US9271399B2 - Electronic module and method for the production thereof - Google Patents
Electronic module and method for the production thereof Download PDFInfo
- Publication number
- US9271399B2 US9271399B2 US14/009,144 US201214009144A US9271399B2 US 9271399 B2 US9271399 B2 US 9271399B2 US 201214009144 A US201214009144 A US 201214009144A US 9271399 B2 US9271399 B2 US 9271399B2
- Authority
- US
- United States
- Prior art keywords
- connection element
- electronic module
- connection
- support plate
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 238000000034 method Methods 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000005452 bending Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000005187 foaming Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 description 6
- 238000003801 milling Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
- F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
- F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
- B60Y2400/00—Special features of vehicle units
- B60Y2400/30—Sensors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Definitions
- the present invention relates to an electronic module, as, for example, a transmission controller for motor vehicles, as well as to a method for the production thereof.
- a plurality of sensors is required at multiple locations, for example, in transmission control systems in order to acquire different signals, as, e.g., temperature, pressure and rotational speed.
- Feed lines to said sensors consist, for example, of flex foils or cables and are connected to the transmission controller which typically comprises a small printed circuit board.
- the transmission controller typically comprises a small printed circuit board.
- a very large assembly outlay is incurred and the necessary connections between sensors and printed circuit board are relatively expensive.
- a large number of procedural steps as, e.g., bonding, soldering, welding or adhesive bonding, are required. It would therefore be desirable to provide a cost effective electronic module which particularly can be used in transmission control systems of motor vehicles.
- the inventive electronic module has in contrast the advantage that a cost effective electronic module which can easily be equipped can be provided, wherein electronic and/or electric components, in particular sensors and/or actuators, can be disposed at arbitrary positions.
- a cost effective, extensive support plate e.g. a printed circuit board, or a ceramic or a substrate, can be used.
- the components can be mounted in a normal surface-mount process (SMT process) and therefore very cost-effectively.
- SMT process normal surface-mount process
- the support plate comprises a base area and a connection element.
- the connection element is a part of the base area and is arranged at an angle to said base area, i.e.
- connection element is integrally formed with the base area and protrudes from said base area.
- the connection element is arranged by bending the base area upward at an arbitrary angle to said base area.
- at least one component is thereby disposed on the connection element.
- a component can therefore be disposed according to the invention at an arbitrary position and at an arbitrary distance from the base plane.
- different sensors can, for example, be disposed at various positions which are spaced differently from the base area, only one single support plate being necessary in this arrangement.
- Temperature sensors, pressure sensors or rotational speed sensors can, for example, be used as sensors.
- the connection elements are preferably bent at an angle of 90° to the base area. Any other angle is, however, also conceivable.
- Support plates are basically commercial substrates, in particular multi-layered substrates, for example substrates having at least one copper layer and at least one insulation layer.
- the connection element is preferably milled from the base area. In so doing, the connection element has, for example, a width of 3-7 mm starting from the intended bending line in the substrate. The width of the connection element is selected as a function of the concrete application.
- the connection element is pivoted upward in a radius along the intended bending line. Experiments show that such commercial substrates withstand multiple bending without incurring damage.
- connection element is furthermore preferably disposed in an end portion of the connection element.
- connection element and/or the support plate is surrounded by a sealing compound or the like.
- a detent connection is provided on the connection element, preferably a plurality of detent connections for connecting said connection element to a counter body.
- the detent connections can thereby be provided on all sides of said connection element.
- the detent connection preferably comprises a detent lug and a recess for receiving said detent lug. In so doing, a reliable fastening can particularly be achieved during assembly. In a preferable manner, a sealing of the electronic module and a filling of cavities with sealing compound can subsequently take place.
- the electronic module comprises a base plate, in particular a sheet metal plate, wherein the support plate is disposed on the base plate, in particular laminated to said base plate.
- the electronic module gains stability on the one hand and the base plate can furthermore be used for cooling.
- the region of the base plate located under the connection element is likewise preferably exposed and bent.
- the invention relates to a structural component comprising an inventive electronic module and a counter body with a recess, at least one end portion of the connection element being disposed in the recess.
- the end region of the connection element can thereby be inserted deeply into the counter body and desired signals can be acquired by means of the sensor arranged in the connection element.
- the recess in the counter body is preferably a blind hole.
- the invention furthermore relates to a method for producing an electronic module.
- a support plate is equipped with at least one electronic or electric component, in particular a sensor, and a connection element is exposed from the support plate. Said component is thereby situated on the connection element, and said connection element is bent out of the plane of the support plate.
- the components can be disposed in a different plane than a base area of the support plate and nevertheless be mounted by means of a surface-mount process. It should noted that the equipping of the support plate with the component can be carried out prior to or after exposing the connection element.
- connection element is milled out of the support plate by means of a milling process, said connection element remaining connected to the base area of the support plate via a remaining connecting area. If the connection element is provided on an edge of the support plate, said connection element can be produced by means of a milling process on one side.
- the present invention is particularly used in transmission control systems of motor vehicles, in which a plurality of values are to be acquired by means of sensors.
- FIG. 1 shows a schematic sectional view of an electronic module pursuant to a first exemplary embodiment of the invention
- FIG. 2 shows a top view of the electronic module from FIG. 1 ;
- FIG. 3 shows a schematic, perspective view of the support plate of the electronic module from FIG. 1 ;
- FIG. 4 shows a schematic sectional view of an electronic module pursuant to a second exemplary embodiment of the invention.
- FIG. 5 shows a schematic top view of the electronic module from FIG. 4 .
- FIGS. 1 to 3 An electronic module 1 pursuant to a first preferred exemplary embodiment of the invention is described below in detail with reference to FIGS. 1 to 3 .
- the electronic module 1 comprises a support plate 2 , which is a printed circuit board in this exemplary embodiment.
- the support plate 2 has a base area 20 and a plurality of connection elements 21 (cf. FIG. 3 ), which are tilted upward from the base area 20 at an angle ⁇ of 90°.
- the printed circuit board is thereby an inexpensive, extensive printed circuit board and serves as a connection printed circuit board.
- the electronic module 1 further comprises electronic and/or electric components 3 , which are sensors in this exemplary embodiment. The sensors are thereby in each case disposed in an end portion 21 a of the connection elements 21 .
- connection elements 21 can be produced by means of milling one side of the support plate, a recess 23 being formed in an edge region of the support plate 2 , or by means of milling three sides of said support plate, in which milling process a recess 23 is formed in the support plate 2 (cf. FIG. 3 ).
- the printed circuit board is equipped with the components 3 using the conventional surface mounted technology, said printed circuit board can thereby be very easily equipped with further electronic components 9 .
- two production methods result.
- the printed circuit board can initially be equipped with all of the components and the connection elements are subsequently milled out of the base area 20 of said printed circuit board and then tilted upwards.
- the connection elements are initially milled out of said base area, the printed circuit board is then equipped with components and finally the connection elements are tilted upwards.
- connection elements are preferably reinforced by means of separate reinforcing elements 24 .
- the reinforcing elements 24 can, for example, be clipped onto the connection elements 21 .
- the support plate 2 is disposed on a sheet metal plate 8 , wherein the sheet metal plate 8 serves as a heat sink so that heat can be easily dissipated from the printed circuit board.
- attitude sensors for example attitude sensors, position sensors, pressure sensors, temperature sensors, etc.
- pressure sensors for example attitude sensors, position sensors, pressure sensors, temperature sensors, etc.
- the further electronic components 9 can, for example, also be pressure sensors which are fixed to the printed circuit board using a clip connector.
- Connection lines which are not depicted, are provided on the surface or in an internal layer of the support plate 8 and are connected to a switching element, etc.
- a plug connection 7 is provided on the support plate 2 . Only one singe printed circuit board has, e.g., to be provided for a transmission control.
- connection elements 21 are disposed in recesses 5 which are provided in a counter body 4 .
- the recesses 5 are in the form of a blind hole, and a motor winding 6 is, for example, arranged on the counter body 4 , wherein the sensor provided on the connection element 21 is intended to acquire an engine variable.
- the recess 5 can also be foamed or filled with a sealing compound. As a result, a secure and vibration-free positioning of the sensors in the end portion 21 a of the connection elements 21 can be achieved.
- sensors can therefore according to the invention be disposed at various positions, starting at the base area 20 which forms a base plane, without undue expense or effort.
- the connection elements 21 can be equipped with components, as described above, during the normal SMT process. The milling procedure and the positioning of said connection elements in the counter body can then take place. In addition, the additional processes required until now in the prior art, such as wiring, soldering, adhesive bonding, etc. are eliminated.
- FIGS. 4 and 5 show an electronic module 1 pursuant to a second exemplary embodiment of the invention, wherein identical or functionally identical parts are designated with the same reference numerals as in the first exemplary embodiment.
- the electronic module 1 of the second exemplary embodiment additionally comprises another separate fixing device for the connection elements 21 in the form of a detent connection 10 .
- the detent connection 10 comprises a detent lug 11 , which is disposed on the counter body 4 , as well as a correspondingly formed recess 12 in the connection element 21 .
- a plurality of detent connections can be provided in order to facilitate a reliable and redundant fixing of the connection elements 21 .
- the recess to be provided on the counter body 4 and the detent lug to be disposed on the connection element 21 . Otherwise this exemplary embodiment corresponds to the preceding exemplary embodiment; and therefore reference can be made to the description provided therefore.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Measuring Fluid Pressure (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011006622 | 2011-04-01 | ||
DE102011006622A DE102011006622A1 (en) | 2011-04-01 | 2011-04-01 | Electronic module and method for its production |
DE102011006622.5 | 2011-04-01 | ||
PCT/EP2012/053422 WO2012130549A1 (en) | 2011-04-01 | 2012-02-29 | Electronic module and method for the production thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
US20140029220A1 US20140029220A1 (en) | 2014-01-30 |
US9271399B2 true US9271399B2 (en) | 2016-02-23 |
Family
ID=45815518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/009,144 Expired - Fee Related US9271399B2 (en) | 2011-04-01 | 2012-02-29 | Electronic module and method for the production thereof |
Country Status (6)
Country | Link |
---|---|
US (1) | US9271399B2 (en) |
EP (1) | EP2695492A1 (en) |
JP (1) | JP5882446B2 (en) |
CN (1) | CN103460814B (en) |
DE (1) | DE102011006622A1 (en) |
WO (1) | WO2012130549A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11536594B2 (en) | 2017-08-23 | 2022-12-27 | Vitesco Technologies Germany Gmbh | Sensor component, pre-assembly arrangement for a sensor component, and method for producing a sensor component |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011006632A1 (en) * | 2011-04-01 | 2012-10-04 | Robert Bosch Gmbh | electronic module |
DE102014205386A1 (en) * | 2014-03-24 | 2015-09-24 | Robert Bosch Gmbh | Electronic module, in particular for transmission control unit, with integrated electronic sensor element |
DE102015211505A1 (en) * | 2015-06-23 | 2016-12-29 | Zf Friedrichshafen Ag | Device for gear selection of a motor vehicle |
DE102022201176A1 (en) | 2022-02-04 | 2023-08-10 | Zf Friedrichshafen Ag | Temperature sensor for an inverter for operating an electric drive in an electric vehicle or a hybrid vehicle, inverter with such a temperature sensor |
Citations (18)
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---|---|---|---|---|
JPH0627487A (en) | 1992-07-08 | 1994-02-04 | Fujitsu Ltd | Thin-film transistor matrix and its production |
EP0740365A2 (en) | 1995-04-28 | 1996-10-30 | TEMIC TELEFUNKEN microelectronic GmbH | Control module for motor vehicle |
DE19839843A1 (en) | 1998-09-02 | 2000-03-09 | Knorr Bremse Systeme | Pressure control device for vehicles |
DE19907949A1 (en) | 1999-02-24 | 2000-09-14 | Siemens Ag | Control device for a motor vehicle |
JP2002026481A (en) | 2000-07-11 | 2002-01-25 | Funai Electric Co Ltd | Structure for mounting sensor component on board |
EP1239710A2 (en) | 2001-03-06 | 2002-09-11 | Conti Temic microelectronic GmbH | Electronic assembly |
US6469902B1 (en) | 1997-05-15 | 2002-10-22 | Siemens Aktiengesellschaft | Adhesive joint assembly |
US6700074B2 (en) * | 2000-10-19 | 2004-03-02 | Cherry Gmbh | Electrical component housing structures and their method of manufacture |
DE102004053958B3 (en) | 2004-11-09 | 2005-09-01 | Behr Hella Thermocontrol Gmbh | Device for detecting electromagnetic radiation, especially sunlight, for use in vehicle, has metal core conducting plate with region(s) inclined to its plane, at least one optoelectronic component arranged in inclined region |
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DE102005002813A1 (en) | 2005-01-20 | 2006-08-10 | Robert Bosch Gmbh | control module |
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WO2012013176A1 (en) | 2010-06-29 | 2012-02-02 | Conti Temic Microelectronic Gmbh | Sensor carrier and sensor module, in particular for use in an on-board control unit for a motor vehicle |
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JP2006303251A (en) * | 2005-04-21 | 2006-11-02 | Fujikura Ltd | Mounting structure of flexible printed board to stationary member |
-
2011
- 2011-04-01 DE DE102011006622A patent/DE102011006622A1/en not_active Withdrawn
-
2012
- 2012-02-29 CN CN201280016180.1A patent/CN103460814B/en not_active Expired - Fee Related
- 2012-02-29 WO PCT/EP2012/053422 patent/WO2012130549A1/en active Application Filing
- 2012-02-29 US US14/009,144 patent/US9271399B2/en not_active Expired - Fee Related
- 2012-02-29 JP JP2014501507A patent/JP5882446B2/en not_active Expired - Fee Related
- 2012-02-29 EP EP12708280.8A patent/EP2695492A1/en not_active Withdrawn
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JPH0627487A (en) | 1992-07-08 | 1994-02-04 | Fujitsu Ltd | Thin-film transistor matrix and its production |
EP0740365A2 (en) | 1995-04-28 | 1996-10-30 | TEMIC TELEFUNKEN microelectronic GmbH | Control module for motor vehicle |
US6469902B1 (en) | 1997-05-15 | 2002-10-22 | Siemens Aktiengesellschaft | Adhesive joint assembly |
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DE102006001890A1 (en) | 2006-01-14 | 2007-08-02 | Zf Friedrichshafen Ag | Electronic add-on controller for a controllable unit fits externally on the unit's casing with a support plate for an electronics module to control the unit |
JP2008004627A (en) | 2006-06-20 | 2008-01-10 | Nidec Sankyo Corp | Mounting structure for electronic component, and optical head device |
EP2031740A2 (en) | 2007-08-31 | 2009-03-04 | Siemens AG Österreich | Circuit board for brush-less DC motors |
DE102007042449A1 (en) | 2007-09-06 | 2009-03-12 | Continental Automotive Gmbh | Integrated sensor module |
WO2012013176A1 (en) | 2010-06-29 | 2012-02-02 | Conti Temic Microelectronic Gmbh | Sensor carrier and sensor module, in particular for use in an on-board control unit for a motor vehicle |
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US11536594B2 (en) | 2017-08-23 | 2022-12-27 | Vitesco Technologies Germany Gmbh | Sensor component, pre-assembly arrangement for a sensor component, and method for producing a sensor component |
Also Published As
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US20140029220A1 (en) | 2014-01-30 |
CN103460814A (en) | 2013-12-18 |
WO2012130549A1 (en) | 2012-10-04 |
EP2695492A1 (en) | 2014-02-12 |
JP5882446B2 (en) | 2016-03-09 |
JP2014512097A (en) | 2014-05-19 |
DE102011006622A1 (en) | 2012-10-04 |
CN103460814B (en) | 2017-04-05 |
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