WO2010066238A3 - Verfahren zur kontaktierung von isolierten drähten mit aufbringung an den draht von einer kugel- oder pilzförmigen beschichtung - Google Patents
Verfahren zur kontaktierung von isolierten drähten mit aufbringung an den draht von einer kugel- oder pilzförmigen beschichtung Download PDFInfo
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- WO2010066238A3 WO2010066238A3 PCT/DE2009/001723 DE2009001723W WO2010066238A3 WO 2010066238 A3 WO2010066238 A3 WO 2010066238A3 DE 2009001723 W DE2009001723 W DE 2009001723W WO 2010066238 A3 WO2010066238 A3 WO 2010066238A3
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- WIPO (PCT)
- Prior art keywords
- contacting
- insulated wires
- mushroom
- spherical
- wire
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Wire Bonding (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Die Erfindung ermöglicht die Kontaktierung von vorzugsweise Mikrobauteilen (104) mit elektrischen Drähten (100). Durch Anwachsen von metallischen Mikro-Abscheidungen (102) an Schnittflächen von Mikrokabeln (100) wird ein Kontaktbereich geschaffen, der die Dosierung und Applikation eines Kontakthilfsstoffes vereinfacht, das Ultraschallbonden zulässt, eine definierte Größe des elektrisch leitfähigen Gebietes aufweist und die Kontaktierung sehr stabil isolierter Drähte (100) zulässt. Das Verfahren ist im Nutzen und in Serie günstig anwendbar.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09831484A EP2384254A2 (de) | 2008-12-09 | 2009-12-08 | Verfahren zur kontaktierung von isolierten drähten mit aufbringung an den draht von einer kugel- oder pilzförmigen beschichtung |
US13/133,848 US8418911B2 (en) | 2008-12-09 | 2009-12-08 | Method for the miniaturizable contacting of insulated wires |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008060862A DE102008060862B4 (de) | 2008-12-09 | 2008-12-09 | Verfahren zur miniaturisierbaren Kontaktierung isolierter Drähte |
DE102008060862.9 | 2008-12-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010066238A2 WO2010066238A2 (de) | 2010-06-17 |
WO2010066238A3 true WO2010066238A3 (de) | 2010-09-23 |
Family
ID=42193974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2009/001723 WO2010066238A2 (de) | 2008-12-09 | 2009-12-08 | Verfahren zur miniaturisierbaren kontaktierung isolierter drähte |
Country Status (4)
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US (1) | US8418911B2 (de) |
EP (1) | EP2384254A2 (de) |
DE (1) | DE102008060862B4 (de) |
WO (1) | WO2010066238A2 (de) |
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US9575560B2 (en) | 2014-06-03 | 2017-02-21 | Google Inc. | Radar-based gesture-recognition through a wearable device |
US9811164B2 (en) | 2014-08-07 | 2017-11-07 | Google Inc. | Radar-based gesture sensing and data transmission |
US9921660B2 (en) | 2014-08-07 | 2018-03-20 | Google Llc | Radar-based gesture recognition |
US9588625B2 (en) | 2014-08-15 | 2017-03-07 | Google Inc. | Interactive textiles |
US10268321B2 (en) | 2014-08-15 | 2019-04-23 | Google Llc | Interactive textiles within hard objects |
US11169988B2 (en) | 2014-08-22 | 2021-11-09 | Google Llc | Radar recognition-aided search |
US9778749B2 (en) | 2014-08-22 | 2017-10-03 | Google Inc. | Occluded gesture recognition |
US9600080B2 (en) | 2014-10-02 | 2017-03-21 | Google Inc. | Non-line-of-sight radar-based gesture recognition |
US10016162B1 (en) | 2015-03-23 | 2018-07-10 | Google Llc | In-ear health monitoring |
US9983747B2 (en) | 2015-03-26 | 2018-05-29 | Google Llc | Two-layer interactive textiles |
KR102327044B1 (ko) | 2015-04-30 | 2021-11-15 | 구글 엘엘씨 | 타입-애그노스틱 rf 신호 표현들 |
EP3289434A1 (de) | 2015-04-30 | 2018-03-07 | Google LLC | Weitfeldradarbasierte gestenerkennung |
CN107430444B (zh) | 2015-04-30 | 2020-03-03 | 谷歌有限责任公司 | 用于手势跟踪和识别的基于rf的微运动跟踪 |
US9693592B2 (en) | 2015-05-27 | 2017-07-04 | Google Inc. | Attaching electronic components to interactive textiles |
US10088908B1 (en) | 2015-05-27 | 2018-10-02 | Google Llc | Gesture detection and interactions |
US10817065B1 (en) | 2015-10-06 | 2020-10-27 | Google Llc | Gesture recognition using multiple antenna |
US9837760B2 (en) * | 2015-11-04 | 2017-12-05 | Google Inc. | Connectors for connecting electronics embedded in garments to external devices |
WO2017192167A1 (en) | 2016-05-03 | 2017-11-09 | Google Llc | Connecting an electronic component to an interactive textile |
WO2017200570A1 (en) | 2016-05-16 | 2017-11-23 | Google Llc | Interactive object with multiple electronics modules |
US10579150B2 (en) | 2016-12-05 | 2020-03-03 | Google Llc | Concurrent detection of absolute distance and relative movement for sensing action gestures |
CN107175400B (zh) * | 2017-04-14 | 2019-12-06 | 国家纳米科学中心 | 一种金丝焊接方法 |
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2008
- 2008-12-09 DE DE102008060862A patent/DE102008060862B4/de not_active Expired - Fee Related
-
2009
- 2009-12-08 US US13/133,848 patent/US8418911B2/en not_active Expired - Fee Related
- 2009-12-08 WO PCT/DE2009/001723 patent/WO2010066238A2/de active Application Filing
- 2009-12-08 EP EP09831484A patent/EP2384254A2/de not_active Withdrawn
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JP2001230534A (ja) * | 2000-02-21 | 2001-08-24 | Nec Corp | 半田ボール付ワイヤとその作成方法及び配線基板の接続変更方法 |
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Also Published As
Publication number | Publication date |
---|---|
EP2384254A2 (de) | 2011-11-09 |
WO2010066238A2 (de) | 2010-06-17 |
US8418911B2 (en) | 2013-04-16 |
US20110303341A1 (en) | 2011-12-15 |
DE102008060862A1 (de) | 2010-06-24 |
DE102008060862B4 (de) | 2010-10-28 |
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