EP2143828B1 - Electrolyte et procédé de dépôt d'une couche de métal mate - Google Patents
Electrolyte et procédé de dépôt d'une couche de métal mate Download PDFInfo
- Publication number
- EP2143828B1 EP2143828B1 EP08012262.5A EP08012262A EP2143828B1 EP 2143828 B1 EP2143828 B1 EP 2143828B1 EP 08012262 A EP08012262 A EP 08012262A EP 2143828 B1 EP2143828 B1 EP 2143828B1
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- EP
- European Patent Office
- Prior art keywords
- electrolyte
- metal
- deposited
- composition
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003792 electrolyte Substances 0.000 title claims description 67
- 229910052751 metal Inorganic materials 0.000 title claims description 52
- 239000002184 metal Substances 0.000 title claims description 52
- 230000008021 deposition Effects 0.000 title claims description 13
- 238000000034 method Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims description 23
- 239000000080 wetting agent Substances 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 239000006185 dispersion Substances 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- 239000000839 emulsion Substances 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 5
- BUACSMWVFUNQET-UHFFFAOYSA-H dialuminum;trisulfate;hydrate Chemical compound O.[Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O BUACSMWVFUNQET-UHFFFAOYSA-H 0.000 claims description 5
- 229910021653 sulphate ion Inorganic materials 0.000 claims description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229920000233 poly(alkylene oxides) Polymers 0.000 claims description 4
- 239000011591 potassium Substances 0.000 claims description 4
- 229910052700 potassium Inorganic materials 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 claims description 2
- -1 alkyl sulphates Chemical class 0.000 claims description 2
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 claims description 2
- 150000003856 quaternary ammonium compounds Chemical group 0.000 claims description 2
- YJWSPTRABMNCGQ-UHFFFAOYSA-L magnesium;methanesulfonate Chemical compound [Mg+2].CS([O-])(=O)=O.CS([O-])(=O)=O YJWSPTRABMNCGQ-UHFFFAOYSA-L 0.000 claims 1
- XWIJIXWOZCRYEL-UHFFFAOYSA-M potassium;methanesulfonate Chemical compound [K+].CS([O-])(=O)=O XWIJIXWOZCRYEL-UHFFFAOYSA-M 0.000 claims 1
- KKVTYAVXTDIPAP-UHFFFAOYSA-M sodium;methanesulfonate Chemical compound [Na+].CS([O-])(=O)=O KKVTYAVXTDIPAP-UHFFFAOYSA-M 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 17
- 238000000151 deposition Methods 0.000 description 12
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 10
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 6
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 5
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 5
- 239000004327 boric acid Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 5
- 235000019341 magnesium sulphate Nutrition 0.000 description 5
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 5
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 4
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical group [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 4
- 239000001164 aluminium sulphate Substances 0.000 description 4
- 235000011128 aluminium sulphate Nutrition 0.000 description 4
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 4
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 4
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 4
- 239000000176 sodium gluconate Substances 0.000 description 4
- 235000012207 sodium gluconate Nutrition 0.000 description 4
- 229940005574 sodium gluconate Drugs 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- OBBXFSIWZVFYJR-UHFFFAOYSA-L tin(2+);sulfate Chemical compound [Sn+2].[O-]S([O-])(=O)=O OBBXFSIWZVFYJR-UHFFFAOYSA-L 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 230000004313 glare Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 3
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000000172 allergic effect Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 208000010668 atopic eczema Diseases 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- WDHWFGNRFMPTQS-UHFFFAOYSA-N cobalt tin Chemical compound [Co].[Sn] WDHWFGNRFMPTQS-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- DIKJULDDNQFCJG-UHFFFAOYSA-M sodium;prop-2-ene-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC=C DIKJULDDNQFCJG-UHFFFAOYSA-M 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
Definitions
- This invention relates to an electrolyte as well as a method for the deposition of a matt metal layer on a substrate surface.
- the invention relates to an electrolyte which has a low concentration of the deposition metal and a method to deposit a matt metal layer by using such electrolytes.
- the intention when depositing metal layers on substrate surfaces to gain a plain and glossy metal layer on the substrate surface may have functional properties, which properties can optimise the substrate surface for the later proposal, or decorative effects should be obtained.
- the substrate sometimes it is preferred to have a non-glossy, matt or so-called pearlbrite metal layer on the substrate surface.
- this intention can be based on the optical appearance of the deposit, on the other side matt or so-called pearlbrite deposits have specific technical properties, like for example to be non-glare, which properties may be desirable for technical or decorative use.
- the application area for such a matt or pearlbrite metal layers is, for example, jewellery industry, fitting industry, automotive industry, as well as optical or fine mechanical industry. Especially in these areas non-glare metal layers are desired.
- the deposition of matt or pearlbrite metal layers of non-allergic or low allergic metals is requested. The same is true for the application of matt or pearlbrite metal layers in the area of kitchen machinery and kitchen implements.
- the substrate surface can be adapted to the later technical use.
- the ductility, the hardness, the corrosion resistance, or comparable mechanical properties of the substrate surface can be optimised.
- the international patent application WO 2007/076898 discloses an electrolyte as well as a method for the deposition of matt metal layers, especially of the metals vanadium, chrome, manganese, iron, cobalt, nickel, copper, zinc, ruthenium, rhodium, palladium, silver, indium, tin, antimony, tellurium, rhenium, platinum, gold, thallium, bismuth, or alloys of these.
- an emulsion and/or dispersion is formed in the electrolyte by addition of an emulsion agent and/or dispersion agent, or a wetting agent.
- a drawback of the electrolyte as well as the method known from the state of the art is that sometimes it is difficult to gain even deposits on the substrate surface.
- an electrolyte for the deposition of a matt metal layer of a metal of the group consisting of Co, Ni, Cu, Sn, or an alloy of these metals on a substrate surface, wherein the electrolyte comprises a substituted or unsubstituted polyalkylene oxide or a derivate of a substituted or unsubstituted polyalkylene oxide, or a wetting agent, wherein the wetting agent is fluorated or perfluorated, or is a quaternary ammonium compound substituted with a polyalkalylene oxide, for building an emulsion and/or dispersion in the electrolyte, characterised in that the electrolyte comprises at least one halogenide, sulphate, or sulfonate of an element of the group consisting of sodium, potassium, aluminium, magnesium, or boron. In an embodiment, a methanesulfonate of sodium, potassium, or magnesium is preferred. In another embodiment, aluminium sulphate
- the cloud point is exceeded, which effect is to be avoided by normal plating electrolytes, but here leads to the desired matt effect of the deposited metal layer.
- the addition of the mentioned inert compounds which do not comprise any depositable metal cations increases the density so that a matt metal layer is deposited even at a very low concentration of plating metal in the electrolyte.
- the electrolyte comprises a density increasing compound within a concentration in the range of from 2 0% to 100% by weight of the concentration of the metal to be deposited.
- the alkali compound or alkaline earth compound is comprised in the inventive electrolyte in a range between 20% to 60% by weight of the concentration of the metal to be deposited.
- a surface active wetting agent to the inventive electrolyte is possible.
- the addition of a surface active wetting agent supports the even deposition of metal layers further.
- the addition of surface active wetting agents was not possible since those surface active wetting agents would influence the formation of an emulsion and/or dispersion in the electrolyte, thereby influencing the matt or pearlbrite effect of the electrolyte. If surface active wetting agents were added to the electrolytes known from the state of the art, the deposited metal layers turned to be glossy instead of being non-glare.
- the addition of surface active wetting agents is possible without influencing the matt effect of the electrolyte.
- the surface active wetting agent which can be added to the inventive electrolyte may be a wetting agent of the group consisting of alkyl sulphates, sulfosuccinic acid, and betaines.
- the surface active wetting agent may be comprised in the inventive electrolyte in a concentration between 0,01 mol/l and 100 mol/l, preferably between 0,1 mol/l and 10 mol/l.
- the density increasing compound in the inventive electrolyte is sodium sulphate, magnesium sulphate, or aluminium sulphate.
- the object of the invention is solved by a method for the electrolytic deposition of a matt metal layer on a substrate surface, which matt metal layer is deposited from an electrolyte forming an emulsion and/or dispersion by conducting a current between a cathodic contacted substrate surface and an anode, which method is characterised in that 10 to 50% by weight of the metal to be deposited comprised in the electrolyte is substituted by at least on density increasing halogenide, sulphate, or sulphonate of an element of the group consisting of sodium, potassium, aluminium, magnesium, or boron.
- Ni-electrolyte comprising:
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Claims (3)
- Procédé de dépôt électrolytique d'un couche mate d'un métal du groupe constitué de Co, Ni, Cu, Sn ou d'un alliage de ces métaux, sur une surface de substrat, à partir d'un électrolyte formant une émulsion et/ou une dispersion, en faisant passer un courant entre un substrat en contact de manière cathodique et une anode, le procédé comprenant les étapes dea) sélection d'une première composition pour un électrolyte capable de déposer une couche de métal mate d'un métal du groupe mentionné auparavant sur la surface du substrat, ladite composition ayant une concentration du métal devant être déposé et où la composition comprend un oxyde de polyalkylène substitué ou non substitué, ou un dérivé d'un oxyde de polyalkylène substitué ou non substitué, ou un agent mouillant pour former une émulsion et/ou une dispersion, où l'agent mouillant est un agent mouillant fluoré ou perfluoré ou un composé d'ammonium quaternaire substitué avec de l'oxyde de polyalkylène ;b) préparation d'un électrolyte de placage basé sur la première composition, où entre 10 et 50 % en poids de métal devant être déposé selon la première composition sont substitués par au moins un composé augmentant la densité de type halogénure, sulfate ou sulfonate d'un élément du groupe constitué du sodium, du potassium, de l'aluminium, du magnésium, ou du bore pour réduire la concentration du métal devant être déposé en comparaison à la première composition et où la concentration du composé augmentant la densité est dans la gamme entre 20 % et 100 % en poids de la concentration du métal devant être déposé ;c) mise en contact de la surface du substrat avec l'électrolyte de placage résultant de l'étape b) et application du courant.
- Procédé selon la revendication 1, dans lequel la composition sélectionnée dans l'étape a) comprend un agent mouillant tensioactif dans une concentration dans la gamme de 0,01 mol/l et 100 mol/l, ledit agent mouillant tensioactif est choisi dans le groupe constitué des alkylsulfates, de l'acide sulfosuccinique et de bétaïnes.
- Procédé selon l'une des revendications 1 ou 2, dans lequel l'électrolyte selon l'étape b) comprend au moins un composé du groupe constitué par du méthanesulfonate de sodium, du méthanesulfonate de potassium, du méthanesulfonate de magnésium, du sulfate d'aluminium, ou du tétrafluorure de bore.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES08012262.5T ES2615337T3 (es) | 2008-07-08 | 2008-07-08 | Electrolito y método para depositar una capa metálica mate |
| EP08012262.5A EP2143828B1 (fr) | 2008-07-08 | 2008-07-08 | Electrolyte et procédé de dépôt d'une couche de métal mate |
| CN2009801346466A CN102144049B (zh) | 2008-07-08 | 2009-07-08 | 电解质和无光泽金属层的淀积方法 |
| US13/003,398 US20110233065A1 (en) | 2008-07-08 | 2009-07-08 | Electrolyte and method for deposition of matte metal layer |
| PCT/US2009/049932 WO2010006045A1 (fr) | 2008-07-08 | 2009-07-08 | Électrolyte et procédé de dépôt d'une couche de métal mat |
| JP2011517566A JP5647979B2 (ja) | 2008-07-08 | 2009-07-08 | つや消し金属層の堆積のための電解質および方法 |
| KR1020117002872A KR101663841B1 (ko) | 2008-07-08 | 2009-07-08 | 무광택 금속 층을 침착시키기 위한 전해질 및 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08012262.5A EP2143828B1 (fr) | 2008-07-08 | 2008-07-08 | Electrolyte et procédé de dépôt d'une couche de métal mate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2143828A1 EP2143828A1 (fr) | 2010-01-13 |
| EP2143828B1 true EP2143828B1 (fr) | 2016-12-28 |
Family
ID=40070778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP08012262.5A Active EP2143828B1 (fr) | 2008-07-08 | 2008-07-08 | Electrolyte et procédé de dépôt d'une couche de métal mate |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20110233065A1 (fr) |
| EP (1) | EP2143828B1 (fr) |
| JP (1) | JP5647979B2 (fr) |
| KR (1) | KR101663841B1 (fr) |
| CN (1) | CN102144049B (fr) |
| ES (1) | ES2615337T3 (fr) |
| WO (1) | WO2010006045A1 (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM404224U (en) * | 2010-07-21 | 2011-05-21 | guang-xi Guo | Improved structure for silverware |
| EP2568063A1 (fr) | 2011-09-09 | 2013-03-13 | Rohm and Haas Electronic Materials LLC | Procédé d'électrodéposition de cuivre à faible contrainte interne |
| EP2620529B1 (fr) * | 2012-01-25 | 2014-04-30 | Atotech Deutschland GmbH | Procédé de production de dépôts de cuivre mate |
| US10056636B1 (en) * | 2013-10-03 | 2018-08-21 | Primus Power Corporation | Electrolyte compositions for use in a metal-halogen flow battery |
| CN104404583A (zh) * | 2014-12-22 | 2015-03-11 | 常熟市伟达电镀有限责任公司 | 一种铝镁合金电镀液 |
| WO2017077655A1 (fr) * | 2015-11-06 | 2017-05-11 | 株式会社Ｊｃｕ | Additif de placage de nickel et bain de placage de nickel satiné le contenant |
| CN109680310B (zh) * | 2019-01-04 | 2020-07-07 | 中国计量大学 | 一种镍锑电镀液及其制备方法 |
| US11981108B2 (en) * | 2020-03-03 | 2024-05-14 | Nippon Steel Corporation | Ni-plated steel sheet and manufacturing method thereof |
Citations (1)
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| JP2005120425A (ja) * | 2003-10-16 | 2005-05-12 | Ishihara Chem Co Ltd | スズ及びスズ合金メッキ浴 |
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| US3839165A (en) * | 1967-08-26 | 1974-10-01 | Henkel & Cie Gmbh | Nickel electroplating method |
| DE1951558C3 (de) * | 1969-10-13 | 1978-06-15 | Henkel & Cie Gmbh, 4000 Duesseldorf | Saures galvanisches Glanzzinkbad |
| DE2346942C3 (de) * | 1973-09-18 | 1978-10-26 | Dr.-Ing. Max Schloetter Gmbh & Co Kg, 7340 Geislingen | Schwach saures Glanzzinkbad |
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| US4617097A (en) * | 1983-12-22 | 1986-10-14 | Learonal, Inc. | Process and electrolyte for electroplating tin, lead or tin-lead alloys |
| DE3909811A1 (de) * | 1989-03-24 | 1990-09-27 | Lpw Chemie Gmbh | Verwendung von zumindest einer organischen sulfinsaeure und/oder von zumindest einem alkalisalz einer organischen sulfinsaeure als mittel ... |
| US6261433B1 (en) * | 1998-04-21 | 2001-07-17 | Applied Materials, Inc. | Electro-chemical deposition system and method of electroplating on substrates |
| JP3871013B2 (ja) * | 1998-11-05 | 2007-01-24 | 上村工業株式会社 | 錫−銅合金電気めっき浴及びそれを使用するめっき方法 |
| TW577938B (en) * | 1998-11-05 | 2004-03-01 | Uyemura C & Co Ltd | Tin-copper alloy electroplating bath and plating process therewith |
| US6387229B1 (en) * | 1999-05-07 | 2002-05-14 | Enthone, Inc. | Alloy plating |
| EP1314799B1 (fr) * | 2000-08-24 | 2013-10-16 | Hideo Yoshida | PROCéDé DE TRAITEMENT éLECTROCHIMIQUE, TEL QUE le placage électrochimique ET DISPOSITIF DE REACTION de placage électrochimique |
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| DE10222962A1 (de) * | 2002-05-23 | 2003-12-11 | Atotech Deutschland Gmbh | Saurer galvanischer Badelektrolyt und Verfahren zur elektrolytischen Abscheidung satinglänzender Nickelniederschläge |
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| JP4603812B2 (ja) * | 2003-05-12 | 2010-12-22 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 改良されたスズめっき方法 |
| US20050173255A1 (en) * | 2004-02-05 | 2005-08-11 | George Bokisa | Electroplated quaternary alloys |
| US20060096868A1 (en) * | 2004-11-10 | 2006-05-11 | Siona Bunce | Nickel electroplating bath designed to replace monovalent copper strike solutions |
| CN101273157A (zh) * | 2005-06-20 | 2008-09-24 | 百富可公司 | 锌镍合金电镀系统 |
| EP1969160B1 (fr) | 2006-01-06 | 2011-04-27 | Enthone, Incorporated | Électrolyte et procédé de séparation d une couche métallique mate |
| JP2007262430A (ja) * | 2006-03-27 | 2007-10-11 | C Uyemura & Co Ltd | 電気めっき方法 |
| US7780839B2 (en) * | 2007-12-12 | 2010-08-24 | Rohm And Haas Electronic Materials Llc | Electroplating bronze |
| US8450169B2 (en) * | 2010-11-29 | 2013-05-28 | International Business Machines Corporation | Replacement metal gate structures providing independent control on work function and gate leakage current |
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2008
- 2008-07-08 EP EP08012262.5A patent/EP2143828B1/fr active Active
- 2008-07-08 ES ES08012262.5T patent/ES2615337T3/es active Active
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- 2009-07-08 US US13/003,398 patent/US20110233065A1/en not_active Abandoned
- 2009-07-08 CN CN2009801346466A patent/CN102144049B/zh active Active
- 2009-07-08 KR KR1020117002872A patent/KR101663841B1/ko active IP Right Grant
- 2009-07-08 WO PCT/US2009/049932 patent/WO2010006045A1/fr active Application Filing
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| JP2005120425A (ja) * | 2003-10-16 | 2005-05-12 | Ishihara Chem Co Ltd | スズ及びスズ合金メッキ浴 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5647979B2 (ja) | 2015-01-07 |
| KR101663841B1 (ko) | 2016-10-07 |
| US20110233065A1 (en) | 2011-09-29 |
| CN102144049A (zh) | 2011-08-03 |
| KR20110031224A (ko) | 2011-03-24 |
| ES2615337T3 (es) | 2017-06-06 |
| EP2143828A1 (fr) | 2010-01-13 |
| JP2011527730A (ja) | 2011-11-04 |
| CN102144049B (zh) | 2013-07-31 |
| WO2010006045A1 (fr) | 2010-01-14 |
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