Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2115/00—Light-generating elements of semiconductor light sources
  • F21Y2115/10—Light-emitting diodes [LED]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
  • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
  • H01L2224/45001—Core members of the connector
  • H01L2224/45099—Material
  • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
  • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
  • H01L2224/45139—Silver (Ag) as principal constituent
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
  • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
  • H01L2224/45001—Core members of the connector
  • H01L2224/45099—Material
  • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
  • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
  • H01L2224/45144—Gold (Au) as principal constituent
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
  • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
  • H01L2224/45001—Core members of the connector
  • H01L2224/45099—Material
  • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
  • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
  • H01L2224/45147—Copper (Cu) as principal constituent
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
  • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
  • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
  • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
  • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01015—Phosphorus [P]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01047—Silver [Ag]

Definitions

• the invention relates to luminous bodies made of a transparent plastic molded part with recesses in which electronic components, in particular LED-DIEs are located, as well as their production.
• Energy-saving lamps are significantly more energy-efficient, but they represent an environmental impact due to heavy metal components, especially mercury, and must be disposed of as hazardous waste.
• LEDs An alternative source of illumination, which does not have these disadvantages and also has a long life and high energy efficiency, are LEDs.
• LEDs are increasingly used as lighting sources, e.g. in the automotive industry, aviation, interior lighting, façade design, etc.
• LED DIEs are integrated directly into the LED as components or secondary optics, which are subsequently combined with the LED as lenses or lens systems.
• the LEDs are applied to printed circuit boards.
• the heat is dissipated via integrated or retrofitted systems.
• the LED-equipped circuit board can usually be protected by a plastic housing from moisture and contamination.
• the plastic housing is transparent in the exit region of the LED radiation and optionally formed as a lens body.
• support elements such as printed circuit boards or electrically conductive films are equipped with semiconductor chips (so-called "DIEs"
• assemblies that contain support elements with a flat support surface, are arranged on the LED DIEs or other electronic components
• Such an arrangement leads to a step formation between support surface and the top of the components arranged thereon in practice has
• the arrangement Pur is the production of an electrical contact of the electronic component with adjacent components (eg, strip conductors) unfavorable
• the object of the present invention was therefore to avoid the aforementioned disadvantages, in particular to provide illuminants with electronic components which are easy to handle, have good luminous properties and can be produced without complications, in particular precise positioning of the electronic components (LED DIEs).
• LED DIEs LED DIEs
• the production of an electrical contact should be easy to carry out on the support element in a simple manner
• the erf ⁇ ndungsgedorfe method represents a new way to integrate LED lighting elements more economical and efficient in components and thus to realize small installation depths
• the invention relates to luminous bodies made of a transparent plastic molded part (1) with LED DIEs (2), which are characterized in that depressions (5) are located in the molded part, in each of which an LED DIE or a transparent LED unit arranged in that one side of the LED DIE or the transparent LED unit connects approximately flush to the top of the plastic molded part, and the LED DIEs are connected to a power supply via electrical conductors (3) located on the molded part
• the advantage of the Leuchtkorpers invention is its - if desired - low space depth, which is advantageous for areal applications
• one has a high degree of freedom in shaping, including through the preferred injection molding process, with which the plastic molded part is produced
• the insertion of the electronic component (LED-DIE) in the recess of the molding has several advantages. This allows the electronic component (LED-DIE) to be precisely positioned on the plastic molded part. Furthermore, the recessed arrangement of the LED-DIE leads to a leveling between the upper part of the molded part and the upper side or free surface of the LED DIE.
• the recess may be configured such that the upper side of the LED DIE connects approximately flush with the upper part of the molding.
• This arrangement has the advantage that the production of an electrical contact of the LED DIE with other LED DIEs and / or electrical conductors (3) can be carried out in an advantageous manner.
• the recesses of the plastic molded part are preferably created by injection molding and have a bottom and the bottom with the upper side of the molding part connecting side wall. With the dimensions to be realized, machining processes reach their performance limits. The injection molding process enables the reproducible and economical production of plastic moldings intended for the production of large series.
• the plastic molded part is preferably made of transparent plastic, such as polycarbonate (PC), polystyrene (PS) and polymethyl methacrylate (PMMA), polysulfone, highly temperature-stable PC (Apec 0 * from Bayer MaterialScience AG), cycloolefin copolymer (COC) (Topas 0 * of Ticona).
• the light transmission should be for transparent, colorless material at least 80%, preferably at least 85%, particularly preferably at least 89% (measured according to ISO 13468-2 at 1 mm specimen thickness).
• the plastic should have very good flow properties, heat resistance and good resistance to LED radiation, mechanical stability and a high refractive index. The method opens up possibilities for solutions in which light is emitted in different ways from the plastic molded part.
• the LED DIEs are plugged into the recesses so that the emitting light radiates through the bottom of the recess.
• This also has the advantage that the LED DIEs can be easily contacted to electrical conductors which are located on the open side of the recesses on the upper part of the molding.
• the plastic molding may preferably be covered on the side of the open recesses with a protective plastic film, preferably polycarbonate film.
• This film may advantageously additionally have a reflection layer.
• the two poles of the LED DIEs are pierced by dot openings (which can be made, for example, by lasers in the bottom of the recesses) Bottom of the deepened through holes.
• the conductor tracks are here on the opposite side of the plastic molding to the open side of the recess.
• the plastic molded part on the open side of the recesses may be covered with a transparent plastic protective film, preferably made of polycarbonate, for the protection of the LED DIEs.
• the LED DIEs can also be plugged into the recesses so that the light shines through the bottom of the recess.
• the two poles of the LED DIEs are then preferably contacted on the open side of the recesses with the conductor tracks.
• the traces used to electrically connect the LED DIEs to a power source may conventionally be copper or silver or gold wires.
• conductive polymers which are preferably transparent.
• Conductive polymers are preferably selected from the series: polypyrrole, Polyanüin, polythiophene, polyphenylene, polyvinyl lyparaphenylen, polyethylenedioxythiophene, polyfluorene, polyacetylene, particularly preferably in combination with polyethylene dioxythiophene polystyrene sulfonic acid (Baytron example, ⁇ > P from HC Starck).
• nano-particulate conductive inks e.g., nano-silver, nano-gold
• inks filled with metal particles in the nanometer range e.g. Using ink-jet technology, print thin, electrically conductive webs with virtually any geometry on plastic. It is particularly desirable in this case that the line width of such interconnects reaches or falls below about 20 ⁇ m. From this limit, structures for the human eye are generally no longer recognizable and a disturbing optical effect due to interconnects is eliminated.
• CNT-containing inks CNT carbon nanotubes, eg Baytubes 00 from Bayer MaterialScience AG
• CNT carbon nanotubes eg Baytubes 00 from Bayer MaterialScience AG
• indium tin oxide as a conductive material is also possible.
• the plastic molding may have a plurality of wells ("receptacles") in the form of MICRO cavities
• the side walls of the depressions may be straight, concave or convex.
• Straight-wall sidewalls have the advantage that they are particularly suitable for high-level recording of the LED DICs
• the side walls can be perpendicular to the floor or to the upper part of the molding
• the side walls may be chamfered at an angle of inclination with respect to the molding top, which is between 1 ° and 89 °
• the side walls of the depressions are tapered towards the bottom and each define an angle of inclination of 5 ° to 85 °, preferably of 20 ° to 70 ° and particularly preferably about 45 °
• the depressions can have a rectangular, circular or polygonal contour in plan view
• the depression can have a step-like configuration in cross-section, which forms at least one step bottom section parallel to the bottom or to the upper part of the molding part
• the LED DIE can be fixed in the depression by a potting compound.
• the potting compound can consist of resin, for example epoxy resin, 2K polyurethane casting resin (Baygai 00 , Baymidur 00 from Bayer Mate ⁇ alScience AG).
• This adhesive can preferably be transparent If necessary, phosphorescent pigments (so-called phosphors) included
• the production of the Leuchtkorper preferably takes place as follows
• thermoplastic material is introduced into a mold by injection molding
• the mold has the negative matrix of the plastic molded part to be produced
• the transparent plastic molded part with its recesses is removed from the mold
• the edge length of the recesses is in the range of 50-4000 ⁇ m
• the height of the depressions is particularly preferably between 50-200 ⁇ m.
• the dimensions of the depressions are adapted to the size of the LED DIEs, which preferably have an edge length in the range of 40-3800 ⁇ m
• the printed conductors are preferably applied to the molded part by screen printing or ink jet technology
• the LED DIEs are inserted or glued into the recesses
• the poles lie on one side, so that the LED DIEs can be contacted with the interconnects on one side
• the poles of the LED DIEs lie on the open side of the recesses and are contacted on this side with the conductor tracks
• a plastic film preferably provided with a reflective layer, can be applied as a protective layer for the printed conductors to the molded part fitted with the LED DIEs on the open side of the recesses
• the luminaire is connected to a power source via a plug connection
• the process is preferably carried out as follows
• thermoplastic material is introduced into a mold by injection molding.
• the mold has the negative matrix of the plastic molded part to be produced.
• the transparent plastic molded part with its depressions is removed from the mold.
• the size of the depressions is in the range of 50-4000 microns
• the injection-molded part can optionally be provided on the open side of the recesses with a reflection layer, preferably by screen printing
• the printed conductors are applied to the molded part on the side opposite the open side of the depressions, preferably by screen printing
• the LED DIEs are plugged or glued into the recesses, with the poles of the LED DIEs being plated through the bottom of the recess
• the molded part adorned with LED DIEs can be provided with a protective foil to protect the printed conductors on this side.
• a transparent film or a transparent plastic molded article can be applied to the open side of the recesses
• the luminaire can be connected to a power source via a plug connection
• heat-conductive additives are added to the plastic prior to its deformation in the mold, so that the heat generated by the LED DIEs can be dissipated more effectively.
• the additionally transparent plastic molded body under e ' which is optionally attached to the luminous body, preferably consists of microlenses, these microlenses being arranged such that in each case a microlens is placed over an LED die.
• plastic molded body with microlenses with the effect of focusing and increased efficiency
• a plastic molded body (plastic film) with diffuser properties can be used, so that the impression of a "surface light” instead of a luminaire with punctual light sources (LED-DIEs) arises.
• phosphorescent pigments so-called phosphors
• white light can be generated if blue LED DIEs were used.
• the method for producing the luminous body is carried out as follows:
• the plastic molding is made with the wells. Thereafter, the conductor tracks are applied on both sides of the molded part.
• the recesses are equipped with the LED DIEs, the poles are contacted with the tracks (one pole on the open side of the wells and one pole through the bottom of the wells).
• power is applied to the LED DIEs via a connector through the traces.
• a plastic film optionally provided with a reflective layer is applied to the open side of the recesses of the molded part, the LED DIEs radiating through the bottom of the recesses.
• a transparent plastic film or a transparent plastic molding may be applied to the molding on the open side of the recesses, the LED DIEs radiating on the open side of the recesses.
• FIG. 1 shows a perspective detail of the luminous body according to the invention
• FIG. 2 a perspective view of the depressions
• FIG. 3 shows a cross section through the depressions according to FIG. 2.
• LED DIEs 2 are inserted in recesses 5 in a plastic molding designated 1.
• the recess 5 is designed such that the LED DIE connects with its top approximately flush with the upper part of the molding.
• Figure 2 shows an arrangement of recesses 5 in a section of the plastic molding.
• FIG. 3 shows the detail from FIG. 2 in cross section.

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Optics & Photonics (AREA)
• Electromagnetism (AREA)
• Injection Moulding Of Plastics Or The Like (AREA)
• Led Device Packages (AREA)
• Non-Portable Lighting Devices Or Systems Thereof (AREA)
• Moulds For Moulding Plastics Or The Like (AREA)
• Illuminated Signs And Luminous Advertising (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=40351577

Family Applications (1)

Country Status (8)

Families Citing this family (7)

Family Cites Families (32)

• 2007
  • 2007-12-19 DE DE102007061261A patent/DE102007061261A1/de not_active Ceased
• 2008
  • 2008-12-09 JP JP2010538409A patent/JP2011507291A/ja active Pending
  • 2008-12-09 WO PCT/EP2008/010414 patent/WO2009077105A1/de not_active Ceased
  • 2008-12-09 CN CN200880121777.6A patent/CN102016387B/zh not_active Expired - Fee Related
  • 2008-12-09 EP EP08862318A patent/EP2235429A1/de not_active Withdrawn
  • 2008-12-09 KR KR1020107013521A patent/KR101556807B1/ko not_active Expired - Fee Related
  • 2008-12-18 TW TW097149311A patent/TW200945508A/zh unknown
  • 2008-12-18 US US12/337,884 patent/US8487322B2/en not_active Expired - Fee Related
• 2013
  • 2013-06-17 US US13/919,311 patent/US20130277695A1/en not_active Abandoned

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