EP2593577A2 - Procédé de revêtement d'un substrat au moyen d'un arc électrique - Google Patents

Procédé de revêtement d'un substrat au moyen d'un arc électrique

Info

Publication number
EP2593577A2
EP2593577A2 EP11748597.9A EP11748597A EP2593577A2 EP 2593577 A2 EP2593577 A2 EP 2593577A2 EP 11748597 A EP11748597 A EP 11748597A EP 2593577 A2 EP2593577 A2 EP 2593577A2
Authority
EP
European Patent Office
Prior art keywords
substrate
target material
reactive gas
evaporator
arc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11748597.9A
Other languages
German (de)
English (en)
Inventor
Oliver Kayser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DREISTEGEN GmbH
HOEDTKE GmbH and Co KG
Original Assignee
DREISTEGEN GmbH
HOEDTKE GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44510911&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP2593577(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by DREISTEGEN GmbH, HOEDTKE GmbH and Co KG filed Critical DREISTEGEN GmbH
Publication of EP2593577A2 publication Critical patent/EP2593577A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
    • C25B11/042—Electrodes formed of a single material
    • C25B11/046—Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32614—Consumable cathodes for arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating

Definitions

  • the invention relates to a method for coating a substrate by means of an arc according to the type specified in the preamble of claim 1 and to an evaporator of a vacuum chamber for carrying out a method for coating a substrate by means of an arc in a vacuum chamber at low pressure.
  • Methods for coating a substrate by means of an arc in a vacuum chamber at low pressure - arc evaporation - have been known for a long time.
  • Arc evaporation or Arc PVD belongs to the ion-plating PVD process. In this process, an arc burns between the chamber and the target material lying at negative potential, which causes the
  • Target material melts and evaporates.
  • the target material thus forms the cathode.
  • the molten and vaporized target material reacts with reactive gas introduced into the vacuum chamber and settles on the substrate, ie on the workpiece to be coated in the vacuum chamber.
  • reactive gas introduced into the vacuum chamber and settles on the substrate, ie on the workpiece to be coated in the vacuum chamber.
  • arc evaporation much of the vaporized material is ionized.
  • the material vapor spreads starting from the target material. Since a negative potential is additionally applied to the substrate-negative bias voltage-the ionized material vapor is first accelerated toward the substrate. At the substrate surface, the material vapor condenses.
  • a high kinetic energy can be introduced into the metal vapor by means of appropriate voltages on the substrate and on the target, so that a more or less pronounced voltage effect can be achieved at the substrate. This is exploited inter alia to influence the properties of the deposited layer, such as layer adhesion, density,
  • Such layers are required for wear protection to produce antibonding surfaces or for corrosion protection on tools and components.
  • the arc evaporation takes place in vacuum chambers at reduced total pressure, see WO 2009/110830 A1.
  • the chambers used for this purpose usually have small dimensions, so that larger components usually can not be coated. Since the deposition from individual round sources takes place in the chamber wall, the arc evaporation offers ideal conditions for high scalability in large Vakuumkammem.
  • Deposition of these metals in the arc process requires operation with comparatively high fuel currents, namely over 100 amperes, and at high burning voltages of often more than 20 V.
  • Such coatings are also required for electrodes.
  • Such catalytically active coatings consist of refractory metal with a high oxygen content. If such layers were produced by arc evaporation, very high arc currents would be necessary, which leads to high evaporation rates and thus to an insufficient reaction with the reactive gas.
  • Catalytically active layers for electrodes are technically with
  • the evaporator with the target material serves as the cathode and the inner wall vacuum chamber as the anode. Between the Target material and the inner wall of the vacuum chamber, the arc is generated.
  • Vacuum chamber prevails low pressure, that is usually a pressure of 0.05 to 2.00 Pa.
  • the invention is based on the object, a method for coating a substrate by means of an arc in a vacuum chamber according to the type specified in the preamble of claim 1 such that as possible with respect to the mixing effective compounds of refractory metals on the one hand and components the supplied reactive gases can be realized on the other side.
  • This object is solved by the characterizing features of claim 1 in conjunction with its preamble features.
  • the invention is based on the finding that an improved mixing of the
  • layer-forming metal and reactive gas can be achieved by increasing the pressure.
  • Chlorine / Alkali Electrolysis for the large-scale production of chlorine and caustic soda.
  • overvoltage in particular by coatings with ruthenium oxide. These coatings have been applied mechanically as a liquid film and then baked. This process is characterized by a low expenditure on equipment.
  • the thickness of the applied film is closely related to the toughness and surface energy of the applied liquid on one side of the execution of the mechanical application.
  • the thermal aftertreatment expels volatile binder and solidifies the coating.
  • the target material used is refractory metal for electrically active surfaces and / or for catalysis and the pressure in the vacuum chamber is during the
  • a layer of electrically active metal with a high oxygen content and / or of catalytically active metal with a high oxygen content is formed on the substrate. Due to the pressure range, the collision rate between the layer-forming metal and the reactive gas is increased sufficiently and only a lower fuel flow is necessary, which in turn results in a lower evaporation rate and thus an improved mixing and reaction of the layer-forming metal with the reactive gas. An improved saturation of the layer-forming Metal vapor with reactive gas is achieved by deposition at this relatively high total pressure in the vacuum chamber. This results in a high probability of collision between vaporized layer-forming metal and reactive gas. As a further consequence, the proportion of pure metal in the layer can advantageously be further reduced. This saves additional material costs, in addition to the significantly lower fuel flow.
  • Electrically active surfaces are necessary for catalysis but also for low-loss power supply in batteries, i. E. low-loss transitions from the electrolyte to the electrode.
  • electrically active surface refers to surfaces with defined electrical properties in terms of electrical resistance and electrolytic overvoltage for electrical applications.
  • pure oxygen - 02 - or a gas with a high oxygen content is used as the reactive gas as the reactive gas.
  • refractory metal for example for electrodes, ruthenium, iridium, titanium, platinum or mixtures thereof has been proven.
  • the target material used is refractory metal in the form of ruthenium, iridium, titanium, platinum or mixtures thereof.
  • the fuel flow is at least 65 amps, preferably 75 amps.
  • Arc not greater than 100 amps.
  • the Reaktjvgas supplied directly to the evaporator to the target material during the coating process is preferably uniformly supplied in a ring-shaped manner to the target material distributed over the ring.
  • a negative voltage is applied to the substrate, that is to say to the workpiece to be coated. Due to the high degree of ionization during arc evaporation, the layer-forming particles are accelerated onto the substrate via this negative voltage, which leads to a significantly improved layer adhesion. For this reason, can be dispensed with adhesion promoter layers in the coating.
  • the method is used for the coating of electrodes which are preferably used for the electrolysis, and above all before the chlor-alkali electrolysis.
  • the catalytically active layers are characterized by a high oxygen content. It is well known that oxygen in the chamber is associated with low adhesion of the layers. Although oxygen-containing coatings from the deposition of chromium and aluminum oxide are known. In this method, the adhesive strength is ensured by the deposition at high temperatures> 400-500 e C. This exploits the fact that high deposition temperatures usually always lead to a better connection. However, the deposition of large-area catalytic coatings at homogeneously high temperatures is associated with considerable expenditure on equipment. An additional problem is tension due to the different thermal expansion of substrate and layer. With typical dimensions of 1, 2 x 2.7 m add up These tensions so much that the applied coating is blasted off. Deposition at high temperatures offers no solution, unlike small-sized cutting tools.
  • the adhesion of PVD layers is greatly degraded by impurities and natural oxides.
  • impurities may have electrical barrier character.
  • Optimum cleaning is achieved by blasting with hard corundum. At least the natural oxidation after cleaning the surface and before applying the coating can not be avoided.
  • the mechanical application of catalytic coatings involves the risk of the formation of barrier layers or insufficient attachment to the base material.
  • Degradation of the native oxide is accomplished in the arc vaporization described herein by bubbling in an argon and hydrogen mixture.
  • the argon is the task of purely mechanical sputtering while hydrogen is used for the chemical reduction of the oxide film.
  • the arc evaporation additionally causes a high degree of ionization of the layer-forming species of over 90%. Thus, almost all layer-forming vapor particles on the
  • the reactive gas e.g. O2
  • the evaporator must be operated at an increased by about 30% fuel flows. This effect makes it difficult to build evaporators of small size.
  • the use of small evaporators is, however, because of the lighter
  • high reactive gas saturation may be realized by direct inlet through annular nozzles disposed around the evaporator, as will be described later in detail.
  • the high reactive gas content allows the
  • the material to be evaporated can be completely saturated with reactive gas.
  • the arc evaporation is thus characterized by a high flexibility in the layer composition.
  • the composition of the layers with increasing layer thickness of metallic oxide can be changed by the reactive gas inlet - oxygen - is increased. Such transitions can improve the operation of the catalytic layers or be exploited as wear protection indicator.
  • the object is achieved by an evaporator
  • Vacuum chamber for carrying out a method for coating a substrate by means of an arc in a vacuum chamber at low pressure - arc vaporization achieved in that the reactive gas supply is arranged annularly around the target material and at regular intervals gas outlet openings thereby also an intensive mixing of layer-forming material and reactive gas guaranteed. This will be despite the high
  • the reactive gas supply is axially and radially and spaced apart from the target material, so that there is no impairment of the arc during the arc evaporation
  • the distance and the ring shape must be chosen so large that a short circuit is avoided, the reactive gas supply is not overheated and a shutdown of the evaporator will not occur.
  • the reactive gas outlet openings have in particular a same opening cross-section. Due to the annular supply of the reactive gas, the oxide formation of the vapor phase on the cathode surface, ie on the surface of the target material, moved. In particular, a finer distribution of arcs on the cathode surface occurs. This allows a reduction of the fuel flow. A reduction of the fuel flow leads to a lowering of the temperature of the cathode surface. As a result, lower evaporation rates of the layer-forming material can be adjusted. Lower evaporation rates in turn allow an improved reaction of layer-forming metal and reactive gas.
  • Fig. 1 is a sectional view through two juxtaposed in a vacuum chamber
  • Fig. 2 is a perspective oblique view of the two evaporators of Fig. 1;
  • Fig. 3 is a plan view of the carrier with evaporators, and
  • Fig. 4 is a plan view of the annular reactive gas supply.
  • FIG. 1 shows a sectional view through two evaporators 12, 14 arranged side by side in a vacuum chamber 10. Process for coating a substrate by means of an arc in a vacuum chamber at low-pressure arc vaporization
  • the sectional line is shown in FIG. 3, line A-A.
  • the vacuum chamber 10 may include a plurality of evaporators 12, 14. Both evaporators 12, 14 are formed corresponding to each other.
  • Each evaporator 12, 14 has a base body 16, on which a target carrier 18 with
  • Target material 20 is held on the base body 16 via a quick-release fastener 22.
  • Cooling channels 24 for cooling the target carrier 18 and above the target material 20 during the arc evaporation are introduced into the base body 16.
  • the evaporators 12, 14 are placed in an evaporator support 26 and fixedly connected thereto.
  • the evaporator support 26, the evaporators 12, 14 adapted recesses 28 and connected to the evaporator support 26 on one side and the associated evaporator 12, 14 on the other side connected to the evaporator receptacles 30.
  • the cooling channels 24 extend almost over the entire, the main body 16 facing side of the target carrier 18 and are connected to a cooling port 32.
  • the main body 16 is connected to a power connection 34, so that the main body 16, the target carrier 18 and the target material 20 can be acted upon by a negative potential, so that the target material 20 acts as a cathode.
  • the evaporator support 26 is screwed to a chamber wall 36 of the vacuum chamber 10, wherein between the evaporator support 26 and chamber wall 36, an insulation 38 is introduced.
  • the screw 40 is insulated from the evaporator support 26.
  • the evaporator support 26 is completely isolated from the chamber wall 36 of the vacuum chamber 10.
  • Base 16 connected via a further screw 42.
  • On the quick release 22 and around the target material 20 around a ring 44 is arranged, which consists of Bohr nitrite.
  • the ring 44 and the target material 20 form a common plane 46.
  • the surface of a shield plate 48 is arranged, which surrounds the evaporator 12, 14 respectively in the region of the target material 20.
  • the shield plate 48 is connected to the evaporator support 26 via
  • a reactive gas supply 52, 54 for each evaporator 12, 14 is provided.
  • the reactive gas feeds 52, 54 are each formed corresponding to one another, see FIG. 2.
  • the reactive gas feeds 52, 54 are connected via corresponding connections 56, 58 with a
  • Reactive gas supply line 60 connected.
  • the evaporator support 26 with six evaporators 12, 14, 62, 64, 66, 68 is shown. Depending on the dimensioning, more or fewer evaporators 12, 1, 62, 64, 66, 68 may also be arranged in an evaporator carrier 26. It is also possible to design the evaporator support 26 for, for example, six evaporators 12, 14, 62, 64, 66, 68, but to use four evaporators. The unused evaporators are not installed, but only a plate not shown here, the recess 28 introduced.
  • a plurality of evaporator supports 26 may be mounted with a plurality of evaporators 12, 14, 62, 64, 66, 68. 4, the reactant gas feed 52 is shown, which corresponds to the other reactive gas feeds 54 and to the reactive gas feeds, which are not designated in more detail by reference numbers.
  • the reactant gas feed 52 is shown, which corresponds to the other reactive gas feeds 54 and to the reactive gas feeds, which are not designated in more detail by reference numbers.
  • Reactjvgaszu Set 52 is annular and has evenly spaced
  • the Reaktjvgaszu Adjustment 52 is aligned parallel to the plane 46 and with respect to the cylindrical formation of the target material 20 to this axially and radially spaced so that no impairment of the arc during the
  • the reactive gas outlet openings 70 have the same opening cross-section. About the
  • Reactive gas feeds 52, 54 is supplied with oxygen, wherein as the target material 20 a
  • refractory metal is used for catalysis, namely ruthenium.
  • a pressure in the vacuum chamber 10 of at least 3 Pa is set, preferably 5 Pa.
  • a control and regulating device is provided, which controls the vacuum pump not shown here accordingly.
  • the fuel flow is at least 65 amperes, preferably 75 amps and thus significantly below 100 amperes.
  • a negative bias voltage is applied to improve the layer adhesion.
  • electrodes for the electrolysis especially for the chlor-alkali electrolysis, prepared in which the electrodes are a layer of an electrically active and at the same time catalytically active metal with a high oxygen content exhibit.

Abstract

L'invention concerne un procédé et un évaporateur (12, 14, 62, 64, 66, 68) destinés au revêtement d'un substrat par arc électrique dans une chambre à vide (10) avec évaporation par arc électrique à faible pression. La chambre à vide (10) comprend au moins un évaporateur (12, 14, 62, 64, 66, 68) comportant un matériau cible (20), des conduites de gaz réactif (53, 54) pour l'alimentation en gaz réactif et une pompe à vide. L'évaporateur (12, 14, 62, 64, 66, 68) avec le matériau cible (20) sert de cathode et la paroi interne (36) de la chambre à vide (10) sert d'anode, entre lesquels est généré l'arc électrique. Selon l'invention, du métal à point de fusion élevé est utilisé comme matériau cible (20) pour la catalyse, et la pression dans la chambre à vide (10), pendant le revêtement, s'élève à au moins 0,5 Pa, notamment à au moins 3 Pa, et de préférence à 5 Pa. Sur le substrat est formée une couche de métal catalytiquement actif à teneur élevé en oxygène.
EP11748597.9A 2010-07-12 2011-07-12 Procédé de revêtement d'un substrat au moyen d'un arc électrique Withdrawn EP2593577A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010036332A DE102010036332B4 (de) 2010-07-12 2010-07-12 Verfahren zum Beschichten von Elektroden für die Elektrolyse mittels eines Lichtbogens
PCT/EP2011/061873 WO2012007469A2 (fr) 2010-07-12 2011-07-12 Procédé de revêtement d'un substrat au moyen d'un arc électrique

Publications (1)

Publication Number Publication Date
EP2593577A2 true EP2593577A2 (fr) 2013-05-22

Family

ID=44510911

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11748597.9A Withdrawn EP2593577A2 (fr) 2010-07-12 2011-07-12 Procédé de revêtement d'un substrat au moyen d'un arc électrique

Country Status (8)

Country Link
US (1) US20130146445A1 (fr)
EP (1) EP2593577A2 (fr)
JP (1) JP2013532234A (fr)
KR (1) KR20130126586A (fr)
CN (1) CN103003466A (fr)
DE (1) DE102010036332B4 (fr)
EA (1) EA201390092A1 (fr)
WO (1) WO2012007469A2 (fr)

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Publication number Priority date Publication date Assignee Title
WO2017033994A1 (fr) * 2015-08-25 2017-03-02 国立大学法人熊本大学 Catalyseur sous forme de feuille métallique, procédé de fabrication de celui-ci et convertisseur catalytique
JP7419107B2 (ja) * 2020-02-28 2024-01-22 いすゞ自動車株式会社 触媒用部材の製造方法

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JPH0215162A (ja) * 1988-06-30 1990-01-18 Nippon Sheet Glass Co Ltd 酸化チタン被膜の形成方法
JPH03141104A (ja) * 1989-10-24 1991-06-17 Sumitomo Electric Ind Ltd 複合酸化物超電導薄膜の作製方法
JPH03147312A (ja) * 1989-11-01 1991-06-24 Nippon Chemicon Corp 電解コンデンサ用アルミニウム電極の製造方法
GB9316926D0 (en) * 1993-08-13 1993-09-29 Ici Plc Electrode
JP3287163B2 (ja) * 1995-01-23 2002-05-27 日新電機株式会社 アーク式蒸発源
JP2000096212A (ja) * 1998-09-28 2000-04-04 Sumitomo Electric Ind Ltd 光触媒膜被覆部材およびその製造方法
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Also Published As

Publication number Publication date
DE102010036332B4 (de) 2012-02-23
EA201390092A1 (ru) 2013-11-29
DE102010036332A1 (de) 2012-01-12
US20130146445A1 (en) 2013-06-13
JP2013532234A (ja) 2013-08-15
WO2012007469A3 (fr) 2012-03-08
KR20130126586A (ko) 2013-11-20
CN103003466A (zh) 2013-03-27
WO2012007469A2 (fr) 2012-01-19

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