EP2384254A2 - Verfahren zur kontaktierung von isolierten drähten mit aufbringung an den draht von einer kugel- oder pilzförmigen beschichtung - Google Patents
Verfahren zur kontaktierung von isolierten drähten mit aufbringung an den draht von einer kugel- oder pilzförmigen beschichtungInfo
- Publication number
- EP2384254A2 EP2384254A2 EP09831484A EP09831484A EP2384254A2 EP 2384254 A2 EP2384254 A2 EP 2384254A2 EP 09831484 A EP09831484 A EP 09831484A EP 09831484 A EP09831484 A EP 09831484A EP 2384254 A2 EP2384254 A2 EP 2384254A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- wire
- contacting
- contact
- coating
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
Definitions
- miniaturization When contacting electrical components often insulated wires are used. In many products, the trend towards miniaturization of components leads to large material savings. The miniaturized components can be produced in the rule because of the small dimensions in the benefit, so many components are made in parallel on a support, resulting in immense cost savings. Above all, miniaturization also enables the development of new applications through miniaturized components and assemblies.
- the blood pressure directly in the coronary vessels can be determined by means of very small sensors.
- Miniaturized actuators can also be used to send and in turn to receive sound waves in the coronary vessels and thus the flow velocity of the blood can be determined via the frequency shift.
- the reaction force of instruments in the coronary vessels can be measured.
- miniaturized electrical components can be found in the aerospace industry, but also in the automotive industry, the building services industry and in the consumer goods industry, and in future in almost all areas of technology.
- micro-sensors must be powered by several meters of energy and the signals are routed.
- advantageously electrical wires often microcable used. In order to protect them against short circuits and against external influences as well as to ensure mechanical protection, these wires can be made insulated from each other. For many applications, a particularly stable, completely enclosed insulation, which prevents any current flow even in humid environments, is necessary.
- a known contacting method which is used in microtechnology, is the ultrasonic wire bonding, which is the standard for the cold welding of micro wires. It is rarely used to contact micro wires with lengths greater than 60 centimeters, because the wire feed is usually done by a very thin capillary, which is not optimized for pulling the wire. In general, wire bonding is used for short contacting distances from the chip to the chip carrier. Recent efforts are aimed at bonding electrically insulated wires.
- a further increase in the bonding energy can lead to the destruction of the component and is often not suitable for sensitive half-conductor chips.
- Even contacting by means of flames or sparks of shaped spheres, as proposed in DE 3642221C2 is not easy to carry out even today with copper wires and, due to the small process windows, is not frequently used in the prior art.
- Both methods have the disadvantage that in each case the isolation by a. Energy input must be removed defined, without destroying the wire or the chip. Especially with the here required stable insulation and the accuracy of the required contact point, this is hardly possible and remain remains of the insulation in Contact area.
- the currently available wires that would be suitable for micro-contacting do not have the necessary stability with respect to mechanical abrasion resistance of the insulation, not completely closed and thus waterproof insulation, as well as excessive costs.
- the metals used are designed for contacting by means of ultrasonic bonding and thus have a ductility which precludes the highest possible tensile strength of the wire, as it is desirable and necessary for simple and cost-effective handling of long micro-wires.
- Another method for contacting electrical wires on microcomponents is the electrically conductive bonding.
- the surfaces of the contact point are finished, for example by a gold coating, in order to obtain a low contact resistance over the long term.
- Difficult here is the dosage of the adhesive or Lotosschers in the nanoliter range.
- the order by means of microdispenser is very expensive, since an alignment of each contact is necessary.
- Another possibility would be the order of the contact aid on the wire end to be contacted.
- the contact aid due to adhesion forces, the contact aid generally draws a distance along the wire so that sufficient contact aid does not remain in the actual contact area.
- the creation of a defined contact area at the wire end is difficult.
- the first isolation step with a long-wave laser is to be carried out so that a material thickness in the micrometer range remains, which in turn is removed with a short-wave laser.
- These methods are complex and it is difficult to provide micrometer-accurate stripping on the length of the wire and the insulation must be suitable for laser processing and be present in a homogeneous thickness.
- a defined contact area can be created by the insulation is weakened, thus a predetermined breaking point is generated, and the insulation is exposed by shifting to one side of a defined line area and subsequently coated, as disclosed in DE 33 12 190 C1 discloses. This is only very limited or not applicable with a required stable insulation on a single conductor, since a strong coating can not be moved.
- the accurate to a few micrometers positioning by moving the insulation due to the necessary micromanipulators certainly only extremely difficult and therefore not usefully applicable.
- the method according to the invention solves the problems of the defined production of the non-isolated region, it enables the production of suitable surface layers in this contact region and thus reduces the use of precious metals to a minimum. At the same time it enables the dosage and application of the contact aid in a simple manner, in the same positioning step as it has to be used anyway for the alignment of the wires for contacting. It allows the choice of a stable insulation optimized for the application, regardless of the type of contacting. It allows the use of inexpensive and mechanically stable standard wires, such as copper wires from high frequency technology.
- the method solves the electrical contacting of microsensors to a thin elongated device such as a guidewire or catheter.
- a contact additive adheresive, solder, etc.
- the method solves the electrical contacting of microsensors to a thin elongated device such as a guidewire or catheter.
- it can also be advantageously used for other applications in the field of contacting microcomponents with long, insulated wires, in which the criteria of high insulation strength and low price of the line are important requirements.
- this sphere is either electrolessly or galvanically selectively coated with gold.
- Alternative coating systems such as tin layers in combination with silver are also applicable. Due to the still existing insulation of the wire, only the deposited sphere is coated with gold, which limits the use of precious metals to a necessary minimum.
- the process can preferably be carried out in terms of usefulness, ie several wires can be processed simultaneously, or these benefits can also be processed very quickly in series. After rinsing the wires, the contacting takes place.
- the wires are prepositioned roughly over the component and applied by means of a tool, in the simplest case of a pin, preferably liquid Lotoksstoff on the contact coating. Due to the execution as a spherical or mushroom-shaped deposition of the excipient attracts only on the prepared deposit, whereby the amount of the contact aid is easily limited and defined on the size of the deposition defined. In contrast to the use of normal straight wires so that the contact aid is located directly at the contact point. By joining the wire end and the contact point of the component of the contact aid from the ball also attracts to the contact field of the component. Thus, the contact is made. Depending on the materials used and subsequent processes, it may be necessary to heat the contact material, for example by means of a heater mounted under the component.
- a subsequent bonding of the wire contacting with the component by means of a non-conductive adhesive may be useful for increased mechanical and electrical stability of the contact.
- the contact aid is not used and the contacting is carried out directly by means of cold welding (wire bonding technique) or by means of heat welding by current, laser or spark welding methods.
- Possible variations in the process are the treatment of the cutting edge with dilute sulfuric acid and hydrogen peroxide to increase the adhesion of the deposit or to create an optimized surface when the time between cut and first coating is longer than five minutes.
- Other variations are the replacement of the galvanic with a chemical coatings, which are not so easy to monitor in the process, but it can eliminate the electrical contact of the non-coated wire end.
- variations of the process can be done by optimizing the cutting edge, which are for example made obliquely, or can be done by grinding in a holder or by simply scoring the insulation.
- nickel offers particular advantages in terms of copper adhesion, copper to gold diffusion, and simple, stable process control
- the exemplary process is not limited to the material components presented and other electroplating or chemical coating systems may be used.
- the method offers particular advantages due to a defined structure, and in addition a particularly simple dosage of the excipient, so of adhesive or solder.
- There which selectively modifies the pad, lead wire, insulation and contact area can be individually optimized. This makes it possible to produce insulated wires with favorable but stable insulation and for the first time can be contacted on microcontacts, since stable contact insulation can not be achieved with stable insulation.
- some contacts are known in which electrically conductive layers are grown, or spherical structures are used for contacting.
- GB 1024540 describes an attachment possibility of conductive pins in non-conductive substrates under heat. This application does not address the microstructibility and the creation of defined contact areas on insulated wires.
- Fig. 1 is a view of a conventional wire with insulation and applied contact aid.
- Fig. 2a is a view of a wire according to the invention with insulation and spherically deposited contact area.
- Fig. 2b is a view of a wire according to the invention with insulation and mushroom-shaped or otherwise deposited contact area.
- Fig. 3 shows the improved deposition coating at the contact point of the contact additive according to the invention.
- Fig. 4 a represents a contacting of a component by means of inventive wire and contact aid.
- Fig. 4 b illustrates a contacting of a component by means of inventive wire without contact aid.
- Fig. 5 is a sketch of a galvanic coating of the wire ends, which can also be used for two-sided coating of one and more wires.
- Fig. 6 shows a possibility for the automated production of wires on a carrier tape.
- liquid contact additive such as solder or adhesive
- this does not pull on standard wires at the contact point on the front surface of the wire, but due to adhesion and cohesion forces a piece along the wire and forms a collection a some distance from the front surface of the wire, as shown in Fig. 1.
- the amount of this adhesive is usually unspecific and too much for a contact.
- the front surface of the wire continues to provide generally no sufficient surface for a stable electrical and mechanical contact.
- a wire according to the invention can be produced from a simple wire. This is processed by cutting, grinding or similar on the front surface. Subsequently, the adhesion of a spherical, conductive deposit takes place by growth. Alternatively, as shown in FIG. 2b, this deposition may also be mushroom-shaped or otherwise. Very short coating times allow the wire to be finished, longer coating times produce for the dosage of the contact additive (101) special flow stop edges with an angle ⁇ orientation, preventing the contact aid from being absorbed by the insulated wire but remaining in the contact area.
- the contact aid (101) rests on the wire (100) only on the deposit (102) and not as shown in FIG. 1, as shown in FIG.
- the amount of adhesive to be applied can be metered in a simple manner.
- Other parameters for the adhesive dosage are the ratio of the surface activity of the outer coating of the deposition and the contact assistant, as well as the surface tension and the viscosity of the contact aid. For a selected material system, however, the latter parameters remain constant, so that in the process the amount of the applied contact additive (101) can be controlled in a simple manner via the size of the deposit (102).
- a contact with the wire according to the invention is shown.
- the contact aid By touching the deposit (102) with the contact aid, it draws on the deposit with a defined amount.
- the dosage of the contact aid is thus carried out in a very simple manner.
- the contact area When contact aid is applied to the deposit, the contact area may be brought into contact with the second contact area and a defined one The amount of contact aid draws from the deposit (101) on the contact surface (103) of the component (104) and thus establishes the electrical contact.
- Another very favorable type of contacting which is possible in particular with the wire according to the invention is also the contacting without contact aid by means of ultrasonic welding according to Fig. 4 b.
- a further positioning of the bonding tool (113) in addition to the wire is necessary, however, proven technologies can be applied to the contacting of stably insulated wires.
- ultrasonic bonding technology will also be applicable to stably insulated wires.
- a preferred method of production is the deposition by means of galvanic coating according to FIG. 5.
- the current intensity can be integrated over time with an integrator (109) and thus the size of the deposition can be set very precisely via the charge which has flowed.
- the front surfaces of the wire ends are exposed by a named method and introduced into a container filled with electrolyte (105).
- the second wire end is electrically contacted, for example via an electrical contact or, as shown in Fig. 5, via a second electrolytic contact.
- the latter simplifies the coating of microcables that are difficult to contact.
- the deposition can also be timed out of reductive chemical baths. As a rule, a refinement of the surface should take place after the first deposition.
- the coatings can in turn be carried out galvanically, chemically or in the latter simply by immersion in a solution of the substance to be coated.
- Fig. 6 shows a principle manufacturing method of the wires according to the invention.
- One or a plurality of wires are fixed on a carrier substrate (110).
- Substart holes are inserted, for example by means of punching, exposing the electrically conductive surfaces of the wire. Alternatively, it is sufficient to just scratch or saw through the wire, and to damage the carrier only minimally. This allows easy further processing.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Wire Bonding (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008060862A DE102008060862B4 (de) | 2008-12-09 | 2008-12-09 | Verfahren zur miniaturisierbaren Kontaktierung isolierter Drähte |
PCT/DE2009/001723 WO2010066238A2 (de) | 2008-12-09 | 2009-12-08 | Verfahren zur miniaturisierbaren kontaktierung isolierter drähte |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2384254A2 true EP2384254A2 (de) | 2011-11-09 |
Family
ID=42193974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09831484A Withdrawn EP2384254A2 (de) | 2008-12-09 | 2009-12-08 | Verfahren zur kontaktierung von isolierten drähten mit aufbringung an den draht von einer kugel- oder pilzförmigen beschichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US8418911B2 (de) |
EP (1) | EP2384254A2 (de) |
DE (1) | DE102008060862B4 (de) |
WO (1) | WO2010066238A2 (de) |
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US9575560B2 (en) | 2014-06-03 | 2017-02-21 | Google Inc. | Radar-based gesture-recognition through a wearable device |
US9921660B2 (en) | 2014-08-07 | 2018-03-20 | Google Llc | Radar-based gesture recognition |
US9811164B2 (en) | 2014-08-07 | 2017-11-07 | Google Inc. | Radar-based gesture sensing and data transmission |
US9588625B2 (en) | 2014-08-15 | 2017-03-07 | Google Inc. | Interactive textiles |
US10268321B2 (en) | 2014-08-15 | 2019-04-23 | Google Llc | Interactive textiles within hard objects |
US9778749B2 (en) | 2014-08-22 | 2017-10-03 | Google Inc. | Occluded gesture recognition |
US11169988B2 (en) | 2014-08-22 | 2021-11-09 | Google Llc | Radar recognition-aided search |
US9600080B2 (en) | 2014-10-02 | 2017-03-21 | Google Inc. | Non-line-of-sight radar-based gesture recognition |
US10016162B1 (en) | 2015-03-23 | 2018-07-10 | Google Llc | In-ear health monitoring |
US9983747B2 (en) | 2015-03-26 | 2018-05-29 | Google Llc | Two-layer interactive textiles |
JP6427279B2 (ja) | 2015-04-30 | 2018-11-21 | グーグル エルエルシー | ジェスチャの追跡および認識のための、rfに基づいた微細動作追跡 |
CN107430443B (zh) | 2015-04-30 | 2020-07-10 | 谷歌有限责任公司 | 基于宽场雷达的手势识别 |
KR102011992B1 (ko) | 2015-04-30 | 2019-08-19 | 구글 엘엘씨 | 타입-애그노스틱 rf 신호 표현들 |
US10088908B1 (en) | 2015-05-27 | 2018-10-02 | Google Llc | Gesture detection and interactions |
US9693592B2 (en) | 2015-05-27 | 2017-07-04 | Google Inc. | Attaching electronic components to interactive textiles |
US10817065B1 (en) | 2015-10-06 | 2020-10-27 | Google Llc | Gesture recognition using multiple antenna |
WO2017079484A1 (en) * | 2015-11-04 | 2017-05-11 | Google Inc. | Connectors for connecting electronics embedded in garments to external devices |
US10492302B2 (en) | 2016-05-03 | 2019-11-26 | Google Llc | Connecting an electronic component to an interactive textile |
WO2017200570A1 (en) | 2016-05-16 | 2017-11-23 | Google Llc | Interactive object with multiple electronics modules |
US10579150B2 (en) | 2016-12-05 | 2020-03-03 | Google Llc | Concurrent detection of absolute distance and relative movement for sensing action gestures |
CN107175400B (zh) * | 2017-04-14 | 2019-12-06 | 国家纳米科学中心 | 一种金丝焊接方法 |
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US3307246A (en) * | 1963-12-23 | 1967-03-07 | Ibm | Method for providing multiple contact terminations on an insulator |
DE3312190C1 (de) * | 1983-04-02 | 1984-04-26 | Dietrich 3420 Herzberg Reidt | Verfahren und Vorrichtung zum Verzinnen, insbesondere Langverzinnen von Leiterenden |
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JPS62136831A (ja) | 1985-12-10 | 1987-06-19 | Mitsubishi Electric Corp | ワイヤボンデイング用ボ−ルの形成方法 |
DE68910428T2 (de) * | 1988-08-19 | 1994-05-11 | Philips Nv | Spannungs-/Stromwandler. |
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DE4116165A1 (de) * | 1991-05-17 | 1992-11-19 | Minnesota Mining & Mfg | Verfahren zum aufbringen von lot auf die abschirmung eines kabels |
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- 2008-12-09 DE DE102008060862A patent/DE102008060862B4/de not_active Expired - Fee Related
-
2009
- 2009-12-08 WO PCT/DE2009/001723 patent/WO2010066238A2/de active Application Filing
- 2009-12-08 EP EP09831484A patent/EP2384254A2/de not_active Withdrawn
- 2009-12-08 US US13/133,848 patent/US8418911B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
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See references of WO2010066238A3 * |
Also Published As
Publication number | Publication date |
---|---|
US20110303341A1 (en) | 2011-12-15 |
WO2010066238A3 (de) | 2010-09-23 |
DE102008060862B4 (de) | 2010-10-28 |
WO2010066238A2 (de) | 2010-06-17 |
US8418911B2 (en) | 2013-04-16 |
DE102008060862A1 (de) | 2010-06-24 |
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