EP2188403B1 - Verfahren und schmelztauchveredelungsanlage zur bandstabilisierung eines zwischen abstreifdüsen der schmelztauchveredelungsanlage geführten, mit einer beschichtung versehenen bandes - Google Patents

Verfahren und schmelztauchveredelungsanlage zur bandstabilisierung eines zwischen abstreifdüsen der schmelztauchveredelungsanlage geführten, mit einer beschichtung versehenen bandes Download PDF

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Publication number
EP2188403B1
EP2188403B1 EP08801674A EP08801674A EP2188403B1 EP 2188403 B1 EP2188403 B1 EP 2188403B1 EP 08801674 A EP08801674 A EP 08801674A EP 08801674 A EP08801674 A EP 08801674A EP 2188403 B1 EP2188403 B1 EP 2188403B1
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EP
European Patent Office
Prior art keywords
strip
hot
distance
detected
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP08801674A
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German (de)
English (en)
French (fr)
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EP2188403A2 (de
Inventor
Holger Behrens
Michael Zielenbach
Hans-Georg Hartung
Pascal Fontaine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SMS Siemag AG
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SMS Siemag AG
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Publication date
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Priority to PL08801674T priority Critical patent/PL2188403T3/pl
Publication of EP2188403A2 publication Critical patent/EP2188403A2/de
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Publication of EP2188403B1 publication Critical patent/EP2188403B1/de
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/003—Apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/24—Removing excess of molten coatings; Controlling or regulating the coating thickness using magnetic or electric fields
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36—Elongated material
    • C23C2/40—Plates; Strips
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/50—Controlling or regulating the coating processes
    • C23C2/52—Controlling or regulating the coating processes with means for measuring or sensing

Definitions

  • the invention relates to a method for stabilizing the strip of a tape provided with a coating between stripping nozzles of a hot-dip coating plant and a corresponding hot-dip coating installation.
  • a method for stabilizing the strip of a tape provided with a coating between stripping nozzles of a hot-dip coating plant and a corresponding hot-dip coating installation.
  • Electromagnetic band stabilizers are based on the principle of induction, in order to generate attractive forces perpendicular to the ferromagnetic steel strip by means of defined magnetic fields. Thus, the position of the steel strip between two opposite electromagnetic inductors (electromagnets) can be changed without contact.
  • Such systems are known in different types. They are used, for example, in hot-dip coating plants in the coating area above the so-called wiping nozzles. Different regulation. and control concepts are known (e.g. DE 10 2005 060 058 A1 . WO 2006/006911 A1 . WO 02/14572 A1 ).
  • Wiping nozzles are used in hot-dip coating plants for steel strip to obtain a defined amount of coating medium on the strip surface.
  • the quality of the coating depends to a large extent on the uniformity of the wiping medium (eg air or nitrogen) as well as on the band movement in the nozzle area.
  • the belt movements are caused by non-circularity of roles or eg by pulse effect of the air in the cooling tower area of hot dip finishing plants.
  • belt stabilization systems connected downstream in the belt running direction can damp or reduce a belt movement occurring within the scraping nozzle, so that an improvement in the coating accuracy and coating uniformity of the liquid metal on the steel belt is achieved.
  • This can z. B. electromagnetically acting actuators exercise the non-contact attractive forces on the continuous steel band and thus change the band position.
  • the goal of all applications is to position the belt stabilization as close as possible to the wiper nozzle, ignoring the relationship between distance and effect.
  • the object of the invention is therefore to improve the strip stabilization in the region of the wiper.
  • This object is achieved according to the invention with the method according to claim 1.
  • This is characterized in that the distance (the effect) of the band stabilization of the wiping nozzles is set to a value equal to a distance threshold value, which as a function of Bandwidth is determined taking into account a factor Phi, wherein the factor Phi is calculated as a function of the strip thickness and the strip tension.
  • the measured quantity strip position represents the temporal and / or local change of the distance of the strip with respect to a straight reference line transversely to the strip running direction; that is, the tape position represents the tape profile and / or its vibration behavior as a function of time.
  • strip stabilization encompasses two essential aspects in the context of the present description: On the one hand, strip stabilization means smoothing of a wave-shaped strip profile, and on the other hand, this term means damping of vibrations of the strip. Both aspects of band stabilization can be implemented independently or in combination or simultaneously with the aid of suitable control circuits.
  • the essential advantage of the claimed limitation of the distance can be seen in the fact that when the distance is set to a value below the distance threshold value that can be calculated according to the invention, a significantly better effect is achieved for both aspects of the desired band stabilization. In contrast, the effect of band stabilization at intervals above the distance threshold decreases significantly or the band is despite stabilization even more unstable than without control (opposite effect).
  • Ideal would be a distance of zero, that is, if the band stabilization at the level of the scrapers would be arranged, because then the band stabilization would act directly at the level of the stripping and the tape would then held optimally stable during a measurement process.
  • this arrangement is structurally not feasible due to lack of space in the rule. Therefore, the distance should be as small as possible, but maximally set to the value of the distance threshold value which can be calculated according to the invention.
  • the electromagnetic forces are applied by on each band side in pairs opposing coil assemblies whose distance from the wiping nozzles is changeable.
  • the band position within the coil arrangement is preferably measured, specifically in the spatial vicinity of the coil arrangement.
  • the tape position above and below the coil assembly can be measured.
  • a plurality of coils are arranged on each band side, wherein the respective outer coils are arranged to be adjustable on the continuous band edges parallel to the plane of the band.
  • the distance of the belt stabilization device, hereinafter also abbreviated to belt stabilization, of the wiping nozzles should not exceed their bandwidth for wider belts (B> 1400 mm). For narrower bands (B ⁇ 1400 mm), a margin of up to 1.75 times the bandwidth can be allowed. This distance results from the principle of Staint-Venant, which states that with increasing distance of an attacking force on z. B. a clamped steel strip whose effect on the overall state decreases.
  • the basis for the solution according to the invention is the positioning of the strip stabilizer to the wiping nozzle or the wiping nozzles, taking into account the stress mechanism.
  • the above object is further achieved by the claimed hot dip coating equipment.
  • This is characterized in that the distance (effect) of the strip stabilization from the wiping nozzles is set to a value less than or equal to a distance threshold determined as a function of the bandwidth taking into account a factor Phi as a function of strip thickness and strip tension.
  • the arrangement of the belt stabilization and the wiper nozzle is in principle from the FIG. 4 seen.
  • the distance threshold results according to the principle of Venant for continuous wide steel bands to about the bandwidth and for narrower bands to max. 1.75 times the bandwidth (see FIG. 5 ). At a greater distance is the effect of the band stabilization with respect to a smoothing of the band profile (transverse arc, S-shape, see Fig. 2 ) very limited or no longer recognizable at long distances.
  • the following device for combining the strip stabilization with the wiping nozzle, in which the strip stabilizing coils always act towards the centered strip layer:
  • the stabilization must be respectively aligned to the band position and the actual position must be determined.
  • the alignment is done by means of specially mounted alignment aids.
  • the stabilization is mounted on this frame and is thus mechanically fixed and reproducibly adjustable ( Fig. 3 ).
  • the centering on the band position or band center is therefore always identical between stabilization and the scraper nozzle.
  • Wiping nozzles and stabilizing coils are mechanically synchronized and aligned!
EP08801674A 2007-08-22 2008-08-22 Verfahren und schmelztauchveredelungsanlage zur bandstabilisierung eines zwischen abstreifdüsen der schmelztauchveredelungsanlage geführten, mit einer beschichtung versehenen bandes Active EP2188403B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL08801674T PL2188403T3 (pl) 2007-08-22 2008-08-22 Sposób i instalacja do uszlachetniania zanurzeniowego do stabilizowania prowadzonej pomiędzy dyszami zgarniającymi instalacji do uszlachetniania zanurzeniowego, pokrytej powłoką taśmy

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007039690 2007-08-22
PCT/EP2008/006923 WO2009024353A2 (de) 2007-08-22 2008-08-22 Verfahren und schmelztauchveredelungsanlage zur bandstabilisierung eines zwischen abstreifdüsen der schmelztauchveredelungsanlage geführten, mit einer beschichtung versehenen bandes

Publications (2)

Publication Number Publication Date
EP2188403A2 EP2188403A2 (de) 2010-05-26
EP2188403B1 true EP2188403B1 (de) 2012-07-25

Family

ID=39967543

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08801674A Active EP2188403B1 (de) 2007-08-22 2008-08-22 Verfahren und schmelztauchveredelungsanlage zur bandstabilisierung eines zwischen abstreifdüsen der schmelztauchveredelungsanlage geführten, mit einer beschichtung versehenen bandes

Country Status (15)

Country Link
US (1) US20100285239A1 (zh)
EP (1) EP2188403B1 (zh)
JP (1) JP5355568B2 (zh)
KR (1) KR101185395B1 (zh)
CN (1) CN101784689B (zh)
AU (1) AU2008290746B2 (zh)
BR (1) BRPI0815633B1 (zh)
CA (1) CA2697194C (zh)
DE (1) DE102008039244A1 (zh)
ES (1) ES2387835T3 (zh)
MX (1) MX2010002049A (zh)
MY (1) MY164257A (zh)
PL (1) PL2188403T3 (zh)
RU (1) RU2436861C1 (zh)
WO (1) WO2009024353A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10982307B2 (en) 2016-02-23 2021-04-20 Fontaine Engineering Und Maschinen Gmbh Method for operating a coating device for coating a metal strip, and coating device

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Publication number Priority date Publication date Assignee Title
FR2905955B1 (fr) * 2006-09-18 2009-02-13 Vai Clecim Soc Par Actions Sim Dispositif de guidage d'une bande dans un bain liquide
DE102009051932A1 (de) * 2009-11-04 2011-05-05 Sms Siemag Ag Vorrichtung zum Beschichten eines metallischen Bandes und Verfahren hierfür
KR101322066B1 (ko) 2010-12-10 2013-10-28 주식회사 포스코 강판 제진장치
DE102012000662A1 (de) 2012-01-14 2013-07-18 Fontaine Engineering Und Maschinen Gmbh Vorrichtung zum Beschichten eines metallischen Bandes mit einem Beschichtungsmaterial
JP6065921B2 (ja) * 2013-07-22 2017-01-25 Ｊｆｅスチール株式会社 鋼板の製造方法
NO2786187T3 (zh) * 2014-11-21 2018-07-28
DE102015216721B3 (de) 2015-09-01 2016-11-24 Fontaine Engineering Und Maschinen Gmbh Vorrichtung zum Behandeln eines Metallbandes
DE102016222230A1 (de) * 2016-08-26 2018-03-01 Sms Group Gmbh Verfahren und Beschichtungseinrichtung zum Beschichten eines Metallbandes
WO2018155245A1 (ja) * 2017-02-24 2018-08-30 Ｊｆｅスチール株式会社 連続溶融金属めっき処理装置及び該装置を用いた溶融金属めっき処理方法
DE102017109559B3 (de) 2017-05-04 2018-07-26 Fontaine Engineering Und Maschinen Gmbh Vorrichtung zum Behandeln eines Metallbandes

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GB1351125A (en) * 1970-04-15 1974-04-24 British Steel Corp Method of and apparatus for controlling a moving metal sheet to conform to a predetermined plane
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JPH10298727A (ja) * 1997-04-23 1998-11-10 Nkk Corp 鋼板の振動・形状制御装置
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Publication number Priority date Publication date Assignee Title
US10982307B2 (en) 2016-02-23 2021-04-20 Fontaine Engineering Und Maschinen Gmbh Method for operating a coating device for coating a metal strip, and coating device

Also Published As

Publication number Publication date
JP2010535945A (ja) 2010-11-25
BRPI0815633B1 (pt) 2018-10-23
KR101185395B1 (ko) 2012-09-25
BRPI0815633A2 (pt) 2015-02-18
ES2387835T3 (es) 2012-10-02
WO2009024353A2 (de) 2009-02-26
JP5355568B2 (ja) 2013-11-27
RU2436861C1 (ru) 2011-12-20
AU2008290746A1 (en) 2009-02-26
PL2188403T3 (pl) 2012-12-31
MY164257A (en) 2017-11-30
CN101784689A (zh) 2010-07-21
CA2697194A1 (en) 2009-02-26
RU2010110581A (ru) 2011-09-27
CN101784689B (zh) 2013-06-26
MX2010002049A (es) 2010-05-03
EP2188403A2 (de) 2010-05-26
DE102008039244A1 (de) 2009-03-12
CA2697194C (en) 2012-03-06
KR20100030664A (ko) 2010-03-18
WO2009024353A3 (de) 2010-01-21
US20100285239A1 (en) 2010-11-11
AU2008290746B2 (en) 2011-09-08

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