EP2600431B1 - Organic electronic device and method of manufacturing the same - Google Patents

Organic electronic device and method of manufacturing the same Download PDF

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Publication number
EP2600431B1
EP2600431B1 EP11823755.1A EP11823755A EP2600431B1 EP 2600431 B1 EP2600431 B1 EP 2600431B1 EP 11823755 A EP11823755 A EP 11823755A EP 2600431 B1 EP2600431 B1 EP 2600431B1
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Prior art keywords
layer
electronic device
organic
organic electronic
refractive index
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German (de)
English (en)
French (fr)
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EP2600431A4 (en
EP2600431A2 (en
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Seong Su Jang
Yeon Keun Lee
Kyoung Sik Moon
Se Hwan Son
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LG Display Co Ltd
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LG Display Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/875Arrangements for extracting light from the devices
    • H10K59/877Arrangements for extracting light from the devices comprising scattering means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/854Arrangements for extracting light from the devices comprising scattering means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/02Diffusing elements; Afocal elements
    • G02B5/0205Diffusing elements; Afocal elements characterised by the diffusing properties
    • G02B5/0236Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place within the volume of the element
    • G02B5/0242Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place within the volume of the element by means of dispersed particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2101/00Properties of the organic materials covered by group H10K85/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14Carrier transporting layers
    • H10K50/16Electron transporting layers
    • H10K50/165Electron transporting layers comprising dopants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to an organic electronic device having a novel structure, and a method of manufacturing the same.
  • An organic electronic device refers to a device that can induce the flow of electric charge between an electrode and an organic material using holes and/or electrons.
  • the organic electronic device is a type of electronic device used as a current source since excitons formed in an organic material layer are separated into electrons and holes by means of photons flowing into the device from an external light source according to its operation principle, and the separated electrons and holes are transferred to different electrodes; or a type of electronic device which is driven by electrons and holes which are injected into an organic material by applying a voltage or electric current to two or more electrodes.
  • Examples of an organic electronic device include an organic light emitting diode (OLED), an organic solar cell, an organic photoconductor (OPC) drum or organic transistor, etc.
  • the OLED refers to a spontaneously light emitting device using electroluminescence in which light emits when an electric current flows in a light-emissive organic compound.
  • the OLED has attracted much attention as a next-generation material in various fields such as displaying or lighting since the OLED has advantages in that it has excellent thermal stability and low drive voltage.
  • JP 2005-353367 describes an OLED which is provided with a luminescence part composed by sandwiching an organic layer between a first electrode and a second electrode; and a fine particle layer part including fine particles stacked and formed on the luminescent part and periodically arranged thereon, and a medium for at least partially embedding the fine particles.
  • the OLED is characterized in that the medium in the fine particle layer includes the first particle coat layer and a second particle coat layer having reflectivity values different from each other; and the second particle coat layer has reflectivity greater than that of the first particle coat layer and is formed on the luminescent part site.
  • EP 1 445 095 describes a composite thin film-holding substrate in which a composite thin film comprising a filler having a refractive index lower than that of a substrate and a binder having a refractive index higher than that of the filler is formed of a surface of the substrate. Light is efficiently scattered when passing through the composite thin film which comprises the filler and the binder having different refractive indexes from each other.
  • US 2007/0228948 describes an OLED which has a light emitting layer and an electron injecting and transporting layer which are sandwiched between a pair of electrodes formed of an anode and a cathode.
  • the electron injection dopant material is doped into an electron transporting material in such a manner that concentration of the dopant becomes low, high and low in the regions of the electron injecting and transporting layer in the stated order from the light emitting layer site in the film thickness direction.
  • the present invention is directed to providing an organic electronic device having a novel structure which is able to improve light extraction efficiency without degrading device performance, and a method of manufacturing the same.
  • the present invention is directed to providing an organic electronic device having improved electron transfer efficiency and luminous efficiency without requiring a separate electron injection layer (EIL), and a method of manufacturing the same.
  • EIL electron injection layer
  • the present invention provides an organic electronic device and a method of manufacturing the same according to independent claims 1 and 16.
  • the organic electronic device includes a substrate comprising a base material; a scattering layer which is formed on the base material, includes a binder and scattering particles for scattering light and has an uneven structure formed on a surface thereof opposite the base material; and a planarization layer which is formed on the scattering layer to planarize an uneven surface of the scattering layer.
  • a refractive index Na of the scattering particles and a refractive index Nb of the planarization layer satisfies the expression
  • the present invention provides a method of manufacturing the organic electronic device.
  • the organic electronic device for example, an organic light emitting device
  • internal total reflection takes place due to the difference in refractive index between layers constituting the device. More particularly, primary total reflection of light generated in the organic material layer takes place at the interface between a transparent electrode having a refractive index of 1.8 or more and a glass substrate having a refractive index of 1.5 or more. Also, secondary total reflection of light passed through the glass substrate also takes place at the interface between a glass substrate having a refractive index of 1.8 and air having a refractive index of 1.0.
  • Such internal total reflection of the device may degrade luminous efficiency and brightness. According to the present invention, the reduction of luminous efficiency caused by such internal reflection of the organic electronic device may be improved, and excellent luminous uniformity may be provided.
  • the substrate for an organic electronic device may improve luminous uniformity of the device and enhance light extraction efficiency.
  • the scattering particles have a refractive index Na of 2.0 to 3.5
  • the planarization layer has a refractive index Nb of 1.7 to 2.5.
  • the refractive index Na of the scattering particles may be in a range of 2.2 to 3.0
  • the refractive index Nb of the planarization layer may be in a range of 1.8 to 2.0.
  • the refractive index is obtained by measuring the refractive index for light with 400 to 450 nm wavelengths under a vacuum condition.
  • the base material is not particularly limited, and may be a transparent base material.
  • the base material may be a light-transmissive plastic substrate or a glass substrate.
  • the scattering particles are not particularly limited as long as they can scatter light using the difference in refractive index between the scattering particles and the planarization layer.
  • the scattering particles may be at least one selected from the group consisting of titanium oxide, zirconium oxide, cerium oxide, hafnium oxide, niobium pentoxide, tantalum pentoxide, tin oxide, zinc sulfide, silicon nitride and aluminum nitride.
  • the scattering particles may be formed on the base material through bonding with the binder, and may be formed in a single-layer or multiple-layer structure or a randomly stacked structure. Specifically, the scattering particles may be formed on the base material in a single-layer structure. Since light may be uniformly dispersed when the scattering particles are formed in a single-layer structure, light can emit uniformly from a light emitting surface.
  • the scattering particles may have a spherical, oval or amorphous shape, preferably a spherical or oval shape.
  • An average diameter of the scattering particles may be in a range of 0.01 ⁇ m to 20 ⁇ m, preferably in a range of 0.1 to 5 ⁇ m.
  • the binder in the scattering layer is not particularly limited, and may be an organic and inorganic, or organic/inorganic complex binder.
  • the binder may be an inorganic or organic/inorganic complex binder.
  • the inorganic or organic/inorganic complex binder is desirable for performance, especially life span, of the device due to excellent heat resistance and chemical resistance compared with an organic binder.
  • the inorganic or organic/inorganic complex binder may be useful in manufacturing various devices since the inorganic or organic/inorganic complex binder is not easily degraded during a process which may be realized in a process of manufacturing a device such as a high temperature process which is performed at 150 °C or more, a photo process and an etching process.
  • the binder may be at least one selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, alumina and an inorganic or organic/inorganic complex based on a siloxane bond (Si-O).
  • Si-O siloxane bond
  • an inorganic binder based on a [Si-O] bond may be formed using a siloxane through condensation polymerization, or a type of organic/inorganic complex in which an alkyl group is not completely removed from the siloxane bond may be used herein.
  • the planarization layer may include a binder such as an inorganic material, or an inorganic or organic/inorganic complex.
  • a binder such as an inorganic material, or an inorganic or organic/inorganic complex.
  • the planarization layer are not particularly limited, but the planarization layer may include at least one selected from the group consisting of silicon nitride, silicon oxynitride, alumina and an inorganic or organic/inorganic complex based on a siloxane bond (Si-O).
  • the planarization layer may further include a high-refractive index filler.
  • the high-refractive index filler functions to reduce a difference in refractive index between the planarization layer and an organic material layer.
  • the high-refractive index filler is not particularly limited as long as it can be dispersed in the planarization layer to enhance the refractive index.
  • the high-refractive index filler may be at least one selected from the group consisting of alumina, aluminum nitride, zirconium oxide, titanium oxide, cerium oxide, hafnium oxide, niobium pentoxide, tantalum pentoxide, indium oxide, tin oxide, ITO, zinc oxide, silicon, zinc sulfide, calcium carbonate, barium sulfate and silicon nitride.
  • the high-refractive index filler may be titanium dioxide.
  • the thickness of the planarization layer may be properly adjusted according to device characteristics.
  • the average thickness of the planarization layer may be more than 0.5 times or twice the average diameter of the scattering particles, for example, 0.5 to 10 times or 1 to 5 times the average diameter of the scattering particles.
  • the present invention provides an organic electronic device including the substrate for an organic electronic device as described above.
  • the organic electronic device has a sequentially stacked structure including the substrate for an organic electronic device as described above, a first electrode, an organic layer including a light emitting layer (LEL), and a second electrode.
  • the organic layer includes an electron transfer layer (ETL) doped with an alkali halide, and the ETL doped with the alkali halide is characterized in that it has a thickness of 55 to 85 nm.
  • ETL electron transfer layer
  • the carrier density for electrons may be enhanced, and an energy barrier for injecting electrons may be reduced by doping the ETL with an alkali halide.
  • an energy barrier for injecting electrons may be reduced by doping the ETL with an alkali halide.
  • the organic electronic device may be effectively driven even when the EIL which has been considered to be an essential component in a conventional organic electronic device, is not separately formed.
  • the organic electronic device has a light-extraction structure in which the scattering particles are formed in the substrate.
  • the ETL doped with the alkali halide is configured to have a relatively large thickness. Accordingly, light extraction efficiency may be improved, and an increase in life span of the device and simplification of the manufacturing process may also be facilitated by simplifying a stacked structure of the organic electronic device.
  • the ETL includes an electron transfer material and an alkali halide with which the electron transfer material is doped.
  • the electron transfer material may include a compound containing at least one functional group selected from the group consisting of an imidazole group, an oxazole group, a thiazole group, a quinoline group and a phenanthroline group.
  • the electron transfer material is not particularly limited, and may be readily selected by those skilled in the related art according to desired physical properties as long as it does not hinder the transfer of electrons.
  • the alkali halide with which the ETL is doped may improve characteristics of electron injection and transfer from the electrode to the LEL, and preferably, improve the life span of the device.
  • Examples of such an alkali halide includes at least one or a mixture of two or more selected from the group consisting of NaF, CsF, LiF, KF, MgF 2 and CaF 2 .
  • the content of the doped alkali halide in the ETL may be selected within a range in which device performance is not degraded.
  • the content of the doped alkali halide may be 0.1% by weight or more, based on the total weight of the ETL.
  • the content of the alkali halide is excessively low, it is difficult to expect the technical effects achieved by doping with the alkali halide.
  • the ETL may be doped with the alkali halide so that the alkali halide can have a concentration gradient according to the thickness of the ETL. Electron transfer characteristics may be further improved by sequentially increasing the doping amount of the alkali halide according to the thickness of the ETL, compared with when the entire region of the ETL is uniformly doped with the alkali halide.
  • the ETL may perform introduction and transfer of electrons at the same time.
  • a structure in which the EIL is not separately formed, or a structure in which the ETL and EIL are formed as one layer is provided. That is, such a structure may be a structure in which the ETL doped with the alkali halide and the second electrode come in direct contact with each other.
  • a case in which the EIL is formed as a separate layer is not excluded in the present invention.
  • the organic layer stacked in the organic electronic device according to the present invention includes an LEL and an ETL doped with an alkali halide.
  • the organic layer may include at least one layer selected from the group consisting of a hole injection layer (HIL), a hole transfer layer (HTL) and an electron injection layer (EIL), as necessary.
  • HIL hole injection layer
  • HTL hole transfer layer
  • EIL electron injection layer
  • some of the layers may be omitted or further provided, but the present invention is limited thereto.
  • an arylamine-based compound, a conductive polymer, or a block copolymer having both a conjugated region and a non-conjugated region may be used as the HTL or HIL.
  • the organic layer may have a structure in which the HIL, the HTL, the LEL, the ETL and the EIL are stacked.
  • the organic electronic device may include a metal wiring formed between the first electrode and the organic layer.
  • the metal wiring functions to compensate for a voltage drop of the first electrode. Accordingly, it is possible to uniformly apply a voltage to the entire surface of the first electrode.
  • a transparent electrode may be used as the first electrode.
  • ITO indium zinc oxide (IZO), SnO 2 , carbon nanotube (CNT) or grapheme
  • various kinds of metal thin films may be used as the second electrode.
  • an aluminum thin film may be used as the second electrode.
  • kinds of the first and second electrodes are not particularly limited, and various kinds of materials or shapes are applicable to the first and second electrodes.
  • the present invention provides a method of manufacturing the organic electronic device as described above.
  • the manufacturing method may include forming a scattering layer on a base material using a coating solution including a binder and scattering particles, and forming a planarization layer on the formed scattering layer to have a planarized surface.
  • the scattering layer may be formed using a method such as CVD, PVD or sol-gel coating.
  • the forming of the scattering layer may include coating the base material with a coating solution including an inorganic or organic/inorganic complex binder and scattering particles, and forming a matrix through condensation reaction of the binder included in the coating solution.
  • An uneven structure may be formed by the presence of the scattering particles during condensation of the binder included in the coating solution.
  • the planarization layer may be formed using a method such as CVD, PVD or sol-gel coating.
  • the forming of the planarization layer may include coating the scattering layer with a coating solution including an inorganic binder and a high-refractive index filler, and forming a matrix through condensation reaction of the binder included in the coating solution.
  • the present invention provides a method of manufacturing an organic electronic device using the substrate manufactured by the method as described above.
  • the manufacturing method also includes forming a first electrode on the substrate, forming an organic layer including an LEL on the first electrode, and forming a second electrode on the organic layer.
  • the forming of the organic layer includes forming an ETL doped with an alkali halide to have a thickness of 55 to 85 nm.
  • the forming of the organic layer may include forming at least one layer of an HIL, an HTL, and an EIL in addition to the ETL and the LEL on the first electrode.
  • the EIL may be omitted, or the EIL and ETL may be formed as one layer.
  • the organic layer may be composed of the HIL, the HTL, the LEL and the ETL. In this case, a case in which the EIL is formed as a separate layer is not excluded in the present invention.
  • the organic layer including the LEL may be repeatedly formed in a 2-stacked or 3-stacked structure.
  • a method of stacking the respective layers constituting an organic electronic device may be performed using methods known in the related art.
  • a method such as a deposition method or a solvent process may be applicable.
  • the solvent process include a spin coating, dip coating, doctor blading, screen printing, inkjet printing or thermal transfer method.
  • the ETL doped with the alkali halide is formed to have a thickness of 55 to 85 nm.
  • the organic electronic device according to one exemplary embodiment of the present invention may be manufactured using methods and materials known in the related art, except that the above-described ETL doped with the alkali halide is formed to have a thickness of 55 to 85 nm.
  • the organic electronic device according to the present invention includes a second electrode.
  • the second electrode may be formed by depositing a metal, a conductive metal oxide or an alloy thereof on a first ITO electrode having an organic layer formed thereon, using a physical vapor deposition (PVD) method such as sputtering or e-beam evaporation.
  • PVD physical vapor deposition
  • the organic electronic device according to the present invention includes an organic layer formed on the substrate.
  • the respective layers constituting the organic layer will be described in further detail, as follows.
  • An HIL or HTL is formed between an anode and an LEL to facilitate the transfer of holes.
  • the material constituting the HIL or HTL that may be used herein may include N,N'-diphenyl-N-N'-di(1-naphthyl)-benzidine (NPD), N,N'-diphenyl-N,N'-di(3-toly)-benzidine (TPD) or N,N'-diphenyl-amino)phenyl-N,N'-diphenylbenzidine (DNTPD).
  • NPD N,N'-diphenyl-N-N'-di(1-naphthyl)-benzidine
  • TPD N,N'-diphenyl-N,N'-di(3-toly)-benzidine
  • DNTPD N,N'-diphenyl-amino)phenyl-N,N'-diphenylbenzidine
  • the LEL may be classified into an n-type LEL, whereas, when the hole transfer is carried out at a higher rate than the electron transfer, the LEL may be classified into a p-type LEL.
  • the n-type LEL includes tris(8-hydroxyquinoline)aluminum (Alq 3 ), 8-hydroxyquinoline beryllium (BAlq), a benzoxazoline-based, benzthiazole-based or benzimidazole-based compound, a polyfluorene-based compound, a silylcyclopentadiene-based compound, etc.
  • the p-type LEL includes a carbazoline-based compound, an anthracene-based compound, a polyphenylene vinylene (PPV)-based polymer, or a spiro compound.
  • the ETL or EIL may be formed of a material having high electron mobility so as to effectively transfer electrons injected from a cathode to the LEL.
  • the ETL or EIL is not particularly limited, but includes an organic compound having an Alq 3 structure, a hydroxyflavone-metal complex compound, or a silylcyclopentadiene-based compound.
  • tris (8-hydroxyquinoline) aluminium (Alq 3 ), Bphen (4,7-diphenyl-1,10-phenanthroline) or 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline (BCP) may be, for example, used as the ETL.
  • FIG. 1 schematically shows a stacked structure of a substrate for an organic electronic device according to the present invention.
  • the substrate for an organic electronic device 100 used in the present invention includes a scattering layer including a binder 21 and scattering particles 30 formed on a base material 10.
  • the scattering layer has an uneven structure formed on a surface thereof opposite the base material 10.
  • a planarization layer 22 is formed on the uneven structure of the scattering layer.
  • An organic device is further stacked on the flat surface planarized by the planarization layer 22.
  • FIG. 2 schematically shows a stacked structure of an organic electronic device including the substrate for an organic electronic device according to one exemplary embodiment of the present invention.
  • the organic electronic device may be formed by sequentially forming a first electrode 40, an organic layer 50 including an LEL, and a second electrode 60 on the substrate 100 manufactured as shown in FIG. 1 .
  • the organic electronic device may further include an additional stacked structure to improve device characteristics, as necessary.
  • FIG. 3 is a schematic diagram showing a configuration in which the ETL and the EIL are formed on an electrode.
  • An EIL 302 may be further provided in addition to an ETL 301 so as to facilitate injection of electrons generated in an electrode 200 into an LEL.
  • electron transfer characteristics may be improved without using a separate EIL by forming a thick ETL 300 doped with an alkali halide 310 on the electrode 200, as shown in FIG. 4 .
  • the ETL 300 is formed to have a thickness of 55 to 85 nm.
  • the present invention provides an electronic device including the organic electronic device as described above.
  • the electronic device is not particularly limited, and, for example, includes lighting equipment or a display device.
  • TMOS Si(OCH 3 ) 4 , siloxane
  • a glass substrate was coated with the polymer bead-dispersed coating solution.
  • the coated coating solution was cured to form a scattering layer.
  • the scattering layer was coated with an inorganic binder (siloxane) having a high-refractive index filler (titanium dioxide) dispersed therein, and then dried to manufacture a substrate for an organic electronic device having a planarization layer formed thereon.
  • the substrate for an organic electronic device was manufactured so that a difference in refractive index between the planarization layer and the polymer beads reached 0.4 by adjusting the content of the high-refractive index filler during formation of the planarization layer.
  • a white OLED including a light-emitting region with a size of 2 ⁇ 2 mm 2 was manufactured by sequentially stacking a first transparent electrode, an organic layer, and a second electrode on the high-refractive index layer of the manufactured substrate for an organic electronic device.
  • ITO was used for the first transparent electrode
  • aluminum (Al) was used for the second electrode.
  • the organic layer was formed in a structure including an HIL, an HTL, an LEL, an ETL and an EIL.
  • the material used in each of the stacked structures was a material generally used for the manufacture of a white organic electronic device, and a method of forming a stacked structure was also performed using a conventional method.
  • a substrate was manufactured in the same manner as in Example 1, except that the scattering particles were used at an amount of 1.5 g, and the difference in refractive index between the polymer beads and the planarization layer was adjusted to 0.8 during preparation of the coating solution. Thereafter, an organic electronic device was formed on the manufactured substrate.
  • a substrate was manufactured in the same manner as in Example 1, except that TEOS (Si(OC 2 H 5 ) 4 , siloxane) was used as the binder during the manufacture of the substrate for an organic electronic device. Thereafter, an organic electronic device was manufactured using the manufactured substrate.
  • TEOS Si(OC 2 H 5 ) 4 , siloxane
  • a substrate was manufactured in the same manner as in Example 1, except that methyl methacrylate was used instead of the siloxane, and the difference in refractive index between the planarization layer and the polymer beads was adjusted to 0.2 during the manufacture of the substrate for an organic electronic device. Thereafter, an organic electronic device was manufactured using the manufactured substrate.
  • a substrate was manufactured in the same manner as in Example 1, except that the difference in refractive index between the planarization layer and the polymer beads was adjusted to 0.2 during the manufacture of the substrate for an organic electronic device. Thereafter, an organic electronic device was manufactured using the manufactured substrate.
  • the organic electronic devices manufactured in Examples 1 and 2 and Comparative Example 1 were measured for light extraction efficiency with the purpose of comparison. More particularly, each of the organic electronic devices was driven under a drive condition such as a constant current of 0.4 mA, and the velocity of extracted light was measured to evaluate light extraction efficiency.
  • the measurement results are listed in the following Table 1.
  • Na represents a refractive index of scattering particle
  • Nb represents a refractive index of a planarization layer
  • N.A. means that there is no substantial difference in refractive index.
  • a transparent IZO first electrode having a thickness of 100 nm was formed on the substrate manufactured in Example 1 using a sputtering method. And an HIL having a thickness of 50 nm was formed by depositing a hexanitrile hexaazatriphenylene (HAT) material under a thermal vacuum. An HTL having a thickness of 40 nm was formed by vacuum-depositing N,N'-diphenyl-N-N'-di(1-naphthyl)-benzidine (NPD) on the HIL, and an LEL having a thickness of 30 nm was then formed by vacuum-depositing tris(8-hydroxyquinoline)aluminum (Alq 3 ).
  • HAT hexanitrile hexaazatriphenylene
  • the manufactured ETL was formed to have a thickness of 55 nm by doping the tris(8-hydroxyquinoline)aluminum (Alq 3 ) with LiF at a content of 10% (w/w).
  • An aluminum electrode having a thickness of 175 nm was formed on the ETL.
  • An organic electronic device was manufactured in the same manner as in Example 4, except that ETLs were formed to have thicknesses of 70 nm and 85 nm, respectively.
  • An organic electronic device was manufactured in the same manner as in Example 4, except that an ETL was formed to have a thickness of 35 nm.
  • An organic electronic device was manufactured in the same manner as in Example 4, except that an ETL was formed to have a thickness of 140 nm.
  • Luminous intensity was determined by attaching a semi-spherical lens having a refractive index of 1.52 to a light emitting surface of an organic electronic device, and measuring the intensity of light emitted from the organic electronic device using an integrating sphere. The measurement results are shown in FIG. 5 .
  • the organic electronic device according to the present invention has advantages in that light-extraction efficiency can be improved and the manufacturing process can be simplified without degrading device performance, and thus can be widely applied in fields such as displaying or lighting.
  • the substrate for an organic electronic device according to the present invention can be useful in improving light extraction efficiency, and the organic electronic device including the substrate has advantages in that light-extraction efficiency can be improved and the manufacturing process can be simplified without degrading device performance.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optical Elements Other Than Lenses (AREA)
EP11823755.1A 2010-09-06 2011-09-06 Organic electronic device and method of manufacturing the same Active EP2600431B1 (en)

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KR20100087090 2010-09-06
KR1020110012493A KR20120024358A (ko) 2010-09-06 2011-02-11 유기전자소자용 기판 및 그 제조방법
PCT/KR2011/006579 WO2012033322A2 (ko) 2010-09-06 2011-09-06 유기전자소자용 기판 및 이를 포함하는 유기전자소자

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Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6223341B2 (ja) * 2011-08-31 2017-11-01 オーエルイーディーワークス ゲーエムベーハーOLEDWorks GmbH 出射結合デバイスおよび光源
KR20130108028A (ko) * 2012-03-23 2013-10-02 주식회사 엘지화학 유기발광소자
KR101628010B1 (ko) * 2012-03-23 2016-06-08 엘지디스플레이 주식회사 유기전자장치용 기판의 제조 방법
KR20130108027A (ko) 2012-03-23 2013-10-02 주식회사 엘지화학 유기전자소자용 기판의 제조방법
JP5956673B2 (ja) * 2012-03-30 2016-07-27 エルジー ディスプレイ カンパニー リミテッド 有機電子素子用基板、有機電子装置、基板の製造方法及び照明
KR101421026B1 (ko) * 2012-06-12 2014-07-22 코닝정밀소재 주식회사 유기발광소자용 광추출층 기판 및 그 제조방법
KR101715112B1 (ko) 2012-06-14 2017-03-10 쌩-고벵 글래스 프랑스 Oled 소자용 적층체, 그 제조방법 및 이를 구비한 oled 소자
KR101447216B1 (ko) * 2012-07-20 2014-10-06 주식회사 창강화학 산란체를 포함하는 렌즈 어레이 및 이를 포함하는 유기 발광 표시 장치
CN104508854B (zh) * 2012-07-31 2017-12-01 株式会社Lg化学 用于有机电子器件的基板
WO2014021644A1 (ko) * 2012-07-31 2014-02-06 주식회사 엘지화학 유기전자소자용 기판
WO2014021642A1 (ko) * 2012-07-31 2014-02-06 주식회사 엘지화학 유기전자소자용 기판
JPWO2014064835A1 (ja) * 2012-10-26 2016-09-05 パイオニア株式会社 発光装置
EP2917949A1 (en) 2012-11-09 2015-09-16 Koninklijke Philips N.V. Light emitting device with improved internal out-coupling and method of providing the same
TWI506836B (zh) 2012-11-14 2015-11-01 Lg Chemical Ltd 透明導電膜及包含其之有機發光裝置
US9660155B2 (en) 2012-11-28 2017-05-23 Lg Chem, Ltd. Light emitting diode
CN103855310A (zh) * 2012-11-30 2014-06-11 海洋王照明科技股份有限公司 有机电致发光装置及其制备方法
TWI535088B (zh) * 2012-11-30 2016-05-21 Lg化學股份有限公司 用於有機電子裝置之基板
KR101466830B1 (ko) * 2013-05-06 2014-11-28 코닝정밀소재 주식회사 유기발광소자용 광추출 기판 제조방법
KR101468972B1 (ko) * 2013-06-04 2014-12-04 코닝정밀소재 주식회사 광산란층이 형성된 기판의 제조방법과 이에 의해 제조된 광산란층이 형성된 기판, 및 상기 광산란층이 형성된 기판을 포함하는 유기발광소자
EP2814078B1 (en) * 2013-06-14 2016-02-10 Saint-Gobain Glass France Transparent diffusive oled substrate and method for producing such a substrate
KR101466831B1 (ko) 2013-07-03 2014-11-28 코닝정밀소재 주식회사 유기발광소자용 광추출 기판, 그 제조방법 및 이를 포함하는 유기발광소자
KR101488660B1 (ko) * 2013-08-14 2015-02-02 코닝정밀소재 주식회사 유기발광소자용 기판, 그 제조방법 및 이를 포함하는 유기발광소자
KR20150024189A (ko) * 2013-08-26 2015-03-06 주식회사 엘지화학 플렉서블 기판의 제조방법 및 이를 포함하는 유기 발광 소자의 제조방법
KR101470295B1 (ko) * 2013-09-12 2014-12-08 코닝정밀소재 주식회사 유기발광소자용 광추출 기판, 그 제조방법 및 이를 포함하는 유기발광소자
KR101928598B1 (ko) 2013-09-30 2018-12-12 주식회사 엘지화학 폴리이미드 필름 및 그 제조방법
JP6361994B2 (ja) * 2013-12-04 2018-07-25 エルジー・ケム・リミテッド 有機電子装置用基板の製造方法
KR102054528B1 (ko) * 2014-01-06 2019-12-10 주식회사 엘지화학 투명 도전성막 및 이를 포함하는 유기 발광 소자
KR101824353B1 (ko) * 2014-03-10 2018-01-31 코니카 미놀타 가부시키가이샤 전계 발광 소자, 조명 장치, 및 전계 발광 소자의 제조 방법
US10205127B2 (en) * 2014-07-04 2019-02-12 Nec Lighting, Ltd. Organic EL panel-use transparent resin layer, organic EL panel, organic EL lighting device, and organic EL display
KR101650541B1 (ko) * 2014-09-23 2016-08-23 코닝정밀소재 주식회사 플렉서블 기판 및 그 제조방법
KR101762642B1 (ko) * 2014-09-25 2017-07-31 코닝정밀소재 주식회사 유기발광소자용 광추출 기판 및 이를 포함하는 유기발광소자
WO2016047970A2 (ko) * 2014-09-25 2016-03-31 코닝정밀소재 주식회사 유기발광소자용 광추출 기판 및 이를 포함하는 유기발광소자
KR101579457B1 (ko) * 2014-12-22 2015-12-22 코닝정밀소재 주식회사 유기발광소자용 광추출 기판 제조방법, 유기발광소자용 광추출 기판 및 이를 포함하는 유기발광소자
KR102028142B1 (ko) * 2014-12-31 2019-10-02 엘지디스플레이 주식회사 유기전자소자용 기판
WO2016117924A1 (ko) * 2015-01-21 2016-07-28 코닝정밀소재 주식회사 유기발광장치용 광추출 기판 및 이를 포함하는 유기발광장치
KR101866243B1 (ko) 2015-01-21 2018-06-12 코닝정밀소재 주식회사 유기발광소자용 광추출 기판 및 이를 포함하는 유기발광소자
KR101957756B1 (ko) * 2016-02-19 2019-03-14 율촌화학 주식회사 유기 발광 소자 광추출층, 이를 이용하는 유기 발광 소자 및 그 제조 방법
CN106206983A (zh) 2016-08-18 2016-12-07 深圳市华星光电技术有限公司 一种有机发光二极管结构
CN106098742A (zh) * 2016-08-18 2016-11-09 信利(惠州)智能显示有限公司 有机发光显示装置及制造方法
KR102309894B1 (ko) 2017-03-14 2021-10-07 삼성디스플레이 주식회사 발광 소자 및 이를 포함하는 표시 장치
CN107942421A (zh) * 2017-11-30 2018-04-20 宁波激智科技股份有限公司 一种光学扩散膜及其制备方法
KR102418724B1 (ko) * 2017-12-05 2022-07-08 삼성디스플레이 주식회사 표시 장치 및 그 제조방법
CN108550614B (zh) * 2018-05-31 2020-03-13 上海天马有机发光显示技术有限公司 有机发光显示面板及其显示装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW574110B (en) * 2001-10-25 2004-02-01 Matsushita Electric Works Ltd Composite thin film holding substrate, transparent conductive film holding substrate, and panel light emitting body
JP2007134339A (ja) 2001-10-25 2007-05-31 Matsushita Electric Works Ltd 面発光体
US7012363B2 (en) 2002-01-10 2006-03-14 Universal Display Corporation OLEDs having increased external electroluminescence quantum efficiencies
WO2004074399A1 (ja) * 2003-02-20 2004-09-02 Idemitsu Kosan Co., Ltd. 有機エレクトロルミネッセンス素子用材料及びそれを用いた有機エレクトロルミネッセンス素子
KR100999974B1 (ko) 2003-03-12 2010-12-13 미쓰비시 가가꾸 가부시키가이샤 일렉트로루미네센스 소자
JP2004327070A (ja) 2003-04-21 2004-11-18 Seiko Epson Corp 表示装置及び方法
US7638807B2 (en) * 2003-10-28 2009-12-29 Sumitomo Metal Mining Co., Ltd. Transparent conductive multi-layer structure, process for its manufacture and device making use of transparent conductive multi-layer structure
KR20120127515A (ko) 2004-05-26 2012-11-21 닛산 가가쿠 고교 가부시키 가이샤 면발광체
JP4177788B2 (ja) * 2004-06-09 2008-11-05 株式会社東芝 有機エレクトロルミネッセンス素子およびその製造方法
JP2007294901A (ja) * 2006-03-31 2007-11-08 Canon Inc 有機発光素子
JP2007287486A (ja) * 2006-04-17 2007-11-01 Aitesu:Kk 透明基板と電極の間に微細構造体を有する有機el素子
US20090015142A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Light extraction film for organic light emitting diode display devices
JP2009070814A (ja) 2007-08-21 2009-04-02 Fujifilm Corp 散乱部材を有する有機エレクトロルミネッセンス表示装置
KR20090019752A (ko) 2007-08-21 2009-02-25 후지필름 가부시키가이샤 산란 부재 및 그것을 사용하는 유기 일렉트로루미네선스 표시 장치
KR20100063729A (ko) 2007-08-27 2010-06-11 파나소닉 전공 주식회사 유기 이엘 소자
JP5054464B2 (ja) * 2007-08-27 2012-10-24 パナソニック株式会社 有機el発光素子
WO2010039009A2 (ko) 2008-10-01 2010-04-08 주식회사 엘지화학 유기발광소자 및 이의 제조방법
US20100110551A1 (en) * 2008-10-31 2010-05-06 3M Innovative Properties Company Light extraction film with high index backfill layer and passivation layer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

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JP5656176B2 (ja) 2015-01-21
KR101427453B1 (ko) 2014-08-08
EP2600431A4 (en) 2014-07-02
KR20120024510A (ko) 2012-03-14
WO2012033322A2 (ko) 2012-03-15
CN103201869A (zh) 2013-07-10
US9257675B2 (en) 2016-02-09
CN103201869B (zh) 2016-06-15
WO2012033322A3 (ko) 2012-05-03
KR20120024358A (ko) 2012-03-14
EP2600431A2 (en) 2013-06-05
KR20140032471A (ko) 2014-03-14
US20140014923A1 (en) 2014-01-16
JP2013539182A (ja) 2013-10-17

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