WO2010066238A3 - Verfahren zur kontaktierung von isolierten drähten mit aufbringung an den draht von einer kugel- oder pilzförmigen beschichtung - Google Patents

Verfahren zur kontaktierung von isolierten drähten mit aufbringung an den draht von einer kugel- oder pilzförmigen beschichtung Download PDF

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Publication number
WO2010066238A3
WO2010066238A3 PCT/DE2009/001723 DE2009001723W WO2010066238A3 WO 2010066238 A3 WO2010066238 A3 WO 2010066238A3 DE 2009001723 W DE2009001723 W DE 2009001723W WO 2010066238 A3 WO2010066238 A3 WO 2010066238A3
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WO
WIPO (PCT)
Prior art keywords
contacting
insulated wires
mushroom
spherical
wire
Prior art date
Application number
PCT/DE2009/001723
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English (en)
French (fr)
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WO2010066238A2 (de
Inventor
Thorsten Meiss
Tim Rossner
Original Assignee
WERTHSCHÜTZKY, Roland
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Filing date
Publication date
Application filed by WERTHSCHÜTZKY, Roland filed Critical WERTHSCHÜTZKY, Roland
Priority to EP09831484A priority Critical patent/EP2384254A2/de
Priority to US13/133,848 priority patent/US8418911B2/en
Publication of WO2010066238A2 publication Critical patent/WO2010066238A2/de
Publication of WO2010066238A3 publication Critical patent/WO2010066238A3/de

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Die Erfindung ermöglicht die Kontaktierung von vorzugsweise Mikrobauteilen (104) mit elektrischen Drähten (100). Durch Anwachsen von metallischen Mikro-Abscheidungen (102) an Schnittflächen von Mikrokabeln (100) wird ein Kontaktbereich geschaffen, der die Dosierung und Applikation eines Kontakthilfsstoffes vereinfacht, das Ultraschallbonden zulässt, eine definierte Größe des elektrisch leitfähigen Gebietes aufweist und die Kontaktierung sehr stabil isolierter Drähte (100) zulässt. Das Verfahren ist im Nutzen und in Serie günstig anwendbar.
PCT/DE2009/001723 2008-12-09 2009-12-08 Verfahren zur miniaturisierbaren kontaktierung isolierter drähte WO2010066238A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP09831484A EP2384254A2 (de) 2008-12-09 2009-12-08 Verfahren zur kontaktierung von isolierten drähten mit aufbringung an den draht von einer kugel- oder pilzförmigen beschichtung
US13/133,848 US8418911B2 (en) 2008-12-09 2009-12-08 Method for the miniaturizable contacting of insulated wires

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008060862A DE102008060862B4 (de) 2008-12-09 2008-12-09 Verfahren zur miniaturisierbaren Kontaktierung isolierter Drähte
DE102008060862.9 2008-12-09

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WO2010066238A2 WO2010066238A2 (de) 2010-06-17
WO2010066238A3 true WO2010066238A3 (de) 2010-09-23

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EP (1) EP2384254A2 (de)
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US20110303341A1 (en) 2011-12-15
EP2384254A2 (de) 2011-11-09
DE102008060862B4 (de) 2010-10-28
US8418911B2 (en) 2013-04-16
WO2010066238A2 (de) 2010-06-17
DE102008060862A1 (de) 2010-06-24

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