) to form a particle board (500) of desired thickness;
    characterized by the following steps:
    3.1 cutting roundwood in a strand cutter (110) to form wet strands (300),
    3.2 transporting the wet strands (300) from the strand cutter (110) into a wet strand bunker (120),
    3.3 transporting the strands (300) from the wet strand bunker (120) into the chip dryer (30), where they are mixed with the chips (100) from the wet chip bunker (20),
    3.4 drying the mixture of strands (300) and chips (100) in the chip dryer (30),
    3.5 transporting the mixture of strands (300) and chips (100) from the chip dryer (30) into the chip bunker (40),
    3.6 transporting the mixture of strands (300) and chips (100) from the chip bunker (40) into the chip sorting system (50),
    3.7 sorting the mixture of strands (300) and chips (100) in the chip sorting system (50) into at least covering layer strands (DS300) and middle layer chips (MS100),
    3.8 transporting the covering layer strands (DS300) out of the chip sorting system (50) into a covering layer strand bunker (160),
    3.9 transporting the middle layer chips (MS100) out of the chip sorting system (50) into the middle layer chip bunker (70),
    3.10 transporting the covering layer strands (DS300) from the covering layer strand bunker (160) into a covering layer strand gluing apparatus (160'),
    3.11 transporting the middle layer chips (MS100) into a middle layer chip gluing apparatus (70'),
    3.12 transporting the glued covering layer chips (DS300) into the at least one covering layer scattering apparatus (80),
    3.13 transporting the glued middle layer chips (MS100) into the at least one middle layer scattering apparatus (90),
    3.14 scattering the covering layer strands (DS300) onto the chip forming belt (75) to form at least one lower covering layer (DSOSB),
    3.15 scattering the glued middle layer chips (MS100) onto the lower covering layer (DSOSB) to form at least one middle layer (MS),
    3.16 scattering the covering layer strands (DS300) onto the middle layer (MS) to form at least one upper covering layer (DSOSB),
    3.17 transporting the strand/chip cake (850) consisting of the lower covering layer (DSOSB), the middle layer (MS) and the upper covering layer (DSOSB) to the hot press (150),
    3.18 pressing the strand/chip cake (850) in the hot press (150) to form an OSB panel (600) of desired thickness.
  4. Process according to Claim 1 or 3, characterized in that the covering layer strands (DS200) and the chips (100) for the middle layer (MSOSB) are glued with a melamine urea phenol formaldehyde glue (MUPF).
  5. Process according to Claim 1 or 3, characterized in that polymeric diphenyl methane diisocyanate (PMDI) is used to glue the covering layer strands (DS200), and melamine urea phenol formaldehyde glue (MUPF) is used to glue the chips (100) for the middle layer (MSOSB), or vice versa.
  6. Process according to Claim 1 or 3, characterized in that polymeric diphenyl methane diisocyanate (PMDI) is also used to glue the covering layer strands (DS200) and the chips (100) for the middle layer (MSOSB).
  7. Process according to Claim 2, characterized in that the covering layer strands (DS200) and the middle layer mixture (MS100 + MS200) are glued with a melamine urea phenol formaldehyde glue (MUPF).
  8. Process according to Claim 2, characterized in that polymeric diphenyl methane diisocyanate (PMDI) is used to glue the covering layer strands (DS200), and melamine urea phenol formaldehyde glue (MUPF) is used to glue the middle layer mixture (MS100 + MS200), or vice versa.
  9. Process according to Claim 2, characterized in that polymeric diphenyl methane diisocyanate (PMDI) is used to glue the covering layer strands (DS200) and the middle layer mixture (MS100 + MS200).
  10. Covering layer scattering apparatus for use in the process according to one of Claims 1 to 7, to be arranged above a chip forming belt (75) circulating continuously in an operating direction (A), having at least:
    a chip bunker (88) having a bunker bottom belt (81) arranged therein and having a first (811) and a second (812) end, a multiplicity of scraping rollers (82) arranged above the bunker bottom belt (81), a multiplicity of ejector rollers (83) arranged above the bunker bottom belt (81), a multiplicity of screens (84) arranged underneath the bunker bottom belt (81), and a multiplicity of wheel heads (85) that can each be driven about an axis of rotation (D2) and are arranged in a plane underneath of and at the side of the bunker bottom belt (81), a feed device (86) arranged above the scraping roller (82), and a device (87) for producing an air stream that is arranged underneath the bunker bottom belt (81),
    wherein the bunker bottom belt (81) can be driven so as to circulate continuously and reversibly, each scraping roller (82) is arranged such that it can be rotated respectively about an axis of rotation (D), and at least some of the scraping rollers (82) can be driven reversibly, the chip or strand feed device (86) is arranged above the scraping rollers (82), the ejector rollers (83) which are arranged such that they can be rotated respectively about an axis of rotation (D1) are arranged in the region of the first end of the bunker bottom belt (81), and the screens (84) are arranged in the region of the second end of the bunker bottom belt (81),
    and wherein
    1. in chip operation
    all the scraping rollers (82) and the bunker bottom belt (81) are in operation, rotating in the direction of rotation in the operating direction (A), the ejector rollers (83) and the wheel heads (85) are out of operation, so that the chips (100) fed in by the chip feed device (86) fall off the bunker bottom belt (81) at the first end (811), are then conveyed through the screens (84) by the air stream and are subsequently scattered onto the chip forming belt (75);
    2. in strand operation
    at least some of the scraping rollers (82), the bunker bottom belt (81), the ejector rollers (83) and the wheel heads (85) are in operation rotating in the direction of rotation counter to the operating direction (A), so that the strands (200, 300) fall off the bunker bottom belt (81) at the end (812) and are scattered onto the chip forming belt (75) via the wheel heads (85).
EP14000794.9A 2014-03-05 2014-03-05 Method and apparatus for manufacturing an OSB panel Active EP2915640B1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
EP14000794.9A EP2915640B1 (en) 2014-03-05 2014-03-05 Method and apparatus for manufacturing an OSB panel
PL14000794T PL2915640T3 (en) 2014-03-05 2014-03-05 Method and apparatus for manufacturing an OSB panel
PT140007949T PT2915640T (en) 2014-03-05 2014-03-05 Method and apparatus for manufacturing an osb panel
ES14000794.9T ES2603423T3 (en) 2014-03-05 2014-03-05 Procedure and equipment to manufacture an OSB panel
LTEP14000794.9T LT2915640T (en) 2014-03-05 2014-03-05 Method and apparatus for manufacturing an OSB panel
HUE14000794A HUE031057T2 (en) 2014-03-05 2014-03-05 Method and apparatus for manufacturing an OSB panel
DK14000794.9T DK2915640T3 (en) 2014-03-05 2014-03-05 Method and apparatus for making an OSB plate
RU2015107522A RU2668328C2 (en) 2014-03-05 2015-03-04 Method for manufacturing of the oriented chipboard
HRP20161496TT HRP20161496T1 (en) 2014-03-05 2016-11-11 Method and apparatus for manufacturing an osb panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP14000794.9A EP2915640B1 (en) 2014-03-05 2014-03-05 Method and apparatus for manufacturing an OSB panel

Publications (2)

Publication Number Publication Date
EP2915640A1 EP2915640A1 (en) 2015-09-09
EP2915640B1 true EP2915640B1 (en) 2016-08-24

Family

ID=50238091

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14000794.9A Active EP2915640B1 (en) 2014-03-05 2014-03-05 Method and apparatus for manufacturing an OSB panel

Country Status (9)

Country Link
EP (1) EP2915640B1 (en)
DK (1) DK2915640T3 (en)
ES (1) ES2603423T3 (en)
HR (1) HRP20161496T1 (en)
HU (1) HUE031057T2 (en)
LT (1) LT2915640T (en)
PL (1) PL2915640T3 (en)
PT (1) PT2915640T (en)
RU (1) RU2668328C2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL3216574T3 (en) 2016-03-10 2020-04-30 SWISS KRONO Tec AG Method for manufacturing an osb
DE102016110070A1 (en) * 2016-05-31 2017-11-30 Dieffenbacher GmbH Maschinen- und Anlagenbau Plant and method for producing a material plate
DE102017111134B4 (en) * 2017-05-22 2018-12-27 Dieffenbacher GmbH Maschinen- und Anlagenbau Method and plant for producing a chipboard
DE102017124063A1 (en) * 2017-10-16 2019-04-18 Dieffenbacher GmbH Maschinen- und Anlagenbau Scattering system and method for producing a spreading material mat in the course of the production of material plates
RU2763720C1 (en) * 2021-05-13 2021-12-30 Бранимир Плазинич Installation for the production of building boards from waste or multilayer partially polymeric materials and method of production
CN113843863A (en) * 2021-07-28 2021-12-28 湖州高裕家居科技有限公司 Artificial wood board for furniture and bedstead using same

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SE346945B (en) * 1970-04-24 1972-07-24 Karlstadplattan Ab
DE3346469A1 (en) * 1983-12-22 1985-07-18 Heggenstaller, Anton, 8892 Kühbach METHOD AND DEVICE FOR EXTRUDING PLANT SMALL PARTS MIXED WITH BINDERS, IN PARTICULAR SMALL WOOD PARTS
DE4021939A1 (en) * 1990-07-10 1992-01-16 Siempelkamp Gmbh & Co SPREADER FOR SPREADING CHIPBOARD RAW MATERIAL
EP0543052A1 (en) * 1991-11-22 1993-05-26 CERIT S.a.r.L Plant to make biodegradable and non-biodegradable products, and the relative method
US5641819A (en) * 1992-03-06 1997-06-24 Campbell; Craig C. Method and novel composition board products
DE4212000C2 (en) * 1992-04-09 1999-05-27 Kvaerner Panel Sys Gmbh Device for dedusting in a top layer spreading device for a molding station
DE20209991U1 (en) * 2002-06-28 2003-10-30 Metso Paper Inc Double band press, for heating and compacting panels, has heater warming band just before pair of guide rollers where band of fibrous material enters press
DE20305236U1 (en) * 2003-04-01 2003-07-17 Kronospan Tech Co Ltd Steaming device
US20070144663A1 (en) * 2005-12-23 2007-06-28 Huber Engineered Woods L.L.C. Process for manufacture of oriented strand lumber products
SE533803C2 (en) * 2008-10-16 2011-01-18 Swedwood Internat Ab Particleboard with middle layer of defibrating wood chips
DE102011118009A1 (en) * 2011-07-07 2013-01-10 Binos Gmbh Method for manufacturing plates with three layers of lignocellulose or cellulose containing chips, involves procuring chips from palm fronds, particularly date-oil palm fronds, in which palm fronds of leaflets and of thorns are exempted

Also Published As

Publication number Publication date
HRP20161496T1 (en) 2016-12-16
EP2915640A1 (en) 2015-09-09
LT2915640T (en) 2017-01-10
RU2668328C2 (en) 2018-09-28
ES2603423T3 (en) 2017-02-27
PL2915640T3 (en) 2017-07-31
RU2015107522A (en) 2016-09-27
RU2015107522A3 (en) 2018-07-31
DK2915640T3 (en) 2017-01-02
PT2915640T (en) 2016-11-25
HUE031057T2 (en) 2017-06-28

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