US9271418B2 - Electronic module - Google Patents

Electronic module Download PDF

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Publication number
US9271418B2
US9271418B2 US14/009,166 US201214009166A US9271418B2 US 9271418 B2 US9271418 B2 US 9271418B2 US 201214009166 A US201214009166 A US 201214009166A US 9271418 B2 US9271418 B2 US 9271418B2
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US
United States
Prior art keywords
electronic module
support plate
module according
electronic
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US14/009,166
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English (en)
Other versions
US20140240927A1 (en
Inventor
Holger Braun
Helmut Bubeck
Matthias Lausmann
Ralf Schinzel
Klaus Voigtlaender
Thomas Mueller
Benjamin Bertsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Assigned to ROBERT BOSCH GMBH reassignment ROBERT BOSCH GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BRAUN, HOLGER, LAUSMANN, MATTHIAS, MUELLER, THOMAS, BUBECK, HELMUT, SCHINZEL, RALF, BERTSCH, Benjamin, VOIGTLAENDER, KLAUS
Publication of US20140240927A1 publication Critical patent/US20140240927A1/en
Application granted granted Critical
Publication of US9271418B2 publication Critical patent/US9271418B2/en
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2400/00—Special features of vehicle units
    • B60Y2400/30—Sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • the present invention relates to an electronic module and in particular to a transmission control module for motor vehicles.
  • a plurality of sensors is required at multiple locations, for example, in the case of transmission control systems in order to acquire different signals, as, e.g., temperature, pressure and rotational speed.
  • Feed lines to said sensors consist, for example, of flex foils or cables and are connected to the transmission controller which typically comprises a small printed circuit board.
  • the transmission controller typically comprises a small printed circuit board.
  • a very large assembly outlay is incurred and the necessary connections between sensors and printed circuit board are relatively expensive.
  • a large number of procedural steps as, e.g., bonding, soldering, welding or adhesive bonding, are required. It would therefore be desirable to provide a cost effective electronic module which particularly can be used in transmission control systems of motor vehicles.
  • the inventive electronic module has in contrast the advantage that a cost effective and simply designed module can be produced, which in particular makes a modular design for applications in different motor vehicles possible.
  • an overall construction height of the module can be reduced in accordance with the invention.
  • the electronic module comprises a base plate and a support plate, on which support plate an electronic or electric component is arranged.
  • the support plate is thereby arranged on the base plate, and said base plate comprises a blind hole-type recess for receiving at least one electronic or electric component on a side oriented towards the support plate.
  • the component is connected to the support plate, in particular to a printed circuit board or substrate, and is arranged in the recess in the base plate. This facilitates a reduction of the total construction height of the module as well as a side protection of the component arranged in the recess.
  • a sensor is furthermore preferably arranged on a side of the support plate facing away from the base plate.
  • the sensor can preferably be a pressure sensor or a temperature sensor or a position sensor or an attitude sensor.
  • the electronic component arranged in the recess is furthermore preferably an interference suppression assembly.
  • the interference suppression assembly is thereby arranged on the support plate at a rear position in relation to a component in which interference is to be suppressed.
  • shielding measures by said interference suppression assembly it is especially possible for shielding measures by said interference suppression assembly to be provided directly at a source of electromagnetic interferences.
  • Said interference suppression assembly particularly achieves a high suppression of interference as a result of the close proximity thereof to a component in which interference is to be suppressed.
  • the electronic component which is arranged in the recess in the base plate is a small modular printed circuit board.
  • Said modular printed circuit board can thereby be arranged in a well protected manner on the support plate.
  • a sealing compound furthermore preferably completely fills a cavity of the recess of the base plate.
  • the sealing compound is preferably made from a material which has very good thermal conductivity properties.
  • the base plate is designed as a cooling plate and in particular as a sheet metal plate or an aluminum plate.
  • the support plate comprises a base area and at least one connection element, which is a part of the base area and is positioned at an angle to said base area, a component, in particular a sensor, being arranged in the connection element.
  • Said connection element is thus formed from a part of the support plate and is tilted upwards at the desired angle, preferably 90°, to the base area.
  • the electronic component can be equipped in the plane of the base area by means of surface technology, the connection element is then exposed from said base area and finally said connection element together with the component is bent at the desired angle out of the plane of said base area.
  • Support plates are basically commercial substrates, in particular multi-layered substrates, for example substrates having at least one copper layer and at least one insulation layer.
  • the connection element is preferably milled from the base area. In so doing, the connection element has, for example, a width of 3-7 mm starting from the intended bending line in the substrate.
  • the connection element is pivoted upward in a radius along the intended bending line.
  • a support element is furthermore preferably provided which supports the connection element.
  • the support element can, for example, be fastened to the connection element using clips.
  • FIG. 1 shows a schematic, perspective and partially cutaway view of an electronic module according to an exemplary embodiment of the invention
  • FIG. 2 shows a sectional view of a section of the electronic module from FIG. 1 .
  • the electronic module 1 comprises a support plate 2 which can, e.g., be a printed circuit board or a substrate. A variety of components can be arranged on the support plate according to need.
  • the electronic module 1 further comprises a base plate 4 , which is an aluminum plate in this exemplary embodiment. The support plate 2 is thereby laminated to one side of the base plate 4 .
  • the base plate 4 further comprises a blind hole-type recess 5 on a side oriented towards the support plate 2 .
  • the electronic or electric component 3 is thereby attached to the support plate 2 such that it protrudes into the cavity 5 a of the recess 5 .
  • the recess 5 is designed having such a depth that the component 3 is completely accommodated.
  • the components 3 are designed as interference suppression components. An interference suppression of the other components disposed, for example, above the interference suppression components can thus result directly at an interference source and has a high interference suppression effect because of short connecting paths.
  • the cavity 5 a of the recess 5 can also be partially or completely filled with a sealing compound or paste or an adhesive.
  • An HDI printed circuit board (HDI: high density interconnect) can, for example, be disposed in a further recess 5 .
  • HDI printed circuit boards are compactly designed printed circuit boards with high packing density.
  • the HDI printed circuit board 10 can, for example, be disposed in the recess 5 by means of a slug-up configuration so that rapid heat dissipation into the base plate 4 is possible.
  • said board can also further be fixed to the bottom and/or side walls of the recess 5 using an adhesive.
  • additional electronic components such as, for example, a pressure sensor 8
  • a pressure sensor 8 can be disposed at arbitrary positions on the support plate 2 .
  • the reference numeral 9 denotes a plug connector.
  • the support plate 2 comprises a base area as well as a plurality of connection elements 21 .
  • the connection elements 21 are bent upwards from the base area at an angle ⁇ of 90°.
  • sensors 6 which are arranged in an end region of each connection element 21 , are thereby disposed in the space relative to the base area 20 .
  • the reference numeral 7 denotes a separate reinforcing element which is fixed to the base plate 4 and supports the connection elements.
  • the connection elements and the reinforcing elements 7 can, for example, be connected by means of clips.
  • connection elements 21 are preferably separated from the base area 20 by means of a milling process. In so doing, a milling process on one side can be sufficient if the connection element is formed on an edge region of the support plate 2 (in FIG. 1 the connection element 21 on the far left); or a milling process is carried out on three sides (in FIG. 1 the central connection element 21 ).
  • the electronic module 1 according to the invention is particularly suitable as a transmission control module, which can be adapted to different variants, for example to different motor vehicles.
  • assembly costs and processing costs such as bonding, soldering, welding or adhesive bonding of electronic components, can particularly be reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Control Of Transmission Device (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
US14/009,166 2011-04-01 2012-02-29 Electronic module Expired - Fee Related US9271418B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102011006632 2011-04-01
DE102011006632.2 2011-04-01
DE102011006632A DE102011006632A1 (de) 2011-04-01 2011-04-01 Elektronikmodul
PCT/EP2012/053420 WO2012130548A1 (fr) 2011-04-01 2012-02-29 Module électronique

Publications (2)

Publication Number Publication Date
US20140240927A1 US20140240927A1 (en) 2014-08-28
US9271418B2 true US9271418B2 (en) 2016-02-23

Family

ID=45922646

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/009,166 Expired - Fee Related US9271418B2 (en) 2011-04-01 2012-02-29 Electronic module

Country Status (6)

Country Link
US (1) US9271418B2 (fr)
EP (1) EP2695493A1 (fr)
JP (1) JP2014518003A (fr)
CN (1) CN103493607A (fr)
DE (1) DE102011006632A1 (fr)
WO (1) WO2012130548A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011006622A1 (de) * 2011-04-01 2012-10-04 Robert Bosch Gmbh Elektronikmodul sowie Verfahren zu dessen Herstellung
DE102015209191A1 (de) * 2015-02-10 2016-08-11 Conti Temic Microelectronic Gmbh Mechatronische Komponente und Verfahren zu deren Herstellung
DE102015208523A1 (de) * 2015-05-07 2016-11-10 Conti Temic Microelectronic Gmbh Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
DE102015219005A1 (de) * 2015-10-01 2017-04-06 Robert Bosch Gmbh Elektronikmodul, insbesondere für Getriebesteuerung, mit Sensoranbindung durch über Zentrierstifte positionierte flexible Leiterfolie
DE102016226156A1 (de) * 2016-12-23 2018-06-28 Conti Temic Microelectronic Gmbh Sensoranordnung und Steuergerät mit Sensoranordnung
DE102023202461A1 (de) 2022-03-31 2023-10-05 Continental Automotive Technologies GmbH Elastische Leiterplatte

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US5703542A (en) * 1996-08-28 1997-12-30 Locus Incorporated Compact temperature stabilized crystal oscillator
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WO2008000551A2 (fr) 2006-06-27 2008-01-03 Continental Automotive Gmbh Dissipateur de chaleur
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US20110100598A1 (en) * 2009-10-30 2011-05-05 Gommel Frank Cooling arrangement
US7983046B1 (en) * 2010-02-22 2011-07-19 Delphi Technologies, Inc. Electronic control module and enclosed power module
DE102010025591A1 (de) * 2010-06-29 2011-12-29 Conti Temic Microelectronic Gmbh Sensorträger sowie Sensormodul insbesondere zum Einsatz in einem Kraftfahrzeugvorortsteuergerät
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US4893590A (en) * 1987-09-30 1990-01-16 Hitachi, Ltd. Automotive liquid-cooled electronic control apparatus
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JPH04251969A (ja) 1990-04-05 1992-09-08 General Electric Co <Ge> 電子装置
JPH08148646A (ja) 1994-11-16 1996-06-07 Nippondenso Co Ltd 回路装置
US5703542A (en) * 1996-08-28 1997-12-30 Locus Incorporated Compact temperature stabilized crystal oscillator
US6469902B1 (en) 1997-05-15 2002-10-22 Siemens Aktiengesellschaft Adhesive joint assembly
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JP2001257306A (ja) 2000-03-10 2001-09-21 Denso Corp 混成集積回路装置及びその製造方法
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DE10051945C1 (de) 2000-10-19 2001-11-29 Siemens Ag Dichte Aufnahmekammer für Kfz-Elektronikbauteil und Verfahren zur Herstellung derselben
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DE102006001890A1 (de) 2006-01-14 2007-08-02 Zf Friedrichshafen Ag Elektronisches Anbau-Steuergerät
WO2008000551A2 (fr) 2006-06-27 2008-01-03 Continental Automotive Gmbh Dissipateur de chaleur
US20090244874A1 (en) 2008-03-31 2009-10-01 Ravi Mahajan Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
US20110100598A1 (en) * 2009-10-30 2011-05-05 Gommel Frank Cooling arrangement
US7983046B1 (en) * 2010-02-22 2011-07-19 Delphi Technologies, Inc. Electronic control module and enclosed power module
DE102010025591A1 (de) * 2010-06-29 2011-12-29 Conti Temic Microelectronic Gmbh Sensorträger sowie Sensormodul insbesondere zum Einsatz in einem Kraftfahrzeugvorortsteuergerät
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US20140029220A1 (en) * 2011-04-01 2014-01-30 Robert Bosch Gmbh Electronic module and method for the production thereof

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International Search Report for Application No. PCT/EP2012/053420 dated Jun. 5, 2012 (2 pages).

Also Published As

Publication number Publication date
JP2014518003A (ja) 2014-07-24
EP2695493A1 (fr) 2014-02-12
DE102011006632A1 (de) 2012-10-04
WO2012130548A1 (fr) 2012-10-04
US20140240927A1 (en) 2014-08-28
CN103493607A (zh) 2014-01-01

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