EP2559936A1 - Kraftfahrzeugbeleuchtungseinrichtung - Google Patents

Kraftfahrzeugbeleuchtungseinrichtung Download PDF

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Publication number
EP2559936A1
EP2559936A1 EP12175839A EP12175839A EP2559936A1 EP 2559936 A1 EP2559936 A1 EP 2559936A1 EP 12175839 A EP12175839 A EP 12175839A EP 12175839 A EP12175839 A EP 12175839A EP 2559936 A1 EP2559936 A1 EP 2559936A1
Authority
EP
European Patent Office
Prior art keywords
semiconductor light
light sources
type
headlamp
illuminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP12175839A
Other languages
German (de)
English (en)
French (fr)
Inventor
Kamislav Fadel
Michael Hamm
Wolfgang Hossfeld
Christian Buchberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Automotive Lighting Reutlingen Germany GmbH
Original Assignee
Automotive Lighting Reutlingen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Automotive Lighting Reutlingen GmbH filed Critical Automotive Lighting Reutlingen GmbH
Publication of EP2559936A1 publication Critical patent/EP2559936A1/de
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F21S41/153—Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/18—Combination of light sources of different types or shapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/285—Refractors, transparent cover plates, light guides or filters not provided in groups F21S41/24 - F21S41/2805
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/40—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by screens, non-reflecting members, light-shielding members or fixed shades

Definitions

  • the invention relates to a headlamp for a motor vehicle, with at least two semiconductor light sources and with light-refractive and / or reflective optical means, which are adapted and arranged to direct light of at least two semiconductor light sources in an apron of the headlamp, that there is a rule-compliant Adjusting the light distribution, and wherein the at least two semiconductor light sources and the optical means are arranged so that one of a first of the at least two semiconductor light sources illuminated portion of the light distribution is not identical to one of a second of the at least two semiconductor light sources illuminated portion of the light distribution.
  • Such a headlight is from the EP 1 357 332 A2 known.
  • a differentiation is made in lighting devices for motor vehicles between lights and headlights.
  • Lights serve others To signal to road users the presence and / or the behavior of a motor vehicle and / or the intentions of its driver. Examples of lights are brake lights, turn signals and position lights, without this being to be understood as a final list.
  • the task or ability of a component to generate light distributions is also referred to as a light function.
  • a lighting device mainly serving as a headlight its headlight lighting functions are also referred to as main functions. Thus, they can be distinguished from other light functions provided by the same lighting device, for example when it also fulfills signal light functions.
  • light-emitting diodes are used as semiconductor light sources, which are supplied preassembled on a support and which generate relatively high luminous fluxes with comparatively high electric currents. While light-generating filaments of incandescent lamps or arcs of gas discharge lamps become very hot during operation (magnitude 2 to 3 times 10 3 degrees) and therefore emit comparatively much heat with the visible light, semiconductor light sources emit their light at much lower temperatures (order of magnitude 1 to less as 2 times 10 2 degrees). Semiconductor light sources can be realized both as a single emitter and as an array of structurally combined individual emitters.
  • the aforementioned EP 1 357 332 A2 relates in this context an optical efficiency.
  • This document already shows a relatively compact constructed light module for a motor vehicle headlight, wherein the light module has a arranged on an optical axis of the light module semiconductor light source in the form of a light emitting diode. Light of the light emitting diode is emitted substantially orthogonally to the optical axis of the light module and then bundled by a realized as a half shell reflector primary optics on an edge of a mirrored and horizontal in the motor vehicle and arranged at the height of the optical axis of the light module aperture.
  • the invention differs in that a first Semiconductor light source of the at least two semiconductor light sources of a first type and a second semiconductor light source of the at least two semiconductor light sources of a second type, wherein the first type and the second type differ in that their semiconductor light sources have different luminous fluxes and a different efficiency.
  • a common heat sink is used for all semiconductor light sources of a light module.
  • a further refinement is characterized in that the optical means for each of the at least two light sources have an attachment optics and a secondary optics common to a plurality of semiconductor light sources, wherein the attachment optics are each adapted to collect light from a semiconductor light source and directly and / or indirectly to the Secondary optics, and with the secondary optics arranged to direct incident light into the fore-beam of the headlamp.
  • the attachment optics are light collecting TIR optics or additional lenses.
  • the optical means have a diaphragm.
  • the diaphragm is preferably a mirror diaphragm which is set up and arranged to reflect light of the semiconductor light sources incident on a mirrored surface onto the secondary optics.
  • the light distribution in the apron of the headlight has a central partial area and peripheral partial areas surrounding the central partial area, wherein the central partial area is illuminated by at least one semiconductor light source of the first type.
  • At least one peripheral portion is illuminated by at least one semiconductor light source of the second type.
  • the left side illumination area and the right side illumination area as well as the central maximum area are each illuminated with two semiconductor light sources, while the remaining partial areas are each illuminated with a semiconductor light source. Furthermore, it is preferred that the central maximum area of two semiconductor light sources of the first type is illuminated. It is also preferable that the left side illumination area and the right side illumination area are illuminated by two semiconductor light sources of the second type or each of a semiconductor light source of the first type and the second type. Another embodiment is characterized in that the central rise area of the asymmetrical light distribution is illuminated by a semiconductor light source of the first type. It is also preferred that semiconductor light sources of the first type produce a higher luminous flux compared to semiconductor light sources of the second type and have a lower efficiency.
  • FIG. 1 a headlight 10 for a motor vehicle having at least one light module 12 for generating at least one headlight light distribution.
  • the at least one headlight light distribution is a light distribution that has a light-dark boundary, as is the case with a low-beam light distribution, or a light distribution that has no light-dark boundary, as it is in a high beam light distribution is the case.
  • the semiconductor light sources of the first row 18 and the second row 20 are arranged on a printed circuit board 22. Via electrical connections on the printed circuit board 22, the semiconductor light sources of the first row 18 and the second row 20 are supplied with electrical energy and controlled.
  • the printed circuit board 22 can be connected to an electrical system of the motor vehicle for this purpose, wherein the connection is preferably via a plug connection.
  • the printed circuit board 22 is connected to a controller or even has one for controlling the semiconductor light sources of the first row 18 and the second Row 20 serving control electronics.
  • control electronics are preferably connected via a bus system to at least one control unit of the motor vehicle in order to set a light distribution requested by the driver or an assistance system.
  • each semiconductor light source of the first row 18 and the second row 20 is a front optics available.
  • Each optical attachment is arranged so that it collects outgoing light from a semiconductor light source and bundles in a predetermined direction.
  • the attachment optics are therefore, like the semiconductor light sources of the first row 18 and the second row 20, each arranged in rows, which are aligned perpendicular to the plane of the drawing.
  • a first row 26 of attachment optics is assigned to the first row 18 of semiconductor light sources, while a second row 28 of attachment optics is assigned to the second row 20 of semiconductor light sources. Due to the arrangement of the rows is in the FIG. 1 only an attachment optics of the first row 26 and a front optics of second row 28 to see.
  • the attachment optics are preferably realized as light-refracting lenses or as light-refracting optical elements additionally operating with internal total reflections.
  • a first the light propagation direction changing refraction occurs when the light enters the material of the lens.
  • a second change in direction takes place only at the refraction at the light exit surface of the lens.
  • a reflection takes place at least for some light beams on a totally reflecting side surface of the optical element between the light entrance and the light exit, so that in this case at least three changes in direction occur for the beams reflected on side surfaces.
  • Each pair of each of a semiconductor light source and its associated attachment optics generates an image of the light exit surface of the semiconductor light source inside the headlamp 10.
  • By superimposing the images of the luminous light exit surfaces of the semiconductor light sources of the light module 12 results in the interior of the headlamp 10, an internal light distribution.
  • the light module 12 has a secondary optics 30, which is arranged approximately at a distance from the inner light distribution in the headlight 10, which corresponds to the focal length of the secondary optics 30.
  • the secondary optics 30 is for example a projection lens 32.
  • the projection lens 32 forms the inner light distribution increases in the run-up to the headlamp, so in particular on a roadway in front of the vehicle.
  • the intent optics and the secondary optics 30 are preferably arranged relative to each other so that the inner light distribution in a Petzval materials the secondary optics 30, and the projection lens 32 is generated.
  • the Petzval surface 34 is a curved surface in the original image space of the projection lens, which is imaged by the projection lens 32 into a planar light distribution in the image space of the projection lens, which is parallel to a main plane of the projection lens 32.
  • a diaphragm 38 which projects into the inner light distribution and which limits the inner light distribution with a diaphragm edge, a light-dark boundary in the light distribution can be generated, which results in the run-up of the headlamp.
  • the light-dark boundary results as a depiction of the diaphragm edge 40 of the diaphragm 38 projecting into the inner light distribution.
  • at least a part of one side of the projection lens can be provided with regular or irregular microstructures. Likewise, structures for generating overhead values are possible on this lens.
  • Such a diaphragm can be arranged perpendicular to the optical axis 36. In this case, it shadows the light incident on its diaphragm surface. The shaded light therefore does not reach the projection lens 32 and thus does not contribute to the generation of the light distribution in advance of the headlight. So it loses light, which affects the optical efficiency of the system.
  • the diaphragm edge is also shown here as a light-dark boundary in the apron of the headlamp.
  • a first row 18 of semiconductor light sources has five semiconductor light sources 18.1,..., 18.5.
  • a second row of semiconductor light sources has five semiconductor light sources 20.1,..., 20.5.
  • the division does not have to be made in equal parts and it can also be used more than two rows or even an irregular arrangement.
  • these semiconductor light sources are arranged on a common printed circuit board 22.
  • the printed circuit board 22 has, in addition to said semiconductor light sources and in the FIG. 2 non-visible electrical connections, a plug connection element 42 for supplying the printed circuit board and electronic and / or electrical components 44, which serve to control and / or coding of the printed circuit board 22 and arranged on the printed circuit board 22 semiconductor light sources.
  • the components 44 may be, for example, a control device and / or coding resistors and / or electronic components for coding the printed circuit board 22 and / or sensors, in particular temperature sensors, for example an NTC or PTC resistor.
  • a printed circuit board several printed circuit boards can be used.
  • the first row 18 of semiconductor light sources is assigned a first row 26 of attachment optics.
  • Each semiconductor light source 18.1,..., 18.5 of the first row 18 of semiconductor light sources is assigned an optical attachment 26.1,..., 26.5 of the first row 26 of attachment optics.
  • the second row 20 of semiconductor light sources is associated with a second row 28 of intent optics.
  • Each semiconductor light source 20.1,..., 20.5 of the first row 20 of semiconductor light sources is assigned an attachment optics 28.1,..., 28.5 of the second row 28 of attachment optics.
  • Each optical attachment collects and bundles the light emanating from its associated semiconductor light source. Like from the FIG. 2 can be seen, have light exit surfaces of the attachment optics in different directions. It follows that the light of the semiconductor light sources is not combined in a single point, but that already generated by the attachment optics within the light module 12 light distribution has spatially different sub-areas, is bundled and directed in each case the light of a semiconductor light source.
  • This inner light distribution with its different subregions is projected by the projection lens 32 into the apron in front of the headlight 10, so that the light distribution ultimately resulting from the road is composed of different subregions whose position within the light distribution depends on the position and orientation of the associated pair Semiconductor light source and attachment optics within the light module 12 is dependent.
  • the individual attachment optics are preferably part of a one-piece attachment optics carrier 46.
  • Such an integral attachment optics carrier 46 can be produced for example by injection molding a transparent plastic material such as PMMA (polymethylmetachrylate) or PC (polycarbonate) or also from glass or another transparent material.
  • the use of a one-piece Front optics support 46 has the particular advantage that the position and orientation of the individual attachment optics of the optical attachment carrier 46 is fixed relative to each other immutable, so that during assembly of the light module 12 no complex adjustment steps for adjusting the individual attachment optics are required.
  • the optical attachment carrier 46 is screwed to the heat sink 24, for example, with the printed circuit board 22 being clamped between the optical attachment carrier 46 and the heat sink 24. This results in particular in a good thermal contact between the circuit board 22 and a contact surface of the heat sink 24.
  • the thermal contact can be improved by using a thermal paste or a thermal adhesive between this contact surface and the circuit board 22.
  • the individual semiconductor light sources are connected to the printed circuit board 22 preferably individually or in groups controllably connected to a power supply, so that the semiconductor light sources individually or in groups can be switched on and off and / or dimmable.
  • FIG. 3 shows various parts of a light distribution, as it is generated by a headlamp 10 according to the invention in its apron, ie in particular on a roadway in front of the vehicle.
  • a partial area is shown, as it is generated by a semiconductor light source or a group of jointly actuated and controlled semiconductor light sources.
  • the partial areas shown are not used individually in the normal driving operation of a motor vehicle, but serve only to illustrate the technical effects of the invention. Light distributions used in normal driving operation result in particular from the fact that the displayed sections are generated simultaneously.
  • each subarea represents itself a light distribution.
  • the cross within each subarea marks in each case the center of gravity of such a light distribution in which a maximum brightness is established.
  • the two closed and non-intersecting closed curves represent Isolux curves, lines that connect the geometric locations of (within a curve) of equal brightness. The brightness decreases from the inside to the outside, ie from the cross over the inner curve to the outer curve.
  • the Indian FIG. 3a shown sub-area 48 is generated by an external semiconductor light source, in particular by the semiconductor light source 18.5 in conjunction with this semiconductor light source 18.5 associated attachment optics 26.5.
  • the lighting function of this portion 48 is to achieve a gradual transition from the dark area to the right of portion 48 to brighter center portions of a light distribution actually used.
  • the portion 50 from the FIG. 3b is generated by the semiconductor light source 18.4 and the semiconductor optical source associated optical attachment 26.4 and serves to connect the portion 48 of the FIG. 3a to a more central, brightly lit area of a real light distribution.
  • the portion 52 of the Figure 3c is from the central semiconductor light source 18.3 and this Semiconductor light source associated central attachment optics generated 26.3.
  • the photometric function of the portion 26.3 is to illuminate the central apron in front of the headlight 10 with the greatest possible range.
  • the portion 54 in the Fig. 3d serves to generate a maximum brightness in the center of a real light distribution to be generated and is generated by central semiconductor light sources and attachment optics, in particular by the semiconductor light source 20.2 in conjunction with its optical attachment 26.2 and / or the semiconductor light source 20.3 in conjunction with its optical attachment 26.3.
  • the partial region 54 lies somewhat deeper in comparison to the partial region 52, so that the partial region 52 marks the position of the light-dark boundary, while the partial region 54 provides the maximum brightness for the region below the light-dark boundary in the center of the light distribution ,
  • the headlamp 10 is a headlamp for a motor vehicle having at least two semiconductor light sources and light-refracting and / or light-reflecting optical means arranged and arranged to light the at least two semiconductor light sources directed in an apron of the headlamp 10 that there is a adjusts rule-compliant spatial light distribution.
  • the light-refracting and / or light-reflecting optical means are, in particular, the auxiliary optics, the diaphragm and the secondary optics.
  • the diaphragm is a light-reflecting optical means.
  • a projection lens is a pure refractive optical means, and the face optics are either light refractive optical means in the form of lenses or refractive and light reflecting optical means in the form of TIR total internal reflection (TIR) optics, depending on the embodiment.
  • the semiconductor light sources and the optical means are arranged such that a partial region of the light distribution illuminated by a first of the at least two semiconductor light sources does not interfere with a partial region illuminated by a second of the at least two semiconductor light sources Light distribution is identical.
  • none of the four sections 48, 50, 52, 54 is identical to another of these four sections.
  • semiconductor light sources of different types and with different properties. These semiconductor light sources having different characteristics can be roughly classified into three types A, B and C, which differ in particular by the values of the luminous flux they generate and the efficiency achieved thereby.
  • FIG. 4 shows a diagram in which luminous fluxes are plotted against the efficiency.
  • the luminous flux is given in lumens (lm) and the efficiency in lumens per watt (lm / W).
  • lm lumens
  • lm / W efficiency in lumens per watt
  • Semiconductor light sources of type A are characterized by a high maximum luminous flux. They have the disadvantage of a rather low efficiency compared to other semiconductor light sources.
  • Semiconductor light sources of type B are characterized by a high efficiency, which is in particular higher than the efficiency of the semiconductor light source type A.
  • the semiconductor light sources of type B have the disadvantage that their maximum luminous flux is rather low, in particular it is rather less than the maximum luminous flux of the semiconductor light sources of type A.
  • Semiconductor light sources of the further type C are characterized in that their maximum luminous flux corresponds to an average value which lies between the maximum luminous fluxes of the semiconductor light sources of types A and B.
  • the type C semiconductor light sources are further distinguished by the fact that their efficiency also lies between the values of the efficiency of the type B and type A semiconductor light sources.
  • Typical representatives of type A are, for example, light-emitting diodes, which are pre-mounted on a fastening unit, wherein in this fastening unit additional components are integrated, such as a electronic contacting, temperature sensors and coding resistors.
  • a fastening unit usually serves for fastening the component in its technical environment, for example on a printed circuit board 22.
  • a printed circuit board 22 is understood as meaning any technical device that carries a plurality of semiconductor light sources and associated power supply and control lines. Examples of Type A representatives are Philips Lumileds Altilon LEDs and Osram Ostar Headlamp LEDs. These LEDs are electronically and thermally designed for a current carrying capacity that is between 1 and 2.5 amperes.
  • luminous flux For every square millimeter of chip area, around 250 lumens of luminous flux can be generated.
  • the luminance is about 6 x 10 7 candela per square meter.
  • the so-called wall plug efficiency that is, the luminous flux related to the absorbed power, is about 75 lumens per watt.
  • One square millimeter size of light-emitting diode chips are available mechanically and electrically combined into arrays of different sizes so that high-intensity sources can be formed. Examples of combinations are arrangements of 1 x 2, 1 x 3, 1 x 4, 1 x 5, 1 x 6, 2 x 2, etc. light-emitting diodes.
  • Semiconductor light sources of type B result in molded single-chip LEDs. These are light-emitting diodes which are arranged on ceramic carriers or in a so-called lead frame package, that is to say a generally cast metal grid, and are set up for attachment and contacting by a soldering process, in particular by a surface-mounted device soldering method (SMD). Examples of this type B are represented by the light-emitting diodes with the designations Osram Oslon and Philips Rebel. Semiconductor light sources of this type B are characterized by the fact that they are covered with a nearly hemispherical potting for protection and for a better coupling-out efficiency. The hemispherical potting is usually made of optical silicone.
  • the LEDs are designed electronically and thermally to a current carrying capacity up to about one ampere.
  • the encapsulation not only increases the decoupling efficiency, but it also increases the size of the light emitting diode chip area by a factor of approximately two.
  • Typical luminous fluxes of semiconductor light sources of this type are 150 lumens at a current of 350 milliamperes.
  • the luminance is 2 x 10 7 candela per square meter and thus about 30% of the corresponding comparative value of semiconductor light sources of type A.
  • the wall plug efficiency is around 100 lumens per watt.
  • Semiconductor light sources of type C are generally single-chip light-emitting diodes which are located on ceramic carriers or in a so-called lead frame package, that is to say a generally cast metal grid, and which are provided for attachment and contacting by a soldering process. Again, for the soldering process that SMD soldering is preferred.
  • a representative of type C is represented by light emitting diodes Nichia NJSW072T. LEDs of this type are characterized by the fact that they are designed electronically and thermally to a current carrying capacity of about 1 ampere. An optical casting is missing.
  • these light-emitting diodes are less efficient than light-emitting diodes of the type B with respect to the extraction of light, but advantageously have the same luminance as the high-power arrays Semiconductor light sources of type A.
  • type C forms in some way a link between types A and B.
  • the invention exploits the different properties of semiconductor light sources of various types.
  • the from the FIG. 3 apparent non-identity of the various sub-areas already results from the spatial separation of the semiconductor light sources, which in turn inevitably results from the use of multiple semiconductor light sources.
  • Individual semiconductor light sources illuminate certain subregions of the light distribution via individual attachment optics.
  • Certain subfunctions such as the creation of a maximum range or a soft transition to the dark side zone, can be assigned to these subregions. This results in the possibility of influencing these individual subfunctions, that is to say the illumination of the various subregions, not only via the attachment optics used in each case, but also through the use of semiconductor light sources of different types in one and the same light module 12.
  • the semiconductor light sources as already associated with the FIG. 2 has been explained, arranged in a first row 18 and in a second row 20.
  • the semiconductor light sources are additionally classified into seven different groups, each group fulfilling a lighting function by having a specific subarea, such as a subarea as in FIG of the FIG. 3 is displayed, illuminates.
  • a first group 56 consists of the semiconductor light sources 18.1 and 20.1 and serves to illuminate a partial area on the left side.
  • a second group 58 consists of the individual semiconductor light source 18.2 and serves to illuminate a left apron area.
  • a third group consists of the individual semiconductor light source 18.3 and serves to illuminate a central apron area.
  • a fourth group consists of the individual semiconductor light source 18.4 and serves to illuminate a right apron area.
  • a fifth group 64 consists of the two semiconductor light sources 18.5 and 20.5 and serves to illuminate a right side area.
  • a sixth group consists of the two semiconductor light sources 20.2 and 20.3 and serves to generate an illumination maximum in the center of the light distribution.
  • a seventh group consists of the single semiconductor light source 20.4 and serves to produce the increase of the asymmetrical light distribution of a low beam light distribution.
  • semiconductor light sources of various types are used for the various groups.
  • 64 semiconductor light sources type B are used for the first group 56, the second group 58, the third group 60, the fourth group 62 and the fifth group 64, which are characterized by high energy efficiency, but a comparatively low luminous flux and also have a comparatively low luminance.
  • type A semiconductor light sources are used which, although they have the disadvantage of low energy efficiency, but provide a high luminance and a high luminous flux.
  • the so-equipped printed circuit board 22 from the FIG. 5 is therefore particularly suitable for generating light distributions with a high maximum value in the center of the light distribution.
  • FIG. 5 shows in particular an embodiment in which semiconductor light sources of a first type and of a second type are used, wherein the first type and the second type differ in that semiconductor light sources of the first type generate a higher compared to semiconductor light sources of the second type luminous flux and have a lower efficiency.
  • the embodiment in the FIG. 5 is represented, corresponds to the first type of construction A and the second type of construction B.
  • the FIG. 6 shows a printed circuit board 22 in which the first row 18 of semiconductor light sources 18.1 to 18.5 equipped with semiconductor light sources type B, while the second row 20 of semiconductor light sources with semiconductor light sources type C is equipped.
  • the type B semiconductor light sources are characterized by comparatively high energy efficiency with rather low luminance and rather low luminous flux.
  • the semiconductor light sources of the type C are characterized by an average energy efficiency, a high luminance and a mean value of the luminous flux.
  • the semiconductor light sources of type C represent representatives of the first type, while the semiconductor light sources of type B represent representatives of the second type.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
EP12175839A 2011-08-17 2012-07-11 Kraftfahrzeugbeleuchtungseinrichtung Ceased EP2559936A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102011081077A DE102011081077A1 (de) 2011-08-17 2011-08-17 Kraftfahrzeugbeleuchtungseinrichtung

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EP2559936A1 true EP2559936A1 (de) 2013-02-20

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US (1) US20130201712A1 (zh)
EP (1) EP2559936A1 (zh)
CN (1) CN102954422A (zh)
DE (1) DE102011081077A1 (zh)

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EP3056803A1 (en) * 2011-09-01 2016-08-17 Koito Manufacturing Co., Ltd. Automotive headlamp apparatus
WO2017025439A1 (fr) * 2015-08-07 2017-02-16 Valeo Vision Dispositif d'eclairage et/ou de signalisation pour vehicule automobile
DE102020104623A1 (de) 2020-02-21 2021-08-26 HELLA GmbH & Co. KGaA Scheinwerfer für ein Fahrzeug

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US20150285458A1 (en) * 2014-04-08 2015-10-08 Ford Global Technologies, Llc Vehicle headlamp system
DE202014004964U1 (de) * 2014-06-14 2015-09-15 Automotive Lighting Reutlingen Gmbh Scheinwerfer für Kraftfahrzeuge
DE102014216127A1 (de) * 2014-08-13 2016-02-18 Automotive Lighting Reutlingen Gmbh Projektionslichtmodul für einen Kraftfahrzeugscheinwerfermit einem zentralen Linsenträger
US10528694B2 (en) * 2016-09-01 2020-01-07 Joebotics Incorporated Breadboard and electronics experimentation system
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DE102011081077A8 (de) 2013-11-07
CN102954422A (zh) 2013-03-06
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