EP2695493A1 - Module électronique - Google Patents

Module électronique

Info

Publication number
EP2695493A1
EP2695493A1 EP12711353.8A EP12711353A EP2695493A1 EP 2695493 A1 EP2695493 A1 EP 2695493A1 EP 12711353 A EP12711353 A EP 12711353A EP 2695493 A1 EP2695493 A1 EP 2695493A1
Authority
EP
European Patent Office
Prior art keywords
component
plate
module according
base plate
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12711353.8A
Other languages
German (de)
English (en)
Inventor
Helmut Bubeck
Thomas Mueller
Ralf Schinzel
Matthias Lausmann
Holger Braun
Klaus Voigtlaender
Benjamin BERTSCH
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2695493A1 publication Critical patent/EP2695493A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2400/00—Special features of vehicle units
    • B60Y2400/30—Sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • the present invention relates to an electronic module and more particularly to a transmission control module for vehicles.
  • transmission controllers require a plurality of sensors at distributed locations to generate various signals, e.g. Temperature, pressure and speed, to capture. Feed lines to these sensors are provided, for example, from flex films or cables and connected to the transmission control, which usually comprises a small printed circuit board. This results in a high installation effort and the necessary
  • the electronic module according to the invention with the features of claim 1 has the advantage that a cost-effective and simply constructed module can be produced, which in particular allows a modular design for uses in different vehicles. Furthermore, according to the invention a total height of the module can be reduced.
  • the electronic module comprises a base plate and a support plate, on which at least one electronic or electrical component is arranged.
  • the support plate is on arranged on the base plate and the base plate has on a side facing the support plate on a blind hole-like depression for receiving at least one electronic or electrical component.
  • the component is connected to the carrier plate, in particular a printed circuit board or a substrate, and arranged in the recess in the base plate. This allows a
  • At least one sensor is arranged on a side remote from the base plate side of the carrier plate.
  • the sensor may preferably be a pressure sensor or a temperature sensor or a position sensor or a position sensor.
  • the electronic component disposed in the recess is an interference suppression module.
  • the suppression module is particularly preferably on the carrier plate at a rearward position to be suppressed
  • the interference suppression module has a high suppression effect, in particular by short paths.
  • the electronic component which is arranged in the recess in the base plate, a small module circuit board.
  • a potting compound completely fills a cavity of the recess of the base plate.
  • the potting compound is preferably from a
  • the base plate is formed as a cooling plate and in particular a metal plate or an aluminum plate.
  • the carrier plate comprises a base region and at least one web, which a
  • Part of the base region is and is positioned at an angle to the base region, wherein a component, in particular a sensor, is arranged on the web.
  • the web is thus formed from a portion of the support plate and folded by the angle, preferably 90 °, to the base area.
  • the electronic component can be equipped in the plane of the basic area by means of surface technology, then the web is exposed from the base area and then the web, together with the component to the desired Wnkel bent out of the plane becomes.
  • substrates in particular multilayer substrates
  • carrier plates for example substrates having at least one copper layer and at least one insulating layer.
  • the web is preferably milled out of the base area.
  • the web from the intended bending line in the substrate for example, a width of 3 - 7 mm.
  • At the intended bending line of the web is pivoted in a radius upwards.
  • a support element which supports the web.
  • the support element can be fixed, for example by means of clips on the web.
  • Figure 1 is a schematic, perspective and partially cut
  • the electronics module 1 comprises a carrier plate 2, which may be e.g. may be a printed circuit board or a substrate.
  • a carrier plate 2 which may be e.g. may be a printed circuit board or a substrate.
  • the electronic module 1 comprises a base plate 4, which in this embodiment is an aluminum plate.
  • the carrier plate 2 is laminated to the base plate 4 on one side.
  • the base plate 4 on a side facing the support plate 2 a blind hole-like depression 5 on.
  • the electronic or electrical component 3 is in this case on the carrier plate
  • Recess 5 is formed with such a depth that the
  • Component 3 is completely absorbed.
  • the components 3 are designed as interference suppression components.
  • Components can thus be made directly to a source of interference and has short paths to a high interference suppression.
  • the cavity 5 a of the recess 5 can also be partially or completely filled with a potting compound or paste or an adhesive.
  • an HDI printed circuit board 10 (HDI: high density interconnect) can be arranged.
  • HDI high density interconnect
  • the HDI circuit board 10 can be any type of circuit board.
  • the HDI circuit board 10 can be any type of circuit board.
  • the module circuit board 10 may also be fixed by means of an adhesive on the bottom and / or the side walls of the recess 5.
  • Components such as a pressure sensor 8, at any position the support plate 2 are arranged. Further, reference numeral 9 denotes a male terminal.
  • the carrier plate 2 has a
  • the webs 21 are from
  • the reference numeral 7 denotes a separate stiffening element, which is fixed to the base plate 4 and supports the webs. A connection between the webs and the stiffening elements 7 can be done for example by means of clips. It should be noted that in principle it is also possible that, instead of the stiffening elements 7, a region of the base plate 4 corresponding to the web 21 is uncovered and folded up together with the web.
  • the webs 21 are preferably by a milling of the
  • Transmission control module is suitable, in which a rapid adaptation to different variants, for example for different vehicles, is possible. In particular, this can be a mounting effort and process costs such as bonding, soldering, welding or gluing of electronic components can be reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Control Of Transmission Device (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un module électronique comportant au moins un composant électronique ou électrique (3), une plaque de base (4) et une plaque support (2), notamment une carte de circuits imprimés ou un substrat, la plaque support (2) étant disposée sur la plaque de base (4) et comprenant des tracés conducteurs. Sur un côté orienté vers la plaque support (2), la plaque de base (4) présente une cavité (5) en forme de trou borgne et le composant (3) est mis en contact sur la plaque support (2) et disposé dans la cavité (5) de la plaque de base (4).
EP12711353.8A 2011-04-01 2012-02-29 Module électronique Withdrawn EP2695493A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011006632A DE102011006632A1 (de) 2011-04-01 2011-04-01 Elektronikmodul
PCT/EP2012/053420 WO2012130548A1 (fr) 2011-04-01 2012-02-29 Module électronique

Publications (1)

Publication Number Publication Date
EP2695493A1 true EP2695493A1 (fr) 2014-02-12

Family

ID=45922646

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12711353.8A Withdrawn EP2695493A1 (fr) 2011-04-01 2012-02-29 Module électronique

Country Status (6)

Country Link
US (1) US9271418B2 (fr)
EP (1) EP2695493A1 (fr)
JP (1) JP2014518003A (fr)
CN (1) CN103493607A (fr)
DE (1) DE102011006632A1 (fr)
WO (1) WO2012130548A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011006622A1 (de) * 2011-04-01 2012-10-04 Robert Bosch Gmbh Elektronikmodul sowie Verfahren zu dessen Herstellung
DE102015209191A1 (de) 2015-02-10 2016-08-11 Conti Temic Microelectronic Gmbh Mechatronische Komponente und Verfahren zu deren Herstellung
DE102015208523A1 (de) * 2015-05-07 2016-11-10 Conti Temic Microelectronic Gmbh Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
DE102015219005A1 (de) * 2015-10-01 2017-04-06 Robert Bosch Gmbh Elektronikmodul, insbesondere für Getriebesteuerung, mit Sensoranbindung durch über Zentrierstifte positionierte flexible Leiterfolie
DE102016226156A1 (de) * 2016-12-23 2018-06-28 Conti Temic Microelectronic Gmbh Sensoranordnung und Steuergerät mit Sensoranordnung
DE102023202461A1 (de) 2022-03-31 2023-10-05 Continental Automotive Technologies GmbH Elastische Leiterplatte

Citations (1)

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Publication number Priority date Publication date Assignee Title
DE102008016684A1 (de) * 2008-04-01 2009-10-15 Minebea Co., Ltd. Elektromechanischer Motor

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Also Published As

Publication number Publication date
JP2014518003A (ja) 2014-07-24
WO2012130548A1 (fr) 2012-10-04
CN103493607A (zh) 2014-01-01
US9271418B2 (en) 2016-02-23
DE102011006632A1 (de) 2012-10-04
US20140240927A1 (en) 2014-08-28

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